Optical module

Abstract

The application discloses an optical module, which comprises a heat dissipation shell, a heat generating device, a non-insulating thermal interface material layer and an insulating heat conducting layer. The heat generating device is arranged in the heat dissipation shell; the non-insulating thermal interface material layer is arranged in the heat dissipation shell and is arranged between the heat generating device and the heat dissipation shell; and the insulating heat conducting layer is arranged between the non-insulating thermal interface material layer and the heat dissipation shell, so that the non-insulating thermal interface material layer is insulated from the heat dissipation shell and is in heat conducting connection with the heat dissipation shell. The technical scheme provided by the application can effectively improve the heat dissipation performance of the optical module, so as to meet the heat dissipation requirement of the optical module with a higher speed, and meanwhile, the insulating performance and the heat dissipation performance are taken into account.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] Optical modules are key components in optical communication technology, performing photoelectric and electro-optical conversions. In recent years, with the rapid development of emerging technologies such as AI, the demand for optical module transmission rates has increased significantly, leading to a rapid increase in module power consumption. This increased power consumption presents a significant challenge to the heat dissipation design of optical modules. Limited by the packaging methods of optical modules, traditional heat dissipation designs are increasingly unable to meet their heat dissipation requirements. Utility Model Content

[0003] This application provides an optical module designed to effectively solve the heat dissipation problem of high-speed optical modules and effectively improve the heat dissipation performance of optical modules.

[0004] This application provides an optical module, the optical module comprising: a heat sink housing; a heat-generating device disposed inside the heat sink housing; a non-insulating thermal interface material layer disposed inside the heat sink housing and between the heat-generating device and the heat sink housing; and an insulating and thermally conductive layer disposed between the non-insulating thermal interface material layer and the heat sink housing, so that the non-insulating thermal interface material layer is insulated from the heat sink housing and thermally connected.

[0005] Optionally, in some embodiments of this application, the optical module further includes: a thermally conductive adhesive layer disposed between the insulating thermally conductive layer and the heat dissipation housing, so as to bond and fix the insulating thermally conductive layer and the heat dissipation housing.

[0006] Optionally, in some embodiments of this application, the insulating thermally conductive layer is a ceramic pad; or the insulating thermally conductive layer is an insulating coating, which is attached to the heat dissipation housing.

[0007] Optionally, in some embodiments of this application, the thermal conductivity of the non-insulating thermal interface material layer is greater than or equal to 80 W / mK; the non-insulating thermal interface material layer is a graphene sheet, indium sheet, or carbon fiber gasket with sealed edges.

[0008] Optionally, in some embodiments of this application, the optical module further includes a flexible thermally conductive protective film disposed between the non-insulating thermal interface material layer and the heating device.

[0009] Optionally, in some embodiments of this application, the optical module further includes a dam, which is disposed within the heat dissipation housing; and the dam surrounds the non-insulating thermal interface material layer to enclose the non-insulating thermal interface material layer between the heat-generating device and the insulating thermally conductive layer.

[0010] Optionally, in some embodiments of this application, the dam is arranged around the outer periphery of the heating device at one end near the heating device.

[0011] Optionally, in some embodiments of this application, one end of the dam near the insulating thermal conductive layer abuts against the surface of the insulating thermal conductive layer facing the heat-generating device; or, the dam is an insulating dam, with one end of the insulating dam near the insulating thermal conductive layer surrounding the outer periphery of the insulating thermal conductive layer and abutting against the heat dissipation housing.

[0012] Optionally, in some embodiments of this application, the thermal conductivity of the non-insulating thermal interface material layer is greater than or equal to 80 W / mK; the non-insulating thermal interface material layer is a graphene layer, an indium layer, a carbon fiber layer, or a liquid metal.

[0013] Optionally, in some embodiments of this application, the dam has a compression of greater than or equal to 30% in the direction from the heating device to the heat dissipation housing.

[0014] Optionally, in some embodiments of this application, the dam is a foam dam.

[0015] Optionally, in some embodiments of this application, the optical module further includes: a circuit board disposed within the heat dissipation housing and electrically connected to the heat-generating device; the heat-generating device, the non-insulating thermal interface material layer, and the insulating thermally conductive layer are disposed on the same side of the circuit board.

[0016] Optionally, in some embodiments of this application, the thickness of the non-insulating thermal interface material layer is greater than or equal to 0.1 mm; the non-insulating thermal interface material layer has a resilience of greater than or equal to 50%; and the thickness of the adhesive layer is less than 0.1 mm.

[0017] The above-described embodiments in this application can achieve at least the following technical effects: The optical module provided in this application effectively improves the heat dissipation performance of the optical module through the ultra-high thermal conductivity of the non-insulating thermal interface material layer, thereby meeting the heat dissipation requirements of higher speed optical modules. At the same time, the insulating thermal conductive layer improves the insulation performance between the heat-generating devices in the optical module and the heat dissipation shell, so that the packaging structure of the optical module takes into account both heat dissipation and insulation requirements. Attached Figure Description

[0018] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0019] Figure 1 A schematic diagram of the structure of a first optical module provided for an embodiment of this application; Figure 2 for Figure 1 The diagram shows the exploded structure of the optical module. Figure 3 for Figure 1 A cross-sectional view of the optical module shown. Figure 4 A cross-sectional structural schematic diagram of a second type of optical module provided for an embodiment of this application; Figure 5 A cross-sectional structural diagram of a third type of optical module provided for an embodiment of this application; Figure 6 A schematic diagram of another heat-conducting structure provided for an embodiment of this application; Figure 7 A schematic diagram of yet another heat-conducting structure provided for an embodiment of this application; Figure 8 A schematic diagram of another heat-conducting structure provided for an embodiment of this application.

[0020] Meaning of the reference numerals in the attached figures: 100. Optical module; 10. Heat dissipation casing; 11. Upper shell; 12. Lower shell; 20. Heating components; 1. Non-insulating thermal interface material layer; 2. Insulating and thermally conductive layer; 4. Flexible thermally conductive protective film; 5. First thermally conductive adhesive layer; 7. Dike; 8. Circuit board; 9. Second thermally conductive adhesive layer. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Furthermore, the character " / " in this document, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0023] Reference Figures 1 to 3 As shown, the optical module 100 of this application mainly includes: a heat dissipation housing 10, a circuit board 8 and a heat-generating device 20, a non-insulating thermal interface material layer 1, an insulating thermally conductive layer 2, a dam 7 and a second thermally conductive adhesive layer 9.

[0024] The non-insulating thermal interface material layer 1 and the insulating thermally conductive layer 2 constitute the thermally conductive structure between the heat-generating device 20 and the heat dissipation shell 10.

[0025] Understandably, the heat dissipation housing 10 forms the overall shape of the optical module 100 and creates an internal storage space, while also providing an interface for heat exchange with the outside.

[0026] The circuit board 8, the heating element 20, the non-insulating thermal interface material layer 1, and the insulating thermally conductive layer 2 are disposed within the internal space of the heat dissipation housing 10. In this embodiment, the circuit board 8 is electrically connected to the heating element 20, and the heating element 20, the non-insulating thermal interface material layer 1, and the insulating thermally conductive layer 2 are located on the same side of the circuit board 8. The circuit board 8 is a rigid circuit board, such as a PCB (Printed Circuit Board), which also has certain support and load-bearing functions.

[0027] In some other embodiments, the heat sink 10 may only provide an interface for exchanging with the outside, that is, the heat sink 10 may only form an internal space to accommodate product components, or it may be considered as the heat sink 10 defined in this application.

[0028] Reference Figure 1 and Figure 2 As shown, specifically, the heat dissipation housing 10 includes: an upper housing 11 and a lower housing 12.

[0029] The upper housing 11 and the lower housing 12 form a two-half structure, which can be joined together to form a whole heat dissipation housing 10 during assembly, thereby forming an opening and assembly space inside the heat dissipation housing 10.

[0030] In this embodiment, the upper housing 11 is used to achieve the main heat dissipation effect. Specifically, the upper housing 11 can be connected to a heat sink to obtain a faster heat dissipation speed.

[0031] Reference Figure 2 and Figure 3 As shown, in this embodiment, the non-insulating thermal interface material layer 1 is disposed between the heating device 20 and the heat dissipation housing 10; the insulating thermally conductive layer 2 is disposed between the non-insulating thermal interface material layer 1 and the heat dissipation housing 10, thereby making the non-insulating thermal interface material layer 1 insulated from the heat dissipation housing 10 and thermally connected.

[0032] Understandably, in this embodiment, the insulating thermally conductive layer 2 is disposed on the second side of the non-insulating thermal interface material layer 1, and can be used for insulation from the outside environment while maintaining thermal conductivity. Therefore, this thermally conductive structure can achieve an insulating thermally conductive connection between the heating device 20 and other components, thereby avoiding electrical short circuits. The first side of the non-insulating thermal interface material layer 1 is used for thermal conductivity connection with the heating device 20 to be dissipated. The non-insulating thermal interface material layer 1 can directly contact the heating device 20, and the heat generated when the heating device 20 is working can be quickly conducted to the non-insulating thermal interface material layer 1, which has ultra-high thermal conductivity, thereby effectively providing heat dissipation efficiency.

[0033] In this way, the high thermal conductivity of the non-insulating thermal interface material layer 1 and the insulation performance of the insulating thermal conductive layer 2 enable the overall thermal conductive structure to have high heat dissipation performance and insulation reliability.

[0034] Compared with traditional thermal interface materials, non-insulating thermal interface materials have ultra-high thermal conductivity, with a thermal conductivity greater than or equal to 80 W / mK, such as graphene, indium, carbon fiber or liquid metal, and some have a thermal conductivity as high as 100 W / mK.

[0035] In some embodiments of this application, to ensure thermal conductivity and deformation recovery performance, the thickness of the non-insulating thermal interface material layer 1 is greater than or equal to 0.1 mm, and the non-insulating thermal interface material layer 1 has a resilience of greater than or equal to 50%. In this embodiment, the resilience of the non-insulating thermal interface material layer 1 is greater than or equal to 60%.

[0036] This application utilizes a non-insulating thermal interface material with ultra-high thermal conductivity to provide a heat conduction path between the heat-generating device 20 and the heat sink housing 10, effectively improving the heat dissipation performance of the optical module 100 to meet the heat dissipation requirements of higher-speed optical modules 100. This solves the problem that traditional heat dissipation solutions cannot meet the heat dissipation requirements of next-generation high-speed optical modules 100.

[0037] This application also provides an insulating thermally conductive material between the non-insulating thermal interface material layer 1 and the heat dissipation housing 10 to insulate the heat-generating device 20 from the heat dissipation housing 10, thereby meeting the ESD requirements of the optical module 100 and taking into account both the improvement of heat dissipation and insulation performance.

[0038] In addition, in this embodiment, the non-insulating thermal interface material layer 1 is made of a material with a certain elasticity, compressibility, and resilience, with a resilience rate of greater than or equal to 50%. Therefore, the non-insulating thermal interface material layer 1 can also absorb the assembly error between the heat dissipation housing 10 and the heat-generating device 20, so that the thermally conductive structure is in close contact with the heat-generating device 20 and the heat dissipation housing 10, thereby further improving the heat dissipation efficiency.

[0039] Reference Figure 2 and Figure 3As shown, in this embodiment, the insulating and thermally conductive layer 2 is a ceramic pad, which has both good thermal conductivity and insulation properties, and is low in cost. This ceramic pad can be bonded to the heat dissipation housing 10 using thermally conductive adhesive.

[0040] That is, the optical module 100 is also provided with a second thermally conductive adhesive layer 9, which is disposed between the insulating thermally conductive layer 2 and the heat dissipation housing 10, so as to bond and fix the insulating thermally conductive layer 2 and the heat dissipation housing 10 and conduct heat together.

[0041] Reference Figure 2 and Figure 3 As shown, in this embodiment, the optical module 100 also includes a dam 7. In this embodiment, the non-insulating thermal interface material layer 1 is one of a graphene layer, an indium layer, a carbon fiber layer, or a liquid metal. The non-insulating thermal interface material layer 1 is sealed between the heat-generating device 20 and the heat dissipation housing 10 by the dam 7 and the insulating thermally conductive layer 2, thereby preventing the non-insulating thermal interface material layer 1 from shedding or leaking and causing a short circuit in the internal circuitry of the optical module 100, thus ensuring the electrical reliability of the optical module 100.

[0042] Specifically, in this embodiment, the insulating thermally conductive layer 2 has a larger area than the non-insulating thermal interface material layer 1, that is, the edge of the insulating thermally conductive layer 2 extends beyond the range of the non-insulating thermal interface material layer 1.

[0043] A dam 7 is also disposed within the heat dissipation housing 10 and surrounds the non-insulating thermal interface material layer 1, thereby enclosing the non-insulating thermal interface material layer 1 between the heat-generating device 20 and the insulating thermally conductive layer 2. In this embodiment, the dam 7 is positioned at one end near the heat-generating device 20 ( Figure 3 The bottom side end face of the heating element 20 is arranged around the outer periphery of the heating element 20. This end may have adhesive backing to facilitate attachment to the circuit board 8 to which the heating element 20 is connected. It is understood that the dam 7 can be supported by the circuit board 8 to which the heating element 20 is connected.

[0044] Since the main function of the dam 7 is to prevent short circuits caused by the non-insulating thermal interface material layer 1, it is sufficient to enclose the non-insulating thermal interface material layer 1. Therefore, in this embodiment, the other end of the dam 7 (the top side end face in Figure 3) abuts against the end face of the insulating thermal conductive layer 2; that is, the end of the dam 7 near the insulating thermal conductive layer 2 abuts against the surface of the insulating thermal conductive layer 2 facing the heat-generating device 20.

[0045] Of course, referring to the above description, in some other embodiments, the dam 7 can also be an insulating dam (such as a foam dam). The end of the dam 7 near the insulating heat-conducting layer 2 is arranged around the outer periphery of the insulating heat-conducting layer 2 and abuts against the heat dissipation shell 10.

[0046] In this embodiment, the dam 7 has a compression amount greater than or equal to 30% in the direction from the heating element 20 to the heat dissipation housing 10. For example, the compression amount of the foam dam can reach 60% to 80%. Here, the compression amount refers to the percentage of compression of the dam 7 before and after assembly compared to its natural state before assembly.

[0047] Understandably, the dam 7 surrounds the outer periphery of the thermal interface material to define a relatively enclosed space, preventing the non-insulated parts of the thermally conductive structure from leaking out and causing risks such as short circuits. Simultaneously, the dam 7 is made of a material with certain compressibility and resilience, allowing the overall thermally conductive structure to be compressible and resilient, thereby absorbing assembly errors between the heat dissipation housing 10 and the heat-generating device 20 within the optical module.

[0048] In addition, the dam 7 can have a certain thermal conductivity, thereby expanding the heat exchange interface between the thermally conductive structure and the outside. Of course, the dam 7 can also be made of a material with a low thermal conductivity, thereby preventing heat from affecting the surrounding space and allowing heat to be transferred only along the thermally conductive path constructed by the thermally conductive structure.

[0049] Reference Figure 4 As shown, with Figure 3 The difference between the illustrated and dissimilar embodiments is that in this embodiment, the non-insulating thermal interface material layer 1 uses a graphene gasket, indium sheet, or carbon fiber gasket with sealed edges. Since the non-insulating thermal interface material layer 1 already has sealed edges, the optical module 100 in this embodiment does not require an additional dam 7. That is, in this embodiment, the optical module 100 omits the dam 7, resulting in a simpler structure and easier assembly.

[0050] Reference Figure 5 As shown, it differs from the above. Figure 3 and Figure 4 In the embodiment shown, the insulating and thermally conductive layer 2 is directly attached to the inner wall of the upper housing 11. That is, the insulating and thermally conductive layer 2 is an insulating coating that is applied or plated inside the heat dissipation housing 10.

[0051] For example, by forming an insulating coating at the corresponding position on the inner wall of the upper housing 11, the second thermally conductive adhesive layer 9 in the above embodiment can be eliminated, thereby avoiding the impact of the second thermally conductive adhesive layer 9 on the overall thermal conductivity and further improving the heat dissipation performance of the optical module 100.

[0052] Reference Figure 6 As shown, with Figures 3 to 5The embodiment shown differs in that, in this embodiment, the optical module 100 further includes a flexible thermally conductive protective film 4. This flexible thermally conductive protective film 4 is disposed between the non-insulating thermal interface material layer 1 and the heating device 20, with the non-insulating thermal interface material layer 1 in contact with the heating device 20 through the flexible thermally conductive protective film. On the one hand, non-insulating thermal interface materials are prone to powder shedding or overflow; the flexible thermally conductive protective film 4 can protect both the non-insulating thermal interface material layer 1 and the heating device 20.

[0053] The flexible thermal conductive protective film 4 has a certain degree of flexibility, thus playing a buffering and protective role. At the same time, in order to ensure the efficient operation of the thermal conduction path of the thermal conductive structure, the thickness of the flexible thermal conductive protective film 4 is extremely small, and its impact on the overall thermal conductivity is also very small.

[0054] In this embodiment, the thermal conductivity of the flexible thermally conductive protective film 4 is greater than or equal to 6 W / mK. Alternatively, the flexible thermally conductive protective film 4 can be a flexible metal protective film (such as copper foil or aluminum foil) or a film made of a non-metallic, highly thermally conductive flexible material.

[0055] Generally speaking, the heat-generating device 20 is an important component such as a chip. Therefore, the flexible thermally conductive protective film 4 can further improve the protection level of the heat-generating device 20 while dissipating heat, thereby improving the overall reliability.

[0056] Reference Figure 7 As shown, unlike the embodiments described above, in some embodiments, the optical module 100 further includes a first thermally conductive adhesive layer 5. This first thermally conductive adhesive layer 5 is disposed between the insulating thermally conductive layer 2 and the non-insulating thermal interface material layer 1.

[0057] In this way, the insulating and thermally conductive layer 2 and the non-insulating thermal interface material layer 1 are bonded together by the first thermally conductive adhesive layer 5 to form a thermally conductive structure, which facilitates assembly.

[0058] The specific design of the first thermally conductive adhesive layer 5 can be the same as that of the second thermally conductive adhesive layer 9 described above. Specifically, the thickness of both the first thermally conductive adhesive layer 5 and the second thermally conductive adhesive layer 9 is less than or equal to 0.1 mm. Their thermal conductivity is typically lower than that of the non-insulating thermal interface material layer 1. Therefore, the thickness of the adhesive layer in this application is kept as small as possible to reduce the impact of the adhesive layer on the thermal conductivity of the thermally conductive structure, as long as the bonding reliability is guaranteed.

[0059] The insulating and thermally conductive layer 2 of this application can be bonded to the non-insulating thermal interface material layer 1 as a whole through a relatively thin first thermally conductive adhesive layer 5. The process is simple, which reduces the difficulty of forming the thermally conductive structure of this application and makes it suitable for most application scenarios.

[0060] As a specific solution, the adhesive layer of this application can be made of an adhesive with good thermal conductivity, such as a thermally conductive adhesive.

[0061] Reference Figure 8 As shown, unlike the embodiments described above, in some embodiments, the optical module 100 may also include both the flexible thermally conductive protective film 4 and the first thermally conductive adhesive layer 5. This embodiment combines the advantages of the above solutions, and will not be elaborated further here.

[0062] The optical module 100 provided in this application effectively improves the heat dissipation performance of the optical module 100 through the non-insulating thermal interface material layer 1 to meet the heat dissipation requirements of the higher speed optical module 100. At the same time, the insulating thermal conductive layer 2 improves the insulation performance between the heat-generating device 20 in the optical module 100 and the heat dissipation shell 10, so that the packaging structure of the heat-generating device 20 in the optical module 100 takes into account both heat dissipation and insulation requirements.

[0063] In summary, although the preferred embodiments of this application have been disclosed above, the above preferred embodiments are not intended to limit this application. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be determined by the scope defined in the claims.

Claims

1. An optical module, characterized in that, include: Heat dissipation housing; The heat-generating device is disposed inside the heat dissipation housing; A non-insulating thermal interface material layer is disposed inside the heat dissipation housing and between the heat-generating device and the heat dissipation housing; An insulating and thermally conductive layer is disposed between the non-insulating thermal interface material layer and the heat dissipation housing, so that the non-insulating thermal interface material layer is insulated from the heat dissipation housing and thermally connected.

2. The optical module as described in claim 1, characterized in that, Also includes: A thermally conductive adhesive layer is disposed between the insulating thermally conductive layer and the heat dissipation housing to bond and fix the insulating thermally conductive layer and the heat dissipation housing.

3. The optical module as described in claim 1 or 2, characterized in that, The insulating and thermally conductive layer is a ceramic pad; Alternatively, the insulating thermally conductive layer may be an insulating coating, which is attached to the heat dissipation housing.

4. The optical module as described in claim 1, characterized in that, The thermal conductivity of the non-insulating thermal interface material layer is greater than or equal to 80 W / mK; The non-insulating thermal interface material layer is a graphene gasket, indium sheet, or carbon fiber gasket with sealed edges.

5. The optical module as described in claim 1, characterized in that, The optical module also includes a flexible thermally conductive protective film disposed between the non-insulating thermal interface material layer and the heating device.

6. The optical module as described in claim 1, characterized in that, The optical module also includes a dam, which is disposed within the heat dissipation housing; and the dam surrounds the non-insulating thermal interface material layer to enclose the non-insulating thermal interface material layer between the heat-generating device and the insulating thermally conductive layer.

7. The optical module as described in claim 6, characterized in that, The dam is arranged around the outer periphery of the heating element at one end closest to the heating element.

8. The optical module as described in claim 7, characterized in that, The end of the dam near the insulating and heat-conducting layer abuts against the surface of the insulating and heat-conducting layer facing the heating device. Alternatively, the dam may be an insulating dam, with one end of the insulating dam near the insulating thermal conductive layer surrounding the outer periphery of the insulating thermal conductive layer and abutting against the heat dissipation shell.

9. The optical module as described in claim 6, characterized in that, The thermal conductivity of the non-insulating thermal interface material layer is greater than or equal to 80 W / mK; The non-insulating thermal interface material layer is a graphene layer, an indium layer, a carbon fiber layer, or a liquid metal.

10. The optical module according to any one of claims 6-9, characterized in that, In the direction from the heating element to the heat dissipation housing, the dam has a compression of greater than or equal to 30%.

11. The optical module as described in claim 8, characterized in that, The dam is a foam dam.

12. The optical module as described in claim 1, characterized in that, It also includes: a circuit board, disposed within the heat dissipation housing and electrically connected to the heat-generating device; The heating element, the non-insulating thermal interface material layer, and the insulating thermally conductive layer are located on the same side of the circuit board.

13. The optical module as described in claim 2, characterized in that, The thickness of the non-insulating thermal interface material layer is greater than or equal to 0.1 mm; The non-insulating thermal interface material layer has a resilience of 50% or more. The thickness of the adhesive layer is less than 0.1 mm.

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