A nitrogen drying apparatus for semiconductor wafer processing

Abstract

The utility model belongs to the technical field of semiconductor wafer processing, specifically disclose a kind of nitrogen drying equipment for semiconductor wafer processing, including support platform, still including conveyer, conveyer embeddedly installed on support platform upper portion, for continuous transmission semiconductor wafer passing;Blower plate, the input end of blower plate fixed in support platform upper portion is used to connect nitrogen supply system, realizes nitrogen drying action;Wherein, blower plate is provided with several jet gaps, and several jet gaps are inclined to set.This utility model wafer is continuously moved to the below blower plate by conveyer, and nitrogen is high-speed blown to wafer surface from inclined jet gap, residual sewage is blown along wafer side, realizes even fast drying, and guarantees batch processing continuity and surface clean water stain simultaneously.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor wafer processing technology, and specifically relates to a nitrogen drying device for semiconductor wafer processing. Background Technology

[0002] Semiconductor wafer processing refers to the manufacturing process of forming integrated circuits or device structures by performing multiple precision processes such as photolithography, etching, ion implantation, thin film deposition, and polishing on silicon wafers. The process requires extremely high cleanliness and precision and is widely used in the fields of electronics, communications, and computer chip production.

[0003] After cleaning, semiconductor wafers must be thoroughly dried to remove residual liquid from the surface. Traditional drying equipment is mostly nitrogen drying oven or hot air oven, which requires operators to frequently put the wafers in and take them out. This results in a highly intermittent and uncontinuous processing, making it unsuitable for infrared drying of large batches of wafers and high-throughput production. Furthermore, the placement or handling process can easily introduce particulate contamination or damage the thin film structure on the wafer surface. For example, when using a single-wafer nitrogen drying oven to process 50 wafers in a wafer manufacturing plant, each batch operation needs to be spaced several minutes apart, which limits capacity and automation efficiency. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a nitrogen drying device for semiconductor wafer processing.

[0005] To achieve the above objectives, this utility model provides a nitrogen drying device for semiconductor wafer processing, including a support platform and a conveyor. The conveyor is embedded in the upper part of the support platform for continuously conveying the semiconductor wafers passing through. A blower plate is fixed to the upper part of the support platform, and its input end is connected to a nitrogen supply system to realize nitrogen drying. The blower plate has several air jet slits, which are inclined. In use, the blower plate performs a blowing and drying action on the passing semiconductor wafers, and the inclined air jet slits can drive the wastewater remaining on the wafer surface to be blown out from the crystal side, thereby realizing the waterproofing of the wafer surface.

[0006] In the above technical solution, the blower plate has an air cavity inside, and the air cavity communicates with a plurality of the jet gaps.

[0007] In the above technical solution, an air inlet pipe is fixedly connected to the upper part of the blower plate, and the output end of the air cylinder fixed to the upper part of the support platform is fixedly connected to the air inlet pipe through a transmission pipe. In the above technical solution, the air cylinder input end is used to connect to the nitrogen supply system, and the drive rod of the air cylinder is fixedly connected to the outer wall of one side of the blower plate. In the above technical solution, the transmission machine further includes a motor fixed inside the support platform, and two rollers rotatably installed inside the support platform, one of which is fixedly connected to the output end of the motor. The two rollers are connected by a transmission belt. In the above technical solution, one of the rollers is further provided with large rotating wheels fixedly connected to both sides, and two small rotating wheels rotatably installed on both sides of the support platform are driven by the two large rotating wheels respectively. A turntable fixed outside the small rotating wheels is slidably connected to a support arm slidably installed outside the support platform. When the motor starts, it drives the roller to drive the conveyor belt and synchronously drives the blower plate to perform reciprocating lateral movement, further enhancing the drying effect. When the blower plate resets, it drives the air cylinder to draw gas from the nitrogen system. When the blower plate moves in the opposite direction again, it supplies gas to the blower plate through the transmission pipe to achieve intermittent gas supply.

[0008] Compared with the prior art, this utility model has the following advantages: by embedding the conveyor on the upper part of the support platform, continuous wafer conveying is realized, thereby overcoming the intermittent problem of frequent placement and removal required by traditional drying devices, and significantly improving production continuity and automation efficiency; the blower plate is fixed on the upper part of the support platform, and its input end is connected to the nitrogen supply system, which can stably deliver high-purity nitrogen to the inside of the blower plate; several inclined air jet gaps are opened on the blower plate, and when the wafer passes through, nitrogen is blown at high speed from the air jet gaps to the wafer surface. At the same time, the inclined angle of the air jet gaps is used to guide the residual wastewater on the wafer surface to be blown out along one side of the crystal, reducing droplet retention and water stain formation, and ensuring uniform drying of the wafer surface; Through the continuous conveying of the conveyor and the inclined air jet design of the blower plate, efficient drying of batch wafers can be achieved, reducing manual handling and contamination risks, while improving wafer yield and processing efficiency. It is suitable for automated drying processes in semiconductor production lines. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the overall structure proposed in this utility model; Figure 2 This is a schematic diagram of the cross-sectional structure of the blower plate proposed in this utility model; Figure 3 This is a schematic diagram of the air cylinder structure proposed in this utility model; Figure 4 This is a schematic diagram of the transmission mechanism structure proposed in this utility model.

[0010] In the diagram: 1. Support platform; 2. Transmission machine; 3. Blower plate; 4. Air inlet pipe; 5. Air chamber; 6. Air jet slit; 7. Support arm; 8. Air cylinder; 9. Transmission pipe; 10. Turntable; 201. Motor; 202. Drum; 203. Conveyor belt; 204. Large impeller; 205. Small impeller. Detailed Implementation To better understand the above-mentioned objectives, features and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0011] like Figures 1-4 The nitrogen drying equipment for semiconductor wafer processing shown includes a support platform 1 and a conveyor 2. The conveyor 2 is embedded in the upper part of the support platform 1 and is used to continuously transport the semiconductor wafers. A blower plate 3 is fixed to the upper part of the support platform 1 and its input end is used to connect to a nitrogen supply system to realize the nitrogen drying action. The blower plate 3 has a number of air jet gaps 6, which are inclined. In use, the blower plate 3 performs a blower drying action on the semiconductor wafers, and the inclined air jet gaps 6 can drive the wastewater remaining on the wafer surface to be blown out from the crystal side, thereby realizing the waterproofing action on the wafer surface.

[0012] The aforementioned nitrogen drying equipment for semiconductor wafer processing achieves continuous wafer transport by embedding the conveyor 2 on the upper part of the support table 1, thereby overcoming the intermittent problem of frequent placement and removal required by traditional drying devices and significantly improving production continuity and automation efficiency. The blower plate 3 is fixed on the upper part of the support platform 1, and its input end is connected to the nitrogen supply system, which can stably deliver high-purity nitrogen to the inside of the blower plate 3. Several inclined air jet gaps 6 are opened on the blower plate 3. When the wafer passes through, nitrogen is blown at high speed from the air jet gaps 6 to the wafer surface. At the same time, the inclined angle of the air jet gaps 6 is used to guide the residual wastewater on the wafer surface to be blown out along one side of the crystal, reducing droplet retention and water stain formation, and ensuring that the wafer surface is dried evenly.

[0013] In this embodiment, an air chamber 5 is provided inside the blower plate 3, and the air chamber 5 is connected to several air jet gaps 6. An air inlet pipe 4 is fixedly connected to the upper part of the blower plate 3. The output end of the air cylinder 8, which is fixed to the upper part of the support platform 1, is fixedly connected to the air inlet pipe 4 through a transmission pipe 9. The input end of the air cylinder 8 is used to connect to the nitrogen supply system. The drive rod of the air cylinder 8 is fixedly connected to the outer wall of one side of the blower plate 3. During use, nitrogen is fed into the cylinder 8 by the nitrogen supply system, enters the air inlet pipe 4 fixed on the upper part of the blower plate 3 through the transmission pipe 9, and then enters the air chamber 5 inside the blower plate 3. The air chamber 5 is connected to multiple inclined jet slits 6, so that the high-pressure nitrogen is evenly distributed and sprayed at high speed onto the surface of the semiconductor wafer. Meanwhile, the drive rod of the air cylinder 8 is fixedly connected to the outer wall of one side of the blower plate 3, so that the nitrogen airflow can effectively blow out the residual moisture on the surface of the wafer, achieving a continuous, efficient and uniform drying effect, while ensuring that the wafer surface is clean and free of water stains, meeting the requirements of batch red drying process.

[0014] In this embodiment, the conveyor 2 includes a motor 201 fixed inside the support platform 1, two rollers 202 rotatably installed inside the support platform 1, one of which is fixedly connected to the output end of the motor 201. The two rollers 202 are connected by a transmission belt 203. Large rollers 204 are fixedly connected to both sides of one of the rollers 202. Two small rollers 205 rotatably installed on both sides of the support platform 1 are driven by the two large rollers 204 respectively. A turntable 10 fixed outside the small rollers 205 is slidably connected to a support arm 7 slidably installed outside the support platform 1. When the motor 201 starts, it drives the roller 202 to drive the transmission belt 203 and simultaneously drives the blower plate 3 to perform reciprocating horizontal movement, further enhancing the drying effect. When the blower plate 3 resets, it drives the air cylinder 8 to draw gas from the nitrogen system. When the blower plate 3 moves in the opposite direction again, it supplies gas to the blower plate 3 through the transmission pipe 9, realizing intermittent gas supply action, thereby avoiding the problem of the blower plate 3 retracting and blowing water back while blowing air.

[0015] The conveyor 2 drives a set of rollers 202 through a motor 201 fixed inside the support platform 1 to achieve continuous transport of semiconductor wafers. One of the rollers 202 is fixedly connected to the output end of the motor 201, and the two rollers 202 are connected by a transmission belt 203 so that the transmission belt 203 moves smoothly when the wafers pass through. Meanwhile, large rotating wheels 204 are fixedly connected to both sides of the roller 202, and small rotating wheels 205 are rotatably installed on both sides of the support platform 1 and are respectively connected to the large rotating wheels 204 by belt drive. The turntable 10 fixed outside the small rotating wheels 205 is slidably connected to the support arm 7 slidably installed outside the support platform 1, thereby realizing the reciprocating lateral movement of the blower plate 3. When the motor 201 starts, the roller 202 drives the conveyor belt 203 to continuously transport the wafers, and at the same time drives the blower plate 3 to move laterally back and forth, which enhances the drying effect of nitrogen on the wafer surface and avoids local water stains. During the reset process, the blower plate 3 draws gas from the nitrogen system through the driving air cylinder 8, and then supplies gas to the blower plate 3 through the transmission pipe 9 during the next reverse movement, realizing intermittent gas supply action. This effectively avoids the problem of water flowing back onto the wafer surface when the blower plate 3 retracts, thereby ensuring that the wafer surface is uniformly dried during continuous conveying, improving drying efficiency and wafer yield, and adapting to the high-throughput operation requirements of batch drying and automated production lines.

[0016] Working principle: By embedding the conveyor 2 on the upper part of the support platform 1, continuous wafer transport is achieved, thereby overcoming the intermittent problem of frequent placement and removal required by traditional drying devices, and significantly improving production continuity and automation efficiency; the blower plate 3 is fixed on the upper part of the support platform 1, and its input end is connected to the nitrogen supply system, which can stably deliver high-purity nitrogen to the inside of the blower plate 3; several inclined air jet gaps 6 are opened on the blower plate 3. When the wafer passes through, nitrogen is blown at high speed from the air jet gaps 6 onto the wafer surface. At the same time, the inclined angle of the air jet gaps 6 is used to guide the residual wastewater on the wafer surface to be blown out along one side of the crystal, reducing droplet retention and water stain formation, and ensuring uniform drying of the wafer surface. The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A nitrogen drying apparatus for semiconductor wafer processing, comprising a support platform (1), characterized in that, Also includes: Transmitter (2), which is embedded in the upper part of the support platform (1) for continuously transmitting semiconductor wafers; The blower plate (3) is fixed on the upper part of the support platform (1). The input end of the blower plate (3) is used to connect to the nitrogen supply system to realize the nitrogen drying action. The blower plate (3) is provided with a number of air jet slits (6), and the number of air jet slits (6) are arranged at an angle. In use, the blower plate (3) blows air to dry the passing semiconductor wafer, and the inclined jet slit (6) can drive the sewage remaining on the wafer surface to be blown out from the crystal side, thereby achieving the waterproofing action on the wafer surface.

2. The nitrogen drying equipment for semiconductor wafer processing according to claim 1, characterized in that, The blower plate (3) has an air cavity (5) inside, and the air cavity (5) is connected to several of the jet gaps (6).

3. The nitrogen drying equipment for semiconductor wafer processing according to claim 1, characterized in that, An air inlet pipe (4) is fixedly connected to the upper part of the blower plate (3), and the output end of the air cylinder (8) fixed on the upper part of the support platform (1) is fixedly connected to the air inlet pipe (4) through the transmission pipe (9).

4. The nitrogen drying equipment for semiconductor wafer processing according to claim 3, characterized in that, The input end of the air cylinder (8) is used to connect to the nitrogen supply system, and the drive rod of the air cylinder (8) is fixedly connected to the outer wall of one side of the blower plate (3).

5. A nitrogen drying apparatus for semiconductor wafer processing according to claim 4, characterized in that, The transmission machine (2) includes a motor (201) fixed inside the support platform (1), and two rollers (202) rotatably installed inside the support platform (1), one of which is fixedly connected to the output end of the motor (201). The two rollers (202) are connected by a transmission belt (203).

6. A nitrogen drying apparatus for semiconductor wafer processing according to claim 5, characterized in that, One of the rollers (202) is fixedly connected to two large rollers (204) on both sides. Two small rollers (205) are rotatably installed on both sides of the support platform (1) and are driven by the two large rollers (204). The turntable (10) fixed outside the small rollers (205) is slidably connected to the support arm (7) slidably installed outside the support platform (1). When the motor (201) starts, it drives the roller (202) to drive the conveyor belt (203) and simultaneously drives the blower plate (3) to perform reciprocating horizontal movement to further enhance the drying effect. When the blower plate (3) resets, it drives the air cylinder (8) to draw gas from the nitrogen system. When the blower plate (3) moves in the opposite direction again, it supplies gas to the blower plate (3) through the transmission pipe (9) to achieve intermittent gas supply.

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