A kind of hemispherical resonator gyro high vacuum packaging equipment based on thin film getter

Abstract

The utility model relates to a kind of hemispherical resonator gyro high vacuum packaging equipment based on film getter, including vacuum chamber and cover are sequentially arranged from below to above by vacuum turntable, lifting mechanism, packaging shell fixing disc and heating mechanism in vacuum chamber;Several fixed positions for installing packaging pedestal are equipped on the vacuum turntable, the packaging pedestal is integrated with self-heating component and is preset with brazing filler metal;The position of packaging pedestal is embedded with packaging shell on the packaging shell fixing disc, and the packaging shell is coated with film getter inside.The utility model discards the traditional air outlet design, effectively reduces the physical size of hemispherical resonator gyro, solves the problem of the volume of traditional packaging structure being too large, improves the product's adaptability;While realizing the precision, independent control of different temperature zones, both the getter activation and shell brazing process are completed synchronously, and the temperature interference of two kinds of processes is avoided, the packaging efficiency and the reliability of high vacuum sealing are improved.

Description

Technical Field

[0001] This utility model relates to the field of hemispherical resonant gyroscope technology, specifically to a high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter. Background Technology

[0002] A hemispherical resonator gyroscope is a high-precision vibration inertial device based on the Coriolis effect. It features no high-speed rotating parts, strong overload resistance, and high reliability, and is widely used in aerospace, high-precision navigation, and other fields. Its measurement accuracy and long-term stability are highly dependent on the internal high-vacuum working environment; therefore, the high-vacuum packaging device is a core piece of equipment in the manufacturing process of a hemispherical resonator gyroscope.

[0003] Existing high-vacuum encapsulation devices for hemispherical resonator gyroscopes generally employ an external pumping system. Furthermore, to ensure subsequent vacuum maintenance, an external getter activation electrode is required to activate the internal thermoelectric getter. However, the design of the external pumping system and external activation electrode increases the structural complexity of the gyroscope's casing, enlarges the overall product size, and severely limits the adaptability of hemispherical resonator gyroscopes in miniaturized and integrated devices. Utility Model Content

[0004] This invention addresses the technical problems existing in the prior art by providing a high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A high-vacuum packaging device for a hemispherical resonator gyroscope based on a thin-film getter includes a vacuum chamber and a vacuum turntable, a lifting mechanism, a packaging shell fixing plate, and a heating mechanism arranged sequentially from bottom to top within the vacuum chamber. The vacuum turntable has several fixing positions for mounting the packaging base. The packaging base integrates a self-heating component and is pre-filled with solder. The packaging shell fixing plate is fitted with a packaging shell at the position corresponding to the packaging base, and the packaging shell is coated with a thin-film getter.

[0006] The beneficial effects of this utility model are: 1. By coating the inner wall of the package with a thin film of getter and activating the getter with a heating mechanism, the traditional air extraction nozzle design is eliminated, effectively reducing the physical size of the hemispherical resonant gyroscope, solving the problem of excessive volume in traditional packaging structures, and improving the product's adaptability. 2. By independently setting heating mechanisms and self-heating components, the activation temperature of the thin-film getter and the brazing temperature of the encapsulation base are matched respectively, achieving precise and independent control of different temperature zones. This not only completes the getter activation and shell brazing processes simultaneously, but also avoids temperature interference between the two processes, improving encapsulation efficiency and the reliability of high vacuum sealing.

[0007] Furthermore, it also includes an optical platform, on which the vacuum chamber and its internal components are mounted. The optical platform provides a high-flatness mounting reference and vibration-resistant support for the equipment, avoiding vibration interference from the vacuum turntable and lifting mechanism during operation, ensuring the alignment accuracy between the packaging base and the shell, as well as the temperature field uniformity of the heating components, and improving the vacuum stability of the final package.

[0008] Furthermore, the lifting mechanism includes a linear guide rail vertically fixed on the vacuum turntable, and the packaging shell fixing plate is slidably connected to the linear guide rail via a slider. The cooperative structure of the linear guide rail and the slider makes the lifting action of the packaging shell fixing plate smoother and more precise, avoids misalignment when the packaging shell is aligned with the base, and ensures the sealing effect after the solder melts.

[0009] Furthermore, the packaging shell fixing plate is provided with several positioning holes, and an electromagnet is provided at the edge of each positioning hole. The packaging shell is embedded in the positioning hole and fixed by the electromagnet. The positioning holes enable precise embedding and positioning of the packaging shell, and the electromagnet enables rapid adsorption / release of the shell. The combination of the two ensures the consistency of the workstation during batch packaging and adapts to the requirements of efficient automated operation.

[0010] Furthermore, the encapsulation shell is generally in the shape of an open cavity, with an annular protrusion on the inner side of the opening, and a thin-film getter coated on the inner surface of the encapsulation shell. The annular protrusion on the inner side of the opening increases the coating surface area of ​​the thin-film getter, and combined with the complete coating of the inner surface, it significantly improves the contact probability between the getter and residual gas, thereby enhancing the vacuum maintenance capability inside the gyroscope after encapsulation.

[0011] Furthermore, the self-heating component includes a ceramic substrate and a heating wire. The ceramic substrate is fixed to the end face of the packaging base facing the outer casing, and the heating wire is sintered and fixed to the surface of the ceramic substrate. The heating wire is made of a tungsten alloy material. The ceramic substrate has the characteristics of high temperature resistance and good insulation, while the tungsten alloy heating wire has strong high-temperature stability. The combination of the two enables the self-heating component to stably output the temperature required for brazing, ensuring uniform melting of the brazing filler and improving the sealing reliability of the package.

[0012] Furthermore, the heating mechanism includes a high-temperature heating lamp bracket and a high-temperature heating lamp assembly slidably mounted on the high-temperature heating lamp bracket, with the high-temperature heating lamp assembly located directly above the packaging shell. The high-temperature heating lamp assembly can slide along the upper and lower brackets of the high-temperature heating lamp, flexibly adjusting the distance between it and the packaging shell to adapt to the getter activation temperature requirements of different packaging shell specifications.

[0013] Furthermore, the high-temperature heating lamp bracket includes a support base and a support frame. The support base is located on one side of the vacuum turntable, with its bottom fixed to the inner wall of the vacuum chamber and a vertical elongated hole at its top. The support frame is Z-shaped, with its lower part slidably embedded in the elongated hole and its upper part fixed with a high-temperature heating lamp assembly. Locking nuts are threadedly connected to both sides of the elongated hole on the support frame. The high-temperature heating lamp bracket makes the height adjustment of the high-temperature heating lamp assembly more convenient and the locking more stable, adapting to the height requirements of different workstations and ensuring the stability of the lamp assembly position during heating, thus preventing temperature field shift.

[0014] Furthermore, the high-temperature heating lamp assembly includes multiple mid-wave infrared heating lamps. Mid-wave infrared heating lamps offer high heating efficiency and strong temperature controllability, enabling them to quickly reach the activation temperature of the thin-film getter while minimizing thermal damage to the encapsulation shell and ensuring the structural integrity of the shell. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model; Figure 2 This is a diagram showing the packaged assembly of the hemispherical resonant gyroscope according to an embodiment of the present invention. Figure 3 This is a cross-sectional view of the packaging shell according to an embodiment of the present utility model; Figure 4 This is a schematic diagram of the packaging shell fixing disk structure according to an embodiment of the present utility model; Figure 5 This is a schematic diagram of the high-temperature heating lamp assembly structure according to an embodiment of the present invention; The attached diagram lists the components represented by each number as follows: 1-1. High-temperature heating lamp assembly; 1-2. High-temperature heating lamp bracket; 2. Self-heating component; 3. Encapsulation shell; 3-1. Annular protrusion; 3-2. Inner surface; 4. Encapsulation shell fixing plate; 4-1. Positioning hole; 4-2. Electromagnet; 5. Linear guide rail; 6. Encapsulation base; 7. Vacuum turntable; 8. Vacuum chamber; 9. Optical platform. Detailed Implementation

[0016] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0017] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0018] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this technology based on the specific circumstances.

[0019] In the description of this application, spatial relation terms such as "below," "under," "below," "below," "above," "over," etc., are used herein to describe the relationship between one element or feature shown in the figures and other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, an element or feature described as "below" or "under" or "below" of other elements or features will be oriented "above" other elements or features. Therefore, the exemplary terms "below" and "under" can include both upper and lower orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein are interpreted accordingly.

[0020] In the description of this application, the term "for example" is used to mean "used as an example, illustration, or description." Any embodiment described as "for example" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to implement and use the present invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the present invention can be implemented without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the present invention with unnecessary detail. Therefore, the present invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0021] Example like Figures 1 to 5As shown, this embodiment provides a high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter, including a vacuum chamber 8 and a vacuum turntable 7, a lifting mechanism, a packaging shell fixing plate 4, and a heating mechanism arranged sequentially from bottom to top within the vacuum chamber 8. The vacuum chamber 8 is used to provide the high vacuum environment required for encapsulation; The vacuum turntable 7 is provided with several fixing positions for installing the encapsulation base 6, which can realize the batch fixing of the encapsulation base 6; The encapsulation base 6 integrates a self-heating component 2 for brazing the encapsulation shell 3 to the encapsulation base 6, and is pre-filled with brazing material (generally In). The lifting mechanism drives the packaging shell fixing plate 4 to move the packaging shell 3 to achieve precise lifting and lowering, so as to adjust the relative position of the packaging shell 3 with the heating mechanism and the packaging base 6, thereby achieving precise control of different temperature zones; The encapsulation housing 3 is embedded on the encapsulation housing fixing plate 4 at the position corresponding to the encapsulation base 6; The inner surface of the encapsulation shell 3 is coated with a thin film of getter. The heating mechanism is used to heat the packaging shell 3 at high temperature to activate the getter.

[0022] This embodiment aims to: by coating the inner wall of the packaging shell 3 with a thin film getter and activating the getter using a heating mechanism, abandon the traditional suction nozzle design, reduce the physical size of the hemispherical resonator gyroscope, and improve the product's adaptability; at the same time, by independently setting the heating mechanism and the self-heating component 2, the activation temperature of the thin film getter and the brazing temperature of the packaging base 6 are matched respectively, achieving precise and independent control of different temperature zones. While simultaneously completing the getter activation and shell brazing processes, the temperature interference between the two processes is avoided, improving packaging efficiency and the reliability of high vacuum sealing.

[0023] Specifically: It also includes an optical platform 9, on which the vacuum chamber 8 and its internal components are mounted. The optical platform 9 provides a high-flatness mounting reference and vibration-resistant support for the equipment, avoiding vibration interference from the vacuum turntable 7 and lifting mechanism during operation, ensuring the alignment accuracy between the packaging base 6 and the outer shell, as well as the temperature field uniformity of the heating components, and improving the vacuum stability of the final packaging.

[0024] The lifting mechanism includes a linear guide rail 5 vertically fixed on the vacuum turntable 7, and the packaging shell fixing plate 4 is slidably connected to the linear guide rail 5 via a slider. The cooperative structure between the linear guide rail 5 and the slider makes the lifting action of the packaging shell fixing plate 4 more stable and precise, avoids misalignment when the packaging shell 3 is aligned with the base, and ensures the sealing effect after the solder melts.

[0025] The packaging shell fixing plate 4 is provided with a plurality of positioning holes 4-1, and an electromagnet 4-2 is provided at the edge of each positioning hole 4-1. The packaging shell 3 is embedded in the positioning hole 4-1 and is fixed by attraction through the electromagnet 4-2. The positioning holes 4-1 realize the precise embedding and positioning of the packaging shell 3, and the electromagnet 4-2 realizes the rapid attraction / release of the shell. The combination of the two not only ensures the consistency of the workstation during batch packaging, but also adapts to the requirements of efficient automated operation and improves packaging efficiency.

[0026] The encapsulation shell 3 is machined from 4J29 stainless steel and is an open cavity without a suction nozzle. An annular protrusion 3-1 is provided on the inner side of the opening of the encapsulation shell 3, and a thin-film getter is coated on the inner surface 3-2 of the encapsulation shell 3. The annular protrusion 3-1 on the inner side of the opening increases the coating surface area of ​​the thin-film getter. Combined with the complete coating of the inner surface 3-2, this significantly improves the contact probability between the getter and residual gas, enhancing the vacuum maintenance capability inside the gyroscope after encapsulation. The thin-film getter material is generally composed of trace elements such as Zr, Co, and Ni.

[0027] The self-heating component 2 includes a ceramic substrate and a heating wire. The ceramic substrate is fixed to the end face of the encapsulation base 6 facing the encapsulation shell 3, and the heating wire is sintered and fixed to the surface of the ceramic substrate. The heating wire is made of a tungsten alloy material. The ceramic substrate has the characteristics of high temperature resistance and good insulation, while the tungsten alloy heating wire has strong high temperature stability. The combination of the two enables the self-heating component 2 to stably output the temperature required for brazing, ensuring uniform melting of the brazing material and improving the sealing reliability of the encapsulation.

[0028] The heating mechanism and the self-heating component 2 are independent temperature control units. The heating mechanism includes a high-temperature heating lamp bracket 1-2 and a high-temperature heating lamp assembly 1-1 slidably mounted on the high-temperature heating lamp bracket 1-2. The high-temperature heating lamp assembly 1-1 is located directly above the packaging shell 3. The high-temperature heating lamp assembly 1-1 can slide up and down along the high-temperature heating lamp bracket 1-2, flexibly adjusting the distance between it and the packaging shell 3. Simultaneously, through its rotational cooperation with the vacuum turntable 7, it can adapt to the getter activation temperature requirements of different specifications of packaging shells 3.

[0029] The high-temperature heating lamp bracket 1-2 includes a support base and a support frame. The support base is located on one side of the vacuum turntable 7, with its bottom fixed to the inner wall of the vacuum chamber 8 and a vertical elongated hole at its top. The support frame is Z-shaped, with its lower part slidably embedded in the elongated hole and its upper part fixed with the high-temperature heating lamp assembly 1-1. Locking nuts are threadedly connected to both sides of the elongated hole on the support frame. The high-temperature heating lamp bracket 1-2 makes the height adjustment of the high-temperature heating lamp assembly 1-1 more convenient and the locking more stable, adapting to the height requirements of different workstations and ensuring the stability of the lamp assembly position during heating, thus avoiding temperature field shift.

[0030] The high-temperature heating lamp assembly 1-1 includes multiple mid-wave infrared heating lamps. The power of the heating lamps is generally 1000W. The mid-wave infrared heating lamps have high heating efficiency and strong temperature controllability, and can quickly reach the activation temperature of the thin-film getter, while reducing thermal damage to the encapsulation shell 3 and ensuring the structural integrity of the shell.

[0031] The packaging process based on the above equipment is as follows: a) Install the pre-filled solder and self-heating component 2 into the fixed position of the vacuum turntable 7 one by one. At the same time, insert the non-vacuuming nozzle encapsulation shell 3 with the inner wall coated with a thin film getter into the positioning hole 4-1 of the encapsulation shell fixing plate 4, and power on the electromagnet 4-2 to complete the adsorption and fixation of the encapsulation shell 3. b) Start the lifting linear guide 5 and adjust it so that the distance between the end face of the package shell 3 and the upper surface of the package base 6 is 85mm; c) Evacuate the vacuum chamber to a vacuum level better than 5×10-4 Pa; d) Start the high-temperature heating lamp group 1-1 to heat the packaging shell 3 to 450°C and keep it at that temperature for 20 minutes, then cool it down to 40°C to complete the activation of the getter; e) Start the vacuum turntable 7 and move it to the next heating station of the package shell 3. Repeat step “d)” to complete the getter activation process of all package shells 3 in sequence. f) Start the lifting guide rail to drive the package shell 3 to fall, so that the end face of the package shell 3 is in contact with the upper surface of the package base 6. g) Activate all self-heating components 2 of the encapsulation base, heat to 220°C, maintain the temperature for 60 minutes, and then cool down to room temperature to complete the encapsulation process.

[0032] While embodiments or examples of this disclosure have been described with reference to the accompanying drawings, it should be understood that the above embodiments are merely exemplary embodiments or examples, and the scope of this utility model is not limited by these embodiments or examples, but only by the granted claims and their equivalents. Various elements in the embodiments or examples may be omitted or replaced by their equivalents. Furthermore, the steps may be performed in a different order than that described in this disclosure. Further, various elements in the embodiments or examples may be combined in various ways. Importantly, as the technology evolves, many elements described herein can be replaced by equivalents that appear after this disclosure.

Claims

1. A high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter, characterized in that, It includes a vacuum chamber (8) and a vacuum turntable (7), a lifting mechanism, a sealing shell fixing plate (4) and a heating mechanism arranged sequentially from bottom to top inside the vacuum chamber (8); The vacuum turntable (7) is provided with several fixed positions for installing the encapsulation base (6), and the encapsulation base (6) integrates a self-heating component (2) and is pre-filled with solder. The encapsulation housing (3) is embedded in the encapsulation base (6) at the position of the encapsulation housing fixing plate (4), and the encapsulation housing (3) is coated with a thin film getter.

2. The high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter according to claim 1, characterized in that, It also includes an optical platform (9), and the vacuum chamber (8) and its internal components are all mounted on the upper surface of the optical platform (9).

3. The high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter according to claim 1, characterized in that, The lifting mechanism includes a linear guide rail (5) vertically fixed on a vacuum turntable (7), and the encapsulation housing fixing plate (4) is slidably connected to the linear guide rail (5) via a slider.

4. The high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter according to claim 1, characterized in that, The packaging shell fixing plate (4) is provided with a number of positioning holes (4-1), and an electromagnet (4-2) is provided at the edge of each positioning hole (4-1). The packaging shell (3) is embedded in the positioning hole (4-1) and is fixed by adsorption through the electromagnet (4-2).

5. The high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter according to claim 1, characterized in that, The encapsulation shell (3) is an open cavity, and an annular protrusion (3-1) is provided on the inner side of the opening of the encapsulation shell (3). The inner surface (3-2) of the encapsulation shell (3) is coated with a thin film getter.

6. The high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter according to claim 1, characterized in that, The self-heating component (2) includes a ceramic substrate and a heating wire. The ceramic substrate is fixed to the end face of the encapsulation base (6) facing the encapsulation shell (3). The heating wire is sintered and fixed to the surface of the ceramic substrate. The heating wire is made of a tungsten alloy material.

7. The high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter according to claim 1, characterized in that, The heating mechanism includes a high-temperature heating lamp bracket (1-2) and a high-temperature heating lamp assembly (1-1) that is slidably mounted on the high-temperature heating lamp bracket (1-2). The high-temperature heating lamp assembly (1-1) is located directly above the encapsulation shell (3).

8. The high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter according to claim 7, characterized in that, The high-temperature heating lamp bracket (1-2) includes a support base and a support frame; The support base is located on one side of the vacuum turntable (7), its bottom is fixed to the inner wall of the vacuum chamber (8), and a vertical elongated hole is provided at the top; The support frame is Z-shaped, with its lower part slidably embedded in the elongated hole and its upper part fixed with a high-temperature heating lamp assembly (1-1). Locking nuts are threadedly connected to both sides of the elongated hole on the support frame.

9. A high-vacuum packaging device for a hemispherical resonant gyroscope based on a thin-film getter according to claim 7, characterized in that, The high-temperature heating lamp group (1-1) includes multiple mid-wave infrared heating lamps.

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