Display module and electronic device

Abstract

The application discloses a display module and an electronic device. The display module comprises a module substrate and a plurality of light-emitting units formed on the module substrate. Each light-emitting unit comprises at least two light-emitting chips with different light-emitting colors. The light-emitting chips arranged in an edge region of the plurality of light-emitting chips arranged on the module substrate are cut, so that the light-emitting chips arranged in the edge region of the light-emitting unit have a cutting surface on the side close to the edge of the light-emitting unit. The cutting surface is inclined to the center of the light-emitting unit, so as to change the light-emitting angle of the light-emitting chips in the edge region of the light-emitting unit, effectively mix the light emitted by the plurality of light-emitting chips, and eliminate the problem of multi-primary color polarization.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and electronic device. Background Technology

[0002] MiniLED or multi-color LEDs have become a hot topic in LCD displays as backlights. Unlike traditional direct-lit white backlight solutions for LCDs, MiniLED or multi-color LED backlights use Mini multi-color chip LEDs as the light source, which can improve the color gamut of LCD displays, resulting in richer and more vibrant colors; finer color zoning, improving the dynamic contrast of LCD displays; and improving the balance between brightness and energy efficiency, effectively reducing display energy consumption.

[0003] However, current direct-lit MiniLEDs use POB or COB LED chips, with each LED chip containing an RGB three-color light-emitting chip arranged in order of red, green, and blue with green in the middle, which results in a problem of polarization of the three primary colors. Utility Model Content

[0004] This application aims to address at least one of the technical problems existing in the prior art. Therefore, one objective of this application is to propose a display module and electronic device that solves the problem of multi-primary-color light polarization in current MiniLED lamp chip solutions.

[0005] To address the aforementioned technical problems, this application provides a display module, including:

[0006] Module substrate;

[0007] Multiple light-emitting units are formed on the module substrate, each light-emitting unit comprising multiple light-emitting chips, wherein at least two of the light-emitting chips emit different colors;

[0008] Among the plurality of light-emitting chips, the plurality of target light-emitting chips arranged in the edge region of the module substrate have a cutting surface on the side near the edge of the module substrate, the cutting surface being inclined to the center of the light-emitting unit, and the cutting surfaces of at least two of the target light-emitting chips being opposite each other.

[0009] In some embodiments, the angle between the cut surface and the module substrate is in the range of 82°-89°.

[0010] In some embodiments, the chamfer angle formed between the cut surface of the target light-emitting chip near the edge of the module substrate and the module substrate is positively correlated with the thickness of the target light-emitting chip.

[0011] In some embodiments, three light-emitting chips are disposed on the module substrate. The three light-emitting chips include a first light-emitting chip, a second light-emitting chip, and a third light-emitting chip. The first light-emitting chip, the second light-emitting chip, and the third light-emitting chip emit different colors.

[0012] The first light-emitting chip, the third light-emitting chip, and the second light-emitting chip are arranged in a straight line. The angle between the cut surface of the first light-emitting chip near the edge of the module substrate and the module substrate is in the range of 82°-89°. The angle between the cut surface of the second light-emitting chip near the edge of the module substrate and the module substrate is in the range of 82°-89°.

[0013] In some embodiments, the chamfer angle formed between the cut surface of the first light-emitting chip near the edge of the module substrate and the module substrate is the same as the chamfer angle formed between the cut surface of the second light-emitting chip near the edge of the module substrate and the module substrate.

[0014] In some embodiments, the chamfer angle formed between the cut surface of the first light-emitting chip near the edge of the module substrate and the module substrate is positively correlated with the distance between the third light-emitting chips; and / or,

[0015] The angle between the cut surface of the second light-emitting chip near the edge of the module substrate and the module substrate is positively correlated with the distance between the third light-emitting chip.

[0016] In some embodiments, three light-emitting chips are disposed on the module substrate. The three light-emitting chips include a first light-emitting chip, a second light-emitting chip, and a third light-emitting chip. The first light-emitting chip, the second light-emitting chip, and the third light-emitting chip emit different colors.

[0017] The first light-emitting chip, the third light-emitting chip, and the second light-emitting chip are arranged in a triangular pattern. The angle between the cut surface of the first light-emitting chip near the edge of the module substrate and the module substrate is in the range of 82°-89°. The angle between the cut surface of the second light-emitting chip near the edge of the module substrate and the module substrate is in the range of 82°-89°. The angle between the cut surface of the third light-emitting chip near the edge of the module substrate and the module substrate is in the range of 82°-89°.

[0018] In some embodiments, four light-emitting chips are disposed on the module substrate, and the four light-emitting chips are arranged in a line or in an array.

[0019] In some embodiments, each of the target light-emitting chips has at least two opposing cut surfaces; or,

[0020] Each target light-emitting chip has two opposite cutting surfaces arranged in parallel.

[0021] A second aspect of this application provides an electronic device including the display module described in any of the preceding claims.

[0022] The beneficial effects of the embodiments of this application are as follows: The display module includes a module substrate and a plurality of light-emitting units formed on the module substrate. Each light-emitting unit includes at least two light-emitting chips with different light-emitting colors. By cutting the light-emitting chips arranged in the edge region of the plurality of light-emitting chips arranged in the module substrate, the light-emitting chips arranged in the edge region of the light-emitting unit have a cutting surface on the side near the edge of the light-emitting unit. The cutting surface is inclined to the center of the light-emitting unit, thereby changing the light emission angle of the light-emitting chips in the edge region of the light-emitting unit, so that the emitted light of the multiple light-emitting chips can be effectively mixed, and the problem of multi-primary-color polarization is eliminated.

[0023] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0024] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0025] Figure 1 This is a first schematic diagram of the display module provided in an embodiment of this application;

[0026] Figure 2 This is a second schematic diagram of the display module provided in the embodiments of this application;

[0027] Figure 3 This is a third schematic diagram of the display module provided in the embodiments of this application;

[0028] Figure 4 This is a fourth schematic diagram of the display module provided in the embodiments of this application;

[0029] Figure 5 This is a fifth schematic diagram of the display module provided in the embodiments of this application;

[0030] Figure 6 This is a sixth schematic diagram of the display module provided in the embodiments of this application;

[0031] Figure 7 This is the seventh schematic diagram of the display module provided in the embodiments of this application.

[0032] Figure label:

[0033] 100: Module substrate, 200: Light-emitting chip, 210: First light-emitting chip, 220: Second light-emitting chip, 230: Third light-emitting chip, 300: Encapsulation layer. Detailed Implementation

[0034] The embodiments of this application are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of this application are described in detail below.

[0035] Current direct-lit MiniLEDs use POB or COB LED chips, with each LED chip containing an RGB tri-color light-emitting chip arranged in order of red, green, and blue with green in the middle, which results in a problem of polarization of the three primary colors.

[0036] To address the aforementioned technical problems, this application provides a display module, see [link to relevant documentation]. Figure 1 As shown, the display module in this embodiment includes: a module substrate 100 and a plurality of light-emitting chips formed on the module substrate 100 and arranged in parallel, wherein at least two of the plurality of light-emitting chips emit different colors. The light-emitting chip located in the edge region of the module substrate is designated as the target light-emitting chip, and the target light-emitting chip has a cutting surface on the side near the edge of the module substrate, the cutting surface being inclined towards the center of the light-emitting unit.

[0037] In this embodiment, cutting a beveled angle on the left side of the light-emitting chip results in more light radiation generated on the right side of the chip, and cutting a beveled angle on the right side results in more light radiation generated on the left side. Therefore, with at least two target light-emitting chips having opposite cut surfaces, the light radiation generated on the side closer to the edge of the two target light-emitting chips in the edge region (e.g., Figure 1 The light radiation generated by the light-emitting chip 200 (with the thicker side) is reduced, which increases the light radiation generated by the side closer to the central region of the light-emitting unit. This changes the emission angle of the light-emitting chips of different colors in each light-emitting unit, so that the emitted light from multiple light-emitting chips in each light-emitting unit can be effectively mixed, eliminating the problem of polarization of the three primary colors.

[0038] In some embodiments, the cutting surface of the target light-emitting chip is inclined to the center of the light-emitting unit, and the angle between the cutting surface and the module substrate 100 is in the range of 82°-89°.

[0039] In some embodiments, the plurality of target light-emitting chips arranged in the edge region of the module substrate 100 include at least a first light-emitting chip 210 and a second light-emitting chip 220. The first light-emitting chip 210 and the second light-emitting chip 220 are target light-emitting chips with cut surfaces. The cut surfaces of the first light-emitting chip 210 and the second light-emitting chip 220 near the edge of the module substrate 100 have intersecting lines, and the central axis of the light-emitting unit has an intersection point with the intersecting lines. The chamfer angle formed between the cut surfaces of the first light-emitting chip 210 and the second light-emitting chip near the edge of the module substrate 100 and the module substrate 100 is in the range of 82°-89°.

[0040] In this embodiment, cutting a beveled angle on the left side of the light-emitting chip results in more light radiation generated on the right side of the chip, and cutting a beveled angle on the right side results in more light radiation generated on the left side. Therefore, by cutting the first light-emitting chip 210 and the second light-emitting chip 220 arranged on the edge of the display module, the intersection line of the cutting surfaces of the first light-emitting chip 210 and the second light-emitting chip 220 near the edge of the module substrate 100 is located on the light-emitting side of the chip, and the beveled angle formed between the cutting surfaces of the first light-emitting chip 210 and the second light-emitting chip 220 near the edge of the module substrate 100 and the module substrate 100 is in the range of 82°-89°. This changes the light emission angle of the light-emitting chips of different colors in the display module, enabling effective mixing of the emitted light from multiple light-emitting chips and eliminating the problem of polarization of the three primary colors.

[0041] In some embodiments, combined with Figure 2 As shown, the angle between the cutting surface of the first light-emitting chip 210 near the edge of the module substrate 100 and the cutting surface of the module substrate 100 near the edge of the second light-emitting chip 220 is the chamfer angle of the first light-emitting chip 210. This chamfer angle is less than 90°, so that there is an intersection point between the cutting surface of the first light-emitting chip 210 near the edge of the module substrate 100 and the cutting surface of the second light-emitting chip 220 near the edge of the module substrate 100. This intersection point is located on the light-emitting side of the display module. Furthermore, the chamfer angle of the first light-emitting chip 210 is less than 90°, which allows the light emitted by the first light-emitting chip 210 to tilt towards the second light-emitting chip 220, thereby eliminating the primary color polarization phenomenon in the display module through the light mixing processing of the multi-color light-emitting chips.

[0042] In some embodiments, the angle between the cut surface of the first light-emitting chip 210 near the edge of the module substrate 100 and the module substrate 100 is in the range of 82°-89°. This allows the light emitted by the first light-emitting chip 210 to be tilted toward the second light-emitting chip 220, thereby eliminating the primary color polarization phenomenon in the display module through the light mixing process of the multi-color light-emitting chips. Also, since the angle between the cut surface of the first light-emitting chip 210 near the edge of the module substrate 100 and the module substrate 100 is greater than 82°, it can prevent the light emitted by the first light-emitting chip 210 from appearing as dark due to the angle being too small.

[0043] In some embodiments, combined with Figure 2 As shown, the angle between the cut surface of the second light-emitting chip 220 near the edge of the module substrate 100 and the cut surface of the module substrate 100 near the first light-emitting chip 210 is the chamfer angle of the second light-emitting chip 220. This chamfer angle is less than 90°, so that there is an intersecting line between the cut surface of the second light-emitting chip 220 near the edge of the module substrate 100 and the cut surface of the first light-emitting chip 210 near the edge of the module substrate 100. The central axis of the light-emitting unit intersects with the intersecting line. This intersection point is located on the light-emitting side of the display module. Furthermore, the chamfer angle of the second light-emitting chip 220 is less than 90°, which allows the light emitted by the second light-emitting chip 220 to tilt towards the first light-emitting chip 210. This enables the light mixing processing of the multi-color light-emitting chips in the display module to eliminate the primary color polarization phenomenon in the display module.

[0044] In some embodiments, combined with Figure 2 As shown, the display module also includes an encapsulation layer 300, which is used to encapsulate the first light-emitting chip 210 and the second light-emitting chip 220.

[0045] In some embodiments, combined with Figure 2 As shown, the encapsulation layer 300 can be a transparent substrate, and the shape of the encapsulation layer 300 can be a microlens.

[0046] In some embodiments, the encapsulation layer 300 may be filled with particles to change the refractive index of the encapsulation layer 300.

[0047] In some embodiments, the density of filling particles in different regions within the encapsulation layer 300 is different. The density of filling particles in the encapsulation layer 300 between the first light-emitting chip 210, the second light-emitting chip 220 and the edge of the module substrate 100 is relatively large, which can make its refractive index larger and improve the light extraction efficiency of the display module.

[0048] In some embodiments, combined with Figure 2As shown, the angle between the cut surface of the second light-emitting chip 220 near the edge of the module substrate 100 and the module substrate 100 is in the range of 82°-89°. This allows the light emitted by the second light-emitting chip 220 to tilt towards the first light-emitting chip 210, thereby enabling the mixing of light from the multi-color light-emitting chips in the display module and eliminating the primary color polarization phenomenon in the display module. Also, since the angle between the cut surface of the second light-emitting chip 220 near the edge of the module substrate 100 and the module substrate 100 is greater than 82°, it can prevent the light emitted by the second light-emitting chip 220 from appearing dark due to the angle being too small.

[0049] In some embodiments, combined with Figure 2 As shown, two light-emitting chips are arranged on the module substrate 100. The two light-emitting chips include a first light-emitting chip 210 and a second light-emitting chip 220. The angle between the cut surface of the first light-emitting chip 210 and the module substrate 100 near the edge of the module substrate 100 is in the range of 82°-89°.

[0050] In some embodiments, the first light-emitting chip 210 and the second light-emitting chip 220 are target light-emitting chips with a cut surface in the edge region of the module substrate 100, and multiple light-emitting chips can be disposed between the first light-emitting chip 210 and the second light-emitting chip 220.

[0051] In some embodiments, the chamfer angle formed between the cut surface of the target light-emitting chip near the edge of the module substrate 100 and the module substrate 100 is positively correlated with the thickness of the target light-emitting chip.

[0052] In this embodiment, the target light-emitting chip has a cut surface, and the cut surface forms a chamfer with the module substrate 100. The greater the thickness of the target light-emitting chip, the larger the angle of the chamfer. In this way, the light emitted by the chamfer formed between the cut surface and the module substrate 100 by the adjacent light-emitting chips can be avoided, and the risk of uneven light emission or shadows in the target light-emitting chip can be reduced.

[0053] In some embodiments, combined with Figure 2 As shown, the angle between the cut surface of the first light-emitting chip 210 near the edge of the module substrate 100 and the module substrate 100 is positively correlated with the thickness of the first light-emitting chip 210.

[0054] In this embodiment, the greater the thickness of the first light-emitting chip 210, the greater the angle of the chamfer angle of the first light-emitting chip 210. In this way, the light emitted by the first light-emitting chip 210 can be avoided by the adjacent light-emitting chips, and the risk of uneven light emission or shadows in the first light-emitting chip 210 can be reduced.

[0055] In some embodiments, combined with Figure 2 As shown, the angle between the cut surface of the second light-emitting chip 220 near the edge of the module substrate 100 and the module substrate 100 is positively correlated with the thickness of the second light-emitting chip 220.

[0056] In this embodiment, the greater the thickness of the second light-emitting chip 220, the greater the angle of the chamfer angle of the second light-emitting chip 220. In this way, the light emitted by the second light-emitting chip 220 can be avoided by the adjacent light-emitting chips, and the risk of uneven light emission or shadows in the second light-emitting chip 220 can be reduced.

[0057] In some embodiments, such as Figure 3 As shown, three light-emitting chips are disposed on the module substrate. These three chips include a first light-emitting chip 210, a second light-emitting chip 220, and a third light-emitting chip 230. The first light-emitting chip 210, the second light-emitting chip 220, and the third light-emitting chip 230 emit different colors. Combined with... Figure 4 As shown, the first light-emitting chip 210, the third light-emitting chip 230, and the second light-emitting chip 220 are arranged in a straight line. The first light-emitting chip 210 emits red light, the second light-emitting chip 220 emits green light, and the third light-emitting chip 230 emits blue light. By setting the chamfer angle between the cutting surface of the first light-emitting chip 210 and the second light-emitting chip 220 at the edge position and the module substrate 100 to 82°-89°, the light emission angle of the first light-emitting chip 210 and the second light-emitting chip 220 can be changed, tilting the red light emitted by the first light-emitting chip 210 and the blue light emitted by the second light-emitting chip 220 towards the green light emitted by the third light-emitting chip 230. This achieves effective light mixing of multiple light-emitting chips, eliminates the problem of polarization of the three primary colors, and improves the pressure-enthalpy diagram (P / H) of the display module.

[0058] In some embodiments, the chamfer formed between the cutting surface of the first light-emitting chip 210 near the edge of the module substrate 100 and the module substrate 100 is the same as the chamfer formed between the cutting surface of the second light-emitting chip 220 near the edge of the module substrate 100 and the module substrate 100.

[0059] In some embodiments, the angle between the cut surface of the first light-emitting chip 210 near the edge of the module substrate 100 and the module substrate 100 is positively correlated with the distance between the third light-emitting chip 230 and the module substrate 100.

[0060] In this embodiment, the distance between the first light-emitting chip 210 and the third light-emitting chip 230 can be the width of the gap between the first light-emitting chip 210 and the third light-emitting chip 230. The greater the distance between the first light-emitting chip 210 and the third light-emitting chip 230, the larger the angle of the chamfer of the first light-emitting chip 210. In this way, the light emitted by the first light-emitting chip 210 can be avoided by the adjacent light-emitting chips, and the risk of uneven light emission or shadows in the first light-emitting chip 210 can be reduced.

[0061] In some embodiments, the angle between the cut surface of the second light-emitting chip 220 near the edge of the module substrate 100 and the module substrate 100 is positively correlated with the distance between the second light-emitting chip 230 and the module substrate 100.

[0062] In this embodiment, the distance between the second light-emitting chip 220 and the third light-emitting chip 230 can be the width of the gap between the second light-emitting chip 220 and the third light-emitting chip 230. The greater the distance between the second light-emitting chip 220 and the third light-emitting chip 230, the larger the angle of the chamfer of the second light-emitting chip 220. In this way, the light emitted by the second light-emitting chip 220 can be avoided by the adjacent light-emitting chips, and the risk of uneven light emission or shadows in the second light-emitting chip 220 can be reduced.

[0063] In some embodiments, the range of the chamfer angle formed between the cut surface of the light-emitting chip arranged in the edge region of the module substrate 100 and the module substrate 100 is 85°.

[0064] In some embodiments, the oblique angle formed between the cutting surface of the first light-emitting chip 210 near the edge of the module substrate 100 and the module substrate 100, and the oblique angle formed between some cutting surfaces of the first light-emitting chip 210 near the third light-emitting chip 230 and the module substrate 100, and the angles of the oblique angles on both sides of the first light-emitting chip 210 may be different, and the angles of the oblique angles on both sides of the first light-emitting chip 210 are all within the range of 82°-89°.

[0065] In some embodiments, the oblique angle formed between the cutting surface of the second light-emitting chip 220 near the edge of the module substrate 100 and the module substrate 100, the oblique angle formed between some cutting surfaces of the second light-emitting chip 220 near the third light-emitting chip 230 and the module substrate 100, and the angles of the oblique angles on both sides of the second light-emitting chip 220 may be different, and the angles of the oblique angles on both sides of the second light-emitting chip 220 are all within the range of 82°-89°.

[0066] In some embodiments, combined with Figure 5As shown, three light-emitting chips are disposed on the module substrate 100. The three light-emitting chips include a first light-emitting chip 210, a second light-emitting chip 220, and a third light-emitting chip 230. The first light-emitting chip 210, the second light-emitting chip 220, and the third light-emitting chip 230 emit different colors. The first light-emitting chip 210, the second light-emitting chip 220, and the third light-emitting chip 230 are arranged in a triangular pattern. The angle between the cut surface of the first light-emitting chip 210 near the edge of the module substrate 100 and the module substrate 100 is in the range of 82°-89°. The angle between the cut surface of the second light-emitting chip 220 near the edge of the module substrate 100 and the module substrate 100 is in the range of 82°-89°. The angle between the cut surface of the third light-emitting chip 230 near the edge of the module substrate 100 and the module substrate 100 is in the range of 82°-89°.

[0067] In this embodiment, combined with Figure 5 As shown in the horizontal cross-sectional diagram, the left cutting surface of the first light-emitting chip 210 is opposite to the right cutting surface of the second light-emitting chip 220, and both the left cutting surface of the first light-emitting chip 210 and the right cutting surface of the second light-emitting chip 220 are inclined towards the center of the light-emitting unit. In order to balance the light mixing of the emitted light from the first light-emitting chip 210, the second light-emitting chip 220 and the third light-emitting chip 230 in the triangular arrangement, the rear cutting surface of the first light-emitting chip 210 and the rear cutting surface of the second light-emitting chip 220 are opposite to the front cutting surface of the third light-emitting chip 230, so that the light emitted by the first light-emitting chip 210 and the light emitted by the second light-emitting chip 220 is inclined towards the light emitted by the third light-emitting chip 230, thereby realizing the effective light mixing of multiple light-emitting chips, eliminating the problem of polarization of the three primary colors, and improving the pressure-enthalpy diagram (P / H) of the display module.

[0068] In some embodiments, four light-emitting chips 200 are disposed on the module substrate 100, and the four light-emitting chips 200 are arranged in a straight line.

[0069] In this embodiment, combined with Figure 6 As shown, among the four light-emitting chips 200 arranged in a straight line, the light-emitting chips 200 on both sides serve as target light-emitting chips. The target light-emitting chip has a cutting surface on the side near the edge of the light-emitting unit. The cutting surface is inclined to the center of the light-emitting unit, so that the light emission of the target light-emitting chip is inclined to the center of the light-emitting unit. This changes the light emission angle of the target light-emitting chip in the edge area of ​​the light-emitting unit, so that the emitted light from multiple light-emitting chips can be effectively mixed, eliminating the problem of multi-primary-color polarization.

[0070] In some embodiments, the four light-emitting chips 200 may include three colors of light-emitting chips 200. For example, the four light-emitting chips 200 may include a red light-emitting chip (R), a green light-emitting chip (G), and a blue light-emitting chip (B). The four light-emitting chips 200 arranged in a line within the same light-emitting unit may be arranged according to GBRG, BGRB, or RGBR, and their arrangement order may be adjusted as needed.

[0071] In some embodiments, four light-emitting chips 200 are disposed on the module substrate 100, and the four light-emitting chips 200 are arranged in an array.

[0072] In this embodiment, combined with Figure 7 As shown, four light-emitting chips 200 are arranged in an array. All four chips 200 are located at the edge region of the light-emitting unit, and their outer cutting surfaces are paired. The two chips 200 in the first row have cutting surfaces on their front sides, and the two chips 200 in the second row have cutting surfaces on their rear sides. The cutting surfaces on the front sides of the two chips 200 in the first row are opposite to the cutting surfaces on the rear sides of the two chips 200 in the second row. The two chips 200 in the first column have cutting surfaces on their left sides, and the two chips 200 in the second column have cutting surfaces on their right sides. The cutting surfaces on the left sides of the two chips 200 in the first column are opposite to the cutting surfaces on the right sides of the two chips 200 in the second column. This causes the light emitted by the four chips 200 to tilt towards the center of the light-emitting unit, changing the emission angle of the target light-emitting chip in the edge region of the light-emitting unit. This allows for effective mixing of the emitted light from multiple light-emitting chips, eliminating the problem of multi-primary-color polarization.

[0073] In some embodiments, each target light-emitting chip has at least two opposing cut surfaces within the edge region of the light-emitting unit.

[0074] In this embodiment, combined with Figure 2 As shown, the first light-emitting chip 210 and the second light-emitting chip 220 are used as target light-emitting chips for explanation. The first light-emitting chip 210 and the second light-emitting chip 220 have cutting surfaces on their opposite sides, and the cutting surfaces are in the same direction.

[0075] In some embodiments, within the edge region of the light-emitting unit, two opposing cut surfaces of each target light-emitting chip are arranged in parallel.

[0076] In this embodiment, combined with Figure 2 As shown, the first light-emitting chip 210 and the second light-emitting chip 220 are used as target light-emitting chips for explanation. The first light-emitting chip 210 and the second light-emitting chip 220 have cutting surfaces on their opposite sides, and the cutting surfaces of the same target light-emitting chip are arranged in parallel.

[0077] This application also provides an electronic device, which includes the display module described in any of the above embodiments.

[0078] The display module in this embodiment includes a module substrate and a plurality of light-emitting units formed on the module substrate. Each light-emitting unit includes at least two light-emitting chips with different light-emitting colors. By cutting the light-emitting chips arranged in the edge region of the plurality of light-emitting chips arranged in the module substrate, the light-emitting chips arranged in the edge region of the light-emitting unit have a cutting surface on the side near the edge of the light-emitting unit. The cutting surface is inclined to the center of the light-emitting unit, thereby changing the light emission angle of the light-emitting chips in the edge region of the light-emitting unit, so that the emitted light of the multiple light-emitting chips can be effectively mixed, and the problem of multi-primary-color polarization is eliminated.

[0079] Other configurations and operations of the electronic devices according to embodiments of this application are known to those skilled in the art and will not be described in detail here.

[0080] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0081] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that, include: Module substrate; Multiple light-emitting units are formed on the module substrate, each light-emitting unit comprising multiple light-emitting chips, wherein at least two of the light-emitting chips emit different colors; Among the plurality of light-emitting chips, the plurality of target light-emitting chips arranged in the edge region of the module substrate have a cutting surface on the side near the edge of the module substrate, the cutting surface being inclined to the center of the light-emitting unit, and the cutting surfaces of at least two of the target light-emitting chips being opposite each other.

2. The display module according to claim 1, characterized in that, The angle between the cut surface and the module substrate is in the range of 82°-89°.

3. The display module according to claim 2, characterized in that, The angle between the cut surface of the target light-emitting chip near the edge of the module substrate and the module substrate is positively correlated with the thickness of the target light-emitting chip.

4. The display module according to claim 1, characterized in that, The module substrate is provided with three light-emitting chips, including a first light-emitting chip, a second light-emitting chip, and a third light-emitting chip, and the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip emit different colors; The first light-emitting chip, the third light-emitting chip, and the second light-emitting chip are arranged in a straight line. The angle between the cut surface of the first light-emitting chip near the edge of the module substrate and the module substrate is in the range of 82°-89°. The angle between the cut surface of the second light-emitting chip near the edge of the module substrate and the module substrate is in the range of 82°-89°.

5. The display module according to claim 4, characterized in that, The chamfer angle formed between the cut surface of the first light-emitting chip near the edge of the module substrate and the module substrate is the same as the chamfer angle formed between the cut surface of the second light-emitting chip near the edge of the module substrate and the module substrate.

6. The display module according to claim 4, characterized in that, The angle between the cut surface of the first light-emitting chip near the edge of the module substrate and the module substrate is positively correlated with the distance between the third light-emitting chips; And / or, The angle between the cut surface of the second light-emitting chip near the edge of the module substrate and the module substrate is positively correlated with the distance between the third light-emitting chip.

7. The display module according to claim 1, characterized in that, The module substrate is provided with three light-emitting chips, including a first light-emitting chip, a second light-emitting chip, and a third light-emitting chip, and the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip emit different colors; The first light-emitting chip, the third light-emitting chip, and the second light-emitting chip are arranged in a triangular pattern. The angle between the cut surface of the first light-emitting chip near the edge of the module substrate and the module substrate is in the range of 82°-89°. The angle between the cut surface of the second light-emitting chip near the edge of the module substrate and the module substrate is in the range of 82°-89°. The angle between the cut surface of the third light-emitting chip near the edge of the module substrate and the module substrate is in the range of 82°-89°.

8. The display module according to claim 1, characterized in that, The module substrate is provided with four light-emitting chips, which are arranged in a line or in an array.

9. The display module according to any one of claims 1-8, characterized in that, Each of the target light-emitting chips has at least two opposing cut surfaces; or, Each target light-emitting chip has two opposite cutting surfaces arranged in parallel.

10. An electronic device, characterized in that, include: The display module as described in any one of claims 1-9.

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