Compatible carrier for pcb paster bonding in optical module

Abstract

The utility model discloses a kind of compatible carriers of PCB patch bonding in optical module, including carrier body, at least one PCB accommodating slot is provided on it, the bottom of the PCB accommodating slot is provided with the golden finger support part and N pairs of support part for supporting PCB board;The carrier body both sides are also provided with different height first track support edge and second track support edge, when patching, the first track support edge is slidably installed in the track of patching machine;When bonding, the second track support edge is slidably installed in the track of bonder.The utility model can improve the compatibility of PCB carrier in optical module.

Description

Technical Field

[0001] This utility model relates to the field of PCB board packaging for optical modules, and more particularly to a compatible carrier for PCB surface mount bonding in optical modules. Background Technology

[0002] In the current surface mount bonding process of optical modules, carriers are used to transport the PCB for surface mount bonding. Currently, surface mount bonding carriers have the following main technical drawbacks: First, PCBs iterate rapidly, while carrier compatibility is insufficient, leading to frequent upgrades and modifications. Existing carriers support a large PCB area (primarily large areas at the electrical ports), and the design of the support position and the length and width of the support area is rather arbitrary. When the PCB layout changes, the carrier can easily interfere with the newly laid-out components, rendering the carrier unusable. Second, carriers for surface mount and bonding processes are not shared, increasing carrier costs: Existing carriers used in both surface mount and bonding equipment are not shared, resulting in two sets of non-shared carriers, thus increasing carrier expenditure costs. Utility Model Content

[0003] The main purpose of this invention is to improve the compatibility of PCB carriers in optical modules.

[0004] The technical solution adopted in this utility model is: A compatible carrier for PCB surface mount bonding in an optical module is provided, comprising a carrier body having at least one PCB receiving slot, wherein the bottom of the PCB receiving slot is provided with a gold finger support portion and N pairs of support portions for supporting the PCB board, where 2≤N≤5; the carrier body is also provided with a first track support edge and a second track support edge of different heights on both sides, wherein during surface mount bonding, the first track support edge is slidably mounted in the track of the surface mount bonding machine; and during bonding, the second track support edge is slidably mounted in the track of the bonding machine.

[0005] Following the above technical solution, where N=3, the three pairs of support parts specifically include: The first pair of support parts are symmetrically arranged at one end of the length direction on both sides of the bottom of the PCB receiving groove; The second pair of support parts are symmetrically arranged in the middle area along the length direction on both sides of the bottom of the PCB receiving groove; The third pair of support parts are symmetrically arranged at the other end of the length direction on both sides of the bottom of the PCB receiving groove.

[0006] Following the above technical solution, the gold finger support is located directly below the gold fingers of the PCB board.

[0007] Following the above technical solution, both the first track support edge and the second track support edge are arranged in a stepped shape.

[0008] Following the above technical solution, the first track support edge is placed inside the second track support edge.

[0009] According to the above technical solution, the width of the first track support edge is adapted to the width of the track of the placement machine; the width of the second track support edge is adapted to the width of the track of the bonding machine.

[0010] Following the above technical solution, the surfaces of the plurality of support portions are lower than the surface of the PCB receiving groove.

[0011] According to the above technical solution, the carrier body is provided with four symmetrical PCB receiving slots.

[0012] Following the above technical solution, N=2, wherein a pair of support parts are symmetrically arranged at one end of the length direction on both sides of the bottom of the PCB receiving groove; and another pair of support parts are symmetrically arranged at the other end of the length direction on both sides of the bottom of the PCB receiving groove.

[0013] Following the above technical solution, the surface of the carrier body is provided with directional markings pointing to the patch panel or bonding machine.

[0014] The beneficial effects of this utility model are as follows: By setting as few support parts as possible, this utility model improves the compatibility of PCB board installation. Even if the layout of the PCB board changes, the position of the support parts will not interfere with it and cause the carrier to become unusable. In addition, by combining the dimensions of the surface mount and bonding equipment tracks, a first track support edge and a second track support edge that can be shared on the same carrier are designed, so that the carrier can be shared and transferred between the two types of equipment without the need to switch between different carriers.

[0015] Furthermore, the first track support edge and the second track support edge are both arranged in a stepped shape, with the surface of one step serving as the first track support edge and the surface of the other step serving as the second track support edge, thus sharing two types of equipment.

[0016] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings: Figure 1 This is a three-dimensional schematic diagram of the compatible carrier for PCB surface mount bonding and the PCB board to be packaged in the optical module of this utility model embodiment; Figure 2 This is a top view of the compatible carrier for PCB surface mount bonding in the optical module of this utility model embodiment; Figure 3 This is a cross-sectional view along the length of the compatible carrier for PCB surface mount bonding in the optical module of this utility model embodiment; Figure 4 This is a schematic diagram of a PCB board placed in a PCB receiving slot of a compatible carrier according to an embodiment of the present invention; Figure 5 This is a schematic diagram of a compatible carrier placed in the track of a chip mounter according to an embodiment of this utility model; Figure 6 This is a schematic diagram of a compatible carrier placed in the bonding machine track according to an embodiment of the present invention; In the diagram: 10, Carrier body; 11, PCB receiving slot; 111, First pair of support parts; 112, Second pair of support parts; 113, Third pair of support parts; 114, Gold finger support part; 115, First track support edge; 116, Second track support edge; 20, PCB board; 30, Track of the pick-and-place machine; 40, Track of the bonding machine. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0019] The compatible carrier of this utility model mainly improves the compatibility of PCB board installation by setting as few supports as possible during the chip mounting and bonding process of optical module PCB board. In combination with the track size of chip mounter and bonding machine, support structures of different heights are set on the same carrier so that the carrier can be shared and transferred between the two machines.

[0020] like Figure 1 As shown, the PCB surface mount bonding in the optical module of this embodiment mainly includes a carrier body 10, which has at least one PCB receiving slot 11. Figure 2As shown, this embodiment has four PCB receiving slots 11, each with a gold finger support 114 and N pairs of support parts (such as 111, 112, 113) at the bottom for supporting the PCB board 20, where 2≤N≤5. The gold finger support 114 is mainly used to support the gold fingers of the PCB board 20, so its position should correspond to the position of the gold fingers after the PCB board 20 is placed in the PCB receiving slot 11, such as directly below, and set as a long and narrow strip corresponding to the shape of the gold fingers. The N pairs of support parts are mainly used to support the main body of the PCB board, eliminating the large area support at the electrical port end (this invention replaces the large area support at the electrical port end with a small pair of support parts). Compared with the prior art, this invention reduces the contact area between the support parts and the PCB. Therefore, the N pairs of support parts need to be reasonably distributed at the bottom of the PCB receiving slot 11 to ensure the stability of the PCB board 20 installation. Moreover, reducing the area of ​​the support parts is also more conducive to adapting to the layout of different PCB boards. Even if the layout of the PCB board changes, the position of the support parts will not interfere with it and cause the carrier to become unusable.

[0021] like Figure 3 , Figure 5 , Figure 6 As shown, the carrier body 10 also has a first track support edge 115 and a second track support edge 116 of different heights on both sides. During placement, the first track support edge 115 is slidably mounted in the track 30 of the placement machine; during bonding, the second track support edge 116 is slidably mounted in the track 40 of the bonding machine. Because the dimensions of the tracks of the placement and bonding equipment are combined, the first track support edge 115 and the second track support edge 116 can be designed to be shared on the same carrier, so that the carrier can be shared and transferred between the two types of equipment without the need to switch between different carriers.

[0022] Specifically, such as Figure 2 As shown, in this embodiment, N=3. The three pairs of support parts specifically include a first pair of support parts 111, a second pair of support parts 112, and a third pair of support parts 113. The first pair of support parts 111 are symmetrically arranged at one end along the length direction on both sides of the bottom of the PCB receiving groove 11, which in this embodiment is the end close to the gold fingers of the PCB board. The second pair of support parts 112 are symmetrically arranged in the middle area along the length direction on both sides of the bottom of the PCB receiving groove 11. The third pair of support parts 113 are symmetrically arranged at the other end along the length direction on both sides of the bottom of the PCB receiving groove 11, which in this embodiment is the end away from the gold fingers of the PCB board, i.e., the optical port end. In this embodiment, when supporting the PCB board 20, only three sets of symmetrical support parts and one gold finger common support surface are set to minimize the number of support positions and improve compatibility.

[0023] In another embodiment of the present invention, when N=2, the second pair of support portions 112 can be removed, leaving only the first pair of support portions 111 and the third pair of support portions 113. In other embodiments, N=4 can be set, allowing an additional pair of support portions to be added between the first pair of support portions 111 and the second pair of support portions 112.

[0024] Furthermore, the shapes of the three pairs of support parts can be designed based on the mold shape of the PCB receiving groove 11. For example, the first pair of support parts 111 is located at the electrical port end (near the gold fingers), which is the location of the positioning structure on the PCB receiving groove 11 used to match the PCB board 20. This positioning structure is designed as a semi-circle, and the first pair of support parts 111 can be snapped onto one side of the semi-circular positioning structure (near the inner side of the gold fingers). Therefore, the first pair of support parts 111 can be set as arc-shaped protrusions that adapt to the shape of the PCB board 20. The second pair of support parts 112 is located in the middle area of ​​the PCB receiving groove 11, which is the junction corresponding to the change in the width of the PCB board 20, and can be designed as protrusions with a trapezoidal cross-section. The third pair of support parts 113 is located at the optical port end, and can therefore be designed as small rectangular blocks.

[0025] like Figure 3 As shown, the first track support edge 115 and the second track support edge 116 are both stepped. During processing, the bottom of the carrier body 10 serves as the support surface. To accommodate the track height of the pick-and-place machine, the first track support edge 115 can be directly machined into the bottom of the carrier body 10. The track support position reserved on the carrier body 10 originally contained material of the same thickness; the excess material is directly removed to form the first stepped surface. When the PCB board 20 is mounted, this first stepped surface serves as the first track support edge 115, placed within the track of the pick-and-place machine. When the compatible carrier is placed on the track of the bonding machine, it needs to be compatible with the bonding height of the bonding machine, which is higher than the placement height of the pick-and-place machine. Therefore, the excess material can be removed from the inner side of the carrier body 10 adjacent to the first stepped surface to form a second stepped surface. The distance from the second stepped surface to the upper surface of the carrier body 10 is greater than the distance from the first stepped surface to the upper surface of the carrier body 10. The aforementioned stepped structure also facilitates the direct improvement of existing incompatible carriers. For example, a second stepped surface can be directly formed on the material originally used to manufacture a pick-and-place machine carrier, thus completing the fabrication of the second track support edge 116 without wasting existing material. Therefore, this embodiment sets the track support edge as a two-stage stepped structure, with one part used for the pick-and-place machine track and the other part for the bonding machine track. This allows one carrier to share two types of equipment, overcoming incompatibility issues and reducing carrier expenditures.

[0026] To facilitate better movement within the tracks of a pick-and-place machine or a bonding machine, the width of the first track support edge 115 is adapted to the width of the track 30 of the pick-and-place machine; the width of the second track support edge 116 is adapted to the width of the track 40 of the bonding machine.

[0027] like Figure 4 As shown, since the PCB board 20 is placed on multiple support parts at the bottom of the PCB receiving groove 11, the surface of the support parts should be lower than the surface of the PCB receiving groove 11 to facilitate the stability of the PCB board 20 within the PCB receiving groove 11.

[0028] In a preferred embodiment of this utility model, such as Figure 1 As shown, the vehicle body 10 has four symmetrical PCB receiving slots 11. The number of PCB receiving slots 11 on the vehicle body 10 can be set according to actual needs.

[0029] In addition, to facilitate the installation of PCB board 20, such as Figure 2 and Figure 4 As shown, the surface of the carrier body is provided with directional markings pointing to the pick-and-place machine or bonding machine to prevent operational errors.

[0030] In summary, this utility model improves the compatibility of PCB board installation by setting as few support parts as possible. Even if the layout of the PCB board changes, the position of the support parts will not interfere with it and cause the carrier to become unusable. In addition, by combining the dimensions of the surface mount and bonding equipment tracks, a first track support edge and a second track support edge that can be shared on the same carrier are designed, so that the carrier can be shared and transferred between the two types of equipment without the need to switch between different carriers.

[0031] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A compatible carrier for PCB surface mount bonding in an optical module, characterized in that, The device includes a carrier body with at least one PCB receiving slot. The bottom of the PCB receiving slot is provided with a gold finger support part and N pairs of support parts for supporting the PCB board, where 2≤N≤5. The carrier body is also provided with a first track support edge and a second track support edge with different heights on both sides. During placement, the first track support edge is slidably installed in the track of the placement machine; during bonding, the second track support edge is slidably installed in the track of the bonding machine.

2. The compatible carrier for PCB surface mount bonding in the optical module according to claim 1, characterized in that, Where N=3, the three pairs of support components specifically include: The first pair of support parts are symmetrically arranged at one end of the length direction on both sides of the bottom of the PCB receiving groove; The second pair of support parts are symmetrically arranged in the middle area along the length direction on both sides of the bottom of the PCB receiving groove; The third pair of support parts are symmetrically arranged at the other end of the length direction on both sides of the bottom of the PCB receiving groove.

3. The compatible carrier for PCB surface mount bonding in the optical module according to claim 2, characterized in that, The gold finger support is located directly below the gold fingers on the PCB board.

4. The compatible carrier for PCB surface mount bonding in the optical module according to claim 1, characterized in that, Both the first track support edge and the second track support edge are arranged in a stepped shape.

5. The compatible carrier for PCB surface mount bonding in the optical module according to claim 1, characterized in that, The first track support edge is placed inside the second track support edge.

6. The compatible carrier for PCB surface mount bonding in the optical module according to claim 1, characterized in that, The width of the first track support edge is adapted to the width of the track of the placement machine; the width of the second track support edge is adapted to the width of the track of the bonding machine.

7. The compatible carrier for PCB surface mount bonding in the optical module according to claim 1, characterized in that, The surfaces of the plurality of support portions are lower than the surface of the PCB receiving groove.

8. The compatible carrier for PCB surface mount bonding in the optical module according to claim 1, characterized in that, The vehicle body is provided with four symmetrical PCB receiving slots.

9. The compatible carrier for PCB surface mount bonding in the optical module according to claim 1, characterized in that, N=2, where a pair of support parts are symmetrically arranged at one end of the length direction on both sides of the bottom of the PCB receiving groove; and another pair of support parts are symmetrically arranged at the other end of the length direction on both sides of the bottom of the PCB receiving groove.

10. The compatible carrier for PCB surface mount bonding in the optical module according to claim 1, characterized in that, The surface of the carrier body is provided with directional markings pointing to the patch panel or bonding machine.

Images