Optoelectronic device and optoelectronic apparatus

Abstract

The utility model provides a kind of photoelectric device and photoelectric equipment, photoelectric device includes: packaging substrate, integrated chip, connector and photoelectric packaging module.Integrated chip is packaged in the first side of packaging substrate;Connector is set in the first side of substrate;Photoelectric packaging module connects connector;Signal interaction between integrated chip and photoelectric packaging module is transmitted via packaging substrate and connector.The photoelectric device provided by the utility model is convenient for hardware maintenance, conducive to quickly troubleshooting, and also easy to realize the transmission of high-speed electrical signal at low cost.

Description

Technical Field

[0001] This utility model relates to the field of optoelectronic packaging technology, and in particular to an optoelectronic device and optoelectronic equipment. Background Technology

[0002] Co-packaged optics (CPO) integrates optoelectronic modules and electrical chips (such as switch chips or ASIC chips) into the same package structure. This can significantly shorten the distance between the electrical chip and the optical engine, thereby reducing insertion loss and crosstalk of high-speed signals. It also solves the problem of impedance mismatch and crosstalk during high-speed signal transmission, thus ensuring stable transmission of high-speed signals, especially electrical signals above 112Gbps.

[0003] However, although existing CPO solutions and technologies have high integration, optoelectronic modules are prone to instability due to the influence of static electricity, temperature and voltage, resulting in a high failure rate and high maintenance costs. Utility Model Content

[0004] To achieve the above and other related objectives, this application provides an optoelectronic device, comprising:

[0005] Packaging substrate;

[0006] An integrated chip is packaged on the first side of the packaging substrate;

[0007] A connector is disposed on the first side of the substrate;

[0008] The optoelectronic packaging module is connected to the connector;

[0009] The signal interaction between the integrated chip and the optoelectronic packaging module is transmitted via the packaging substrate and the connector.

[0010] In some embodiments, the optoelectronic packaging module includes a signal processing chip and an optical engine respectively connected to the connector. The signal processing chip is used to modulate and convert electrical signals, and transmit the modulated and converted electrical signals to the optical engine or the integrated chip through the connector and the packaging substrate. The optical engine is used to convert between electrical signals and optical signals.

[0011] In some embodiments, the integrated chip includes:

[0012] The computing module is used to generate electrical signals in parallel format or to perform calculations on received electrical signals in parallel format.

[0013] The first serial-to-parallel converter, connecting the computing module and the packaging substrate, is used to convert parallel electrical signals into serial electrical signals.

[0014] Accordingly, the signal processing chip includes:

[0015] A second serial-to-parallel converter, connected to the connector, is used to convert serial electrical signals into parallel electrical signals.

[0016] A digital signal processor, connected to the second serial-to-parallel converter and the connector, is used to modulate electrical signals in a parallel format.

[0017] Accordingly, the electrical signals in the optical engine are in parallel format.

[0018] In some embodiments, the optoelectronic packaging module further includes an optical co-packaging substrate. The signal processing chip and the optical engine are packaged on the front side of the optical co-packaging substrate, and the back side of the optical co-packaging substrate is connected to the packaging substrate via the connector.

[0019] In some embodiments, the connector includes: a base plate having a plurality of signal terminals; wherein the two ends of the signal terminals are respectively used to connect the optoelectronic packaging module and the packaging substrate.

[0020] In some embodiments, the connector is modularly integrated with the optoelectronic packaging module; or, the connector further includes: a snap-fit ​​structure disposed on the edge of the base plate; the snap-fit ​​structure is snap-fit ​​connected to the optoelectronic packaging module.

[0021] In some embodiments, the optoelectronic device further includes:

[0022] A heat sink is disposed on the side of the optoelectronic packaging module and the integrated chip away from the packaging substrate, and is used to dissipate heat from the optoelectronic packaging module and the integrated chip.

[0023] In some embodiments, the optoelectronic packaging module is located beside the integrated chip along a direction parallel to the packaging substrate; wherein the orthographic projection of the heat sink on the packaging substrate covers the orthographic projections of the optoelectronic packaging module and the integrated chip on the packaging substrate.

[0024] This application, in another aspect, provides an optoelectronic device, including the optoelectronic devices provided in any of the above embodiments.

[0025] In some embodiments, the optoelectronic device further includes an external switching chip that is optically connected to the optoelectronic packaging module.

[0026] According to the optoelectronic device provided by this utility model, the optoelectronic packaging module is connected to the packaging substrate via a connector, and the signal interaction between the integrated chip packaged on the first side of the packaging substrate and the optoelectronic packaging module is transmitted through the packaging substrate and the connector. Thus, when the optoelectronic packaging module fails, only the optoelectronic packaging module can be replaced, avoiding the need to replace the entire optoelectronic device due to the optoelectronic packaging module being soldered to the packaging substrate. This facilitates hardware maintenance, enables rapid troubleshooting, and allows for low-cost implementation of high-speed electrical signal transmission. Attached Figure Description

[0027] To better describe and illustrate embodiments and / or examples of the applications disclosed herein, reference may be made to one or more accompanying drawings. Additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed applications, the embodiments and / or examples currently described, or the best mode of conduct of these applications as currently understood.

[0028] Figure 1 This is a schematic diagram of the structure of an optoelectronic device provided in some embodiments;

[0029] Figure 2 This is a top view schematic diagram of an optoelectronic device provided in some embodiments;

[0030] Figure 3 This is a schematic diagram of the structure of an optoelectronic packaging module provided in some embodiments;

[0031] Figure 4 This is a schematic diagram of signal conversion and transmission of an optoelectronic device provided in some embodiments;

[0032] Figure 5 This is a schematic diagram of the signal transmission path of an optoelectronic device provided in some embodiments;

[0033] Figure 6A This is a schematic diagram of the structure of a connector provided in some embodiments;

[0034] Figure 6B This is a top view schematic diagram of a connector provided in some embodiments.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100. Optoelectronic device; 110. Packaging substrate; 120. Optoelectronic packaging module; 121. Optical engine; 122. Signal processing chip; 123. Optical co-packaging substrate; 130. Connector; 131. Base plate; 132. Signal terminal; 133. Snap-fit ​​structure; 140. Integrated chip; 141. System-on-a-chip (SoC) section; 142. Storage section; 150. Heat sink; 160. First mounting hole group; 170. Power supply module; 310. Fiber optic cable; 320. Fiber optic connector. Detailed Implementation

[0037] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate preferred embodiments of the application. However, this application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0039] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0040] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this application. Although the illustrations only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation, the form, quantity and proportion of each component in the actual implementation can be arbitrarily changed, and the layout of the components may also be more complex.

[0041] Please see Figure 1 and Figure 2 This utility model provides an optoelectronic device 100, including: a packaging substrate 110, an optoelectronic packaging module 120, a connector 130, and an integrated chip 140. The integrated chip 140 is packaged on a first side of the packaging substrate 110. The connector 130 is disposed on the first side of the packaging substrate 110. The optoelectronic packaging module 120 is connected to the connector 130. Signal interaction between the integrated chip 140 and the optoelectronic packaging module 120 is transmitted via the packaging substrate 110 and the connector 130.

[0042] In the optoelectronic device provided in this embodiment, the optoelectronic packaging module 120 is connected to the packaging substrate 110 via a connector 130, and the signal interaction between the integrated chip 140 packaged on the first side of the packaging substrate 110 and the optoelectronic packaging module 120 is transmitted through the packaging substrate 110 and the connector 130. Thus, when the optoelectronic packaging module 120 fails, only the optoelectronic packaging module 120 can be replaced, avoiding the need to replace the entire optoelectronic device due to the optoelectronic packaging module being soldered to the packaging substrate. This facilitates hardware maintenance, allows for quick troubleshooting, and enables low-cost high-speed electrical signal transmission.

[0043] In some embodiments, the packaging substrate 110 serves as a carrier for chip packaging, providing electrical connection, protection, support, heat dissipation, and assembly for the chip, thereby achieving the goals of multi-pin configuration, reduced package size, improved electrical performance and heat dissipation, ultra-high density, or multi-chip modularization.

[0044] In some embodiments, the packaging substrate 110 includes a plurality of signal pins disposed on its surface and traces for connecting the plurality of signal pins. The traces may be disposed on the surface of the packaging substrate 110 (i.e., outer layer traces) or disposed inside the substrate 110 (i.e., inner layer traces). Specifically, a printed circuit board (PCB) is typically used as the packaging substrate 110, but this is not limiting; any substrate capable of chip packaging can be used in this application.

[0045] In some embodiments, please continue reading Figure 1 and Figure 2 The integrated chip 140 is bonded to the signal pins of the package substrate 110. The integrated chip 140 includes, but is not limited to, at least one of a switch chip and an application-specific integrated circuit (ASIC) chip. Typically, the integrated chip 140 includes multiple serial-to-parallel converters (Serdes), which respectively constitute the system-on-chip (SOC) portion 141 and the memory portion (RAM) 142 of the integrated chip 140.

[0046] In some embodiments, the integrated chip 140 is directly connected to the packaging substrate 110, and the connection method between the integrated chip 140 and the packaging substrate 110 can be soldering.

[0047] In some embodiments, the optoelectronic packaging module 120 is connected to the packaging substrate 110 via the connector 130, and the integrated chip 140 is fixedly connected to the packaging substrate 110 by means of welding or bonding, which can realize the electrical connection between the optoelectronic packaging module 120 and the integrated chip 140 via the packaging substrate 110 and the connector 130, thereby realizing the signal interaction between the optoelectronic packaging module 120 and the integrated chip 140.

[0048] In some embodiments, please refer to Figure 1 and Figure 3 The optoelectronic packaging module 120 includes a light engine 121 and a signal processing chip 122, both connected to a connector 130. The signal processing chip 122 modulates and converts electrical signals, and transmits the modulated and converted electrical signals to the light engine 121 or the integrated chip 140 via the connector 130 and the packaging substrate 110. The light engine performs the conversion between electrical and optical signals.

[0049] For example, please refer to Figure 4 The integrated chip 140 includes a computing module and a first serial-to-parallel converter. The computing module is used to generate electrical signals in parallel format or to perform calculations on received electrical signals in parallel format. The first serial-to-parallel converter connects the computing module and the packaging substrate 110 and is used to convert the electrical signals in parallel format into electrical signals in serial format.

[0050] Please continue reading. Figure 4 The signal processing chip 122 includes a second serial-to-parallel converter and a digital signal processor. The second serial-to-parallel converter is connected to connector 130 and is used to convert serial electrical signals into parallel electrical signals. The digital signal processor is connected to the second serial-to-parallel converter and connector 130 and is used to modulate parallel electrical signals. Accordingly, the electrical signals in the optical engine 121 are in parallel format. This embodiment does not limit the structure of the optical engine 121, but it is understood that the optical engine 121 necessarily includes a light receiving section and a light emitting section.

[0051] It should be noted that the first serial-to-parallel converter (Serdes) and the second serial-to-parallel converter (Serdes) mentioned above can be configured to match the requirements as: serializer (SERializer), deserializer (DESerializer), and combinations thereof.

[0052] In some embodiments, the system-on-chip (SOC) portion of the integrated chip 140 needs to handle large amounts of data and computational tasks. In high-performance computing SOCs, the Ethernet physical layer (PHY) is a crucial component, capable of supporting high-speed data transmission. (Refer to...) Figure 4As shown, the high-speed serial signal generated by the first serial-to-parallel converter (Serdes) in the integrated chip 140 via the Ethernet physical layer (PHY) is transmitted to the optoelectronic packaging module 120 via the packaging substrate 110. Then, the Ethernet physical layer (PHY) and digital signal processor (DSP) in the second serial-to-parallel converter (Serdes) on the optoelectronic packaging module 120 perform digital signal modulation processing on the received or transmitted signal, which can enhance the strength of the useful signal and make the modulated signal more suitable for subsequent optoelectronic conversion and transmission. The optical receiving section and optical emitting section in the optical engine (Optic) 121 can effectively realize the mutual conversion of optoelectronic signals.

[0053] In some embodiments, please combine Figures 3-5 It is understood that the optoelectronic packaging module 120 also includes an optical co-packaging substrate 123. The signal processing chip 122 and the light engine 121 are packaged on the front side of the optical co-packaging substrate 123, and the back side of the optical co-packaging substrate 123 is connected to the packaging substrate 110 via a connector 130. Figure 5 The two signal transmission paths shown by the dashed lines are: a bidirectional signal interaction path between the integrated chip 140 and the signal processing chip 122 via the packaging substrate 110-connector 130, and a bidirectional signal interaction path between the signal processing chip 122 and the optical engine 121 via the optical co-packaging substrate 123-connector 130-packaging substrate 110-connector 130-optical co-packaging substrate 123.

[0054] In this embodiment, the signal processing chip 122 and the optical engine 121 in the optoelectronic packaging module 120 can be technically integrated through the optical co-package substrate 123. The optical engine 121 can transmit data via optical signals (e.g., lasers, photons). The second serial-to-parallel converter (Serdes) in the signal processing chip 122 can serialize electrical signals for high-speed transmission and deserialize them to restore them to parallel data. The optical co-package substrate 123 integrates the optical engine 121 and the signal processing chip 122 within a single package module, enabling optoelectronic co-design. Thus, based on the optical co-package substrate 123, the signal processing chip 122 and the optical engine 121 can be deeply integrated, driving the development of communication systems towards high bandwidth, low power consumption, and small size.

[0055] In some embodiments, please refer to Figure 6A and Figure 6BThe connector 130 includes a base plate 131 with multiple signal terminals 132; wherein the two ends of the signal terminals 132 are used to connect the optoelectronic packaging module 120 and the packaging substrate 110, respectively. The signal terminals 132 can be referred to as socket pins or socket pins.

[0056] Optionally, the connector 130 further includes a snap-fit ​​structure 133 disposed on the edge of the base plate 131. The snap-fit ​​structure 133 is snapped into connection with the optoelectronic packaging module 120. In this way, slippage or misalignment between the connector 130 and the optoelectronic packaging module 120 can be effectively prevented.

[0057] In some examples, such as Figure 6A and 6B As shown, the engaging structure 133 includes, but is not limited to, symmetrically arranged elastic hooks or annularly closed elastic frames.

[0058] It can be understood that the snap-fit ​​structure 133 of connector 130 is snap-fitted to optoelectronic packaging module 120, meaning that the connection between connector 130 and optoelectronic packaging module 120 can be detachable. In other words, the signal terminal 132 in connector 130 and optoelectronic packaging module 120 can be in contact connection when snap-fitted to each other, or they can be separated (i.e., disconnected) when snap-fitted to each other. In this case, connector 130 and optoelectronic packaging module 120 are two independent devices that need to be snap-fitted together.

[0059] Optionally, connector 130 is modularly integrated with optoelectronic packaging module 120.

[0060] In some examples, the connection between connector 130 and optoelectronic packaging module 120 is a fixed connection. For example, the signal terminal 132 in connector 130 is soldered to optoelectronic packaging module 120, and they can be presented as the same module. In this case, the signal terminal 132 in connector 130 and optoelectronic packaging module 120 always remain in contact and cannot be separated, and connector 130 and optoelectronic packaging module 120 are an integral module structure.

[0061] It is understandable that, due to the high failure rate of the optoelectronic packaging module 120, compared to directly soldering and binding the optoelectronic packaging module 120 to the packaging substrate 110, it is easy to need to replace the entire optoelectronic device 100 due to the failure of the optoelectronic packaging module 120, resulting in high cost and complicated operation. In this embodiment, the optoelectronic packaging module 120 is connected to the packaging substrate 110 through the connector 130, especially the detachable snap-fit ​​connection, which makes the optoelectronic packaging module 120 and the packaging substrate 110 detachable. Therefore, when the optoelectronic packaging module 120 fails, only the optoelectronic packaging module 120 needs to be replaced, which facilitates hardware maintenance and enables rapid troubleshooting.

[0062] Furthermore, the connection between connector 130 and packaging substrate 110 is a detachable connection, such as a pluggable connection; that is, the signal terminal 132 in connector 130 and the signal pin on the surface of packaging substrate 110 can be contacted or disconnected (i.e., disconnected). When both ends of the signal terminal 132 in connector 130 are connected to optoelectronic packaging module 120 and packaging substrate 110 respectively, optoelectronic packaging module 120 is connected to packaging substrate 110 via connector 130 to realize electrical connection between optoelectronic packaging module 120 and packaging substrate 110, thereby realizing signal transmission between optoelectronic packaging module 120 and packaging substrate 110. This also facilitates hardware maintenance and rapid troubleshooting when optoelectronic packaging module 120 fails, requiring only replacement of optoelectronic packaging module 120 and connector 130.

[0063] It is worth mentioning that, in some embodiments, please refer to Figure 1 The optoelectronic device also includes a heat sink 150. The heat sink 150 is disposed on the side of the optoelectronic packaging module 120 and the integrated chip 140 away from the packaging substrate 110, and is used to dissipate heat from the optoelectronic packaging module 120 and the integrated chip 140.

[0064] Optionally, along the direction parallel to the packaging substrate 110, the optoelectronic packaging module 120 is located beside the integrated chip 140, which easily reduces the packaging complexity of the optoelectronic packaging module 120 and the integrated chip 140. Correspondingly, the orthographic projection of the heat sink 150 on the packaging substrate 110 can directly cover the orthographic projections of the optoelectronic packaging module 120 and the integrated chip 140 on the packaging substrate 110.

[0065] Optionally, at least one surface of the heat sink 150 is in direct contact with the heat dissipation surface of the integrated chip 140, and this surface of the heat sink 150 covers the heat dissipation surface of the integrated chip 140, which helps to ensure heat dissipation effect. Specifically, the surface with the largest area of ​​the integrated chip 140 is used as the heat dissipation surface. Among the multiple surfaces of the integrated chip 140, the surfaces with the largest area are the lower surface and the upper surface that are arranged opposite to each other. Since the lower surface of the integrated chip 140 is soldered and bonded to the packaging substrate 110, the heat dissipation surface of the integrated chip 140 is its upper surface, and the heat sink 150 covers the upper surface of the integrated chip 140.

[0066] Optionally, at least one surface of the heat sink 150 is in direct contact with the heat dissipation surface of the optoelectronic packaging module 120, and this surface of the heat sink 150 covers the heat dissipation surface of the optoelectronic packaging module 120, which helps to ensure heat dissipation effect. Specifically, the surface with the largest area of ​​the optoelectronic packaging module 120 is used as the heat dissipation surface. Among the multiple surfaces of the optoelectronic packaging module 120, the surfaces with the largest area are the lower surface and the upper surface arranged opposite to each other. Since the lower surface of the optoelectronic packaging module 120 is connected to the connector 130, the upper surface of the optoelectronic packaging module 120 is used as the heat dissipation surface, and the heat sink 150 covers the upper surface of the optoelectronic packaging module 120.

[0067] Furthermore, when the heat dissipation surface of the integrated chip 140 and the heat dissipation surface of the optoelectronic packaging module 120 are at the same height, the lower surface of the heat sink 150 is a horizontal plane and directly contacts the heat dissipation surface of the integrated chip 140 and the heat dissipation surface of the optoelectronic packaging module 120.

[0068] When the heat dissipation surface of the integrated chip 140 and the heat dissipation surface of the optoelectronic packaging module 120 are not at the same height, the lower surface of the heat sink 150 is a stepped surface, and makes contact with the heat dissipation surface of the integrated chip 140 and the heat dissipation surface of the optoelectronic packaging module 120 respectively.

[0069] In some embodiments, by applying stress to the heat sink 150 in the direction of the packaging substrate 110, and simultaneously applying stress to the packaging substrate 110 in the direction of the heat sink 150, alignment and pressing connection between the packaging substrate 110, the integrated chip 140, the optoelectronic packaging module 120 and the heat sink 150 can be achieved.

[0070] For example, optoelectronic devices can be mounted entirely on a PCB circuit board.

[0071] For example, please combine Figure 2It is understood that a first mounting hole group 160 is provided on the PCB circuit board or packaging substrate 110, and a second mounting hole group opposite to the first mounting hole group 160 is provided on the heat sink 150. Alternatively, a fixing plate may be provided on the side of the heat sink 150 away from the packaging substrate 110, and a second mounting hole group opposite to the first mounting hole group 160 may be provided in the fixing plate, so that the device can be fastened by screws or the like through the corresponding mounting holes. Thus, by adjusting the tightening force of screws and other fasteners, the distance between the heat sink 150 and the packaging substrate 110 can be adjusted. For example, as the tightening force of screws and other fasteners increases, the distance between the heat sink 150 and the packaging substrate 110 decreases. This not only enables tight contact between the signal terminals and signal pins between the connector 130 and the packaging substrate 110, and tight contact between the heat sink 150 and the integrated chip 140 and the optoelectronic packaging module 120 (to ensure and enhance heat dissipation), but also prevents the relative displacement between the various components of the optoelectronic device 100 (e.g., the heat sink 150, the optoelectronic packaging module 120, the connector 130, etc.) caused by external forces (e.g., stress with an angle to compressive stress). In other words, it helps to reduce the failure risk of the optoelectronic device 100.

[0072] It is understood that in other embodiments, the aforementioned mounting hole group can also be mounted on other components of optoelectronic devices and / or optoelectronic equipment. This application does not limit the scope of the embodiments in this regard, but rather focuses on achieving the desired functionality.

[0073] In some embodiments, please combine Figure 2 It is understood that a power supply module 170 may also be provided on the PCB circuit board or package substrate 110. The power supply module 170 may include, for example, a power controller and a power output module, and may be used to supply power to the integrated chip 140 and / or other components or modules.

[0074] In some embodiments, please combine Figure 1 and Figure 2 It is understood that the optoelectronic device also includes an optical fiber cable 310 connected to the optoelectronic packaging module 120.

[0075] For example, please combine Figure 1 and Figure 2 It is understood that the optoelectronic device also includes a fiber optic connector 320. One end of the fiber optic cable 310 is connected to the optical engine 121, and the other end can be connected to the fiber optic connector 320. The fiber optic connector 320 can be used to connect to external devices, such as external switching chips or external switches, thereby enabling data exchange between the optoelectronic device and other computing units.

[0076] This application also provides an optoelectronic device, including the optoelectronic devices provided in any of the above embodiments. The optoelectronic device also possesses all the technical advantages of the aforementioned optoelectronic devices, and will not be detailed here.

[0077] In some embodiments, the optoelectronic device further includes an external switching chip that is optically connected to the optoelectronic packaging module 120.

[0078] For example, the optical engine 121 in the optoelectronic packaging module 120 is connected to the optical fiber cable 310, and is connected to the optical fiber connector 320 through the optical fiber cable 310, and then connected to an external switching chip through the optical fiber connector 320.

[0079] Please note that the above embodiments are for illustrative purposes only and do not imply any limitation on this application.

[0080] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0081] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. An optoelectronic device, characterized in that, include: Packaging substrate; An integrated chip is packaged on the first side of the packaging substrate; A connector is disposed on the first side of the substrate; The optoelectronic packaging module is connected to the connector; The signal interaction between the integrated chip and the optoelectronic packaging module is transmitted via the packaging substrate and the connector.

2. The optoelectronic device according to claim 1, characterized in that, The optoelectronic packaging module includes a signal processing chip and an optical engine that are respectively connected to the connector; The signal processing chip is used to modulate and convert electrical signals, and to transmit the modulated and converted electrical signals to the optical engine or the integrated chip through the connector and the packaging substrate. The optical engine is used to convert between electrical signals and optical signals.

3. The optoelectronic device according to claim 2, characterized in that, The integrated chip includes: The computing module is used to generate electrical signals in parallel format or to perform calculations on received electrical signals in parallel format. A first serial-to-parallel converter, connecting the computing module and the packaging substrate, is used to convert parallel electrical signals into serial electrical signals. The signal processing chip includes: A second serial-to-parallel converter, connected to the connector, is used to convert serial electrical signals into parallel electrical signals. A digital signal processor, connected to the second serial-to-parallel converter and the connector, is used to modulate electrical signals in parallel format; The electrical signals in the optical engine are in parallel format.

4. The optoelectronic device according to claim 2, characterized in that, The optoelectronic packaging module further includes: an optical co-packaging substrate; The signal processing chip and the optical engine are packaged on the front side of the optical co-package substrate, and the back side of the optical co-package substrate is connected to the packaging substrate via the connector.

5. The optoelectronic device according to claim 1, characterized in that, The connector includes a base plate with multiple signal terminals; wherein the two ends of the signal terminals are respectively used to connect the optoelectronic packaging module and the packaging substrate.

6. The optoelectronic device according to claim 5, characterized in that, The connector is modularly integrated with the optoelectronic packaging module; Alternatively, the connector may further include: a snap-fit ​​structure disposed on the edge of the base plate; the snap-fit ​​structure being snap-fit ​​connected to the optoelectronic packaging module.

7. The optoelectronic device according to claim 1, characterized in that, Also includes: A heat sink is disposed on the side of the optoelectronic packaging module and the integrated chip away from the packaging substrate, and is used to dissipate heat from the optoelectronic packaging module and the integrated chip.

8. The optoelectronic device according to claim 7, characterized in that, Along a direction parallel to the packaging substrate, the optoelectronic packaging module is located beside the integrated chip; Wherein, the orthographic projection of the heat sink on the packaging substrate covers the orthographic projections of the optoelectronic packaging module and the integrated chip on the packaging substrate.

9. A photoelectric device, characterized in that, The optoelectronic device includes any one of claims 1 to 8.

10. The optoelectronic device according to claim 9, characterized in that, Also includes: An external switching chip that is optically connected to the optoelectronic packaging module.

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