Thermally conductive structure and optical module

Abstract

The application discloses a heat-conducting structure and an optical module, and belongs to the technical field of optical communication. The heat-conducting structure comprises a non-insulating thermal interface material layer and a first insulating heat-conducting layer; the non-insulating thermal interface material layer has opposite first and second sides, wherein the first side is used for heat-conducting connection of a heating device to be radiated; and the first insulating heat-conducting layer is arranged on the second side of the non-insulating thermal interface material layer. The technical scheme provided by the application uses the non-insulating thermal interface material with super-high heat-conducting performance as the core of the heat-conducting structure, effectively improves the heat-radiating performance of the heat-radiating structure, has certain compressibility, and realizes insulation between the heat-conducting structure and an external radiator through the insulating heat-conducting layer, so that the heat-radiating performance is effectively improved while the insulation requirement is met.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to a heat-conducting structure and an optical module. Background Technology

[0002] An optical module is a component in optical communication technology that utilizes optical... Electricity and electricity Optical modules are key components for optical conversion. In recent years, with the rapid development of emerging technologies such as AI, the demand for transmission rates in optical modules has been increasing, leading to a rapid increase in module power consumption. As power consumption increases, the heat dissipation design of optical modules themselves faces significant challenges. Limited by the packaging method of optical modules, traditional heat dissipation designs are increasingly unable to meet the heat dissipation requirements of optical modules.

[0003] Although non-insulating materials such as graphene have high thermal conductivity and high resilience, their electrical conductivity is good and cannot prevent electrical short circuits, so they cannot be directly applied to heat-generating devices that need to be insulated from heat sinks. Utility Model Content

[0004] This application provides a thermally conductive structure and an optical module, which aims to effectively solve the technical problem that the prior art cannot simultaneously achieve insulation and thermal conductivity.

[0005] According to a first aspect of this application, this application provides a thermally conductive structure, comprising: a non-insulating thermal interface material layer having a first side and a second side opposite to each other, wherein the first side is used for thermally conductive connection of a heat-generating device to be dissipated; and a first insulating thermally conductive layer disposed on the second side of the non-insulating thermal interface material layer.

[0006] Optionally, in some embodiments of this application, the thermally conductive structure further includes: a second insulating thermally conductive layer disposed on the first side of the non-insulating thermal interface material layer, wherein the non-insulating thermal interface material layer is thermally connected to the heating device through the second insulating thermally conductive layer.

[0007] Optionally, in some embodiments of this application, the thermally conductive structure further includes: a flexible thermally conductive protective film disposed on the first side of the non-insulating thermal interface material layer, wherein the non-insulating thermal interface material layer contacts the heating device through the flexible thermally conductive protective film.

[0008] Optionally, in some embodiments of this application, the thermal conductivity of the flexible thermally conductive protective film is greater than or equal to 6 W / mK.

[0009] Optionally, in some embodiments of this application, the thermally conductive structure further includes: a first adhesive layer disposed between the non-insulating thermal interface material layer and the first insulating thermally conductive layer to bond the non-insulating thermal interface material layer and the first insulating thermally conductive layer; the thickness of the first adhesive layer is less than or equal to 0.1 mm.

[0010] Optionally, in some embodiments of this application, the first insulating and thermally conductive layer is a ceramic pad.

[0011] Optionally, in some embodiments of this application, the second insulating and thermally conductive layer is a ceramic pad.

[0012] Optionally, in some embodiments of this application, the thermally conductive structure further includes: a second adhesive layer disposed between the non-insulating thermal interface material layer and the second insulating thermally conductive layer to bond the non-insulating thermal interface material layer and the second insulating thermally conductive layer; the thickness of the second adhesive layer is less than or equal to 0.1 mm.

[0013] Optionally, in some embodiments of this application, the thickness of the non-insulating thermal interface material layer is greater than or equal to 0.1 mm and has a resilience of greater than or equal to 50%; the thermal conductivity of the non-insulating thermal interface material layer is greater than or equal to 80 W / (m·K).

[0014] Optionally, in some embodiments of this application, the non-insulating thermal interface material layer includes at least one of a graphene layer, an indium layer, a carbon fiber layer, and a liquid metal layer.

[0015] Optionally, in some embodiments of this application, the heat-conducting structure further includes: a dam, the dam being disposed around the outer periphery of the thermal interface material to cover the sides of the thermal interface material other than the first and second sides; the dam having a compression of greater than or equal to 30%.

[0016] According to another aspect of this application, this application also provides an optical module including the heat-conducting structure described above.

[0017] Optionally, in some embodiments of this application, the overall thickness of the heat-conducting structure ranges from 0.3 mm to 0.5 mm.

[0018] Through one or more embodiments of the above embodiments in this application, at least the following technical effects can be achieved: In the technical solution disclosed in this application, a non-insulating thermal interface material with ultra-high thermal conductivity is used as the core of the thermal conductive structure, which effectively improves the heat dissipation performance of the heat dissipation structure and has a certain degree of compressibility. By setting a first insulating thermal conductive layer on the second side of the non-insulating thermal interface material, the non-insulating thermal interface material is insulated from the heat sink or other components, so as not to cause a short circuit. Furthermore, since the first insulating thermal conductive layer also has a thermal conductive function, the heat dissipation effect of the thermal interface material will not fail due to the setting of the first insulating thermal conductive layer. Attached Figure Description

[0019] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0020] Figure 1 A schematic diagram of a first heat-conducting structure provided for an embodiment of this application; Figure 2 A schematic diagram of a second heat-conducting structure provided for an embodiment of this application; Figure 3 A schematic diagram of a third heat-conducting structure provided for an embodiment of this application; Figure 4 A schematic diagram of a fourth heat-conducting structure provided for an embodiment of this application; Figure 5 A schematic diagram of a fifth heat-conducting structure provided for an embodiment of this application; Figure 6 A schematic diagram of a sixth heat-conducting structure provided for an embodiment of this application; Figure 7 A schematic diagram of a seventh heat-conducting structure provided for an embodiment of this application; Figure 8 A schematic diagram of an eighth heat-conducting structure provided for an embodiment of this application; Figure 9 A schematic diagram of the structure of a first optical module provided for an embodiment of this application; Figure 10 for Figure 9 The diagram shows the exploded structure of the optical module. Figure 11 for Figure 9 The diagram shows a cross-sectional view of the optical module.

[0021] Explanation of reference numerals in the attached figures: 100. Optical module; 10. Heat dissipation casing; 11. Upper shell; 12. Lower shell; 20. Heating components; 1. Non-insulating thermal interface material layer; 2. First insulating and thermally conductive layer; 3. Second insulating and thermally conductive layer; 4. Flexible thermally conductive protective film; 5. First adhesive layer; 6. Second adhesive layer; 7. Dike; 8. Circuit board; 9. Third adhesive layer. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0023] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Furthermore, the character " / " in this document, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0024] Reference Figures 1 to 11 As shown, according to a first aspect of this application, this application provides a thermally conductive structure, which includes at least: a non-insulating thermal interface material layer 1 and an insulating thermally conductive layer (such as a first insulating thermally conductive layer 2 and a second insulating thermally conductive layer 3).

[0025] Reference Figure 1 As shown, this is one of the most typical embodiments of the heat-conducting structure of this application. Figure 1 The thermally conductive structure shown includes a non-insulating thermal interface material layer 1 and a first insulating thermally conductive layer 2.

[0026] The non-insulating thermal interface material layer 1 has two surfaces that are spatially opposite to each other, located on its first side and second side respectively (corresponding to...). Figure 1 The bottom and top sides of the non-insulating thermal interface material layer 1 have opposing first and second sides.

[0027] Reference Figure 1As shown, in this embodiment, the first insulating thermally conductive layer 2 is disposed on the second side of the non-insulating thermal interface material layer 1, and can be used for insulation from the outside environment while maintaining thermal conductivity. Therefore, this thermally conductive structure can achieve an insulating thermally conductive connection between the heating device 20 and other components, thereby avoiding electrical short circuits. The first side of the non-insulating thermal interface material layer 1 is used for thermally conductive connection with the heating device 20 to be dissipated. The non-insulating thermal interface material layer 1 can directly contact the heating device 20, and the heat generated by the heating device 20 during operation can be quickly conducted to the non-insulating thermal interface material layer 1, which has ultra-high thermal conductivity, thereby effectively providing heat dissipation efficiency.

[0028] In this way, the high thermal conductivity of the non-insulating thermal interface material layer 1 and the insulation performance of the first insulating thermal conductive layer 2 enable the overall thermal conductive structure to have high heat dissipation performance and insulation reliability.

[0029] The non-insulating thermal interface material layer 1 can be made of a material with high thermal conductivity and good deformation recovery (with good elastic recovery and / or plastic recovery).

[0030] It is understandable that thermal interface materials include both insulating thermal interface materials and thermal interface materials that are conductive to a certain extent (i.e., non-insulating thermal interface materials).

[0031] The heat dissipation performance of conventional insulating thermal interface materials can no longer meet the heat dissipation requirements of the high-speed optical module 100. The thermally conductive structure of this application uses a non-insulating, high-thermal-conductivity material with ultra-high thermal conductivity in conjunction with an insulating thermally conductive layer to achieve efficient heat dissipation and insulation reliability. Furthermore, in this embodiment, the non-insulating thermal interface material layer 1 is made of a material with a certain degree of elasticity, capable of being compressed and rebounding. Therefore, in application, the thermally conductive structure of this application can also absorb assembly errors between the heat sink housing 10 and the heat-generating device 20, ensuring that the thermally conductive structure is in close contact with the heat-generating device 20 and the heat sink housing 10, thereby further improving heat dissipation efficiency.

[0032] In some embodiments of this application, to ensure thermal conductivity and deformation recovery performance, the thickness of the non-insulating thermal interface material layer 1 is greater than or equal to 0.1 mm, and it has a resilience of greater than or equal to 50%. The thermal conductivity of the non-insulating thermal interface material layer 1 is greater than or equal to 80 W / (m·K), and in some cases can reach as high as 100 W / mK, which is much higher than that of traditional insulating thermal conductive materials.

[0033] As a specific option, in some embodiments of this application, the non-insulating thermal interface material layer 1 includes at least one of a graphene layer, a carbon fiber layer, and a liquid metal layer; that is, the non-insulating thermal interface material layer 1 may be at least partially composed of a graphene layer, an indium layer, a carbon fiber layer, and a liquid metal layer, or may use a liquid metal layer that has been encapsulated.

[0034] On the other hand, the insulating and thermally conductive layer of this application (including but not limited to the first insulating and thermally conductive layer 2) can be made of materials with good thermal conductivity and insulation properties.

[0035] In this application, the insulating and thermally conductive layer can be made of ceramic material; for example, the first insulating layer can be composed of ceramic pads. Ceramic pads have good heat dissipation and insulation properties, and are also relatively inexpensive.

[0036] Reference Figure 1 As shown, in the first embodiment of this application, the non-insulating thermal interface material layer 1 and the first insulating thermally conductive layer 2 can be directly combined to form the thermally conductive structure of this application. From the perspective of implementation process, the first insulating thermally conductive layer 2 (such as a ceramic pad) can be formed first, and then the non-insulating thermal interface material layer 1 can be formed on the surface of the first insulating thermally conductive layer 2 to form the structure. Figure 1 The heat-conducting structure shown.

[0037] Reference Figure 2 As shown, as a second embodiment of this application, and Figure 1 The implementation shown is different, Figure 2 The heat-conducting structure shown also includes a second insulating heat-conducting layer 3. The second insulating heat-conducting layer 3 is disposed on the first side of the non-insulating thermal interface material layer 1. The non-insulating thermal interface material layer 1 is thermally connected to the heating device 20 through the second insulating heat-conducting layer 3, so that the heating device 20 is insulated from the heat-conducting structure, thereby further improving the insulation performance of the heat-conducting structure and better ensuring the electrical reliability of the product.

[0038] The material selection and physical properties of the second insulating and heat-conducting layer 3 can be referenced from the first insulating and heat-conducting layer 2. For example, both the first insulating and heat-conducting layer 2 and the second insulating and heat-conducting layer 3 are ceramic pads, which will not be elaborated here.

[0039] In other embodiments, the first thermally insulating layer 2 and the second thermally insulating layer 3 may also be coated with other highly thermally conductive insulating materials onto the surface of the non-insulating thermal interface material layer 1. For example, this can be achieved by spraying an insulating coating onto the surface of the non-insulating thermal interface material layer 1.

[0040] In practical applications, a second insulating thermally conductive layer 3, a non-insulating thermal interface material layer 1, and a first insulating thermally conductive layer 2 can be sequentially stacked on the heating device 20.

[0041] Reference Figure 3 As shown, as a third embodiment of this application, and Figure 1 The difference between the embodiments shown is that, Figure 3The heat-conducting structure shown also includes a flexible thermally conductive protective film 4. The flexible thermally conductive protective film 4 is disposed on the first side of the non-insulating thermal interface material layer 1, which contacts the heating device 20 through the flexible thermally conductive protective film. On the one hand, non-insulating thermal interface materials are prone to powder shedding or overflow; the flexible thermally conductive protective film 4 protects both the non-insulating thermal interface material layer 1 and the heating device 20.

[0042] The flexible thermal conductive protective film 4 has a certain degree of flexibility, which plays a role in buffering and protection. At the same time, in order to ensure the efficient operation of the thermal conduction path of the thermal conductive structure, the flexible thermal conductive protective film 4 also has good thermal conductivity.

[0043] In this embodiment, the thermal conductivity of the flexible thermally conductive protective film 4 is greater than or equal to 6 W / mK. Alternatively, the flexible thermally conductive protective film 4 can be a flexible metal protective film (such as copper foil or aluminum foil) or a film made of a non-metallic, highly thermally conductive flexible material.

[0044] Generally speaking, the heat-generating device 20 is an important component such as a chip. Therefore, the flexible thermally conductive protective film 4 can further improve the protection level of the heat-generating device 20 while dissipating heat, thereby improving the overall reliability.

[0045] Reference Figure 4 As shown, this is the fourth embodiment of the present application. Figure 4 The heat-conducting structure shown also includes a first adhesive layer 5.

[0046] The first adhesive layer 5 is disposed between the non-insulating thermal interface material layer 1 and the first insulating thermally conductive layer 2 to bond the non-insulating thermal interface material layer 1 and the first insulating thermally conductive layer 2. Figure 4 The illustrated embodiments and Figure 1 The difference in the illustrated embodiment lies in the way the non-insulating thermal interface material layer 1 and the first insulating thermally conductive layer 2 are bonded together. In this embodiment, the non-insulating thermal interface material layer 1 and the first insulating thermally conductive layer 2 are bonded together by a first adhesive layer 5.

[0047] Reference Figure 5 As shown, as the fifth embodiment of this application, and Figure 2 The difference between the embodiments shown is that the thermally conductive structure in this embodiment also has a second adhesive layer 6.

[0048] The second adhesive layer 6 is disposed between the non-insulating thermal interface material layer 1 and the second insulating thermally conductive layer 3 to bond the non-insulating thermal interface material layer 1 and the second insulating thermally conductive layer 3. Figure 5 The illustrated embodiments and Figure 2The difference in the illustrated embodiment lies in the way the non-insulating thermal interface material layer 1 and the second insulating thermally conductive layer 3 are bonded together. In this embodiment, the non-insulating thermal interface material layer 1 and the second insulating thermally conductive layer 3 are bonded together by a second adhesive layer 6.

[0049] Specifically, Figure 5 In the embodiment shown, both opposite surfaces of the non-insulating thermal interface material layer 1 are bonded to the insulating thermally conductive layer via an adhesive layer.

[0050] In the embodiments of this application, the thickness of at least one of the first adhesive layer 5 and the second adhesive layer 6 is less than or equal to 0.1 mm. The thermal conductivity of the adhesive layer is generally less than that of the non-insulating thermal interface material layer 1. Therefore, the thickness of the adhesive layer in this application is kept as small as possible to reduce the impact of the adhesive layer on the thermal conductivity of the thermally conductive structure, as long as the bonding reliability is guaranteed.

[0051] The insulating and thermally conductive layer of this application can be bonded to the non-insulating thermal interface material layer 1 as a whole by a relatively thin adhesive layer (such as at least one of the first adhesive layer 5 and the second adhesive layer 6). The process is simple, which reduces the difficulty of forming the thermally conductive structure of this application and makes it suitable for most application scenarios.

[0052] As a specific solution, the adhesive layer of this application can be made of an adhesive with good thermal conductivity, such as a thermally conductive adhesive.

[0053] Reference Figure 6 As shown, as the sixth embodiment of this application, and Figure 3 The difference between the embodiments shown is that, Figure 6 The heat-conducting structure shown uses a first adhesive layer 5 to bond the first insulating heat-conducting layer 2 to the non-insulating thermal interface material layer 1. For details on the specific configuration of the first adhesive layer 5, please refer to [reference needed]. Figure 4 and Figure 5 The embodiments shown are not described in detail here.

[0054] In the above embodiments, the non-insulating thermal interface material layer 1 can be a graphene sheet with sealed edges, which simplifies the thermal conductivity structure and facilitates fabrication. Alternatively, the non-insulating thermal interface material layer 1 can also be an indium sheet or carbon fiber sheet with sealed edges, or encapsulated liquid metal.

[0055] Reference Figure 7 As shown, as the seventh embodiment of this application, and Figure 1 Compared to the implementation shown, Figure 7 The heat-conducting structure shown also includes a dam 7.

[0056] Specifically, the dam 7 is erected around the outer periphery of the thermal interface material to cover the sides of the thermal interface material other than the first and second sides. That is, the dam 7 surrounds the outer periphery of the thermal interface material to protect it.

[0057] In this embodiment, the non-insulating thermal interface material layer 1 is one of graphene layer, indium layer, carbon fiber layer or liquid metal. The non-insulating thermal interface material layer 1 is sealed between the heat-generating device 20 and the heat dissipation shell 10 by the dam 7 and the insulating thermal conductive layer (first insulating thermal conductive layer 2 and second insulating thermal conductive layer 3), thereby avoiding the non-insulating thermal interface material layer 1 from shedding or leaking and causing short circuit in the internal circuit of the optical module 100, thus ensuring the electrical reliability of the optical module 100.

[0058] The dam 7 can be made of a material with certain compressibility. In this embodiment, the dam 7 has a compression ratio of 30% or higher; for example, it can be made of foam, and the compression ratio of a foam dam can reach 60% to 80%. The main function of the dam 7 is to define a relatively enclosed space to prevent the non-insulated parts of the heat-conducting structure from overflowing, thereby preventing risks such as short circuits. At the same time, the certain compressibility allows the heat-conducting structure as a whole to be compressible and resilient, thus absorbing assembly errors between the heat sink housing 10 and the heat-generating device 20 when applied to a product.

[0059] In addition, the dam 7 can have a certain thermal conductivity, thereby expanding the heat exchange interface between the thermally conductive structure and the outside. Of course, the dam 7 can also be made of a material with a low thermal conductivity, thereby preventing heat from affecting the surrounding space and allowing heat to be transferred only along the thermally conductive path constructed by the thermally conductive structure.

[0060] Reference Figure 7 As shown, the height direction of the dam 7 ( Figure 7 The dimension (in the vertical direction) is equal to the overall height (also the thickness) of the non-insulating thermal interface material layer 1 and the first insulating thermally conductive layer 2. That is, in this embodiment, the dam 7 surrounds the entire outer perimeter of the thermally conductive structure.

[0061] Figure 7 This example only illustrates a thermally conductive structure comprising a first insulating thermally conductive layer 2, a non-insulating thermal interface material layer 1, and a dam 7. In other embodiments, the thermally conductive structure within the dam 7 may also include a second insulating thermally conductive layer 3 or a flexible thermally conductive protective film 4; please refer to [reference needed] for details. Figure 1-6 The implementation methods shown will not be described in detail here.

[0062] The inner side of the dam 7 can be in close contact with the whole formed by the non-insulating thermal interface material layer 1 and the first insulating thermal conductive layer 2, or it can have pores to fill other materials or structures.

[0063] In practical applications, considering the elasticity of the material used in the dam 7 and its stability in the overall device, the height dimension of the dam 7 can be greater than the overall height formed by the non-insulating thermal interface material layer 1, the first adhesive layer 5 and the first insulating thermally conductive layer 2, so that the dam 7 has a certain amount of compression after forming a thermally conductive structure.

[0064] Reference Figure 8 As shown, as the eighth embodiment of this application, and Figure 7 The difference between the embodiments shown is that in this embodiment, the dam 7 only surrounds the outer periphery of the non-insulating thermal interface material layer 1, and is sandwiched between the first insulating thermally conductive layer 2 and the second insulating thermally conductive layer 3. The first insulating thermally conductive layer 2, the second insulating thermally conductive layer 3 and the dam 7 together encapsulate the non-insulating thermal interface material layer 1.

[0065] same, Figure 8 The example provided only considers a thermally conductive structure comprising a first insulating thermally conductive layer 2, a non-insulating thermal interface material layer 1, a second insulating thermally conductive layer 3, and a dam 7. In other embodiments, the dam 7 may also be sandwiched between the first insulating thermally conductive layer 2 and the flexible thermally conductive protective film 4. Alternatively, the thermally conductive structure may include the first insulating thermally conductive layer 2 and the dam 7, with the first insulating thermally conductive layer 2 simultaneously covering the dam 7 and the non-insulating thermal interface material layer 1.

[0066] As mentioned above, the dam 7 only needs to cover the outer periphery of the non-insulating thermal interface material layer 1 to protect it. The assembly structure of the dam 7 with the first insulating thermally conductive layer 2, the second insulating thermally conductive layer 3, or the flexible thermally conductive protection module can be configured according to actual needs.

[0067] Reference Figures 9 to 11 As shown, according to a second aspect of this application, this application also provides an optical module 100, which includes a heat sink housing 10, a heat-generating device 20, and a heat-conducting structure as described above. The heat-conducting structure is disposed between the heat-generating device 20 and the heat sink housing 10 to rapidly conduct the heat generated by the heat-generating device 20 during operation to the heat sink housing 10 for heat dissipation.

[0068] In this embodiment, the heat dissipation housing 10 includes a separable upper housing 11 and a lower housing 12, which are fitted together to form an internal cavity. The heat-generating device 20 and the heat-conducting structure are disposed within the cavity. The upper housing 11 serves as the main heat dissipation surface of the optical module 100, connecting to an external heat sink for heat dissipation. A third adhesive layer 9 is provided between the upper housing 11 and the first insulating heat-conducting layer 2, and the heat-conducting structure is bonded and fixed to the upper housing 11 via the third adhesive layer 9. For details on the third adhesive layer 9, please refer to the description of the adhesive layer above; it will not be repeated here. A circuit board 8 is also disposed inside the heat dissipation housing 10, and the heat-generating device 20 is mounted on and electrically connected to the circuit board 8.

[0069] In this structure, the first insulating and thermally conductive layer 2 of the thermally conductive structure is thermally connected to the heat dissipation shell 10 through a thermally conductive adhesive, and the non-insulating thermal interface material layer 1 is closer to the heat-generating device 20 than the first insulating and thermally conductive layer 2, and is thermally connected to the heat-generating device 20. Figure 11 This example illustrates only one thermally conductive structure. In this embodiment, the thermally conductive structure can be any of the thermally conductive structures described above.

[0070] The heat-generating devices 20 in the optical module 100 of this application are mainly power-consuming devices, primarily electrical signal processing chips or control chips in the optical module 100, such as DSPs, driver chips, or MCUs and other integrated circuit chips. Power-consuming devices refer to electronic devices or chips that consume energy and generate heat during operation. The DSPs and driver chips in the optical module 100 are high-power-consuming devices, often generating significant amounts of heat during operation.

[0071] In this embodiment, the optical module 100 is a pluggable, small-package optical module 100, and its internal space is limited by standards. Therefore, in this embodiment, the overall thickness of the aforementioned heat-conducting structure ranges from 0.3mm to 0.5mm. This thickness range ensures that the heat-conducting structure can be accommodated between the heat-generating device 20 and the heat sink 10, while also ensuring that the heat-conducting structure can be in close contact with the heat-generating device 20 and the heat sink 10 to reduce the thermal resistance of the contact surface.

[0072] In the technical solution disclosed in this application, the optical module 100 uses a non-insulating thermal interface material with ultra-high thermal conductivity as the core of the thermal conductive structure, which effectively improves the heat dissipation performance of the heat dissipation structure and has a certain degree of compressibility. By setting a first insulating thermal conductive layer 2 on the second side of the non-insulating thermal interface material, the non-insulating thermal interface material is insulated from the heat sink or other components, so as not to cause a short circuit. Furthermore, since the first insulating thermal conductive layer 2 also has a thermal conductive function, the heat dissipation effect of the thermal interface material will not fail due to the setting of the first insulating thermal conductive layer 2.

[0073] The technical solution of this application improves the heat dissipation performance of heat-generating devices such as chips 20 while avoiding the risks brought by non-insulating materials, and solves the problem that traditional insulating thermal conductive materials have low thermal conductivity and low resilience, which cannot break through the heat dissipation bottleneck of the module.

[0074] In summary, although the preferred embodiments of this application have been disclosed above, the above preferred embodiments are not intended to limit this application. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be determined by the scope defined in the claims.

Claims

1. A thermally conductive structure, characterized in that, include: A non-insulating thermal interface material layer having a first side and a second side opposite to each other, wherein the first side is used for thermally conductive connection to the heat-generating device to be dissipated. A first insulating and thermally conductive layer is disposed on the second side of the non-insulating thermal interface material layer.

2. The thermally conductive structure as described in claim 1, characterized in that, It also includes: a second insulating and thermally conductive layer disposed on the first side of the non-insulating thermal interface material layer, wherein the non-insulating thermal interface material layer is thermally connected to the heating device through the second insulating and thermally conductive layer.

3. The thermally conductive structure as described in claim 1, characterized in that, It also includes: a flexible thermally conductive protective film disposed on the first side of the non-insulating thermal interface material layer, wherein the non-insulating thermal interface material layer contacts the heating device through the flexible thermally conductive protective film; The thermal conductivity of the flexible thermally conductive protective film is greater than or equal to 6 W / mK.

4. The thermally conductive structure as described in claim 1, characterized in that, It also includes: a first adhesive layer disposed between the non-insulating thermal interface material layer and the first insulating thermally conductive layer to bond the non-insulating thermal interface material layer and the first insulating thermally conductive layer; The thickness of the first adhesive layer is less than or equal to 0.1 mm.

5. The thermally conductive structure as described in claim 2, characterized in that, The first insulating and thermally conductive layer is a ceramic pad; And / or, the second insulating thermally conductive layer is a ceramic pad.

6. The thermally conductive structure as described in claim 2, characterized in that, It also includes: a second adhesive layer disposed between the non-insulating thermal interface material layer and the second insulating thermally conductive layer to bond the non-insulating thermal interface material layer and the second insulating thermally conductive layer; The thickness of the second adhesive layer is less than or equal to 0.1 mm.

7. The thermally conductive structure as described in claim 1, characterized in that, The thickness of the non-insulating thermal interface material layer is greater than or equal to 0.1 mm, and it has a resilience of greater than or equal to 50%. The thermal conductivity of the non-insulating thermal interface material layer is greater than or equal to 80 W / (m·K).

8. The thermally conductive structure as described in claim 1, characterized in that, The non-insulating thermal interface material layer includes at least one of a graphene layer, an indium layer, a carbon fiber layer, and a liquid metal layer.

9. The thermally conductive structure as described in claim 1, characterized in that, Also includes: A dam, which is constructed around the outer periphery of the thermal interface material to cover the sides of the thermal interface material other than the first and second sides; The dam has a compression of 30% or more.

10. An optical module, characterized in that, Includes the thermally conductive structure as described in any one of claims 1-9.

11. The optical module as described in claim 10, characterized in that, The overall thickness of the heat-conducting structure ranges from 0.3 mm to 0.5 mm.

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