Automotive camshaft position sensor

Abstract

The utility model provides a kind of automobile camshaft position sensor, including chip, circuit board, pin, support and packaging hopper, wherein: circuit board is installed on support, and its two ends are respectively welded with chip and pin and form integrated structure's welding assembly, welding assembly is assembled in packaging hopper, welding assembly is sealed in packaging hopper using resin material filling, and welding assembly after filling sealing and embedding ring together injection molding form sensor shell.The utility model realizes the accurate positioning and integrated assembly of chip, circuit board and pin by support structure, effectively solve the problem that traditional sensor component positioning is not accurate, assembly consistency is poor, with the advantages of improving sensor signal acquisition accuracy, enhancing assembly consistency and improving production convenience.

Description

Technical Field

[0001] This utility model relates to a position sensor, and more particularly to an automotive camshaft position sensor. Background Technology

[0002] As a key component of modern automotive engine management systems, the camshaft position sensor's performance directly affects core engine functions such as fuel injection control, ignition timing adjustment, and knock suppression. The camshaft position sensor's function is to collect the position signal of the valve train camshaft and input it into the ECU, allowing the ECU to identify the top dead center of cylinder 1 during compression, thereby enabling sequential fuel injection control, ignition timing control, and knock control.

[0003] Because the space for installing camshaft position sensors is limited, these sensors are required to be as miniaturized as possible. However, existing camshaft position sensor chips are relatively large compared to other sensor chips. To ensure miniaturization, current camshaft position sensors are mostly designed without a support frame, consisting of the chip, circuit board, and pins directly soldered together. This sensor design cannot precisely control the chip's position or guarantee the accuracy of the finished product, and there is a risk of the chip being installed backwards during production. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide an automotive camshaft position sensor to address the shortcomings of the existing technology, thereby ensuring the accuracy and reliability of the sensor.

[0005] To solve the above-mentioned technical problems, this utility model adopts the following technical solution:

[0006] An automotive camshaft position sensor includes a chip, a circuit board, pins, a bracket, and a packaging container, wherein: the circuit board is mounted on the bracket, and its two ends are respectively welded to the chip and the pins to form an integral welding assembly, and the welding assembly is assembled inside the packaging container.

[0007] Preferably, the chip is disposed at one end of the bracket, and several bent ends of its pins are fixedly installed in corresponding fixing slots on the bracket.

[0008] Preferably, the circuit board is detachably mounted in the corresponding buckle on the top of the bracket through at least one positioning hole thereon.

[0009] Preferably, several pin ends of the pin are fixedly installed in the corresponding pin slot at the other end of the bracket.

[0010] Preferably, the outer side wall of the bracket is provided with a limiting protrusion, and the inner side wall of the packaging hopper is provided with a limiting groove that is snapped into the limiting protrusion.

[0011] Preferably, the limiting protrusions and the limiting grooves are in two sets, both with a contour-following structure design, and are respectively disposed on the left and right outer side walls of the bracket and the left and right inner side walls of the encapsulation hopper.

[0012] Preferably, the bracket comprises an integrally formed chip mounting portion and a circuit board mounting portion, wherein:

[0013] The chip mounting portion has a semi-circular cross-section with a superior arc shape, and it is located at one end of the circuit board mounting portion, with the chip disposed on its outer side wall.

[0014] The circuit board mounting section has a planar plate-like structure, with the circuit board embedded in a groove at the top and reinforcing ribs arranged longitudinally and transversely at the bottom.

[0015] Preferably, both the bracket and the encapsulation container are made of engineering plastics, metals, or ceramic materials.

[0016] Preferably, the welding assembly is filled and sealed in the encapsulation container using resin material.

[0017] Preferably, the welded assembly, after being filled and sealed, is injection molded together with the embedded ring to form the sensor housing.

[0018] The present invention adopts the above technical solution and has the following technical effects compared with the prior art:

[0019] The automotive camshaft position sensor provided by this utility model mainly includes a sensor housing, a packaging chamber, an embedded ring, a pin, a bracket, a circuit board, a chip, and resin material. The circuit board is mounted on the bracket and soldered to the chip and pin. The soldered assembly is then assembled into the packaging chamber and encapsulated with resin material. Finally, the encapsulated assembly and the embedded ring are injection molded together to form the housing. This sensor solution achieves precise positioning and integrated assembly of the chip, circuit board, and pin through a bracket structure, effectively solving the problems of inaccurate positioning and poor assembly consistency of traditional sensor components. It has the advantages of improving sensor signal acquisition accuracy, enhancing assembly consistency, and improving production convenience. Attached Figure Description

[0020] Figure 1 This is a schematic cross-sectional view of the overall structure of an automotive camshaft position sensor according to the present invention;

[0021] Figure 2 This is a three-dimensional structural diagram of the welding assembly in an automotive camshaft position sensor according to the present invention. Figure 1 ;

[0022] Figure 3 This is a three-dimensional structural diagram of the welding assembly in an automotive camshaft position sensor according to the present invention. Figure 2 ;

[0023] Figure 4 This is a schematic diagram of the assembly structure of the welding assembly of an automotive camshaft position sensor and its encapsulation bucket according to the present invention.

[0024] Figure 5 This is a schematic diagram of the encapsulation bucket in an automotive camshaft position sensor according to the present invention;

[0025] The accompanying figures are labeled as follows:

[0026] 100-Chip, 101-Pin bending end; 200-Circuit board, 201-Positioning hole; 300-Pin, 301-Pin end; 400-Bracket, 401-Fixing groove, 402-Snap-in, 403-Pin groove, 404-Limiting protrusion, 410-Chip mounting part, 420-Circuit board mounting part, 421-Reinforcing rib; 500-Encapsulation hopper, 501-Limiting groove; 600-Resin material; 700-Embedding ring; 800-Sensor housing. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0028] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0029] In existing technologies, camshaft position sensors generally employ a bracketless design, with the chip directly soldered to the circuit board and pins. When operating in the confined space of an engine compartment, this structure, lacking a rigid support, is prone to positional misalignment during the soldering process. The relative positional tolerances between internal sensor components are difficult to control, leading to decreased signal acquisition accuracy. During mass production, operators must manually adjust the chip orientation, resulting in a 3%-5% probability of reverse installation, directly impacting product yield.

[0030] To address these issues, researchers discovered the core problem lay in the lack of positioning reference components. Analysis of production data revealed that positional errors in the welding process accounted for approximately 60-70% of all defects. After numerous experiments, it was verified that introducing a rigid support structure could reduce displacement deviation. Based on this, a positioning reference system was proposed to be constructed inside the sensor, ensuring precise alignment of each component through mechanical constraints. Specifically addressing the chip's orientation issue, error-proofing structures were incorporated into the support structure, using physical limits to eliminate human error.

[0031] Based on the above design concept, in some of the embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, this application proposes an automotive camshaft position sensor, including a chip 100, a circuit board 200, a pin 300, a bracket 400, and a housing 500. The circuit board 200 is mounted on the bracket 400, and its two ends are respectively welded to the chip 100 and the pin 300 to form an integral welding assembly, which is assembled inside the housing 500.

[0032] The bracket 400 is a rigid support structure with positioning function, which can be made of injection-molded engineering plastic and has chip fixing grooves and pin mounting grooves on its surface. The encapsulation container 500 is a shell structure that houses the welding components, which can be made of metal stamping or injection molding and has internal limiting grooves. The pins of the chip 100 are bent and then embedded in the fixing grooves of the bracket 400. The circuit board 200 is a substrate that carries electronic components and is connected to the bracket by a snap-fit ​​mechanism through positioning holes. The pin 300 is a signal transmission interface, which can be made of phosphor bronze gold-plated terminals and has its pins fixed in the pin slots of the bracket.

[0033] Specifically, the bracket 400 serves as a positioning reference component, pre-fabricating the chip fixing groove 4, pin slot, and circuit board clip during the injection molding stage. During assembly, the leads of the chip 100 are bent and embedded into the fixing groove to achieve radial constraint, while the pin leads are inserted into the pin slot for axial positioning. The circuit board 200 achieves planar positioning through the cooperation of the positioning holes and clips, forming a stable triangular positioning system. During the welding process, each component maintains precise alignment due to the mechanical constraint of the bracket 400. The welded assembly is then placed into the encapsulation container 500, where the limiting protrusions on the outside of the bracket 400 and the contoured fit of the groove inside the container ensure a single assembly direction.

[0034] Compared to existing technologies, traditional bracketless structures rely on manual visual alignment, resulting in significant tolerances in component position after welding. This solution, through the mechanical positioning system of bracket 400, significantly improves the installation position accuracy of chip 100. The physical error-proofing structure also significantly reduces the assembly orientation error rate. The reinforcing rib design of the bracket significantly improves the vibration resistance of the components, meeting the requirements of the harsh operating conditions in the engine compartment.

[0035] Through the above technical solutions, the structural stability of the welding assembly is fundamentally improved. The relative positional accuracy of chip 100 and pin 300 is improved by 2-3 times, ensuring consistent signal acquisition. The error-proof design completely eliminates manual assembly orientation errors, increasing the product first-pass yield from 92% to 99.8%. The conformal fit between the encapsulation bucket 500 and the bracket 400 reduces the assembly time to one-third of the original process, significantly improving production efficiency. While maintaining the advantages of miniaturization, the overall structure meets the reliability requirements of automotive-grade sensors.

[0036] In some of these embodiments, such as Figure 2 , Figure 3 and Figure 4 As shown, this application further proposes a chip 100 disposed at one end of a bracket 400, with several bent ends 101 of its pins fixedly mounted within corresponding fixing grooves 401 on the bracket. The bent ends 101 refer to the mechanical structure formed by bending the pins of the chip 100 before soldering. This can be achieved using stamping or die forming processes, with bending angles such as 90° or 120° to form a geometric shape matching the fixing grooves 401. The fixing grooves 401 are recessed structures on the surface of the bracket used to constrain the spatial freedom of the pins.

[0037] Specifically, chip 100 is positioned in a designated end region of bracket 400, and its bent pin ends 101 are three-dimensionally positioned by embedding into fixing slots 401. During assembly, the operator aligns the bent pin ends 101 of chip 100 with the fixing slots 401 and presses them in. If the geometry of the bent pin ends 101 and the fixing slots 401 does not match, the assembly cannot be completed. This forms a physical error-proofing mechanism, ensuring that the chip can only be installed in the correct orientation. The wrapping fixation of the bent pin ends 101 by the fixing slots 401 further restricts the displacement of the chip during the soldering process.

[0038] In some of these embodiments, such as Figure 2 and Figure 4 As shown, this application further proposes that the circuit board 200 can be detachably mounted in the corresponding snap-fit ​​402 on the top of the bracket 400 through at least one positioning hole 201. The positioning hole 201 refers to a hole-like structure on the circuit board 200 for engaging with the bracket snap-fit ​​402. Specifically, it can be a circular or irregularly shaped hole, and its position corresponds to the bracket snap-fit ​​402, ensuring that the circuit board 200 can only be positioned in a preset direction during installation. The snap-fit ​​402 refers to a protrusion on the top of the bracket for fixing the circuit board 200. Specifically, it can be an elastic snap-fit ​​or a rigid snap-fit, and its shape matches the positioning hole 201, forming a mechanical constraint.

[0039] Specifically, during assembly, the positioning hole 201 of the circuit board 200 and the latch 402 on the top of the bracket 400 form a physical alignment relationship. The precise positioning of the circuit board 200 is achieved through the engagement of the hole and the protrusion. The elasticity of the latch 402 allows the circuit board 200 to be installed or removed when external force is applied, while the positional design of the positioning hole 201 ensures that the circuit board 200 can only engage with the latch in a single direction, thus eliminating the risk of incorrect assembly orientation. During soldering, the fixing effect of the latch 402 on the circuit board 200 prevents displacement caused by external force, ensuring the alignment accuracy of the solder joints between the chip 100, the pin 300, and the circuit board 200.

[0040] Through the above technical solution, this application achieves rapid and precise assembly of the circuit board 200 and the bracket 400, effectively preventing misalignment caused by incorrect installation direction. The detachable structure facilitates later maintenance or component replacement. The mechanical constraint of the clip 402 and the positioning hole 201 ensures the positional stability of the circuit board 200 during the welding process, thereby ensuring the reliability of the overall sensor structure and the accuracy of signal detection.

[0041] In some of these embodiments, such as Figure 3 As shown, this application further proposes that several pin ends 301 of the pin 300 be fixedly installed in the corresponding pin slot 403 at the other end of the bracket 400. The pin slot 403 refers to a recessed structure at the other end of the bracket 400 that matches the shape of the pin end 301. Specifically, it can be implemented using a rectangular, trapezoidal, or arc-shaped slot, used to restrict the degree of freedom of movement of the pin end 301. The pin end 301 refers to the conductive portion of the pin 300 that is soldered to the circuit board 200. Specifically, it can be implemented using a flat or columnar metal structure, and its dimensions form an interference fit with the depth and width of the pin slot 403.

[0042] Specifically, the pin slot 403 is configured to accommodate and fix the pin end 301 of the pin 300. When the pin end 301 is inserted into the pin slot 403, its spatial position is constrained by the inner wall of the slot 300, thus mechanically locking the pin to the bracket 400. During the soldering process of the pin end 301 to the circuit board 200, the sidewall of the pin slot 403 prevents the pin end 301 from shifting laterally or longitudinally. At the same time, the opening direction of the pin slot 403 has a unique correspondence with the insertion direction of the pin end 301, thereby avoiding reverse installation. Thus, the relative position of the pin 300 and the bracket 400 is precisely defined before soldering, ensuring that the connection end of the pin 300 and the circuit board 200 remains aligned after soldering.

[0043] In some of these embodiments, such as Figure 3 and Figure 4 As shown, this application further proposes that the outer wall of the support 400 is provided with a limiting protrusion 404, and the inner wall of the packaging container 500 is provided with a limiting groove 501 that snaps into the limiting protrusion 400. The limiting protrusion 404 refers to a protruding structure provided on the outer wall of the support 400, used to match the groove on the inner side of the packaging container 500. The limiting groove 501 refers to a recessed structure provided on the inner wall of the packaging container 500, used to accommodate the limiting protrusion 404 to restrict the movement direction of the support 400. The contour-following structural design of both ensures that the support 400 and the packaging container 500 can only be assembled in a specific direction, avoiding misalignment or reversal during assembly.

[0044] Specifically, the limiting protrusion 404 of the bracket 400 and the limiting groove 501 of the encapsulation hopper 500 correspond perfectly in shape and position. During assembly, the limiting protrusion 404 is guided into the limiting groove 501 until the two are fully engaged. At this point, the mounting position of the bracket 400 is precisely fixed and cannot be rotated or moved laterally. Due to the conformal matching characteristic of the limiting protrusion 404 and the limiting groove 501, if the assembly direction is incorrect, the limiting protrusion 400 will not be able to fit into the limiting groove 501, thus immediately prompting the operator to adjust the assembly direction.

[0045] Through the above technical solution, this application achieves precise positioning of the welding components and the packaging container 500, ensuring the uniqueness of the assembly direction and eliminating the risk of reverse assembly caused by human operation. The mechanical interlock between the limiting protrusion 404 and the limiting groove 501 enhances the connection strength between the components, avoiding relative displacement caused by transportation or vibration, thereby improving the stability and reliability of the overall sensor structure.

[0046] As a preferred embodiment, this application further proposes that the limiting protrusions 404 and the limiting grooves 501 are in two sets, both with a contour-following structural design, respectively disposed on the left and right outer side walls of the bracket 400 and the left and right inner side walls of the encapsulation hopper 500. The contour-following structural design refers to the asymmetrical geometric shape of the contact surfaces of the limiting protrusions 404 and the limiting grooves 500, specifically employing a trapezoidal cross-section and a dovetail groove fit, ensuring that the protrusions and grooves on the left and right sides have a unique matching direction.

[0047] Specifically, the two sets of contouring structures are arranged symmetrically on the left and right sides of the bracket 400. When the welding components are assembled into the encapsulation hopper 500, the limiting protrusions 404 on both sides must be aligned with the corresponding limiting grooves 501 simultaneously to complete the installation. Since the contouring structures on both sides have a unique orientation, if the assembly direction is incorrect, the limiting protrusions 404 on both sides will not be able to simultaneously embed into the limiting grooves 501, thus triggering physical interference to prevent incorrect assembly. In the correct assembly state, the limiting structures on both sides together form a four-point positioning constraint, effectively restricting the axial displacement and rotational freedom of the bracket 400 within the encapsulation hopper 500.

[0048] Through the above technical solution, this application achieves the identification of the unique correct assembly direction of the welding component within the packaging hopper 500, eliminating the possibility of misjudgment of direction during manual assembly. The symmetrically distributed limiting structure forms a dual positioning reference, ensuring that the axis of the welding component precisely coincides with the axis of the inner cavity of the packaging hopper. At the same time, the assembly stress is evenly distributed through a four-point contact method, avoiding the loss of positioning accuracy caused by local deformation.

[0049] In some of its embodiments, such as Figure 3 and Figure 4As shown, this application further proposes that the bracket 400 is composed of an integrally formed chip mounting part 410 and a circuit board mounting part 420. The chip mounting part 410 has a semi-circular cross-section with a superior arc shape and is located at one end of the circuit board mounting part 420, with a chip 100 disposed on its outer side wall. The circuit board mounting part 420 has a planar plate structure, with a circuit board 200 embedded in a groove at its top and longitudinally and transversely arranged reinforcing ribs 421 at its bottom.

[0050] The integrated chip mounting section 410 and circuit board mounting section 420 are composite structures manufactured as a whole through injection molding or die casting processes. This eliminates assembly gaps in split brackets. For example, injection molding with polyamide material ensures the relative positional accuracy of the chip 100 and circuit board 200. The semi-circular structure with a superior arc shape refers to an arc-shaped cross-section with a radius of curvature greater than that of a semicircle. Its outer contour matches the chip package shape, achieving circumferential positioning. The top groove of the planar plate structure refers to a rectangular recessed area with a depth of 0.5mm, which constrains the planar displacement of the circuit board through the sidewalls. The longitudinally and transversely arranged reinforcing ribs refer to cross-shaped ribs. For example, three longitudinal ribs are set along the length of the circuit board mounting section, and two transverse ribs are set along the width, forming a grid-like support structure.

[0051] Specifically, during assembly, the chip 100 is mounted on the outer curved surface of the semi-circular mounting portion 410, with its bent pin ends 101 embedded in the corresponding fixing grooves 401. The circuit board 200 is precisely embedded in the groove of the planar mounting portion 420, and the limiting surface at the edge of the groove constrains the circuit board's degree of freedom of movement in the XY plane. The bottom reinforcing rib network 421 effectively resists the pressure generated by resin flow during injection molding by increasing the moment of inertia of the cross-section. The continuous structural design of the chip mounting portion 410 and the circuit board mounting portion 420 ensures that the welding thermal stress is evenly distributed along the integrated bracket, avoiding local deformation.

[0052] Through the above technical solutions, this application achieves precise alignment and installation of chip 100 and circuit board 200, eliminating positional deviations during the welding process; the structural design of reinforcing rib 421 effectively suppresses structural deformation caused by the packaging process, ensuring the geometric stability of the internal components of the sensor.

[0053] In some embodiments, this application further proposes that both the support 400 and the encapsulation container 500 are made of engineering plastics, metals, or ceramic materials. Engineering plastics refer to polymeric materials with high strength, heat resistance, and insulation properties, specifically polyamide, polyphenylene sulfide, or polyetheretherketone, formed through injection molding to create the complex structure of the support and encapsulation container. Metals can be made of aluminum alloys, stainless steel, or copper alloys, formed through die casting or machining. Ceramic materials can be made of alumina, silicon nitride, or silicon carbide, formed through sintering to create the support and encapsulation container.

[0054] Specifically, the materials chosen for the bracket 400 and the encapsulation chamber 500 are adapted to the actual operating conditions. For example, in scenarios requiring normal temperatures and lightweight design, engineering plastics are selected to reduce sensor weight and simplify manufacturing processes; in high-temperature or high-mechanical-load scenarios, metallic materials are used to enhance structural strength and accelerate heat conduction; and in scenarios with chemical corrosion or electromagnetic interference, ceramic materials are employed to ensure long-term stability and block external electromagnetic interference. This parallel arrangement of three types of materials allows the material system of the sensor's core components to cover the differentiated needs of various application scenarios, resolving the contradiction that traditional single materials cannot simultaneously address mechanical strength, temperature resistance, and environmental adaptability through targeted matching of material properties.

[0055] In some of these embodiments, such as Figure 1 and Figure 4 As shown, this application further proposes that the welding assembly be filled and sealed within the encapsulation container 500 using resin material 600. The filling and sealing process refers to the process of injecting liquid resin material into the encapsulation container 500 and allowing it to cure to form a sealing layer. Specifically, epoxy resin or polyurethane resin material can be used, achieved through vacuum filling or pressure injection molding. During the flow process, the liquid resin fills the gap between the encapsulation container 500 and the welding assembly. After the resin cures, it forms a dense encapsulation layer, isolating the external environment from contact with the internal welding assembly. The encapsulation container 500 refers to the shell structure that houses the welding assembly. Specifically, it can be made of engineering plastics or metal materials through injection molding or stamping processes. Its internal space shape matches the shape of the welding assembly, providing a sealed cavity for resin filling.

[0056] Specifically, after the chip 100, circuit board 200, and pins 300 are positioned and soldered on the support 400, the entire assembly is placed into the packaging chamber 500. Resin material 600 is injected into the cavity of the packaging chamber 500 in liquid form and flows under vacuum to the surface of the solder assembly and the gaps in the support 400, completely covering the chip pin solder points, circuit board pads, and pin connections. After the resin cures, it forms a continuous sealing layer that encapsulates all conductive parts of the solder assembly, eliminating the risk of oxidation caused by air gaps.

[0057] Through the above technical solution, this application solves the problem of sensor reliability degradation caused by insufficient sealing of welded components. The resin sealing layer blocks moisture corrosion of the weld joint, prevents dust particles from causing short circuits, and at the same time, the rigid support of the cured resin reduces the risk of weld joint fatigue fracture caused by vehicle vibration, ensuring long-term stable operation of the sensor in the high temperature and high humidity environment of the engine compartment.

[0058] In addition, such as Figure 1As shown, this application further proposes that the welded assembly, after being filled and sealed, be injection molded together with the embedded ring 700 to form the sensor housing 800. The embedded ring 700 is made of metal or engineering plastic and forms a mechanical interlock with the welded assembly after filling and sealing through the injection molding process, thereby enhancing the structural strength of the sensor housing 800.

[0059] Specifically, after the welded components inside the encapsulation chamber 500 are potted and cured with resin, a potted assembly with a stable internal structure is formed. The potted assembly with the encapsulation chamber 500 is placed together in an injection mold, and the molten material of the embedded ring forms an interlocking connection with it during the cooling process, enhancing the mechanical strength of the shell. The injection molding material of the embedded ring 700 wraps around the potted assembly and fills the area around the front end of the encapsulation chamber 500, ultimately forming a protective and dimensionally stable integral sensor shell 800.

[0060] In summary, combining Figures 1 to 5 As shown, the assembly method of the automotive camshaft position sensor provided by this utility model is as follows: First, the circuit board 200 is installed on the bracket 400 and soldered to the chip 100 and pin 300. Then, the soldered assembly is assembled into the encapsulation container 500 and encapsulated with resin material 600. Finally, the encapsulated assembly and the embedded ring 700 are injection molded together to form the sensor housing 800. On the one hand, the bracket 400 fixes the circuit board 200, chip 100 and pin 300, ensuring the accuracy of the product after soldering. On the other hand, the anti-error design, such as the limiting protrusion 404, in the bracket 400 ensures the correct and consistent position of the soldered assembly in the encapsulation container 500.

[0061] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0062] Secondly, the accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0063] Finally, the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A camshaft position sensor for automobiles, characterized in that, The device includes a chip (100), a circuit board (200), a pin (300), a bracket (400), and a packaging container (500), wherein: the circuit board (200) is mounted on the bracket (400), and its two ends are respectively welded to the chip (100) and the pin (300) to form an integral structure of a welding assembly, and the welding assembly is assembled in the packaging container (500).

2. The automotive camshaft position sensor according to claim 1, characterized in that, The chip (100) is disposed at one end of the bracket (400), and several bent ends (101) of its pins are fixedly installed in the corresponding fixing grooves (401) on the bracket (400).

3. The automotive camshaft position sensor according to claim 1, characterized in that, The circuit board (200) is detachably mounted in the corresponding buckle (402) on the top of the bracket (400) through at least one positioning hole (201).

4. The automotive camshaft position sensor according to claim 1, characterized in that, Several pin ends (301) of the pin (300) are fixedly installed in the corresponding pin slot (403) at the other end of the bracket (400).

5. The automotive camshaft position sensor according to claim 1, characterized in that, The outer side wall of the bracket (400) is provided with a limiting protrusion (404), and the inner side wall of the encapsulation hopper (500) is provided with a limiting groove (501) that is snapped into the limiting protrusion (404).

6. The automotive camshaft position sensor according to claim 5, characterized in that, The limiting protrusion (404) and the limiting groove (501) are two sets, both with a contoured structure design, and are respectively set on the left and right outer side walls of the bracket (400) and the left and right inner side walls of the encapsulation bucket (500).

7. The automotive camshaft position sensor according to claim 1, characterized in that, The bracket (400) consists of an integrally formed chip mounting part (410) and a circuit board mounting part (420), wherein: The chip mounting portion (410) has a semi-circular cross-section with an arc shape, and is located at one end of the circuit board mounting portion (420), with the chip (100) disposed on its outer side wall. The circuit board mounting part (420) has a planar plate structure, with the circuit board (200) embedded in the groove at the top and the reinforcing ribs (421) arranged in the longitudinal and transverse directions at the bottom.

8. The automotive camshaft position sensor according to claim 1, characterized in that, Both the bracket (400) and the encapsulation container (500) are made of engineering plastics, metals, or ceramic materials.

9. The automotive camshaft position sensor according to claim 1, characterized in that, The welding assembly is filled and sealed in the encapsulation container (500) with resin material (600).

10. The automotive camshaft position sensor according to claim 9, characterized in that, After filling and sealing, the welded assembly is injection molded together with the embedded ring (700) to form the sensor housing (800).

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