An air extraction structure and wafer drying apparatus for reducing IPA overflow

Abstract

The utility model discloses a kind of for reducing the air extraction structure and wafer drying equipment of IPA overflow, it is related to semiconductor production equipment technical field, including bearing box, first gas pipe and second gas pipe are equipped on the top plate of bearing box, the two side walls of bearing box perpendicular to length direction are respectively equipped with third gas pipe and air outlet pipe, third gas pipe is connected with the drive cylinder in bearing box, drive cylinder is used to control the on-off of third gas pipe, air outlet pipe is connected with negative pressure source, first manual valve is equipped at the port of second gas pipe, air outlet pipe is sequentially equipped with second manual valve and pneumatic rotary valve in the direction of departing from bearing box, pneumatic rotary valve is connected with IPA concentration detection meter signal, the present application solves the technical problem that the air extraction device for the wafer drying equipment of existing air extraction structure is single, air extraction air direction is fixed, and air extraction efficiency cannot be adjusted according to the variation of equipment internal IPA steam concentration.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a ventilation structure and wafer drying equipment for reducing IPA overflow. Background Technology

[0002] With the rapid development of the semiconductor industry and the continuous increase in wafer size, the requirements for the precision and stability of drying equipment are also increasing. Currently, most existing semiconductor wafer drying equipment uses a single exhaust port design with a fixed exhaust direction and an exhaust rate that cannot be dynamically adjusted according to changes in the concentration of IPA (isopropanol) vapor inside the equipment. During actual operation, when the drying equipment dries the wafers, IPA vapor diffuses evenly within the equipment. Due to the limited coverage of a single exhaust port, IPA vapor in some areas cannot be removed in time, leading to excessively high local IPA vapor concentrations, which then overflow through the equipment's sealing gaps. Furthermore, existing exhaust structures lack effective airflow guiding devices, causing eddies to easily form inside the equipment, further exacerbating the retention and overflow of IPA vapor.

[0003] In summary, developing an exhaust structure and wafer drying equipment that can adjust the ventilation opening according to the IPA concentration within the frame, improve exhaust efficiency, and prevent IPA vapor overflow is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] The purpose of this invention is to provide a ventilation structure and wafer drying equipment for reducing IPA overflow, which solves the technical problems of limited ventilation range, low sewage discharge efficiency, and easy IPA vapor overflow and leakage of existing ventilation equipment.

[0005] To achieve the above objectives, this utility model provides an exhaust structure for reducing IPA overflow, comprising:

[0006] The support box has a first gas supply pipe and a second gas supply pipe on its top plate. A third gas supply pipe and an air outlet pipe are respectively provided on the two side walls of the support box perpendicular to its length. The third gas supply pipe is connected to a drive cylinder inside the support box. The drive cylinder is used to control the opening and closing of the third gas supply pipe. The air outlet pipe is connected to a negative pressure source. A first manual valve is provided at the end of the second gas supply pipe. A second manual valve and a pneumatic rotary valve are provided sequentially on the air outlet pipe in the direction away from the support box. The pneumatic rotary valve is connected to the IPA concentration detector signal.

[0007] Preferably, both the first manual valve and the second manual valve include an operating plate and a first valve plate. The first valve plate is specifically a circular plate. The operating plate is vertically connected to a connecting shaft, which is connected to the edge of the first valve plate, and its extension direction passes through the center of the first valve plate.

[0008] Preferably, the second air supply pipe and the air outlet pipe are provided with connecting pipes and limiting rods on their side walls, and the two are arranged in parallel. The inner cavity of each connecting pipe is connected to the inner cavity of the second air supply pipe and the air outlet pipe, respectively. The connecting shaft passes through the connecting pipe and is connected to the first valve plate at its end. The operating plate can drive the first valve plate to rotate.

[0009] Preferably, the operating panel is fan-shaped, with a connecting shaft at its center. A limiting groove is provided on the side of the operating panel near the arc sidewall. The limiting groove is specifically an arc-shaped groove. The limiting rod can slide within the limiting groove. When the limiting rod is rotated to the beginning of the limiting groove, the edge of the first valve plate is in contact with the inner cavity of the second air supply pipe and air outlet pipe, and the second air supply pipe and air outlet pipe are closed. When the limiting rod is at the end of the limiting groove, the first valve plate is parallel to the axis of the second air supply pipe and air outlet pipe, and the second air supply pipe and air outlet pipe reach their maximum opening.

[0010] Preferably, the air outlet duct includes a first duct body, a second duct body, and a third duct body, with both ends of the three duct bodies connected by connecting flanges. The first duct body and the second duct body are located inside the frame cavity, and the third duct body is located outside the frame.

[0011] Preferably, sealing rings are provided at both ends of the first tube, the second tube, and the third tube.

[0012] Preferably, the pneumatic rotary valve includes a rotary cylinder, the output shaft of which extends into the second tube body, the output shaft is connected to a second valve plate, and the extension direction of the output shaft passes through the center of the second valve plate.

[0013] Preferably, a mounting bracket is fixed to the top of the side wall of the second tube, and the mounting bracket is used to support the rotary cylinder.

[0014] Preferably, the driving cylinder is a single-shaft double-acting cylinder.

[0015] A wafer drying apparatus includes the aforementioned exhaust structure for reducing IPA overflow.

[0016] Compared to the aforementioned background technology, the exhaust structure for reducing IPA overflow provided by this utility model includes: a support box, a first air supply pipe and a second air supply pipe provided on the top plate of the support box, a third air supply pipe and an exhaust pipe respectively provided on the two side walls of the support box perpendicular to its length direction, the third air supply pipe being connected to a drive cylinder, the drive cylinder being used to control the on / off connection between the third air supply pipe and the support box, the first air supply pipe being connected to a bubble generator, a first manual valve being provided in the second air supply pipe, a second manual valve and a drive rotary valve being sequentially provided on the side wall of the exhaust pipe facing away from the support box, a negative pressure source being connected to the end of the exhaust pipe facing away from the support box, and the pneumatic rotary valve and the drive cylinder also being connected to the IPA concentration detector signal. During the drying process using this application, the operator opens the first and second manual valves, drives the cylinder to close the third gas supply pipe port, and the bubble generator delivers IPA vapor to the tank. At the same time, the IPA concentration detector monitors the IPA concentration in the frame cavity in real time. The negative pressure in the vent pipe draws out the IPA vapor overflowing from the bubble generator and the frame cavity through the second and first gas supply pipes. After the wafer drying operation is completed, the drive cylinder opens the third gas supply pipe, and the negative pressure discharges the remaining IPA vapor in the tank, preventing the overflowing IPA vapor from damaging the equipment and workers. The pneumatic rotary valve is used to quickly close the air outlet pipe and isolate the ignition source from the negative pressure source when the IPA vapor burns. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0018] Figure 1 This is a structural diagram of an exhaust structure for reducing IPA overflow provided in an embodiment of the present invention;

[0019] Figure 2 An exploded view of the ventilation structure for reducing IPA overflow provided in an embodiment of this utility model;

[0020] Figure 3 This is a structural diagram of the wafer drying equipment provided in an embodiment of the present invention.

[0021] Wherein, 1-supporting box; 2-first gas supply pipe; 3-second gas supply pipe; 4-third gas supply pipe;

[0022] 5-Outlet duct; 51-First duct body; 52-Second duct body; 53-Third duct body; 6-Drive cylinder; 7-First manual valve; 8-Second manual valve; 91-Operating panel; 92-Connecting shaft; 93-First valve plate; 94-Limiting groove; 101-Connecting pipe; 102-Limiting rod; 11-Pneumatic rotary valve; 111-Rotating cylinder; 112-Second valve plate; 12-IPA concentration detector; 13-Frame; 14-Bubble generator; 15-Tank body. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] This invention provides an exhaust structure for reducing IPA overflow; please refer to the appendix of the specification. Figures 1 to 3 This application includes a support box 1. A third air supply pipe 4 and an air outlet pipe 5 are respectively provided on the two side walls of the support box 1 perpendicular to its length direction. A first air supply pipe 2 and a second air supply pipe 3, which are parallel to each other, are provided on the top plate of the support box 1. It should be noted that this application includes a frame 13 for wafer drying equipment. The inner cavity of the frame 13 is also equipped with a bubble generator 14 for generating IPA vapor and a drying process tank 15. The tank 15 and the bubble generator 14 are connected by an additional conveying pipe, which transports the IPA vapor generated by the bubble generator 14 to the tank 15. Furthermore, the third air supply pipe 4 and the second air outlet pipe 5 are respectively provided on the two side walls perpendicular to its length direction. The air pipe 4 is connected to the tank 15, the first air supply pipe 2 is connected to the bubble generator 14, the second air supply pipe 3 is not connected to any additional components, and its inner cavity is connected to the inner cavity of the frame 13. The end of the ventilation pipe away from the bearing box 1 is connected to a negative pressure source. Furthermore, a first manual valve 7 is provided on the second air supply pipe 3, and a second manual valve 8 and a pneumatic rotary valve 11 are provided on the air outlet pipe 5. The two are arranged in sequence along the direction away from the bearing box 1. The pneumatic rotary valve 11 is signal-connected to an IPA concentration detector 12. The IPA concentration detector 12 is used to detect the concentration of IPA vapor that escapes from the tank 15 into the frame 13.

[0026] In one embodiment of this application, when the wafer drying equipment is in the drying process, the drive cylinder 6 closes the port of the third air supply pipe 4, while simultaneously opening the first manual valve 7, the second manual valve 8, and the pneumatic rotary valve 11. The opening degree of the three valves is adjusted according to process requirements. The bubble generator 14 delivers the generated IPA vapor to the tank 15 to dry the wafers in the tank 15. The unconsumed IPA vapor escapes into the inner cavity of the frame 13, and the negative pressure source of the exhaust pipe 5 discharges the escaped IPA vapor through the second air supply pipe 3. Furthermore, the IPA vapor in the bubble generator 14 is not completely input into the tank 15. Some of this gas escapes into the inner cavity of the frame 13 and remains in the bubble generator 14. The first gas supply pipe 2 and the second gas supply pipe 3 discharge this gas, so that the IPA vapor concentration in the inner cavity of the frame 13 is always below 25%. After the wafer in the tank 15 has completed the drying process, the drive cylinder 6 opens the port of the third gas supply pipe 4. At this time, the third gas supply pipe 4 is connected to the negative pressure source, and the unconsumed gas in the tank 15 is extracted and discharged.

[0027] This application effectively controls IPA vapor overflow, preventing it from corroding electronic components around the equipment, extending the equipment's service life, and protecting the health of operators, thus providing a safer and more stable production environment for semiconductor wafer manufacturing.

[0028] Preferably, the driving cylinder 6 is a single-axis double-acting cylinder, which controls the connection and closure of the third air supply pipe 4 and the bearing box 1 by reciprocating sliding along its own axis.

[0029] Preferably, both the first manual valve 7 and the second manual valve 8 include a first valve plate 93 and an operating plate body 91. The first valve plate 93 is specifically a circular plate. A connecting shaft 92 is perpendicularly connected to the edge of the end face of the operating plate body 91. The other end of the connecting shaft 92 is connected to the edge of the first valve plate 93. It should be noted that the axis of the connecting shaft 92 is parallel to the first valve plate 93, and the axis of the connecting shaft 92 passes through the center of the first valve plate 93. The radius of the first valve plate 93 is equal to the radius of the second air supply pipe 3. Similarly, the radius of the second valve plate 112 is equal to the radius of the air outlet pipe 5. Further, the side walls of the second air supply pipe 3 and the air outlet pipe 5 are respectively provided with a connecting pipe 101 and a limiting rod 102. The connecting pipe 101 and the limiting rod 102 are arranged parallel to each other. Each connecting pipe 101 has its inner cavity connected to the second air supply pipe 3 and the air outlet pipe 5, respectively. The connecting shaft 92 extends into the inner cavity of the second air supply pipe 3 and the air outlet pipe 5 through the connecting pipe 101 and is fixedly connected to each first valve plate 93. In addition, the operating plate body 91 is a fan-shaped plate. The connecting shaft 92 is provided at one end of the operating plate body 91 away from the arc surface. A limiting groove 94 is provided on the edge near the arc surface. The limiting groove 94 is an arc-shaped groove. When the connecting shaft 92 is connected to the connecting pipe 101, the limiting rod 102 extends into the limiting groove 94 and slides in it. Preferably, the arc corresponding to the limiting groove 94 is 90°. When the operator needs to adjust the valve opening of the second air supply pipe 3 and the air outlet pipe 5, the first valve plate 93 is rotated by the operating plate body 91. When the limiting rod 102 is rotated to the beginning of the limiting groove 94, the edge of the first valve plate 93 is in contact with the inner cavity of the second air supply pipe 3 and the air outlet pipe 5, and the second air supply pipe 3 and the air outlet pipe 5 are closed. When the limiting rod 102 is at the end of the limiting groove 94, the first valve plate 93 is parallel to the axis of the second air supply pipe 3 and the air outlet pipe 5, and the second air supply pipe 3 and the air outlet pipe 5 reach their maximum opening.

[0030] Please refer to the instruction manual appendix. Figure 2 The air outlet duct 5 includes a first pipe body 51, a second pipe body 52, and a third pipe body 53. Preferably, connecting flanges are provided at both ends of the three pipe bodies along their axial direction. The first pipe body 51 and the second pipe body 52 are located inside the frame 13, and the third pipe body 53 is located outside the frame 13. The connecting flanges on both sides of the first pipe body 51 are fixed to the bearing housing 1 and the second pipe body 52. ​​The connecting flanges at both ends of the second pipe body 52 are fixed to the first pipe body 51 and the inner wall of the frame 13, respectively. The connecting flanges at both ends of the third pipe body 53 are fixed to the outer wall of the frame 13 and the negative pressure source. Sealing rings are clamped between each connecting flange, between the connecting flange and the bearing housing 1, and between the connecting flange and the frame 13. The air outlet duct 5 discharges the overflowing IPA vapor, and the sealing rings are used to improve the sealing performance of the air outlet duct 5 and prevent IPA vapor from leaking to the outside during the discharge process, which could affect the health of the staff.

[0031] Preferably, a mounting bracket is fixed to the top of the side wall of the second tube 52. The mounting bracket is used to support the rotary cylinder 111. The pneumatic rotary valve 11 includes the rotary cylinder 111. The rotary cylinder 111 is connected to the mounting bracket through four support rods. The output shaft of the rotary cylinder 111 extends into the second tube 52. The output shaft is connected to the second valve plate 112. The extension direction of the output shaft passes through the center of the second valve plate 112. The drive cylinder 6 is signal-connected to the IPA concentration detector 12. The drive cylinder 6 adjusts the valve opening of the air outlet 5 according to the detected concentration signal.

[0032] This application also provides a wafer drying apparatus, which includes a drying tank 15, a bubble generator 14 for generating IPA vapor, and the aforementioned exhaust structure for reducing IPA overflow. The wafer drying apparatus is a prior art and will not be described in detail here.

[0033] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0034] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of this utility model.

Claims

1. A ventilation structure for reducing IPA overflow, characterized in that, include: The support box (1) has a first gas supply pipe (2) and a second gas supply pipe (3) on its top plate. The support box (1) has a third gas supply pipe (4) and an air outlet pipe (5) on its two side walls perpendicular to its length direction. The third gas supply pipe (4) is connected to a drive cylinder (6) inside the support box (1). The drive cylinder (6) is used to control the opening and closing of the third gas supply pipe (4). The air outlet pipe (5) is connected to a negative pressure source. The second gas supply pipe (3) has a first manual valve (7) at its port. The air outlet pipe (5) has a second manual valve (8) and a pneumatic rotary valve (11) in sequence in the direction away from the support box (1). The pneumatic rotary valve (11) is connected to the IPA concentration detector (12) for signal connection.

2. The exhaust structure for reducing IPA overflow according to claim 1, characterized in that, Both the first manual valve (7) and the second manual valve (8) include an operating plate body (91) and a first valve plate (93). The first valve plate (93) is specifically a circular plate. The operating plate body (91) is vertically connected to a connecting shaft (92). The connecting shaft (92) is connected to the edge of the first valve plate (93), and its extension direction passes through the center of the first valve plate (93).

3. The exhaust structure for reducing IPA overflow according to claim 2, characterized in that, The second air supply pipe (3) and the air outlet pipe (5) are provided with connecting pipes (101) and limiting rods (102) on their side walls, and the two are arranged in parallel. The inner cavity of each connecting pipe (101) is connected to the inner cavity of the second air supply pipe (3) and the air outlet pipe (5). The connecting shaft (92) passes through the connecting pipe (101) and is connected to the first valve plate (93) at its end. The operating plate (91) can drive the first valve plate (93) to rotate.

4. The exhaust structure for reducing IPA overflow according to claim 3, characterized in that, The operating plate (91) is specifically fan-shaped. The connecting shaft (92) is set at the center of the operating plate (91). The operating plate (91) has a limiting groove (94) on one side near the arc sidewall. The limiting groove (94) is specifically an arc groove. The limiting rod (102) is slidably disposed in the limiting groove (94). When the limiting rod (102) is rotated so that it is located at the beginning of the limiting groove (94), the edge of the first valve plate (93) is in contact with the inner cavity of the second air supply pipe (3) and the air outlet pipe (5), and the second air supply pipe (3) and the air outlet pipe (5) are closed. When the limiting rod (102) is located at the end of the limiting groove (94), the first valve plate (93) is parallel to the axis of the second air supply pipe (3) and the air outlet pipe (5), and the second air supply pipe (3) and the air outlet pipe (5) reach the maximum opening.

5. The exhaust structure for reducing IPA overflow according to claim 1, characterized in that, The air outlet pipe (5) includes a first pipe body (51), a second pipe body (52) and a third pipe body (53), and both ends of the three are connected by connecting flanges. The first pipe body (51) and the second pipe body (52) are located in the inner cavity of the frame (13), and the third pipe body (53) is located on the outside of the frame (13).

6. The exhaust structure for reducing IPA overflow according to claim 5, characterized in that, The first tube (51), the second tube (52), and the third tube (53) are all provided with sealing rings at both ends.

7. The exhaust structure for reducing IPA overflow according to claim 5, characterized in that, The pneumatic rotary valve (11) includes a rotary cylinder (111), the output shaft of which extends into the second tube (52), and the output shaft is connected to a second valve plate (112). The extension direction of the output shaft passes through the center of the second valve plate (112).

8. The exhaust structure for reducing IPA overflow according to claim 7, characterized in that, The top of the side wall of the second tube (52) is fixed with a mounting bracket, which is used to support the rotary cylinder (111).

9. The exhaust structure for reducing IPA overflow according to claim 1, characterized in that, The drive cylinder (6) is specifically a single-shaft double-acting cylinder.

10. A wafer drying device, characterized in that, Includes an exhaust structure for reducing IPA overflow as described in any one of claims 1 to 9 above.

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