An optical module

Abstract

The application discloses an optical module, comprising a circuit board, a laser assembly, a light detection assembly and a receiving optical fiber assembly. The circuit board has a first surface and a second surface opposite to each other in the thickness direction, and is provided with a hollow part and a groove. The hollow part penetrates through the first surface and the second surface in the thickness direction. The groove is arranged at the edge of the hollow part and is communicated with the hollow part. The groove is recessed from the first surface to the second surface. The bottom of the groove is provided with a bonding pad. The laser assembly is arranged in the hollow part. The laser assembly and the bonding pad are electrically connected through a bonding wire to electrically connect the laser assembly and the circuit board. The receiving optical fiber assembly is arranged on the first surface and above the hollow part and the groove. In this way, the problem of interference between the bonding wire and the optical fiber of the receiving optical fiber assembly can be solved. Moreover, the length of the bonding wire between the bonding pad and the laser assembly can be shortened, so that the signal crosstalk is reduced, and the signal transmission quality and stability of the optical module are improved.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, specifically to an optical module. Background Technology

[0002] In recent years, the global cloud computing data center market has continued to expand, and the construction of 5G telecommunications networks has been fully launched, leading to a growing demand for high-speed optical modules. The successive introduction of various product series provides customers in cloud computing data centers, wireless access, and transmission fields with more choices regarding optical module products.

[0003] With the continuous iteration and upgrading of optical communication technology, the increase in optical communication products is not simply a matter of doubling the numbers. Entering the 800G and 1.6T stages, in addition to the increase in speed, there is also an increase in the number of optical fibers due to the high speed. The space on the existing optical module's PCBA board is limited. Due to the increased number of optical fibers, interference can occur between the receiving fiber of the optical module and the laser wire bonding pads on the PCBA board. To prevent interference between the receiving fiber and the wire bonding pads, moving the laser wire bonding pads on the PCBA board would result in a wire length increase of more than 2 times. This increased wire length would inevitably generate greater crosstalk, affecting the performance of the optical module product. Utility Model Content

[0004] This application provides an optical module designed to solve the problem of increased internal crosstalk in the optical module due to excessively long wire bonding length between the laser and the circuit board.

[0005] This application provides an optical module, including: A circuit board has a first surface and a second surface opposite to each other in its thickness direction. The circuit board has a cutout and a groove. The cutout extends through the first surface and the second surface along the thickness direction. The groove is located at the edge of the cutout and communicates with the cutout. The groove is recessed from the first surface toward the second surface. The bottom of the groove is provided with a solder pad. A laser assembly is disposed within the cutout portion, and the laser assembly is electrically connected to the pad via bonding wires to electrically connect the laser assembly and the circuit board; A photodetector assembly is disposed on the first surface of the circuit board and positioned on the opposite side of the cutout portion and the groove. A receiving fiber optic assembly, one end of which is optically coupled to the photodetector assembly, and the other end of which is used to receive optical signals from outside the optical module; The receiving optical fiber assembly is disposed on the first surface of the circuit board and spans over the cutout and the groove. The pads are spaced apart from the receiving optical fiber assembly in the thickness direction.

[0006] Optionally, the distance between the pad and the receiving optical fiber assembly in the thickness direction of the circuit board is a, and a satisfies: 0.3mm≤a≤0.5mm.

[0007] Optionally, the depth from the first surface of the circuit board to the bottom of the groove is h, and h satisfies: 0.3mm≤h≤0.65mm.

[0008] Optionally, the bonding leads and the receiving optical fiber assembly are spaced apart in the thickness direction of the circuit board.

[0009] Optionally, the pads and the receiving optical fiber assembly are offset from each other in the width direction of the circuit board.

[0010] Optionally, in the width direction of the circuit board, the distance between the pad closest to the receiving optical fiber assembly and the receiving optical fiber assembly is b, and b satisfies: 0.5mm≤b≤1mm.

[0011] Optionally, the laser assembly includes at least a first laser and a second laser, and at least two of the first lasers and the second laser are spaced apart in the cutout portion along the width direction of the circuit board; The bottom of the groove is provided with a plurality of pads, and the plurality of pads are electrically connected to the first laser and the second laser respectively through the bonding wires; The multiple pads are arranged in two rows, with the two rows of pads spaced apart along the length of the circuit board, and the multiple pads in the same row spaced apart along the width of the circuit board.

[0012] Optionally, a row of pads adjacent to the laser assembly includes a first pad, a second pad, and a third pad, wherein the distances between the first pad, the second pad, and the third pad and the receiving fiber assembly increase sequentially in the width direction of the circuit board. In the width direction of the circuit board, the first laser is closer to the receiving fiber optic assembly than the second laser; The first pad and the second pad are respectively electrically connected to the first laser; The other row of pads includes a fourth pad and a fifth pad, wherein the third, fourth and fifth pads are electrically connected to the second laser.

[0013] Optionally, a first adhesive portion is provided at the connection between the side of the groove opposite to the hollow portion and the first surface of the circuit board to fix the receiving optical fiber assembly.

[0014] Optionally, the photodetector is disposed on the circuit board near the edge of the cutout portion; The receiving optical fiber assembly and the optical detection assembly are optically coupled at one end with a first coupling part, and the projection of the first coupling part on the circuit board falls into the hollow part.

[0015] Optionally, the optical module further includes: The transmitting end photonic integrated chip is disposed on the second surface of the circuit board and is located on the other side of the cutout portion opposite to the groove; The transmitting fiber assembly has a second coupling part at one end for optical coupling with the transmitting end photonic integrated chip through the second coupling part, and the other end is used to transmit optical signals to the outside of the optical module; the transmitting fiber assembly is disposed on the first surface of the circuit board, and the second coupling part passes through the cutout of the circuit board for optical coupling with the transmitting end photonic integrated chip disposed on the second surface.

[0016] Optionally, a second adhesive portion is provided at the connection between the side of the cutout portion away from the photonic integrated chip at the transmitter and the first surface of the circuit board to fix the transmitting fiber assembly.

[0017] Optionally, the cutout portion includes a first region and a second region that are connected to each other. The first region extends along the width direction of the circuit board, and the second region extends along the length direction of the circuit board on the side of the first region away from the photonic integrated chip at the transmitting end. The laser assembly, the first coupling portion, and the second coupling portion are disposed in the first region, and the second region is used to avoid the transmitting fiber assembly.

[0018] Optionally, in the width direction of the circuit board, the size of the first region is larger than the size of the second region; the second region is connected to the middle of the first region, and the second coupling portion is located in the middle of the first region; The receiving fiber optic assembly, laser assembly, and pad are each provided in two sets. The two sets of laser optic assemblies are respectively located on both sides of the second coupling part, and the two sets of receiving fiber optic assemblies are respectively located on the side of the two sets of laser optic assemblies away from the second coupling part. The groove includes two parts located on both sides of the second region, and two sets of pads are respectively disposed on the two parts of the groove to electrically connect the two sets of laser components.

[0019] The beneficial effects of this application are: by setting a groove on the circuit board and placing the pads for connecting to the laser components at the bottom of the groove, not only can the problem of interference between the bonding wires and the optical fiber be solved, but the length of the bonding wires between the pads and the laser components can also be shortened, thereby reducing signal crosstalk and helping to improve the signal transmission quality and stability of the optical module.

[0020] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0023] Figure 1 This is a schematic diagram of the overall structure of the optical module shown in this application; Figure 2 This is a schematic diagram of the circuit board in the optical module shown in this application from one perspective; Figure 3 yes Figure 2 A schematic diagram of the circuit board in the optical module from another perspective; Figure 4 yes Figure 2 Schematic diagram of the structure at point A in the diagram; Figure 5 yes Figure 2 A top view of the circuit board structure in the optical module shown. Figure 6 yes Figure 5 A cross-sectional view of the three-dimensional structure along the BB direction; Figure 7 yes Figure 6 Schematic diagram of the structure at point D in the diagram; Figure 8 yes Figure 7 Schematic diagram of the structure at point E in the diagram; Figure 9 yes Figure 7 Schematic diagram of the structure at point F in the diagram; Figure 10 yes Figure 5 A schematic diagram of the structure at point C.

[0024] Explanation of reference numerals in the attached figures: 10. Circuit board; 100. Cutout; 101. Groove; 102. Photodetector assembly; 103. First bonding part; 104. Transmitter photonic integrated chip; 105. Second bonding part; 106. First surface; 107. Second surface; 110. First region; 120. Second region; 20. Receiving fiber assembly; 200. Fiber optic connector; 201. First coupling part; 30. Housing; 301. Optical port; 302. Electrical port; 40. Laser assembly; 41. First laser; 42. Second laser; 50. Pad; 51. First pad; 52. Second pad; 53. Third pad; 54. Fourth pad; 55. Fifth pad; 60. Transmitting fiber assembly; 600. Second coupling part; 70. Bonding wire; X, length direction; Y, width direction; Z, thickness direction. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0026] Reference Figures 1 to 3 This application provides an optical module, including a housing 30, and a circuit board 10, a laser assembly 40, a transmitting photonic integrated chip 104, a photodetector assembly 102, a transmitting fiber optic assembly 60, and a receiving fiber optic assembly 20 disposed within the housing 30. The housing 30 has opposing optical ports 301 and electrical ports 302. One end of the circuit board 10 extends out of the electrical port 302 for electrical connection with external devices. An optical fiber connector 200 is provided within the optical port 301, and one end of both the transmitting fiber optic assembly 60 and the receiving fiber optic assembly 20 are fixed within the optical fiber connector 200 for connection to external optical fibers via the connector 200. In other optical modules, the transmitting fiber optic assembly 60 and the receiving fiber optic assembly 20 may also extend directly out of the optical port 301, with the optical fiber connector 200 located outside the optical port 301.

[0027] Laser assembly 40 emits continuous light, which is input to transmitter photonic integrated chip 104. Transmitter photonic integrated chip 104 modulates the input light and outputs a modulated optical signal. Transmitting fiber assembly 60 transmits the modulated optical signal to a transmission fiber outside the optical module. Receiving fiber assembly 20 receives externally input optical signals from outside the optical module and transmits them to photodetector assembly 102. Photodetector assembly 102 converts the received optical signal into an electrical signal and outputs the electrical signal via circuit board 10.

[0028] In the embodiments of this application, please refer to Figures 2 to 4 The circuit board 10 has lines intersecting in a length direction X, a width direction Y, and a thickness direction Z, and has a first surface 106 and a second surface 107 facing away from each other in the thickness direction Z. The circuit board 10 has a cutout portion 100 and a groove 101. The cutout portion 100 extends through the first surface 106 and the second surface 107 along the thickness direction Z, and the groove 101 is located at the edge of the cutout portion 100 and connects to it. The groove 101 is recessed from the first surface 106 toward the second surface 107, and a pad 50 is provided at the bottom of the groove 101. Thus, compared to the form where the pad 50 is directly set on the first surface 106 of the circuit board 10, this embodiment provides a groove 101 on the circuit board 10 and places the pad 50 at the bottom of the groove 101, causing the pad 50 to sink, which can avoid interference between the bonding leads 70 on the pad 50 and components such as the receiving optical fiber assembly 20. The circuit board 10 includes several layers of conductive layers and dielectric layers alternately arranged in the thickness direction Z, and the dielectric layers are made of insulating material. The pad 50 is electrically connected to the conductive layer inside the circuit board 10.

[0029] The laser assembly 40 is disposed within the cutout portion 100. The laser assembly 40 and the bonding pad 50 are electrically connected via bonding wires 70 to electrically connect the laser assembly 40 and the circuit board 10. Specifically, the optical module may also include a heat sink (not shown), which is fixedly connected to the circuit board 10 and at least partially covers the cutout portion 100 to support the laser assembly 40. Furthermore, the heat sink dissipates heat from the laser assembly 40, ensuring its normal operation. By placing the bonding pad 50 at the bottom of the groove 101, allowing it to sink, the length of the bonding wires 70 between the bonding pad 50 and the laser assembly 40 can be shortened, thereby reducing signal crosstalk within the optical module. It should be noted that the bonding pad 50 is located at the bottom of the groove 101 on the side adjacent to the laser assembly 40, which further shortens the length of the bonding wires 70 and further reduces signal crosstalk within the optical module.

[0030] The photodetector 102 is disposed on the first surface 106 of the circuit board 10, and is located on the opposite side of the cutout 100 and the groove 101. The photodetector 102 is disposed on the first surface 106 of the circuit board 10 and is electrically connected to the circuit board 10.

[0031] One end of the receiving fiber optic assembly 20 is optically coupled to the photodetector assembly 102, and the other end is used to receive optical signals from outside the optical module. The receiving fiber optic assembly 20 includes a fiber bundle for transmitting the received external optical signals to the photodetector assembly 102.

[0032] The receiving fiber optic assembly 20 is disposed on the first surface 106 of the circuit board 10, spanning above the cutout 100 and the groove 101. The pads 50 and the receiving fiber optic assembly 20 are spaced apart in the thickness direction Z. The receiving fiber optic assembly 20 extends approximately along the length direction X of the circuit board 10 on the first surface 106, spanning above the cutout 100 and the groove 101. Placing the pads 50 at the bottom of the groove 101 increases the spacing between the receiving fiber optic assembly 20 and the pads 50 in the thickness direction Z, thereby providing space for bonding leads 70 on the pads 50 and avoiding interference between the bonding leads 70 and the receiving fiber optic assembly 20 due to excessively close proximity.

[0033] As described above, by setting a groove 101 on the circuit board 10 and placing the pad 50 for connection with the laser assembly 40 at the bottom of the groove 101, not only can the problem of interference between the bonding wire 70 and the optical fiber be solved, but the length of the bonding wire 70 between the pad 50 and the laser assembly 40 can also be shortened, thereby reducing signal crosstalk and helping to improve the signal transmission quality and stability of the optical module.

[0034] Please refer to Figures 5 to 8 The distance between the pad 50 and the receiving fiber optic assembly 20 in the thickness direction Z of the circuit board 10 is 'a'. In some embodiments, this distance 'a' satisfies: 0.3mm ≤ a ≤ 0.5mm. This prevents interference between the bonding lead 70 connected to the pad 50 and the receiving fiber optic assembly 20 due to excessive proximity, shortens the length of the bonding lead 70, and ensures sufficient thickness and strength of the circuit board 10 at the groove 101. 'a' can be any value or range of values ​​from 0.3, 0.32, 0.34, 0.36, 0.38, 0.4, 0.42, 0.44, 0.46, 0.48, and 0.5, all of which are within the scope of protection of this application.

[0035] Please refer to Figure 7 and Figure 9 The depth from the first surface 106 of the circuit board 10 to the bottom of the groove 101 is h. In some embodiments, the depth h satisfies: 0.3mm ≤ h ≤ 0.65mm. Specifically, setting the depth h of the groove 101 within the range of 0.3mm ≤ h ≤ 0.65mm ensures that the bonding pad 50 at the bottom of the groove 101 has sufficient depth to accommodate the bonding lead 70 after it is connected, preventing interference between the bonding lead 70 and the receiving optical fiber assembly 20 due to excessive proximity, and shortening the length of the bonding lead 70. It should be noted that, in order to ensure that the circuit board 10 has sufficient thickness and strength at the groove 101, the ratio of the depth h of the groove 101 to the thickness of the circuit board 10 cannot be too large. In the optical module of this application, the depth h of the groove 101 is set to be no greater than one-third of the thickness of the circuit board 10.

[0036] In some embodiments, please refer to Figure 2 , Figure 4 as well as Figures 6 to 8 The bonding leads 70 and the receiving fiber optic assembly 20 are spaced apart along the thickness direction Z of the circuit board 10. Specifically, after the bonding leads 70 are placed on the pads 50 at the bottom of the groove 101, it is necessary to ensure that the bonding leads 70 and the receiving fiber optic assembly 20 are spaced apart along the thickness direction Z of the circuit board 10. This way, even if the receiving fiber optic assembly 20 moves along the width direction Y of the circuit board 10, it will not come into contact with the bonding leads 70, thus affecting the connection stability between the bonding leads 70 and the pads 50.

[0037] In some embodiments, please Figure 2 and Figures 4 to 8 Further reference Figure 10 The pads 50 and the receiving fiber optic assembly 20 are offset in the width direction Y of the circuit board 10. Specifically, after the bonding leads 70 are installed on the pads 50 located at the bottom of the groove 101, it is necessary to ensure that the bonding leads 70 are offset from the receiving fiber optic assembly 20 in the width direction Y of the circuit board 10. This ensures that even if the receiving fiber optic assembly 20 moves in the thickness direction Z of the circuit board 10, it will not come into contact with the bonding leads 70, thus ensuring the connection stability between the bonding leads 70 and the pads 50.

[0038] It should be noted that, in other embodiments, the bonding leads 70 and the receiving fiber optic assembly 20 are not only spaced apart in the thickness direction Z of the circuit board 10, but also staggered in the width direction Y of the circuit board 10. This ensures that the receiving fiber optic assembly 20 will not come into contact with the bonding leads 70 when the circuit board 10 moves in both the width direction Y and the thickness direction Z, preventing the bonding leads 70 from being affected by contact with the receiving fiber optic assembly 20 and thus affecting the connection stability with the pads 50. Furthermore, this shortens the length of the bonding leads 70, thereby reducing signal crosstalk and ensuring the signal transmission quality and stability of the optical module.

[0039] Please refer to Figures 5 to 8 as well as Figure 10In the width direction Y of the circuit board 10, the distance between the pad 50 of the nearest receiving fiber optic component 20 and the receiving fiber optic component 20 is b. In some embodiments, the distance b satisfies: 0.5mm ≤ b ≤ 1mm. This prevents interference between the bonding wire 70 connected to the pad 50 of the nearest receiving fiber optic component 20 and the receiving fiber optic component 20 due to excessive proximity, and also avoids wasting space due to excessive distance between the pad 50 and the receiving fiber optic component 20. Since the size of the optical module is limited by standards and space is limited, if the distance b between the pad 50 of the nearest receiving fiber optic component 20 and the receiving fiber optic component 20 in the width direction Y is made too large to prevent interference between the bonding wire 70 and the receiving fiber optic component 20, it will result in wasted space, making it difficult to arrange multiple channels of pads 50 and lasers, and hindering the improvement of the optical module speed. Wherein, b can be any value or range of values ​​from 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, to 1, and all such values ​​are within the scope of protection of this application.

[0040] In some embodiments, the laser assembly 40 includes at least a first laser 41 and a second laser 42, and at least two first lasers 41 and second lasers 42 are spaced apart along the width direction Y of the circuit board 10 within the cutout portion 100. In this embodiment, the laser assembly 40 including the first laser 41 and the second laser 42 is used as an example for description.

[0041] The bottom of the groove 101 is provided with multiple pads 50, which are electrically connected to the first laser 41 and the second laser 42 via bonding leads 70. The pads 50 are arranged in two rows, spaced apart along the length (X) of the circuit board 10, and spaced apart along the width (Y) of the circuit board 10 within the same row. In practical applications, the first laser 41 is closer to the receiving fiber optic assembly 20 than the second laser 42. Among the pads 50 adjacent to the first laser 41 and the second laser 42, the pads 50 electrically connected to the first laser 41 are arranged relatively closer to the receiving fiber optic assembly 20, while the pads 50 electrically connected to the second laser 42 are arranged relatively farther away from the receiving fiber optic assembly 20. This shortens the length of the bonding leads 70 between the first laser 41 and the second laser 42 and their corresponding pads 50, thereby reducing signal crosstalk.

[0042] For details, please refer to Figure 4 , Figure 7 and Figure 10In some embodiments, a row of pads 50 adjacent to the laser assembly 40 includes a first pad 51, a second pad 52, and a third pad 53. In the width direction Y of the circuit board 10, the distances between the first pad 51, the second pad 52, and the third pad 53 and the receiving fiber assembly 20 increase sequentially. In the width direction Y of the circuit board 10, the first laser 41 is closer to the receiving fiber assembly 20 than the second laser 42. The first pad 51 and the second pad 52 are electrically connected to the first laser 41, respectively. Specifically, the first pad 51 and the second pad 52 are electrically connected to the positive and negative terminals of the first laser 41, respectively, via bonding leads 70. Thus, connecting the first pad 51 and the second pad 52, which are closer to the receiving fiber assembly 20, to the positive and negative terminals of the first laser 41 adjacent to the receiving fiber assembly 20, respectively, helps to shorten the length of the bonding leads 70 connecting the circuit board 10 and the first laser 41.

[0043] Another row of pads 50 includes a fourth pad 54 and a fifth pad 55. The third pad 53, fourth pad 54, and fifth pad 55 are electrically connected to the second laser 42. Specifically, the fourth pad 54 and fifth pad 55 are located at the bottom of the groove 101 adjacent to the second laser 42. The third pad 53 is electrically connected to the thermistor of the second laser 42 via a bonding wire 70. The fourth pad 54 and fifth pad 55 are electrically connected to the positive and negative electrodes of the second laser 42 via bonding wires 70, respectively. Thus, connecting the third pad 53, which is farther from the receiving fiber optic assembly 20, and the thermistor of the second laser 42, which is farther from the receiving fiber optic assembly 20, to each other, and connecting the fourth pad 54 and fifth pad 55, which are adjacent to the second laser 42, to the positive and negative electrodes of the second laser 42, helps to shorten the length of the bonding wire 70 connecting the circuit board 10 and the second laser 42.

[0044] Therefore, by arranging multiple pads 50 in at least two rows at the bottom of the groove 101, the space at the bottom of the groove 101 can be reasonably utilized. While avoiding interference caused by the bonding wires 70 being too close to the receiving optical fiber assembly 20, the length of the bonding wires 70 between the circuit board 10 and the first laser 41 and the second laser 42 can also be shortened, reducing signal crosstalk and facilitating multi-channel packaging.

[0045] In some embodiments, please refer to Figure 4 , Figure 7 , Figure 9 and Figure 10A first adhesive portion 103 is provided at the connection point between the side of the groove 101 opposite to the hollow portion 100 and the first surface 106 of the circuit board 10 to fix the receiving optical fiber assembly 20. Specifically, the first adhesive portion 103 can be formed by dispensing or other methods. The circuit board 10 can bond the optical fiber of the receiving optical fiber assembly 20 through the first adhesive portion 103 to improve the stability of the receiving optical fiber assembly 20 on the circuit board 10, avoid large-scale shaking of the receiving optical fiber assembly 20 in the thickness direction Z and width direction Y of the circuit board 10, and thus prevent the receiving optical fiber assembly 20 from contacting components such as the bonding leads 70 on the circuit board 10.

[0046] In some embodiments, please refer to Figure 1 , Figure 2 , Figure 5 and Figure 6 The photodetector component 102 is located on the edge of the cutout portion 100 near the circuit board 10. The receiving fiber optic component 20, optically coupled to the photodetector component 102, has a first coupling portion 201 at one end. The projection of the first coupling portion 201 on the circuit board 10 falls within the cutout portion 100. Specifically, the receiving fiber optic component 20 is optically coupled to the photodetector component 102 through the first coupling portion 201, allowing external optical signals from the optical module to be input to the photodetector component 102 via the receiving fiber optic component 20. In the length direction X of the circuit board 10, the photodetector component 102 and the groove 101 are located on opposite sides of the cutout portion 100. The first coupling portion 201 of the receiving fiber optic component 20 can be positioned above the cutout portion 100, with the optical fiber of the receiving fiber optic component 20 spanning above the cutout portion 100 and the groove 101. Thus, in the thickness direction Z of the circuit board 10, the pads 50 and the receiving fiber optic component 20 are spaced apart.

[0047] It should be noted that the first coupling part 201 can be a fiber array unit (FAU), and the receiving fiber assembly 20 can achieve optical coupling with the photodetector assembly 102 through the fiber array unit. A fiber optic connector 200 is provided at one end of the receiving fiber assembly 20 opposite to the first coupling part 201. The fiber optic connector 200 is located inside the optical port 301 of the optical module housing 30 and is used to connect to an external optical fiber.

[0048] Please refer to Figures 1 to 5 In some embodiments, the emitting photonic integrated chip 104 is disposed on the second surface 107 of the circuit board 10, and is located on the opposite side of the cutout portion 100 and the groove 101. The emitting photonic integrated chip 104 and the photodetector component 102 are respectively disposed on both sides of the circuit board 10. In this way, the double-sided structure of the circuit board 10 can be reasonably utilized, the number of components integrated on the first surface 106 of the circuit board 10 can be reduced, and the circuit design of the circuit board 10 can be optimized.

[0049] The transmitting fiber optic assembly 60 has a second coupling portion 600 at one end for optical coupling with the transmitting photonic integrated chip 104, and the other end is used to transmit optical signals to the outside of the optical module. The transmitting fiber optic assembly 60 is disposed on the first surface 106 of the circuit board 10, and the second coupling portion 600 passes through the cutout portion 100 of the circuit board 10 for optical coupling with the transmitting photonic integrated chip 104 disposed on the second surface 107. Specifically, the transmitting fiber optic assembly 60 is optically coupled to the transmitting photonic integrated chip 104 through the second coupling portion 600, thereby enabling the transmission of optical signals to the outside of the optical module.

[0050] In addition, an optical fiber connector 200 is provided at one end of the transmitting optical fiber assembly 60 relative to the second coupling part 600. The optical fiber connector 200 is located inside the optical port 301 of the optical module housing 30 and is used to connect to an external optical fiber.

[0051] It should be noted that the fiber optic connector 200 of this application can connect both the transmitting fiber optic assembly 60 and the receiving fiber optic assembly 20 simultaneously. In this embodiment, the receiving fiber optic assembly 20 and the transmitting fiber optic assembly 60 are disposed on the same surface of the circuit board 10, which facilitates the simultaneous connection of the ends of the receiving fiber optic assembly 20 and the transmitting fiber optic assembly 60 to the fiber optic connector 200.

[0052] In some embodiments, please refer to Figure 2 and Figure 5 A second adhesive portion 105 is provided at the connection point between the cutout portion 100, the side facing away from the emitting end photonic integrated chip 104, and the first surface 106 of the circuit board 10, to fix the emitting fiber assembly 60. Specifically, the second adhesive portion 105 can be formed by dispensing or other methods. The circuit board 10 can bond the optical fiber of the emitting fiber assembly 60 through the second adhesive portion 105 to improve the stability of the emitting fiber assembly 60 on the circuit board 10, avoid large-scale shaking of the emitting fiber assembly 60 in the thickness direction Z and width direction Y of the circuit board 10, and thus prevent the emitting fiber assembly 60 from contacting components such as the bonding leads 70 on the circuit board 10.

[0053] In some embodiments, please refer to Figures 3 to 5The cutout portion 100 includes a first region 110 and a second region 120 that are connected to each other. The first region 110 extends along the width direction Y of the circuit board 10, and the second region 120 extends along the length direction X of the circuit board 10 on the side of the first region 110 opposite to the emitting end photonic integrated chip 104. The laser assembly 40, the first coupling portion 201, and the second coupling portion 600 are disposed in the first region 110, and the second region 120 is used to avoid the emitting fiber assembly 60. By setting the second region 120, when the optical fiber of the emitting fiber assembly 60 passes through the first surface 106 of the circuit board 10 and connects with the second coupling portion 600 through the first region 110, it is possible to avoid the edge of the first region 110 damaging the emitting fiber assembly 60, which helps to extend the service life of the emitting fiber assembly 60.

[0054] In some embodiments, please continue to refer to Figures 3 to 5 In the width direction Y of the circuit board 10, the size of the first region 110 is larger than the size of the second region 120; the second region 120 is connected to the middle of the first region 110, and the second coupling part 600 is located in the middle of the first region 110. The first region 110 and the second region 120 can be arranged in a T-shaped groove structure. Since the laser assembly 40, the first coupling part 201 and the second coupling part 600 need to be arranged in the first region 110, and the second region 120 is only used to avoid the transmitting fiber assembly 60, the size of the first region 110 needs to be larger than the size of the second region 120. Of course, in other embodiments, according to the actual design requirements of the optical module, the design size of the first region 110 can also be smaller than the design size of the second region 120, which is not a unique limitation here.

[0055] The receiving fiber optic assembly 20, laser assembly 40, and pad 50 are each provided in two sets. The two sets of laser assemblies 40 are respectively located on both sides of the second coupling part 600, and the two sets of receiving fiber optic assemblies 20 are respectively located on the side of the two sets of laser assemblies 40 facing away from the second coupling part 600. In the width direction Y of the circuit board 10, the two sets of receiving fiber optic assemblies 20 are located on the outermost side of the circuit board 10, the second coupling part 600 is located in the middle of the circuit board 10, and the two sets of laser assemblies 40 are respectively located between the second coupling part 600 and the outermost receiving fiber optic assembly 20. In this way, the internal structure of the optical module can be reasonably arranged to achieve multi-channel packaging.

[0056] The groove 101 includes two parts located on either side of the second region 120. Two sets of pads 50 are respectively disposed on the two parts of the groove 101 to electrically connect the two sets of laser components 40. Specifically, after the second region 120 is set on the circuit board 10, the groove 101 can be divided into two parts on the circuit board 10. Each set of pads 50 is disposed in the two parts of the groove 101, and each set of pads 50 corresponds to a set of laser components 40. Each set of pads 50 can be connected to a set of laser components 40 through bonding leads 70. In this way, by setting the groove 101 into two parts on the circuit board 10 and by providing a set of pads 50 for electrical connection with the laser components 40 in the two parts of the groove 101, the positions of the pads 50 and the laser components 40 can be reasonably arranged, which helps to shorten the length of the bonding leads 70 and reduce signal crosstalk.

[0057] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0058] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0059] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0060] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. An optical module, characterized in that, include: A circuit board has a first surface and a second surface opposite to each other in its thickness direction. The circuit board has a cutout and a groove. The cutout extends through the first surface and the second surface along the thickness direction. The groove is located at the edge of the cutout and communicates with the cutout. The groove is recessed from the first surface toward the second surface. The bottom of the groove is provided with a solder pad. A laser assembly is disposed within the cutout portion, and the laser assembly is electrically connected to the pad via bonding wires to electrically connect the laser assembly and the circuit board; A photodetector assembly is disposed on the first surface of the circuit board and positioned on the other side of the cutout portion opposite to the groove. A receiving fiber optic assembly, one end of which is optically coupled to the photodetector assembly, and the other end of which is used to receive optical signals from outside the optical module; The receiving optical fiber assembly is disposed on the first surface of the circuit board and spans over the cutout and the groove. The pads are spaced apart from the receiving optical fiber assembly in the thickness direction.

2. The optical module according to claim 1, characterized in that, The distance between the pad and the receiving optical fiber assembly in the thickness direction of the circuit board is a, and a satisfies: 0.3mm≤a≤0.5mm.

3. The optical module according to claim 1, characterized in that, The depth from the first surface of the circuit board to the bottom of the groove is h, and h satisfies: 0.3mm≤h≤0.65mm.

4. The optical module according to claim 1, characterized in that, The bonding leads and the receiving optical fiber assembly are spaced apart in the thickness direction of the circuit board.

5. The optical module according to claim 1, characterized in that, The pads and the receiving optical fiber assembly are offset from each other in the width direction of the circuit board.

6. The optical module according to claim 5, characterized in that, In the width direction of the circuit board, the distance between the pad closest to the receiving optical fiber assembly and the receiving optical fiber assembly is b, and b satisfies: 0.5mm≤b≤1mm.

7. The optical module according to claim 5, characterized in that, The laser assembly includes at least a first laser and a second laser, and at least two of the first lasers and the second laser are spaced apart in the cutout portion along the width direction of the circuit board. The bottom of the groove is provided with a plurality of solder pads, and the plurality of solder pads are electrically connected to the first laser and the second laser respectively through the bonding wires; The multiple pads are arranged in two rows, with the two rows of pads spaced apart along the length of the circuit board, and the multiple pads in the same row spaced apart along the width of the circuit board.

8. The optical module according to claim 7, characterized in that, The row of pads adjacent to the laser assembly includes a first pad, a second pad, and a third pad, and the distances between the first pad, the second pad, and the third pad and the receiving fiber assembly increase sequentially in the width direction of the circuit board. In the width direction of the circuit board, the first laser is closer to the receiving fiber optic assembly than the second laser; The first pad and the second pad are respectively electrically connected to the first laser; The other row of pads includes a fourth pad and a fifth pad, wherein the third, fourth and fifth pads are electrically connected to the second laser.

9. The optical module according to claim 1, characterized in that, A first adhesive portion is provided at the connection between the side of the groove away from the hollow portion and the first surface of the circuit board to fix the receiving optical fiber assembly.

10. The optical module according to claim 1, characterized in that, The optical detection component is located on the circuit board near the edge of the cutout portion; The receiving optical fiber assembly and the optical detection assembly are optically coupled at one end with a first coupling part, and the projection of the first coupling part on the circuit board falls into the hollow part.

11. The optical module according to claim 10, characterized in that, The optical module also includes: The transmitting end photonic integrated chip is disposed on the second surface of the circuit board and is located on the other side of the cutout portion opposite to the groove; The transmitting fiber assembly has a second coupling part at one end for optical coupling with the transmitting end photonic integrated chip through the second coupling part, and the other end is used to transmit optical signals to the outside of the optical module; the transmitting fiber assembly is disposed on the first surface of the circuit board, and the second coupling part passes through the cutout of the circuit board for optical coupling with the transmitting end photonic integrated chip disposed on the second surface.

12. The optical module according to claim 11, characterized in that, A second adhesive portion is provided at the connection point between the hollowed-out portion and the first surface of the circuit board on the side opposite to the transmitting end photonic integrated chip, so as to fix the transmitting fiber assembly.

13. The optical module according to claim 11, characterized in that, The cutout portion includes a first region and a second region that are connected to each other. The first region extends along the width direction of the circuit board, and the second region extends along the length direction of the circuit board on the side of the first region away from the photonic integrated chip at the transmitting end. The laser assembly, the first coupling portion, and the second coupling portion are located in the first region, and the second region is used to avoid the transmitting fiber assembly.

14. The optical module according to claim 13, characterized in that, In the width direction of the circuit board, the size of the first region is larger than the size of the second region; the second region is connected to the middle of the first region, and the second coupling part is located in the middle of the first region; The receiving fiber optic assembly, laser assembly, and pad are each provided in two sets. The two sets of laser optic assemblies are respectively located on both sides of the second coupling part, and the two sets of receiving fiber optic assemblies are respectively located on the side of the two sets of laser optic assemblies away from the second coupling part. The groove includes two parts located on both sides of the second region, and two sets of pads are respectively disposed on the two parts of the groove to electrically connect the two sets of laser components.

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