A 1.6TLPO silicon photonics engine

Abstract

The utility model relates to a 1.6T LPO silicon light engine, silicon light chip is pasted on the upper surface of PCB board, the through slot is set up below the silicon light chip light side on the PCB board, one end of glass block is fixed with silicon light chip, and the other end extends to the above of through slot and is hollowed out, a pedestal is arranged below the PCB board, the PCB board has at least partial area with the pedestal fixed at the pasted silicon light chip, the light emission end coupled with silicon light chip is arranged in the through slot, the converging lens in the light emission end is bonded to the lower surface of glass block hollowed out area, a glue blocking groove is arranged between silicon light chip and converging lens on the lower surface of glass block, and other devices except converging lens in the light emission end are fixed on the pedestal. Advantageous effects are that the area of the PCB board bonded with the silicon light chip can be prevented from bending relative to the pedestal, thereby avoiding the light path displacement, and the angle inclination between the converging lens light path and the collimating lens light path is very small.

Description

Technical Field

[0001] This utility model relates to the field of silicon photonics engine technology, specifically to a 1.6T LPO silicon photonics engine. Background Technology

[0002] To ensure performance, traditional 1.6T LPO silicon photonics engines use a flip-chip process to mount both the silicon photonics chip and the electrical chip onto the PCB board. Black glue is then filled into the gaps between the silicon photonics chip, electrical chip, and the PCB board to reinforce their adhesion. The light emitting end is fixed to the PCB board and coupled to the silicon photonics chip. The light emitting end includes at least a DFB chip, a collimating lens, an optical isolator, and a converging lens. The DFB chip is fixed to the PCB board via a heat sink, which can be made of ceramic. The DFB chip is coupled to the silicon photonics chip after passing through the collimating lens, optical isolator, and converging lens in sequence. This means that the emitted light from the DFB chip can be coupled into the silicon photonics chip after passing through the collimating lens, optical isolator, and converging lens in sequence. This design is prone to optical path displacement due to PCB board bending and deformation. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a 1.6T LPO silicon photonics engine to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A 1.6T LPO silicon photonics engine includes: a PCB board and a silicon photonics chip upside down on the surface of the PCB board. A through slot is formed below the light-incident side of the silicon photonics chip on the PCB board, and a glass block is placed above the silicon photonics chip. One end of the glass block is fixed to the silicon photonics chip, and the other end extends upwards from the through slot and is open. A base is placed below the PCB board, and at least a part of the PCB board at the location where the silicon photonics chip is upside down is fixed to the base. A light emitting end coupled to the silicon photonics chip is arranged in the through slot. A converging lens in the light emitting end is bonded to the lower surface of the open area of ​​the glass block. An adhesive resist groove is formed on the lower surface of the glass block between the silicon photonics chip and the converging lens. Other components in the light emitting end, except for the converging lens, are fixed to the base.

[0005] The beneficial effects of this utility model are: The converging lens in the light emitting end is bonded to the lower surface of the gap in the glass block, and other components in the light emitting end, except for the converging lens, are fixed to the base. Since at least a portion of the PCB board is fixed to the base at the inverted silicon photonics chip location, it can be ensured that the area of ​​the PCB board where the silicon photonics chip is bonded does not bend relative to the base, thereby avoiding optical path displacement. In this scheme, the angle tilt between the optical path of the converging lens and the optical path of the collimating lens is very small, the light from the collimating lens to the converging lens is parallel, and its coupling tolerance is very large, with an X / Y position tolerance greater than 40μm. This design can ensure the stability of the optical path. A resist groove is provided on the lower surface of the glass block between the silicon photonics chip and the converging lens to prevent the adhesive used to bond the converging lens from overflowing to the end face of the silicon photonics chip. At the same time, there is no need to open a coupling hole on the base for coupling the converging lens.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, the two ends of the base along the light propagation direction in the light emitting end are respectively located on both sides of the through slot along the light propagation direction in the light emitting end, and are respectively fixed to the PCB board.

[0008] The further beneficial effects of adopting the above are: increasing the contact area between the base and the PCB board, and improving stability.

[0009] Furthermore, the base is made of tungsten copper.

[0010] Furthermore, the base and the PCB board are fixed together by adhesive bonding.

[0011] Furthermore, the optical emitting end includes: a DFB chip, a collimating lens, an optical isolator, and a converging lens. The DFB chip is fixed to the base via a heat sink, the collimating lens is fixed to the base via a first pad, and the optical isolator is fixed to the first pad via a second pad. The DFB chip is coupled to the silicon photonics chip after passing through the collimating lens, the optical isolator, and the converging lens in sequence.

[0012] Furthermore, the collimating lens is fixed to the first pad by adhesive bonding.

[0013] Furthermore, the glass block is made of Schott 33.

[0014] Furthermore, an electrical chip is attached upside down to the upper surface of the PCB board, and black glue is filled in the gap between the electrical chip and the PCB board.

[0015] The further beneficial effect of adopting the above is that it strengthens the bonding of the electrical chip to the PCB board.

[0016] Furthermore, black glue is filled into the gap between the silicon photonics chip and the PCB board.

[0017] The further beneficial effect of adopting the above is that it strengthens the adhesion of the silicon photonics chip to the PCB board.

[0018] Furthermore, the PCB board has an area with a length of 4mm to 5mm and a width of 4mm to 5mm at the location where the silicon photonics chip is mounted, which is fixed to the base. Attached Figure Description

[0019] Figure 1 This is a structural diagram of the 1.6T LPO silicon photonics engine in this utility model; Figure 2 This is an optical coupling tolerance diagram.

[0020] The attached diagram lists the components represented by each number as follows: 1. PCB board, 110. Through slot, 2. Silicon photonics chip, 3. Glass block, 310. Resistant groove, 4. Base, 5. Light emitting end, 510. Converging lens, 520. DFB chip, 530. Collimating lens, 540. Optical isolator, 550. Heat sink, 560. First pad, 570. Second pad, 6. Electrical chip, 7. Black glue. Detailed Implementation

[0021] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0022] Example 1 like Figure 1 As shown, a 1.6T LPO silicon photonics engine includes: a PCB board 1, a silicon photonics chip 2, a glass block 3, a base 4, and a light emitting end 5. The silicon photonics chip 2 is upside down attached to the upper surface of the PCB board 1, meaning the connection method between the silicon photonics chip 2 and the PCB board 1 remains unchanged. A through slot 110 is formed on the PCB board 1 below the light-incident side of the silicon photonics chip 2. A glass block 3 is placed above the silicon photonics chip 2, wherein one end of the glass block 3 is fixed to the silicon photonics chip 2, and the other end of the glass block 3 extends upwards from the through slot 110 and is open. The lower part of the PCB board 1... A base 4 is installed on the PCB board 1. At least a portion of the area where the silicon photonic chip 2 is mounted is fixed to the base 4. A light emitting end 5 coupled to the silicon photonic chip 2 is arranged in the through groove 110. The converging lens 510 in the light emitting end 5 is bonded to the lower surface of the open area of ​​the glass block 3, for example, by using UV adhesive. A resist groove 310 is provided on the lower surface of the glass block 3 between the silicon photonic chip 2 and the converging lens 510. Other components in the light emitting end 5, except for the converging lens 510, are fixed on the base 4.

[0023] The converging lens 510 in the light emitting end 5 is bonded to the lower surface of the open area of ​​the glass block 3, and the other components in the light emitting end 5, except for the converging lens 510, are fixed on the base 4. Since at least a part of the PCB board 1 at the location where the silicon photonic chip 2 is attached is fixed to the base 4, it can be ensured that the area of ​​the PCB board 1 where the silicon photonic chip 2 is attached does not bend relative to the base 4, thereby avoiding optical path displacement. In this scheme, the angle between the optical path of the converging lens 510 and the optical path of the collimating lens 530 can be very small. The light from the collimating lens 530 to the converging lens 510 is parallel, and its coupling tolerance is very large. The X / Y position tolerance is greater than 40μm. This design can ensure the stability of the optical path.

[0024] Figure 2 The graph shows the optical coupling tolerance. The vertical axis represents the coupling efficiency, which is better the higher it is. The horizontal axis represents the displacement between the converging lens 510 and the collimating lens 530. The graph shows that the displacement between the converging lens 510 and the collimating lens 530 can be 40μm. At this point, the reduction in coupling efficiency is very small, which means that the reduction in optical power is very small, from 82% to 73%. The reduction is 10×log(0.73 / 0.82)=0.5dB.

[0025] During coupling, the converging lens 510 and the glass block 3 are first bonded together, and then the whole assembly is coupled and fixed onto the silicon photonic chip 2. A resist groove 310 is provided on the lower surface of the glass block 3 between the silicon photonic chip 2 and the converging lens 510 to prevent the converging lens 510 from overflowing onto the end face of the silicon photonic chip 2. At the same time, there is no need to open a coupling hole on the base 4 for coupling the converging lens 510.

[0026] Example 2 like Figure 1 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The two ends of the base 4 along the light propagation direction of the light emitting end 5 are respectively located on both sides of the through groove 110 along the light propagation direction of the light emitting end 5, and the two ends of the base 4 along the light propagation direction of the light emitting end 5 are respectively fixed to the PCB board 1.

[0027] Furthermore, the base 4 is preferably made of tungsten copper. The base 4 is preferably fixed to the PCB board 1 by adhesive bonding.

[0028] Example 3 like Figure 1 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below: The optical emitter 5 includes a DFB chip 520, a collimating lens 530, an optical isolator 540, and a converging lens 510. The DFB chip 520 is fixed to the base 4 via a heat sink 550, which can be made of ceramic. The collimating lens 530 is fixed to the base 4 via a first pad 560, which can also be made of ceramic. The optical isolator 540 is fixed to the first pad 560 via a second pad 570, which can also be made of ceramic. The DFB chip 520 is coupled to the silicon photonic chip 2 after passing through the collimating lens 530, the optical isolator 540, and the converging lens 510 in sequence. That is, the emitted light from the DFB chip 520 can be coupled into the silicon photonic chip 2 after passing through the collimating lens 530, the optical isolator 540, and the converging lens 510 in sequence.

[0029] Furthermore, the collimating lens 530 is fixed to the first pad 560 by adhesive bonding, for example, by using UV adhesive.

[0030] Example 4 like Figure 1 As shown, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below: The glass block 3 is made of Schott 33, with a CTE of 3.3 ppm / ℃, which is close to that of silicon.

[0031] Example 5 like Figure 1 As shown, this embodiment is a further improvement on embodiment 1, 2, 3, or 4, as detailed below: The electrical chip 6 is attached upside down to the upper surface of the PCB board 1, and the gap between the electrical chip 6 and the PCB board 1 is filled with black glue 7. The gap between the silicon photonic chip 2 and the PCB board 1 is also filled with black glue 7, which is consistent with the existing technology.

[0032] Example 6 like Figure 1 As shown, this embodiment is a further improvement on any one of embodiments 1 to 5, as detailed below: The PCB board 1 has an area with a length of 4mm to 5mm and a width of 4mm to 5mm at the location where the silicon photonic chip 2 is mounted, and is fixed to the base 4.

[0033] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A 1.6T LPO silicon photonics engine, comprising: A PCB board (1) and a silicon photonic chip (2) upside down on the upper surface of the PCB board (1), characterized in that a through slot (110) is formed on the PCB board (1) below the light-incident side of the silicon photonic chip (2), and a glass block (3) is arranged above the silicon photonic chip (2); one end of the glass block (3) is fixed to the silicon photonic chip (2), and the other end extends above the through slot (110) and is open; a base (4) is arranged below the PCB board (1), and the silicon photonic chip (2) is upside down on the PCB board (1). (2) At least a portion of the area is fixed to the base (4). The through groove (110) is provided with a light emitting end (5) coupled to the silicon photonic chip (2). The converging lens (510) in the light emitting end (5) is bonded to the lower surface of the open area of ​​the glass block (3). A resist groove (310) is provided on the lower surface of the glass block (3) between the silicon photonic chip (2) and the converging lens (510). Other devices in the light emitting end (5) except for the converging lens (510) are fixed to the base (4).

2. A 1.6T LPO silicon photonic engine according to claim 1, characterized in that, The two ends of the base (4) along the light propagation direction in the light emitting end (5) are respectively located on both sides of the through groove (110) along the light propagation direction in the light emitting end (5) and are respectively fixed to the PCB board (1).

3. A 1.6T LPO silicon photonic engine according to claim 1, characterized in that, The base (4) is made of tungsten copper.

4. A 1.6T LPO silicon photonic engine according to claim 1, 2, or 3, characterized in that, The base (4) is fixed to the PCB board (1) by adhesive bonding.

5. A 1.6T LPO silicon photonic engine according to claim 1, characterized in that, The light emitting end (5) includes: a DFB chip (520), a collimating lens (530), an optical isolator (540), and a converging lens (510). The DFB chip (520) is fixed to the base (4) via a heat sink (550). The collimating lens (530) is fixed to the base (4) via a first pad (560). The optical isolator (540) is fixed to the first pad (560) via a second pad (570). The DFB chip (520) is coupled to the silicon photonic chip (2) after passing through the collimating lens (530), the optical isolator (540), and the converging lens (510) in sequence.

6. A 1.6T LPO silicon photonic engine according to claim 5, characterized in that, The collimating lens (530) is fixed to the first pad (560) by adhesive bonding.

7. A 1.6T LPO silicon photonic engine according to claim 1, characterized in that, The glass block (3) is made of Schott 33.

8. A 1.6T LPO silicon photonic engine according to claim 1, characterized in that, The electrical chip (6) is attached upside down on the upper surface of the PCB board (1), and the gap between the electrical chip (6) and the PCB board (1) is filled with black glue (7).

9. A 1.6T LPO silicon photonic engine according to claim 1, characterized in that, The gap between the silicon photonic chip (2) and the PCB board (1) is filled with black glue (7).

10. A 1.6T LPO silicon photonic engine according to claim 1, characterized in that, The PCB board (1) has an area with a length of 4mm to 5mm and a width of 4mm to 5mm at the location where the silicon photonic chip (2) is attached, which is fixed to the base (4).

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