Optical waveguide device and optoelectronic co-packaged chip

Abstract

The utility model discloses an optical waveguide device and photoelectricity co-encapsulation chip. Optical waveguide device includes: glass substrate, the upper surface of glass substrate is provided with recess, first metal layer, the surface of recess is covered by first metal layer, optical waveguide, set up in recess and be located above first metal layer, second metal layer, optical waveguide is wrapped in between second metal layer and first metal layer. The utility model discloses optical waveguide can avoid or reduce the deflection of photon in it, makes photon transmission in single direction in optical waveguide channel, reduces optical waveguide transmission loss.

Description

Technical Field

[0001] This utility model relates to an optical waveguide device and an optoelectronic co-packaged chip. Background Technology

[0002] Co-packaged optoelectronics (CPO) is an optoelectronic integration technology used in data center interconnects, particularly in switch interfaces. By mounting the switching chip and optical devices together in the same slot, optical and electrical signals can be converted and processed on the same chip. This technology shortens the trace distance between the chip and the module, minimizes high-speed electrical channel losses and impedance discontinuities, and significantly reduces power consumption while increasing transmission rates.

[0003] Patent CN100510812C discloses an optoelectronic substrate comprising a conductive plate and a light guide plate, which are bonded together using a lamination process. The light guide plate includes a first substrate and a light guide layer formed on the first substrate. The light guide layer consists of an optical waveguide and a cover layer encapsulating the optical waveguide. Integrating the optical waveguide with the printed circuit board (PCB) process allows it to become a layer within the PCB, enabling it to transmit optical signals. However, this optoelectronic substrate suffers from the following problems: photons experience deflection losses during propagation within the optical waveguide, and photons cannot be guaranteed to propagate in a single direction.

[0004] The information disclosed in the background section is only intended to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0005] To address the aforementioned technical problems, this utility model provides an optical waveguide device and an optoelectronic co-packaged chip. The optical waveguide can avoid or reduce the deflection of photons within it, enabling photons to propagate in a single direction within the optical waveguide channel and reducing optical waveguide transmission loss.

[0006] The first aspect of this utility model provides an optical waveguide device, comprising: A glass substrate, wherein a groove is provided on the glass substrate; A first metal layer, the surface of the groove is covered by the first metal layer; An optical waveguide is disposed within the groove and located above the first metal layer; A second metal layer is formed between the optical waveguide and the first metal layer.

[0007] In some preferred embodiments, the first metal layer and the second metal layer are connected and form a shell structure, the shell structure being fitted over the optical waveguide. In some preferred embodiments, the housing structure is hollow and open at both ends, with the optical waveguide exposed only at both ends of the housing structure.

[0008] In some preferred embodiments, a plurality of grooves are formed on the glass substrate to form a plurality of optical waveguides, the plurality of optical waveguides having different refractive indices.

[0009] In some preferred embodiments, the optical waveguide is made of liquid glass, which solidifies in the groove to form the optical waveguide.

[0010] In some preferred embodiments, the thickness of the optical waveguide is 100 Å to 50 μm.

[0011] In some preferred embodiments, the first metal layer includes one of Ti, TiN, Al, Cu, Ta, and TaN, and the thickness of the first metal layer is 10 Å to 20000 Å.

[0012] In some preferred embodiments, in step S5, the second metal layer includes one of Ti, TiN, Al, Cu, Ta, and TaN, and the thickness of the second metal layer is 10 Å to 20000 Å.

[0013] In some preferred embodiments, an adhesive material is coated on the surface of a glass substrate and a second metal layer, and another glass substrate is inverted on the adhesive material, and the two glass substrates are connected by the adhesive material; or, an adhesive material is coated on the surface of a glass substrate without grooves, and another glass substrate is placed on the adhesive material, and the two glass substrates are connected by the adhesive material. The adhesive material includes liquid glass.

[0014] A second aspect of this utility model provides an optoelectronic co-packaged chip, including a printed circuit board layer and the aforementioned optical waveguide device, wherein the optical waveguide device is stacked on the printed circuit board layer.

[0015] In some preferred embodiments, the optoelectronic co-packaged chip includes a plurality of optical waveguide devices, wherein the grooved surfaces of the glass substrates of at least two optical waveguide devices are stacked and connected to each other, or the opposite surfaces of the glass substrates of at least two optical waveguide devices to the grooved surfaces are stacked and connected to each other.

[0016] The present invention adopts the above solution and has the following advantages compared with the prior art: This invention relates to an optical waveguide device in which the optical waveguide is completely encased in a metal layer to form an optical transmission channel. Photons can travel continuously in one direction within this channel, rather than being deflected on the waveguide surface, thus avoiding or reducing photon transmission loss and ensuring unidirectional photon transmission. This optical waveguide device is suitable for application in optoelectronic packaged chips to realize the interconnection and conversion of electrical and optical signals, and can serve as a control and processing module in AI systems.

[0017] In a further preferred embodiment, optical waveguides with different refractive indices can be obtained on the same glass substrate, which can convert the added electrical signal into multiple different optical signals, thereby accelerating the signal processing speed. Attached Figure Description

[0018] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart illustrating the fabrication process of an optical waveguide device according to an embodiment of the present invention.

[0020] Figure 2 This is a schematic diagram of a glass substrate according to an embodiment of the present invention.

[0021] Figure 3 This is a schematic diagram of the photoresist film after development according to an embodiment of the present invention.

[0022] Figure 4 This is a schematic diagram showing the groove formed according to an embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram showing the photoresist film after it has been removed according to an embodiment of the present invention.

[0024] Figure 6 This is a schematic diagram of the first metal layer deposited according to an embodiment of the present invention.

[0025] Figure 7 This is a schematic diagram showing the optical waveguide after being installed according to an embodiment of the present invention.

[0026] Figure 8 This is a schematic diagram showing the deposition of the second metal layer according to an embodiment of the present invention.

[0027] Figure 9 This is a schematic diagram of an optical waveguide device according to an embodiment of the present invention.

[0028] Figure 10This is a schematic diagram of another optical waveguide device according to an embodiment of the present invention.

[0029] in: 100. Optical waveguide devices; 1. Glass substrate; 2. Photoresist film; 3. Groove; 4. First metal layer; 5. Optical waveguide; 6. Second metal layer; 7. Shell structure; 8. Adhesive material. Detailed Implementation

[0030] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is intended to aid in understanding the present invention, but does not constitute a limitation thereof.

[0031] In this document, the terms “upper,” “lower,” “front,” “rear,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0032] Figure 1 An embodiment of a method for fabricating an optical waveguide device is shown. Figures 2 to 9 An embodiment of an optical waveguide device or its constituent components is illustrated. (Combined) Figures 2 to 9 As shown, the optical waveguide device includes a glass substrate 1, a first metal layer 4, an optical waveguide 5, and a second metal layer 6. A groove 3 is provided on the glass substrate 1, and the surface of the groove 3 is covered by the first metal layer 4. The optical waveguide 5 is disposed in the groove 3 and located on the first metal layer 4, and the optical waveguide 5 is wrapped between the second metal layer 6 and the first metal layer 4.

[0033] Reference Figure 1 and combined Figures 2 to 9 The fabrication method of this optical waveguide device includes the following steps: S1. Provide glass substrate; S2. A groove is prepared on the glass substrate; S3. A first metal layer is deposited on a glass substrate, and the surface of the groove is covered by the first metal layer; S4. An optical waveguide is placed inside the groove; S5. A second metal layer is deposited on the glass substrate, and the optical waveguide is wrapped between the second metal layer and the first metal layer. S6. Retain the first metal layer and the second metal layer above the groove, and remove the other first metal layer and the other second metal layer on the surface of the glass substrate.

[0034] In step S1, the glass substrate 1 can be ordinary glass or encapsulation-specific glass, such as borosilicate glass BF33 or EXG, etc. (Refer to...) Figure 2 .

[0035] In step S2, grooves 3 are fabricated on the glass substrate 1 using photolithography. Specifically, a photoresist film 2 is first fabricated on the surface of the glass substrate 1. This film can be a liquid film or a dry film, and can be a negative or positive photoresist. The thickness of the photoresist film 2 is 100 Å to 20 μm. The photoresist material can be coated onto the surface of the glass substrate 1, for example, by spin-coating; or it can be laminated onto the surface of the glass substrate 1. Subsequently, the photoresist film 2 is selectively exposed and developed to form a patterned photoresist film 2, exposing a portion of the surface of the glass substrate 1, as shown in the reference image. Figure 3 Exposure can be performed using a photolithography machine or a laser direct imaging device, while development can be performed using organic or inorganic alkaline solutions.

[0036] The area of ​​the glass substrate 1 not covered by the photoresist film 2 is etched, for example, using a solution containing fluoride, sodium, or potassium ions. A groove 3 is formed by localized downward etching of the glass substrate 1, such as... Figure 4 As shown. Then, remove the remaining photoresist film 2 from the upper surface of the glass substrate 1, for example, using an organic or inorganic alkaline solution, leaving only the glass substrate 1 with the etched grooves 3, as shown. Figure 5 As shown.

[0037] In other embodiments, the glass substrate 1 with the groove 3 can be formed by an imprinting process or an injection molding process.

[0038] Reference Figure 5 The groove 3 extends along a predetermined direction and penetrates from one edge of the glass substrate 1 to the other edge. For example, the groove 3 extends along the first side length direction of the glass substrate 1 and penetrates from the second edge to the third edge of the glass substrate 1. The second and third edges are opposite to each other and parallel to each other, and the two ends of the groove 3 are open. The cross-section of the groove 3 can be rectangular, arc-shaped, etc. In this embodiment, multiple grooves 3 are simultaneously prepared on the glass substrate 1, and the multiple grooves 3 are arranged side by side.

[0039] In step S3, the first metal layer 4 can be deposited on the glass substrate 1 by ALD, PVD, CVD, MOCVD, chemical plating, or electroplating methods, as shown in the figure. Figure 6 The deposited material can be an elemental metal or a metal compound, including one or more combinations of Ti, TiN, Al, Cu, Ta, and TaN. The thickness of the first metal layer 4 is 10 Å to 20,000 Å. In this embodiment, the first metal layer 4 covers the entire upper surface of the glass substrate 1 and the entire surface of the groove 3.

[0040] In step S4, the optical waveguide material includes liquid glass. The liquid glass is injected into the groove 3 and solidified to form the optical waveguide 5. (Refer to...) Figure 7 The thickness of the optical waveguide 5 is 100 Å to 50 μm. Further, in step S4, the injected liquid glass is baked to solidify at a temperature of 25 to 300 degrees Celsius. The liquid glass comprises a silicon dioxide substrate and metal ions, including but not limited to Na, Ba, K, or Mg. The liquid glass injected into different grooves 3 can be different, for example, in terms of density or the metal ions it contains, resulting in optical waveguides 5 solidified in different grooves 3 having different refractive indices. After the liquid glass is injected into the groove 3, the next process is carried out after the liquid glass has leveled.

[0041] In step S5, the second metal layer 6 can be deposited on the glass substrate 1 by ALD, PVD, CVD, MOCVD, chemical plating, or electroplating methods, specifically deposited on the first metal layer 4 and the optical waveguide 5, as shown in the figure. Figure 8 The deposited material can be a metallic element or a metallic compound, including one or more combinations of Ti, TiN, Al, Cu, Ta, and TaN. The thickness of the second metal layer 6 is 10 Å to 20,000 Å. In this embodiment, the second metal layer 6 completely covers the first metal layer 4 and the optical waveguide 5. The first metal layer 4 can be the same or different.

[0042] In step S6, the first metal layer 4 and the second metal layer 6 located directly above the groove 3 are removed by photolithography, leaving only the first metal layer 4 inside the groove 3, the optical waveguide 5, the second metal layer 6 directly above the groove 3, and a small amount of the first metal layer 4, forming... Figure 9 The diagram shows a single optical waveguide device 100. In the optical waveguide device 100, a first metal layer 4 and a second metal layer 6 are connected and enclose a shell structure 7. The shell structure 7 is fitted over the optical waveguide 5, and the first metal layer 4 and the second metal layer 6 are tightly connected without any gap between them. The shell structure 7 is hollow and open at both ends, forming a narrow channel. The optical waveguide 5 is only exposed at both ends of the shell structure 7 to facilitate coupling of optical or electrical signal transmitting or receiving devices. Multiple grooves 3 can be fabricated on the glass substrate 1 to form multiple optical waveguides 5, and the multiple optical waveguides 5 have different refractive indices. Specifically, optical waveguides 5 with different refractive indices can be obtained by adjusting the liquid glass injected into the grooves 3, for example, by adjusting the density of the liquid glass or the metal ions it contains, so that the optical waveguides 5 solidified in different grooves 3 have different refractive indices.

[0043] In step S6, the specific photolithography steps may include: depositing a liquid photoresist film or dry film with a thickness of 100 Å to 20 μm on the second metal layer 6, locally exposing and developing it, retaining only the portion directly above the groove 3, and removing the other portions of the liquid photoresist film or dry film; subsequently, using an etching method, removing the second metal layer 6 and the first metal layer 4 not covered by the liquid photoresist film or dry film, retaining only the first metal layer 4 and the second metal layer 6 directly above the groove 3; finally, removing the liquid photoresist film or dry film directly above the groove 3. The etching method may employ dry etching using chemical gases (e.g., containing chlorine, fluorine, or ozone), or use substances containing Fe, Cl, hydrogen peroxide, or H₂O. + Wet etching is performed using a chemical solution.

[0044] In one embodiment, the fabrication method of the optical waveguide device 100 further includes a docking step. The docking step includes: coating an adhesive material onto the surface of a glass substrate 1 and a second metal layer 6; inverting another glass substrate 1 onto the adhesive material; and connecting the two glass substrates 1 using the adhesive material to obtain... Figure 10 The multilayer mating optical waveguide device 100 is shown. In another embodiment, an adhesive material is coated on the surface of a glass substrate 1 without grooves 3, and another glass substrate 1 is placed on the adhesive material to connect the two glass substrates 1. The adhesive material includes liquid glass with a coating thickness of 100 Å to 50 μm after coating. (See reference...) Figure 10 As shown, it consists of two Figure 9 The optical waveguide device 100 shown is formed by vertically connecting the two devices. In some other embodiments, more optical waveguide devices 100 can be stacked vertically using liquid glass to form more optical waveguide channels 5.

[0045] The specific implementation method of fabricating the optical waveguide device 100 in this embodiment is as follows: S100, Provides glass substrate 1; S101. A photoresist film 2 is disposed on the upper surface of the glass substrate 1, and selectively exposed, developed and etched to prepare multiple grooves 3 on the glass substrate 1, and the residual photoresist film 2 is removed. S102. A first metal layer 4 with a thickness of 10A~20000A is deposited on the upper surface of the glass substrate 1, and the surface of the groove 3 is covered by the first metal layer 4. S103. Liquid glass is injected into the groove 3 and solidified to form an optical waveguide 5, wherein the two sides and the lower surface of the optical waveguide 5 are covered by a first metal layer 4; the liquid glass includes a silicon dioxide substrate and metal ions; S104. A second metal layer 6 with a thickness of 10A~20000A is deposited on the upper surface of the glass substrate 1. The upper surface of the optical waveguide 5 and the first metal layer 4 that is not blocked by the optical waveguide 5 are both covered by the second metal layer 6, so that the optical waveguide 5 is wrapped between the second metal layer 6 and the first metal layer 4. S105. A patterned photoresist film is formed on the upper surface of the glass substrate 1. The photoresist film is located directly above the groove 3 to shield the first metal layer 4 and the second metal layer 6 around the optical waveguide 5. S106. Selective metal etching: retain the first metal layer 4 and the second metal layer 6 directly above the groove 3, and remove the other first metal layer 4 and other second metal layers 6 on the surface of the glass substrate 1 to obtain a single optical waveguide device.

[0046] The embodiment also provides an optoelectronic co-packaged chip. The optoelectronic co-packaged chip includes a printed circuit board layer and an optical waveguide device 100, which are stacked on top of each other.

[0047] Furthermore, the optoelectronic co-packaged chip may include multiple optical waveguide devices 100. Among them, the surfaces of the glass substrates 1 of at least two optical waveguide devices 100 with grooves 3 are stacked and connected to each other; or the other surfaces of the glass substrates 1 of at least two optical waveguide devices 100 opposite to the surfaces with grooves 3 are stacked and connected to each other.

[0048] In the embodiment of the optical waveguide device 100, the optical waveguide 5 is completely encased in a metal layer to form an optical transmission channel. Photons can travel continuously in one direction within this channel, rather than being deflected on the surface of the optical waveguide 5, thus avoiding or reducing photon transmission loss and ensuring unidirectional photon transmission. Furthermore, optical waveguides 5 with different refractive indices can be obtained on the same glass substrate 1, which can convert the input electrical signal into multiple different optical signals, thereby accelerating signal processing. This optical waveguide device 100 is suitable for application in optoelectronic packaging chips to realize the interconnection and conversion of electrical and optical signals, and can serve as a control processing module for AI systems.

[0049] It should be noted that the rectangular or bow-shaped shapes mentioned in this application refer to the objects forming approximate rectangular or bow-shaped shapes when viewed as a whole. When viewed at a small scale, the edges of these shapes may not be straight lines, and the angles of these shapes may not be the intersections of straight lines.

[0050] As indicated in this specification and claims, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, and these steps and elements do not constitute an exclusive list; the method or apparatus may also include other steps or elements. The term "and / or" as used herein includes any combination of one or more of the associated listed items.

[0051] It can be further understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar.

[0052] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature.

[0053] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0054] The above embodiments are only for illustrating the technical concept and features of this utility model, and are preferred embodiments. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly, and should not be construed as limiting the protection scope of this utility model. All equivalent transformations or modifications made based on the principles of this utility model should be covered within the protection scope of this utility model.

Claims

1. An optical waveguide device, characterized in that, include: A glass substrate, wherein a groove is provided on the glass substrate; A first metal layer, the surface of the groove is covered by the first metal layer; An optical waveguide is disposed within the groove and located above the first metal layer; A second metal layer is formed between the optical waveguide and the first metal layer.

2. The optical waveguide device according to claim 1, characterized in that, The first metal layer and the second metal layer are connected and form an outer shell structure, which is fitted over the optical waveguide.

3. The optical waveguide device according to claim 2, characterized in that, The outer shell structure is hollow and open at both ends, with the optical waveguide only exposed at both ends of the outer shell structure.

4. The optical waveguide device according to claim 1, characterized in that, Multiple grooves are formed on the glass substrate to create multiple optical waveguides, and the multiple optical waveguides have different refractive indices.

5. The optical waveguide device according to claim 1, characterized in that, The optical waveguide is made of liquid glass, which solidifies in the groove to form the optical waveguide.

6. The optical waveguide device according to claim 1, characterized in that, The thickness of the optical waveguide is 100 Å to 50 μm.

7. The optical waveguide device according to claim 1, characterized in that, The first metal layer includes one of Ti, TiN, Al, Cu, Ta, and TaN, and the thickness of the first metal layer is 10 Å to 20000 Å.

8. The optical waveguide device according to claim 1, characterized in that, The second metal layer includes one of Ti, TiN, Al, Cu, Ta, and TaN, and the thickness of the second metal layer is 10 Å to 20000 Å.

9. A co-packaged optoelectronic chip, characterized in that, It includes a printed circuit board layer and an optical waveguide device according to any one of claims 1 to 8, wherein the optical waveguide device is stacked on the printed circuit board layer.

10. The optoelectronic co-packaged chip according to claim 9, characterized in that, The device includes multiple optical waveguide devices, wherein the surfaces of the glass substrates of at least two optical waveguide devices with grooves are stacked and connected to each other, or the surfaces of the glass substrates of at least two optical waveguide devices opposite to the surfaces with grooves are stacked and connected to each other.

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