Socket type room temperature acquisition device temperature rise compensation device

Abstract

The utility model relates to temperature measurement and compensation field, concretely relates to a socket type room temperature collection device temperature rise compensation device, include, socket type room temperature collection device main part, NTC temperature measurement component and digital temperature sensor, still include temperature difference monitoring unit and temperature compensation unit, temperature difference monitoring unit is connected with NTC temperature measurement component and digital temperature sensor, is used for monitoring the temperature difference between NTC temperature measurement component and digital temperature sensor and generates temperature difference signal, temperature compensation unit is connected with temperature difference monitoring unit and digital temperature sensor, is used for according to temperature difference signal to digital temperature sensor carries out temperature compensation, the application is through setting socket type room temperature collection device main part, NTC temperature measurement component, digital temperature sensor, temperature difference monitoring unit and the combination structure of temperature compensation unit, effectively solved the socket type room temperature collection device temperature rise because of external plug and lead heating in the background art proposed, and then influence environmental temperature measurement accuracy problem.

Description

Technical Field

[0001] This utility model relates to the field of temperature measurement and compensation, specifically to a temperature rise compensation device for a socket-type room temperature acquisition device. Background Technology

[0002] In numerous fields such as smart homes, industrial environmental monitoring, and residential heating regulation, socket-type room temperature acquisition devices have been widely used due to their convenient installation and high integration. These devices can collect real-time temperature data of the surrounding environment, providing crucial foundational data support for subsequent temperature control decisions, energy consumption optimization, and equipment safety operation. Therefore, their measurement accuracy directly determines the operational effectiveness and reliability of the entire related system. However, in practical applications, socket-type room temperature acquisition devices generally face a prominent technical challenge: when the device is under load, the external plug and connecting wires generate significant heat due to current flow. This heat is transferred to the device's interior through thermal conduction, leading to a noticeable temperature rise. This temperature rise is not caused by changes in ambient temperature but rather by heat interference from external electrical components. If this is not effectively addressed, it will severely affect the detection accuracy of the internal temperature measuring elements.

[0003] Currently, most mainstream socket-type room temperature monitoring devices on the market are equipped with only a single temperature sensor to collect ambient temperature data, and lack a dedicated monitoring and compensation mechanism for temperature rise caused by external plugs and wires. Taking the patent CN107516799A, "A Smart Socket with Temperature Monitoring," as an example, this patent discloses a technical solution that uses multiple temperature sensors to acquire the temperature of the voltage regulator rectifier module and power output interface. Its core purpose is to achieve on / off control under abnormal conditions by monitoring the temperature of key components of the socket, thereby ensuring electrical safety. However, this technical solution only focuses on temperature data acquisition and safety protection triggering, completely neglecting the interference of temperature rise conducted from external heating components to the device's internal components on the accuracy of ambient temperature measurement. It lacks both a dedicated temperature rise monitoring element and corresponding temperature compensation methods, making it unable to distinguish between changes in the actual ambient temperature and the temperature rise caused by external heating when used as a room temperature monitoring device, thus compromising the accuracy of the measurement data.

[0004] As the requirements for the accuracy of environmental temperature monitoring continue to increase, especially in scenarios where temperature data is highly sensitive, such as centralized heating temperature control in northern regions and monitoring of the working environment of precision instruments, the measurement errors caused by temperature rise interference in traditional devices are far from meeting the needs of practical applications. This error not only causes inaccurate adjustments in temperature control systems, leading to energy waste or a decline in environmental comfort, but may also result in incorrect judgments of production parameters in industrial monitoring scenarios, posing potential production risks. Therefore, how to accurately identify the temperature rise caused by the heating of external plugs and wires in socket-type room temperature acquisition devices, and how to compensate for the temperature measurement results accordingly to improve the accuracy of environmental temperature measurement, has become a key problem that urgently needs to be solved in this field. Utility Model Content

[0005] The purpose of this invention is to provide a temperature rise compensation device for a socket-type room temperature acquisition device, in order to solve the problem of how to accurately identify the temperature rise caused by the heating of the external plug and wires of the socket-type room temperature acquisition device, and to compensate the temperature measurement results accordingly, so as to improve the accuracy of ambient temperature measurement.

[0006] To achieve the above objectives, the following technical solution is adopted.

[0007] A temperature rise compensation device for a socket-type room temperature acquisition device includes a socket-type room temperature acquisition device body, an NTC temperature measuring element, and a digital temperature sensor, and further includes a temperature difference monitoring unit and a temperature compensation unit; the temperature difference monitoring unit is connected to the NTC temperature measuring element and the digital temperature sensor, and is used to monitor the temperature difference between the NTC temperature measuring element and the digital temperature sensor and generate a temperature difference signal; the temperature compensation unit is connected to the temperature difference monitoring unit and the digital temperature sensor, and is used to perform temperature compensation on the digital temperature sensor according to the temperature difference signal.

[0008] Optionally, the NTC temperature sensing element is located near the external plug of the socket-type room temperature acquisition device body, and is used to monitor the temperature rise caused by the heating of the external plug and wires.

[0009] Optionally, the NTC temperature measuring element is located at the wire connection point of the main body of the socket-type room temperature acquisition device, and is used to monitor the temperature rise caused by the heating of the external plug and wire.

[0010] Optionally, the temperature difference monitoring unit includes an alarm module, which is used to generate an alarm signal when the temperature difference reaches a set temperature difference alarm threshold.

[0011] Optionally, the temperature compensation unit is connected to the alarm module and is used to initiate temperature compensation for the digital temperature sensor when the alarm signal is received.

[0012] Optionally, the temperature compensation unit includes a data storage module and a compensation calculation module; the data storage module is used to store calibrated temperature rise data and regression equations; the compensation calculation module is used to calculate compensation values ​​based on the temperature difference signal, the calibrated temperature rise data and the regression equations, and to correct the output of the digital temperature sensor.

[0013] Optionally, the NTC temperature measuring component and the digital temperature sensor are integrated on the same circuit board of the socket-type room temperature acquisition device.

[0014] Optionally, the temperature difference monitoring unit and the temperature compensation unit are integrated into the control processor of the main body of the socket-type room temperature acquisition device.

[0015] Optionally, the main body of the socket-type room temperature acquisition device includes a power interface and a load connection terminal, and the NTC temperature measuring component is disposed near the load connection terminal.

[0016] Optionally, the temperature compensation unit is implemented through hardware circuitry or embedded software to perform real-time temperature rise compensation on the digital temperature sensor.

[0017] Compared with the prior art, the present invention has the following beneficial effects: This application, through a combined structure of a socket-type room temperature acquisition device, an NTC temperature measuring component, a digital temperature sensor, a temperature difference monitoring unit, and a temperature compensation unit, effectively solves the problem mentioned in the background art where the temperature rise caused by the external plug and wires affects the accuracy of ambient temperature measurement in socket-type room temperature acquisition devices. The connection design between the temperature difference monitoring unit, the NTC temperature measuring component, and the digital temperature sensor accurately captures the temperature difference signal between them, effectively identifying the temperature rise caused by external heat. The temperature compensation unit compensates for the measurement results of the digital temperature sensor based on this temperature difference signal, fundamentally distinguishing between the true ambient temperature and temperature rise interference, significantly improving the accuracy of room temperature acquisition data, and providing reliable data support for various systems that rely on temperature data. The NTC temperature sensing element is located near the external plug, wire connection, or load connection, enabling direct and sensitive monitoring of the temperature rise conducted to the device by external heat-generating components. This avoids the problem of delayed or inaccurate temperature rise monitoring caused by improper test point selection, further ensuring the effectiveness of the temperature difference signal. Furthermore, its design, which integrates with the digital temperature sensor on the same circuit board, optimizes the internal structural layout of the device and reduces space occupation while ensuring monitoring accuracy.

[0018] The alarm module in the temperature difference monitoring unit enables timely alarm signal generation when the temperature difference reaches a set threshold. This provides operators with abnormal device operation status alerts and, through linkage with the temperature compensation unit, allows for on-demand activation of the compensation function, avoiding unnecessary compensation operations and improving the device's energy efficiency. The data storage module in the temperature compensation unit stores calibration temperature rise data and regression equations. Combined with the calculation module's processing, this makes the compensation value calculation more scientific and accurate, enabling personalized compensation corrections based on different temperature rise levels. Compared to simple fixed-value compensation, this further improves the accuracy of temperature measurement. The integration of the temperature difference monitoring unit and the temperature compensation unit into the device's control processor simplifies the device's hardware structure, reduces manufacturing costs, and minimizes signal transmission delays between components, improving compensation response speed. Furthermore, the flexible implementation of the temperature compensation unit through hardware circuitry or embedded software allows it to adapt to different types of socket-type room temperature acquisition devices, enhancing the versatility and scalability of the technical solution and facilitating its widespread application. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of an embodiment of a socket-type room temperature acquisition device and a temperature rise compensation device according to this utility model.

[0020] Figure 2 This is a schematic diagram of the internal structure of an embodiment of a socket-type room temperature acquisition device and a temperature rise compensation device according to this utility model.

[0021] The components include: 1. Socket-type room temperature acquisition device main body; 2. NTC temperature measuring components; 3. Digital temperature sensor; 4. Control processor; 5. Temperature difference monitoring unit; 6. Temperature compensation unit; 7. Alarm module; 8. Load connection terminal. Detailed Implementation

[0022] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0023] The following detailed description is exemplary and intended to provide further detailed explanation of the present invention. Unless otherwise specified, all technical terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present invention.

[0024] like Figure 1 and Figure 2As shown, the temperature rise compensation device of this socket-type room temperature acquisition device is mainly used to solve the problem that the temperature rise caused by the heating of the external plug and wires during the operation of the socket-type room temperature acquisition device under load has an adverse effect on the temperature measurement accuracy. Through a combination of reasonable hardware configuration and software algorithm, it achieves accurate monitoring and real-time compensation of temperature rise, ensuring the accuracy of room temperature acquisition data. The entire device adopts a modular design concept, and all components use existing mature technology products to ensure the stability and reliability of the device operation, while also facilitating production, processing, and subsequent maintenance.

[0025] The device comprises a socket-type room temperature acquisition unit 1, an NTC temperature measuring component 2, a digital temperature sensor 3, a temperature difference monitoring unit 5, and a temperature compensation unit 6. These components are interconnected via circuitry to form a complete functional system. The socket-type room temperature acquisition unit 1 serves as the core structural support, integrating the hardware circuitry and software programs that implement various functions. Externally, it features a power interface for connecting to the power grid and load connection terminals 8 for connecting to various electrical devices. The power interface uses a standard three-hole socket structure, model AC100-250V16A, compatible with commonly used power lines in Chinese homes and offices, ensuring a stable power supply for the device. The load connection terminals 8 also adopt a standardized design, including two two-hole and two three-hole sockets, simultaneously meeting the power supply needs of multiple small electrical devices. Internally, TB-4508 type terminals are used, characterized by low contact resistance and aging resistance, effectively reducing interference from self-heating on temperature measurement.

[0026] The core control component inside the main body 1 of the socket-type room temperature data acquisition device is a highly integrated circuit board. Key components such as the main control chip, memory chip, and power management chip are soldered onto the circuit board. The main control chip is an STM32L431RCT6 microcontroller. This microcontroller is based on the ARM Cortex-M4 core and features low power consumption and high performance. Its operating voltage range is 1.71V-3.6V, enabling stable operation over a wide temperature range, making it ideal for devices requiring long-term continuous operation, such as room temperature data acquisition. The power management chip is an AMS1117-3.3V, which rectifies and filters the 220V AC power input from the mains, converting it to 3.3V DC to provide a stable power supply for the microcontroller, sensors, and other components. This chip can output up to 800mA, meeting the power consumption requirements of the device's components. The circuit board also includes an ESD protection circuit using an SMF05C type electrostatic discharge protection diode, which effectively resists damage caused by external electrostatic discharge and improves the device's anti-interference capability.

[0027] Both the NTC temperature sensing component 2 and the digital temperature sensor 3 are integrated on the aforementioned circuit board, with a spacing of 3-5mm between them. Both are positioned close to the load connection terminal 8. This layout allows the NTC temperature sensing component 2 to more accurately capture the temperature rise generated by the external plug and wires, while facilitating the digital temperature sensor 3 to acquire the ambient temperature unaffected by localized temperature rises. The NTC temperature sensing component 2 uses an MF52A series negative temperature coefficient thermistor, specifically model MF52A-103F-3950. This thermistor has a nominal resistance of 10kΩ, a B value of 3950K, and an operating temperature range of -55℃ to 125℃, fully covering the actual operating temperature range of the socket-type room temperature acquisition device. It adopts a radial lead package with a lead diameter of 0.5mm, directly soldered to the circuit board via pads. The solder joint is no more than 10mm away from the terminal of the load connection terminal 8, ensuring rapid response to temperature changes in the external plug and wires.

[0028] The digital temperature sensor 3 uses the SHT30 type temperature and humidity sensor. This sensor adopts an I2C communication interface and can simultaneously acquire temperature and humidity data. The temperature measurement range is -40℃ to 125℃, and the measurement accuracy is ±0.3℃, which can meet the high accuracy requirements of room temperature acquisition. The SHT30 sensor uses a DFN package, is compact, and is directly mounted on the circuit board. Its position is closer to the center of the circuit board than the NTC temperature sensing element 2, and it forms a certain thermal isolation with the NTC temperature sensing element 2 through the copper isolation layer on the circuit board, reducing the impact of heat conducted by the NTC temperature sensing element 2 on its measurement accuracy. The sensor's VDD pin is grounded through a 0.1μF ceramic capacitor to filter out power supply noise. The SDA and SCL pins are connected to the 3.3V power supply through 4.7kΩ pull-up resistors to ensure stable communication signals.

[0029] The temperature difference monitoring unit 5 is connected to the NTC temperature sensing element 2 and the digital temperature sensor 3 to monitor the temperature difference between them in real time and generate a corresponding temperature difference signal. This unit is not an independent physical module, but its function is realized through an STM32L431RCT6 microcontroller combined with peripheral circuits. The signal acquisition circuit of the NTC temperature sensing element 2 adopts a voltage divider design. The NTC thermistor and a 10kΩ precision metal film resistor (model RJ14-0.25W-10kΩ±1%) are connected in series to form a voltage divider circuit. This metal film resistor has an extremely low temperature coefficient, which can effectively reduce the influence of its resistance change with temperature on the measurement results. The input of the voltage divider circuit is connected to a 3.3V stable power supply, and the output is connected to the ADC input pin PA0 of the microcontroller. The ADC module inside the microcontroller has a 12-bit resolution and a sampling rate that can be configured to 1MHz. By sampling the output voltage of the voltage divider circuit and combining it with the resistance-temperature characteristic curve of the NTC thermistor, the temperature value at the location of the NTC temperature sensing element 2 can be calculated.

[0030] The digital temperature sensor 3SHT30 connects to the microcontroller via an I2C bus. The microcontroller's PB8 pin serves as the I2C SCL line, and the PB9 pin as the I2C SDA line. The microcontroller acquires the ambient temperature data collected by the SHT30 sensor by sending a read command. This data is transmitted in 16-bit binary format. The microcontroller parses the data using its built-in driver to obtain the corresponding temperature value. The temperature difference monitoring function is implemented through the microcontroller's software program, which includes a timed sampling mechanism. The sampling period can be configured according to actual needs, typically set to 100ms to ensure real-time temperature change capture. Within each sampling period, the microcontroller reads the temperature data from both the NTC temperature sensing element 2 and the digital temperature sensor 3, and then calculates the temperature difference between them using its built-in subtraction unit to obtain the temperature difference signal.

[0031] The alarm module 7 included in the temperature difference monitoring unit 5 is also implemented through a combination of hardware circuitry and software programs. In terms of hardware, the alarm module 7 includes a buzzer and an LED indicator. The buzzer is an SFM-27 passive buzzer with an operating voltage of 3.3V and an operating current of 10mA. It is driven by a PNP transistor S8550. The base of the transistor is connected to the PB12 pin of the microcontroller through a 1kΩ current-limiting resistor, the emitter is connected to the 3.3V power supply, the collector is connected to one end of the buzzer, and the other end is grounded. The LED indicator is a 0805 packaged red light-emitting diode with a forward voltage of 1.8-2.2V and an operating current of 5mA. It is connected to the PB13 pin of the microcontroller through a 220Ω current-limiting resistor. In terms of software, the program pre-sets a temperature difference alarm threshold, which can be calibrated according to the actual working conditions of the socket-type room temperature acquisition device, and is typically set to 5℃. When the temperature difference calculated by the microcontroller reaches or exceeds the threshold, it immediately controls the PB12 and PB13 pins to output a low level, turning on the transistor, causing the buzzer to emit a continuous alarm sound, and at the same time the LED indicator lights up to remind relevant personnel that there is an abnormal temperature in the device.

[0032] Temperature compensation unit 6 is connected to temperature difference monitoring unit 5 and digital temperature sensor 3, and is used to compensate for the temperature based on the measurement results of digital temperature sensor 3 according to the temperature difference signal. This unit is also integrated into the microcontroller and its peripheral circuits, including a data storage module and a compensation calculation module. The data storage module uses an AT24C64 EEPROM with a storage capacity of 64Kbit. It uses an I2C communication interface and is connected to the microcontroller's I2C2 bus (SCL for PB10, SDA for PB11), enabling long-term stable data storage without data loss after power failure. The data stored in the data storage module includes calibration temperature rise data and regression equation parameters, which were obtained through extensive experimental calibration before the device left the factory.

[0033] The process of acquiring calibration temperature rise data is as follows: The socket-type room temperature acquisition device is connected to a standard constant temperature environment chamber. The temperature of the environment chamber is set to different typical room temperature values, such as 10℃, 20℃, and 30℃. At each ambient temperature, by adjusting the load size, different current loads (1A, 3A, 5A, 10A, etc.) are connected to the load connection terminal 8 of the device. After the device temperature stabilizes, the temperature data of the NTC temperature measuring element 2 and the digital temperature sensor 3 are recorded respectively. The temperature difference between the two is calculated, and the actual measurement error of the digital temperature sensor 3 is recorded simultaneously. Through statistical analysis of multiple sets of experimental data, calibration temperature rise data under different ambient temperatures and different load conditions are obtained. The regression equation is obtained based on these calibration temperature rise data through least squares fitting, used to describe the mathematical relationship between the temperature difference and the measurement error of the digital temperature sensor 3. Its form is usually y=ax+b, where y is the compensation value, x is the temperature difference, and a and b are coefficient parameters obtained through fitting. These parameters are also stored in the AT24C64 memory.

[0034] The compensation calculation module's function is implemented through the microcontroller's software program, which works in conjunction with the temperature difference monitoring module. After the microcontroller calculates the temperature difference signal, it immediately reads the corresponding regression equation parameters from the AT24C64 memory, substitutes the temperature difference value into the regression equation, and calculates the compensation value using the microcontroller's internal floating-point unit. Subsequently, the microcontroller superimposes the original temperature data collected by the digital temperature sensor 3 with this compensation value to obtain the corrected temperature data, thus compensating for the temperature rise effect on the digital temperature sensor 3. For example, if the original measurement value of the digital temperature sensor 3 is 25℃, the calculated temperature difference is 4℃, and the corresponding regression equation parameters are a=0.8 and b=0.2, then the compensation value is y=0.8×4+0.2=3.4℃, and the corrected temperature data is 25℃+3.4℃=28.4℃.

[0035] There is a linkage mechanism between the temperature compensation unit 6 and the alarm module 7. When the alarm module 7 generates an alarm signal, i.e., when the temperature difference reaches the set alarm threshold, the microcontroller will immediately activate the high-speed compensation mode of the temperature compensation unit 6, shortening the temperature compensation sampling period from the conventional 100ms to 50ms. This allows for faster response and correction of the measurement data from the digital temperature sensor 3, ensuring accurate room temperature data is still obtained even under abnormal temperature conditions. Simultaneously, the microcontroller will send the alarm status and corrected temperature data to an external communication module via the UART interface. This communication module is an ESP8266-01S Wi-Fi module with an operating voltage of 3.3V. It connects to the microcontroller's PA9 and PA10 pins via the TXD and RXD pins, enabling data upload to a cloud server or local monitoring terminal for remote monitoring and early warning.

[0036] The placement of the NTC temperature sensing element 2 can be optimized according to the actual application scenario. In addition to the basic placement near the load connection terminal 8, it can also be placed near the external plug of the main body 1 of the socket-type room temperature acquisition device. When the device is connected to the power grid via an external plug, the metal contact part of the external plug is prone to heat generation under load. In this case, the NTC temperature sensing element 2 can be extended into the outer shell of the external plug through a wire, near the metal pin. The wire is made of AWG28 enameled wire, which has good insulation and thermal conductivity. The NTC temperature sensing element 2 is fixed inside the plug shell with high-temperature resistant epoxy resin, ensuring that the distance between it and the metal pin does not exceed 5mm, so as to accurately monitor the temperature rise caused by the plug heating.

[0037] In another embodiment, the NTC temperature sensing element 2 can be located at the wire connection point of the main body 1 of the socket-type room temperature acquisition device. The wire connection point is the connection between the internal power line and the load connection terminal 8. This location is prone to heat generation due to contact resistance under high current loads. Here, the NTC temperature sensing element 2 uses a surface-mount MF58 series thermistor, model MF58-104F-3950, directly mounted on the circuit board near the terminal. A copper heat dissipation area is provided at the corresponding position on the circuit board, ensuring that the NTC temperature sensing element 2 can accurately sense the temperature at the wire connection point while preventing it from overheating and being damaged. Simultaneously, a crimping process combined with solder reinforcement is used at the wire connection point to further reduce contact resistance and minimize interference from its own heat generation on temperature measurement.

[0038] Both the temperature difference monitoring unit 5 and the temperature compensation unit 6 are integrated into the STM32L431RCT6 microcontroller, and their respective functions are implemented through a modular software design. The microcontroller's internal program is written in C language and based on the FreeRTOS real-time operating system. Functions such as temperature difference sampling, data calculation, alarm control, and compensation correction are divided into different tasks, and a task scheduling mechanism ensures the real-time performance and reliability of each function. The temperature difference sampling task has the highest priority to ensure timely acquisition of temperature data; the compensation calculation task has the second highest priority to ensure rapid completion of compensation calculations after the sampling data is acquired; and the alarm control task has the lowest priority to prevent alarm signal processing from affecting the core temperature monitoring and compensation functions.

[0039] The temperature compensation unit 6 can be implemented through either hardware circuitry or embedded software. In practical applications, a single method or a combination of both can be selected depending on the requirements. When implemented using hardware circuitry, an analog compensation circuit is mainly constructed using operational amplifiers. An LM358 dual operational amplifier is selected; one operational amplifier amplifies the voltage divider signal from the NTC temperature sensing element 2, while the other operational amplifier superimposes the amplified temperature difference signal with the output signal from the digital temperature sensor 3 to achieve analog-level temperature compensation. The amplification factor and compensation coefficient of this hardware circuit can be calibrated by adjusting an external precision potentiometer to ensure compensation accuracy.

[0040] When implemented using embedded software, in addition to the aforementioned compensation algorithm based on regression equations, an adaptive compensation algorithm can be introduced. This algorithm uses a microcontroller to learn the temperature change patterns under different load conditions in real time, dynamically adjusting the parameters of the regression equation to further improve compensation accuracy. For example, when the device operates under a fixed load for an extended period, the software can automatically calculate the correspondence between the temperature difference under that load and the compensation value. If a deviation is found between the actual compensation effect and the theoretical value, the coefficients a and b of the regression equation are automatically corrected to make the compensation result closer to the actual situation. This software implementation method offers high flexibility, allowing the compensation algorithm to be updated via firmware upgrades without requiring modifications to the hardware circuitry.

[0041] To ensure stable operation of the device in complex electromagnetic environments, in addition to the aforementioned ESD protection circuit, electromagnetic shielding measures are also implemented on the circuit board. A grounded metal shield, made of 0.2mm thick tinplate, is placed around the NTC temperature sensing component 2 and the digital temperature sensor 3. This shield is connected to the ground plane of the circuit board via solder pads, effectively isolating external electromagnetic interference from affecting the sensor signal. Simultaneously, a common-mode inductor (ACM7060-601) and a safety capacitor (X2-0.22μF) are connected in series in the power input circuit to form an EMC filtering circuit. This reduces the impact of electromagnetic interference generated by the device itself on the power grid and other electrical equipment, complying with the requirements of the GB / T17626 electromagnetic compatibility standard.

[0042] The device's casing is made of ABS plastic with a UL94V-0 flame-retardant rating, offering excellent insulation and high-temperature resistance. Internal heat dissipation fins correspond to heat-generating components on the circuit board (such as power management chips), dissipating heat through conduction and convection to further reduce the impact of the device's own heat generation on temperature measurement. Ventilation holes with a louvered design are located on the casing corresponding to the load connection terminal 8, ensuring effective heat dissipation while preventing dust from entering the device. Furthermore, status indicator windows are provided on the casing for easy observation of the device's operating status, such as a green power indicator, a blue normal operation indicator, and a red alarm indicator.

[0043] During the debugging and calibration phase of the device, standard temperature calibration equipment is required to calibrate the accuracy of the NTC temperature sensing element 2 and the digital temperature sensor 3. For example, using a FLUKE51-II standard thermometer as a reference, the device is placed in a constant temperature environment chamber, and the readings of the NTC temperature sensing element 2, the digital temperature sensor 3, and the standard thermometer are compared at different temperature points. The deviation values ​​are recorded, and the temperature calculation algorithm inside the microcontroller is corrected based on the deviation values. For the digital temperature sensor 3SHT30, calibration commands can be sent via the I2C bus to adjust its internal temperature compensation coefficient, ensuring that its measurement accuracy meets the requirements throughout the entire operating temperature range.

[0044] The power management section of the device is also equipped with overcurrent and overvoltage protection circuits. Overcurrent protection uses a self-resetting fuse (model JK60-016). When the device's operating current exceeds 16A, the fuse automatically blows, cutting off the power circuit and preventing damage to the device due to overload. Overvoltage protection uses a transient voltage suppressor diode (model SMDJ6.5CA). When a transient overvoltage occurs, the diode quickly breaks down, clamping the voltage within a safe range and protecting subsequent circuits. These protection measures further improve the reliability and safety of the device, ensuring its long-term stable operation in complex electrical environments.

[0045] In terms of data transmission, in addition to the Wi-Fi communication module, an RS485 communication interface can be added. The MAX485 chip is used as the level conversion device. This chip operates at 3.3V and can achieve bidirectional conversion between TTL and RS485 levels, with a communication distance of up to 1200 meters, suitable for remote data transmission in industrial scenarios. The A and B pins of the RS485 interface are protected against ESD by TVS diodes (model SMF05C) to ensure the stability of the communication line. Through these communication interfaces, the device can interact with building automation systems, smart home systems, etc., to achieve centralized management and remote control of room temperature data, further expanding the device's application scenarios.

[0046] As is known from common technical knowledge, this utility model can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative in all respects and are not the only ones. All modifications within the scope of this utility model or its equivalents are included in this utility model.

Claims

1. A temperature rise compensation device for a socket-type room temperature acquisition device, characterized in that, The device includes a socket-type room temperature acquisition device body (1), an NTC temperature measuring element (2), and a digital temperature sensor (3), as well as a temperature difference monitoring unit (5) and a temperature compensation unit (6). The temperature difference monitoring unit (5) is connected to the NTC temperature measuring element (2) and the digital temperature sensor (3) and is used to monitor the temperature difference between the NTC temperature measuring element (2) and the digital temperature sensor (3) and generate a temperature difference signal. The temperature compensation unit (6) is connected to the temperature difference monitoring unit (5) and the digital temperature sensor (3) and is used to perform temperature compensation on the digital temperature sensor (3) according to the temperature difference signal.

2. The temperature rise compensation device for the socket-type room temperature acquisition device according to claim 1, characterized in that: The NTC temperature measuring component (2) is located near the external plug of the main body (1) of the socket-type room temperature acquisition device, and is used to monitor the temperature rise caused by the heating of the external plug and wires.

3. The temperature rise compensation device for the socket-type room temperature acquisition device according to claim 1, characterized in that: The NTC temperature measuring component (2) is located at the wire connection point of the main body (1) of the socket-type room temperature acquisition device, and is used to monitor the temperature rise caused by the heating of the external plug and wire.

4. The temperature rise compensation device for the socket-type room temperature acquisition device according to claim 1, characterized in that: The temperature difference monitoring unit (5) includes an alarm module (7), which is used to generate an alarm signal when the temperature difference reaches a set temperature difference alarm threshold.

5. The temperature rise compensation device for the socket-type room temperature acquisition device according to claim 4, characterized in that: The temperature compensation unit (6) is connected to the alarm module (7) and is used to initiate temperature compensation for the digital temperature sensor (3) when the alarm signal is received.

6. The temperature rise compensation device for the socket-type room temperature acquisition device according to claim 1, characterized in that: The temperature compensation unit (6) includes a data storage module and a compensation calculation module; the data storage module is used to store calibration temperature rise data and regression equation; the compensation calculation module is used to calculate compensation value based on the temperature difference signal, the calibration temperature rise data and the regression equation, and to correct the output of the digital temperature sensor (3).

7. The temperature rise compensation device for the socket-type room temperature acquisition device according to claim 1, characterized in that: The NTC temperature measuring component (2) and the digital temperature sensor (3) are integrated on the same circuit board of the main body (1) of the socket-type room temperature acquisition device.

8. The temperature rise compensation device for the socket-type room temperature acquisition device according to claim 1, characterized in that: The temperature difference monitoring unit (5) and the temperature compensation unit (6) are integrated into the control processor (4) of the main body (1) of the socket-type room temperature acquisition device.

9. The temperature rise compensation device for the socket-type room temperature acquisition device according to claim 1, characterized in that: The main body (1) of the socket-type room temperature acquisition device includes a power interface and a load connection terminal (8), and the NTC temperature measuring component (2) is set close to the load connection terminal (8).

10. The temperature rise compensation device for the socket-type room temperature acquisition device according to claim 1, characterized in that: The temperature compensation unit (6) is implemented by hardware circuit or embedded software and is used to compensate for the temperature rise of the digital temperature sensor (3) in real time.

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