Wafer clamping and limiting mechanism

Abstract

The utility model belongs to wafer detection technical field, concretely relates to a wafer clamping limiting mechanism, including tray body, positioning column, rotating assembly, limiting component and support component, multiple support components are configured on tray body, and be used for supporting wafer;Tray body is equipped with limiting component and rotating assembly, and rotating assembly includes first limiting column, and first limiting column is used for abutting to the circular edge of wafer, and limiting component includes multiple second limiting columns, and second limiting column is used for abutting to the plane edge of wafer, and tray body is equipped with positioning column, and is used for abutting to the notch of wafer;Through adjusting rotating assembly and limiting component, to make first limiting column and second limiting column or first limiting column and positioning column abut to the outer edge of wafer simultaneously, to clamp the wafer of different size;The utility model can be compatible with clamping multiple size specifications wafer, need not frequently replace tray because of detecting different size wafer, greatly improved detection efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of wafer inspection technology, specifically relating to a wafer clamping and limiting mechanism. Background Technology

[0002] An ultrasonic scanning microscope is a non-destructive testing device that utilizes a transmission medium. In operation, it employs scanning methods such as reflection or transmission to inspect for defects such as delamination, voids, and cracks within components, materials, wafers, and other samples.

[0003] When inspecting wafers using an ultrasonic scanning microscope, the wafers need to be loaded and positioned. Existing wafer carriers can only support wafers of a single size and cannot support wafers of different sizes. Typically, one size carrier corresponds to one size wafer. If the scanning and inspection equipment needs to scan wafers of different sizes, the carrier needs to be changed. However, scanning has high requirements for the levelness of the wafer. After changing the carrier, it is necessary to level the carrier to adapt it to the needs of wafer scanning. However, the carrier leveling operation is highly professional and time-consuming.

[0004] Therefore, it is necessary to improve upon the shortcomings of existing technologies in order to overcome their deficiencies in practical applications. Utility Model Content

[0005] Based on the aforementioned shortcomings and deficiencies in the prior art, one of the objectives of this utility model is to at least solve one or more of the aforementioned problems in the prior art. In other words, one of the objectives of this utility model is to provide a wafer clamping and limiting mechanism that meets one or more of the aforementioned requirements.

[0006] To achieve the above-mentioned objectives, this utility model adopts the following technical solution:

[0007] This utility model provides a wafer clamping and limiting mechanism, including a carrier body, positioning posts, a rotating assembly, a limiting assembly, and a support assembly. The carrier body is equipped with multiple support assemblies for supporting the wafer. The carrier body has a limiting assembly and a rotating assembly. The rotating assembly includes a first limiting post that abuts against the circular edge of the wafer. The limiting assembly includes multiple second limiting posts that abut against the planar edge of the wafer. The carrier body has positioning posts that abut against a notch in the wafer.

[0008] By adjusting the rotating assembly and the limiting assembly, the first limiting post and the second limiting post, or the first limiting post and the positioning post, simultaneously abut against the outer edge of the wafer to clamp wafers of different sizes.

[0009] As a preferred embodiment, two rotating components are configured, and the two rotating components are respectively rotated and engaged with the carrier plate body.

[0010] As a preferred embodiment, the rotating assembly further includes a rotating body and a rotating handle. The rotating body is provided with a first limiting post and a rotating handle, and the first limiting post abuts against the circular edge of the wafer.

[0011] As a preferred embodiment, the carrier plate body is provided with multiple threaded holes, and the threaded holes are arranged one-to-one with the rotating components; a plunger is installed inside the threaded holes.

[0012] As a preferred embodiment, the rotating body is symmetrically provided with conical holes, and the plunger is engaged with the conical holes.

[0013] As a preferred embodiment, the side wall of the rotating body is provided with a V-shaped groove, and when the rotating handle is rotated, the plunger rotates along the V-shaped groove.

[0014] As a preferred embodiment, the limiting component is detachably connected to the carrier plate body.

[0015] As a preferred embodiment, the limiting component further includes a fixing block, on which two parallel second limiting posts are provided, and the second limiting posts abut against the planar edge of the wafer.

[0016] As a preferred embodiment, the positioning post is provided with a locking protrusion, which engages with the notch on the wafer.

[0017] As a preferred embodiment, the carrier plate body is provided with three support components evenly distributed.

[0018] Compared with the prior art, the advantages of this utility model are:

[0019] This invention provides a wafer clamping and limiting mechanism that can be compatible with clamping wafers of various sizes and specifications, eliminating the need to frequently change carriers for testing wafers of different sizes, thus greatly improving testing efficiency.

[0020] This invention provides a wafer clamping and limiting mechanism. Through precise adjustment of the rotating and limiting components, it ensures stable clamping of the wafer on the carrier disk, effectively avoiding detection errors caused by wafer movement or shaking, and improving the accuracy and reliability of the inspection. The mechanism is compact, rationally designed, easy to operate and maintain, and provides great convenience for wafer inspection work. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of a wafer clamping and limiting mechanism according to an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the rotating component and plunger according to an embodiment of the present invention;

[0024] Figure 3 This is a cross-sectional view of the clamping and limiting mechanism according to an embodiment of the present utility model;

[0025] Figure 4 This is a schematic diagram showing the connection between the clamping and limiting mechanism and the wafer in an embodiment of this utility model;

[0026] Figure 5 This is a schematic diagram showing the connection between the clamping and limiting mechanism of this utility model and a wafer of another specification;

[0027] In the figure: 0 wafer, 1 carrier body, 11 threaded hole, 2 rotating assembly, 21 rotating body, 211 V-groove, 212 tapered hole, 22 rotating handle, 23 first limiting post, 24 plunger, 3 limiting assembly, 31 fixing block, 32 second limiting post, 4 support assembly, 5 positioning post, 51 locking protrusion. Detailed Implementation

[0028] To more clearly illustrate the embodiments of this application, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0029] In the description of the embodiments of this application, the terms "upper," "lower," "front," "rear," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," etc., are only used for distinction in description and have no special meaning.

[0030] When inspecting wafers using an ultrasonic scanning microscope, the wafers need to be clamped and positioned. Existing wafer carriers can only support wafers of a single size and cannot accommodate wafers of different sizes. According to SEMI standards, wafers generally come in various sizes such as 2-inch, 4-inch, 6-inch, 8-inch, and 12-inch. Wafers of 6-inch and smaller sizes generally have flat edges, while wafers of 8-inch and larger sizes generally have notches. For these different wafer sizes, current technology typically uses multiple carriers to position the wafers, and these carriers need to be changed. However, ultrasonic scanning microscopes have high requirements for the levelness of wafer inspection. After changing carriers, they need to be leveled to adapt to the wafer scanning requirements. However, carrier leveling is a highly specialized and time-consuming operation.

[0031] To address the aforementioned technical problems, some embodiments of this application are described below. Figures 1 to 5 As shown, a wafer clamping and limiting mechanism is provided, including a carrier body 1, a positioning post 5, a rotating assembly 2, a limiting assembly 3, and a support assembly 4. The carrier body 1 is equipped with multiple support assemblies 4 for supporting the wafer 0. The carrier body 1 has a limiting assembly 3 and a rotating assembly 2. The rotating assembly 2 includes a first limiting post 23 for abutting against the circular edge of the wafer 0. The limiting assembly 3 includes multiple second limiting posts 32 for abutting against the planar edge of the wafer 0. The carrier body 1 has a positioning post 5 for abutting against a notch on the wafer 0. By adjusting the rotating assembly 2 and the limiting assembly 3, the first limiting post 23 and the second limiting post 32, or the first limiting post 23 and the positioning post 5, can simultaneously abut against the outer edge of the wafer 0 to clamp wafers of different sizes.

[0032] In some embodiments of this application, two rotating components 2 are configured, and the two rotating components 2 are respectively rotated and engaged with the carrier body 1.

[0033] In some embodiments of this application, the rotating assembly 2 further includes a rotating body 21 and a rotating handle 22. The rotating body 21 is provided with a first limiting post 23 and a rotating handle 22. The first limiting post 23 abuts against the circular edge of the wafer 0. The rotating body 21 can be easily rotated by rotating handle 22, thereby driving the first limiting post 23 to move to realize the abutment and release operation of the circular edge of wafers of different sizes.

[0034] In some embodiments of this application, the carrier body 1 is provided with a plurality of threaded holes 11, and the threaded holes 11 are arranged one-to-one with the rotating components 2; a plunger 24 is installed inside the threaded hole 11, and the plunger 24 is threadedly engaged with the threaded hole 11, so that the rotating components 2 can be positioned and stabilized by the plunger 24.

[0035] In some embodiments of this application, the rotating body 21 is symmetrically provided with tapered holes 212, and the plunger 24 is engaged with the tapered holes 212 to ensure that the rotating body 21 can be stably fixed after rotating to a suitable position.

[0036] In some embodiments of this application, the side wall of the rotating body 21 is provided with a V-groove 211. When the rotating handle 22 is rotated, the plunger 24 rotates along the V-groove 211, thereby achieving precise adjustment of the rotating assembly 2.

[0037] In some embodiments of this application, the limiting component 3 is detachably connected to the carrier plate body 1, so that the limiting component 3 can be disassembled and replaced as needed.

[0038] In some embodiments of this application, the limiting component 3 further includes a fixing block 31, on which two parallel second limiting posts 32 are provided. The second limiting posts 32 abut against the planar edge of the wafer 0, such as... Figure 4 As shown, it can effectively limit the position of wafers with planar edges of 6 inches and below.

[0039] In some embodiments of this application, the positioning post 5 is provided with a latching protrusion 51, which engages with the notch of the wafer 0, such as... Figure 5 As shown, it can accurately locate notched wafers of 8 inches and above.

[0040] In some embodiments of this application, the carrier disk body 1 is uniformly provided with three support components 4, which can stably support the wafer 0 and ensure the levelness of the wafer 0 during the testing process.

[0041] According to some embodiments of this application, a wafer clamping and limiting mechanism is provided, which can be compatible with clamping wafers of various sizes and specifications, eliminating the need for frequent tray changes for inspecting wafers of different sizes, thus greatly improving inspection efficiency. Through precise adjustment of the rotating and limiting components, stable clamping of the wafer on the tray is ensured, effectively avoiding inspection errors caused by wafer movement or shaking, and improving the accuracy and reliability of inspection. This mechanism has a compact structure, reasonable design, and is easy to operate and maintain, providing great convenience for wafer inspection work.

[0042] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0043] The above description is only a detailed explanation of the preferred embodiments and principles of this application. For those skilled in the art, there may be changes in the specific implementation based on the ideas provided by this utility model, and these changes should also be considered within the scope of protection of this application.

Claims

1. A wafer clamping and limiting mechanism, characterized in that, The device includes a carrier body, positioning posts, a rotating assembly, a limiting assembly, and a support assembly. The carrier body is equipped with multiple support assemblies for supporting a wafer. The carrier body has a limiting assembly and a rotating assembly. The rotating assembly includes a first limiting post for abutting against the circular edge of the wafer. The limiting assembly includes multiple second limiting posts for abutting against the planar edge of the wafer. The carrier body has positioning posts for abutting against a notch in the wafer. By adjusting the rotating assembly and the limiting assembly, the first limiting post and the second limiting post, or the first limiting post and the positioning post, simultaneously abut against the outer edge of the wafer to clamp wafers of different sizes.

2. The wafer clamping and limiting mechanism according to claim 1, characterized in that, Two rotating components are configured, and the two rotating components are respectively rotated and engaged with the carrier plate body.

3. The wafer clamping and limiting mechanism according to claim 1, characterized in that, The rotating assembly further includes a rotating body and a rotating handle. The rotating body is provided with a first limiting post and a rotating handle, and the first limiting post abuts against the circular edge of the wafer.

4. The wafer clamping and limiting mechanism according to claim 3, characterized in that, The carrier plate body is provided with multiple threaded holes, and the threaded holes are arranged one-to-one with the rotating components; a plunger is installed inside the threaded holes.

5. A wafer clamping and limiting mechanism according to claim 4, characterized in that, The rotating body is symmetrically provided with conical holes, and the plunger is engaged with the conical holes.

6. A wafer clamping and limiting mechanism according to claim 4, characterized in that, The side wall of the rotating body is provided with a V-shaped groove. When the rotating handle is rotated, the plunger rotates along the V-shaped groove.

7. The wafer clamping and limiting mechanism according to claim 1, characterized in that, The limiting component is detachably connected to the carrier plate body.

8. A wafer clamping and limiting mechanism according to claim 7, characterized in that, The limiting component also includes a fixing block, on which two parallel second limiting posts are provided, and the second limiting posts abut against the planar edge of the wafer.

9. A wafer clamping and limiting mechanism according to claim 1, characterized in that, The positioning post is provided with a locking protrusion, which engages with the notch of the wafer.

10. A wafer clamping and limiting mechanism according to claim 1, characterized in that, The carrier disk body is uniformly provided with three support components.

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