Display device and display apparatus

Abstract

The application relates to the technical field of electrophoretic display, in particular to a display device and a display apparatus. The display device is provided with a driving back plate, an electrophoretic display assembly and an electrode layer in a stack. The electrophoretic display assembly comprises a micro-cup layer, electronic ink and a conductive sealing layer. The micro-cup layer is arranged on the driving back plate, and the micro-cup layer is formed with micro-cups arranged in an array. The electronic ink is filled in the micro-cups. The conductive sealing layer comprises a first sealing part and a second sealing part. The first sealing part is attached to the surface of the micro-cup layer away from the driving back plate. The second sealing part is connected to the first sealing part, and the second sealing part is filled in the micro-cups. The electrode layer is arranged on the side of the electrophoretic display assembly away from the driving back plate. The electrode layer is in electrical communication with the conductive sealing layer, and the electrode layer is in electrical communication with the driving back plate. The second sealing part can support and buffer the electronic ink, so as to weaken the extrusion impact force suffered by the electronic ink, and the electronic ink can be prevented from leaking.

Description

Technical Field

[0001] This application relates to the field of electrophoretic display technology, and more particularly to a display device and display apparatus. Background Technology

[0002] Electronic paper displays are a new type of display technology that simulates the effect of paper printing, featuring a paper-like texture, low power consumption, and eye-friendly characteristics. Electronic paper displays primarily employ electrophoretic display technology, utilizing an external electric field to control the movement of charged particles in electronic ink to form an image.

[0003] In related technologies, to reduce the risk of leakage, a microcup array is arranged on the driving backplane, and electronic ink is filled inside the microcups. A conductive sealing layer covers the opening side of the microcup to achieve an airtight seal. The electronic ink is divided into tiny, independent units, and each microcup is a closed microscopic container. However, when the electronic paper display device is pressed, the electronic ink inside the microcup is squeezed, making it easy for the electronic ink to be squeezed out of the aforementioned microscopic container. This causes the electronic ink to leak from between the conductive sealing layer and the end face around the opening of the microcup, resulting in leakage. Utility Model Content

[0004] The purpose of this application is to provide a display device and display apparatus to solve the technical problem of easy leakage of electronic ink.

[0005] To achieve the above objectives, the technical solution adopted in the first aspect of this application is: a display device, including a driving backplate, an electrophoretic display component, and an electrode layer stacked together.

[0006] The electrophoretic display assembly includes a microcup layer, electronic ink, and a conductive sealing layer. The microcup layer is disposed on the driving backplate, and microcuplets are formed in an array within the microcup layer. The electronic ink fills the microcuplets. The conductive sealing layer includes a first sealing portion and a second sealing portion. The first sealing portion is attached to the surface of the microcup layer facing away from the driving backplate, and the second sealing portion is connected to the first sealing portion and fills the microcuplets. The electrode layer is located on the side of the electrophoretic display assembly facing away from the driving backplate. The electrode layer is electrically connected to the conductive sealing layer and to the driving backplate.

[0007] The beneficial effects of the display device provided in the first aspect of this application are as follows: Since the first sealing portion is attached to the surface of the microcup layer away from the driving backplate, and the second sealing portion is connected to the first sealing portion and fills the microcup, the conductive sealing layer can both cover the upper surface of the microcup layer to seal the microcup and fill part of the gap inside the microcup. When the display is pressed, the second sealing portion filled in the microcup can provide support and cushioning for the electronic ink, thereby reducing the squeezing impact force on the electronic ink and preventing the electronic ink from accumulating at the opening end of the microcup due to squeezing and impacting the sealing interface between the first sealing portion and the microcup layer. This blocks the path of electronic ink leakage from the conductive sealing layer and the end face around the opening of the microcup, thus preventing electronic ink leakage.

[0008] In some embodiments, the first sealing portion and the second sealing portion are integrally formed.

[0009] In some embodiments, the conductive sealing layer is formed on the microcup layer by a coating process or a bonding process.

[0010] In some embodiments, in the stacking direction of the drive backplate and the electrode layer, the thickness of the second sealing portion is 5% to 20% of the depth of the microcup.

[0011] In some embodiments, the second sealing portion is fitted to the inner wall of the microcup.

[0012] In some embodiments, the inner wall of the microcup is provided with a concave-convex anchoring structure, and the second sealing portion fills and adheres to the surface of the concave-convex anchoring structure.

[0013] In some embodiments, the electrode layer has a main body and an extension, the main body covering the electrophoretic display assembly, and the extension extending outward from the edge of the main body and suspended on one side of the drive backplate; The display device further includes a conductive structure disposed on the driving back plate, the conductive structure being located between the driving back plate and the extension; the driving back plate is electrically connected to the conductive structure, and the extension is electrically connected to the conductive structure.

[0014] In some embodiments, the display device further includes an encapsulation layer disposed on the driving backplane, the encapsulation layer surrounding the electrophoretic display component and the electrode layer.

[0015] In some embodiments, the display device further includes a protective layer disposed on the side of the electrode layer opposite to the driving backplate.

[0016] To achieve the above objectives, the technical solution adopted in the second aspect of this application is: a display device, including the display device of the first aspect embodiment described above.

[0017] The beneficial effect of the display device provided in the second aspect of this application is that by applying the display device of the first aspect embodiment to the display device, leakage of electronic ink in the display device can be prevented. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a display device in one embodiment of this application; Figure 2 yes Figure 1 The cross-sectional view of the display device shown along the AA direction; Figure 3 yes Figure 2 A magnified view of region B in the display device shown; Figure 4 yes Figure 2 A magnified view of region C in the display device shown.

[0020] Figure label: 100. Drive backplane; 200, Electrophoretic display assembly; 210, Microcup layer; 211, Microcup; 220, Electronic ink; 230, Conductive sealing layer; 231, First sealing portion; 232, Second sealing portion; 233, Second main body portion; 234, Second extension portion; 300, Electrode layer; 310, First main body portion; 320, First extension portion; 400. First adhesive layer; 500. Conductive structure; 600, Encapsulation layer; 700, protective layer; 800, Second adhesive layer; 900. Driver circuit board; 1000, Driver chip. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings. The embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0022] In the description of this application, it should be understood that the terms "length", "width", "thickness", "top", "bottom", "inner", "outer", "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] To facilitate a clear description of the technical solutions of this application, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" do not necessarily imply that they are different.

[0024] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0025] In this application, "and / or" is merely a way of describing the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0026] It should be noted that, in this application, the terms "in one embodiment," "in one implementation," "exemplarily," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "in one embodiment," "in one implementation," "exemplarily," or "for example" should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of terms such as "in one embodiment," "exemplarily," and "for example" is intended to present the relevant concepts in a specific manner.

[0027] Electronic paper displays are a new type of display technology that simulates the effect of paper printing, featuring a paper-like texture, low power consumption, and eye-friendly characteristics. Electronic paper displays primarily employ electrophoretic display technology, utilizing an external electric field to control the movement of charged particles in electronic ink to form an image.

[0028] In related technologies, to reduce the risk of leakage, a microcup array is arranged on the driving backplane, and electronic ink is filled inside the microcups. A conductive sealing layer covers the opening side of the microcup to achieve an airtight seal. The electronic ink is divided into tiny, independent units, and each microcup is a closed microscopic container. However, when the electronic paper display device is pressed, the electronic ink inside the microcup is squeezed, making it easy for the electronic ink to be squeezed out of the aforementioned microscopic container. This causes the electronic ink to leak from between the conductive sealing layer and the end face around the opening of the microcup, resulting in leakage.

[0029] In view of the above problems, this application provides a display device and display apparatus to solve the technical problem of easy leakage of electronic ink.

[0030] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0031] Please refer to Figure 1 and Figure 2 This application provides a display device, including a driving backplate 100, an electrophoretic display component 200, and an electrode layer 300 stacked together.

[0032] An electrophoretic display assembly 200 is disposed on a driving backplate 100. The electrophoretic display assembly 200 includes a microcup layer 210, electronic ink 220, and a conductive sealing layer 230. The microcup layer 210 is disposed on the driving backplate 100, and microcuplets 211 are formed in an array within the microcup layer 210. The electronic ink 220 fills the microcuplets 211. The conductive sealing layer 230 includes a first sealing portion 231 and a second sealing portion 232. The first sealing portion 231 is attached to the surface of the microcup layer 210 facing away from the driving backplate 100, and the second sealing portion 232 is connected to the first sealing portion 231 and fills the microcuplets 211. An electrode layer 300 is located on the side of the electrophoretic display assembly 200 facing away from the driving backplate 100. The electrode layer 300 is electrically connected to the conductive sealing layer 230 and the driving backplate 100.

[0033] It should be noted that the electrodes on the driving backplate 100 and the electrode layer 300 cooperate to form an electric field, which causes the charged particles in the electronic ink 220 located between the driving backplate 100 and the electrode layer 300 to move under the action of the electric field to achieve image display.

[0034] A microcup layer 210 is disposed on the drive backplate 100. Microcup 211 on the microcup layer 210 can be formed by imprinting after the microcup layer 210 is disposed on the drive backplate 100. During imprinting, the microcup layer 210 is penetrated, causing the microcup layer 210 and the drive backplate 100 to enclose and form a matrix of microcup 211. Alternatively, during imprinting, only a portion of the microcup layer 210 is penetrated to form a matrix of microcup 211 on the microcup layer 210. The microcup layer 210 can be formed by coating the drive backplate 100 with a UV-curable composition (such as a UV-curable resin) and then curing it. The size and spacing of the microcup 211 can be designed according to display resolution requirements to separate and accommodate electronic ink 220.

[0035] Electronic ink 220 is composed of charged particles (such as black particles and white particles), dispersion medium and surfactants. The charged particles in electronic ink 220 can move under the action of the electric field between the driving back plate 100 and the electrode layer 300 to achieve image display.

[0036] The conductive sealing layer 230 is a layered structure with conductive and sealing functions. The conductive sealing layer 230 is divided into a first sealing part 231 and a second sealing part 232. The first sealing part 231 is a sheet-like structure covering the surface of the microcup layer 210 away from the drive backplate 100, and the second sealing part 232 is a filling structure filling the interior of the microcup 211.

[0037] The electrode layer 300 is a sheet-like electrode structure disposed on the side of the electrophoretic display assembly 200 facing away from the driving backplate 100. The electrode layer 300 is made of a transparent conductive material; for example, it can be an ITO (Indium Tin Oxide) film, an AZO (Aluminum-doped Zinc Oxide) film, a graphene conductive film, or a carbon nanotube conductive film. The electrode layer 300 acts as the upper electrode plate for forming an electric field, cooperating with the driving backplate 100 to form a driving electric field, and is directly electrically connected to the conductive sealing layer 230, ensuring the continuity of the electric field conduction. The electrode layer 300 is adhered to the surface of the conductive sealing layer 230 facing away from the driving backplate 100 via the first adhesive layer 400.

[0038] In the display device provided by the first aspect of this application, since the first sealing portion 231 is attached to the surface of the microcup layer 210 away from the driving backplate 100, and the second sealing portion 232 is connected to the first sealing portion 231 and fills the microcup 211, the conductive sealing layer 230 can both cover the upper surface of the microcup layer 210 to seal the microcup 211 and fill part of the gap inside the microcup 211. When the display is pressed, the second sealing portion 232 filled in the microcup 211 can provide support and buffer for the electronic ink 220, thereby reducing the squeezing impact force on the electronic ink 220 and preventing the electronic ink 220 from accumulating towards the opening end of the microcup 211 due to the squeezing action and impacting the sealing interface between the first sealing portion 231 and the microcup layer 210. This blocks the path of leakage of the electronic ink 220 from the conductive sealing layer 230 and the end face around the opening of the microcup 211, thus preventing the electronic ink 220 from leaking.

[0039] Please refer to Figure 2 In some embodiments, the first sealing portion 231 and the second sealing portion 232 are integrally formed.

[0040] In the above embodiments, the two sub-parts (first sealing part 231 and second sealing part 232) of the conductive sealing layer 230 are formed into an inseparable integral structure through the same preparation process and the same material, without obvious interface boundary lines.

[0041] In the above embodiment, the first sealing portion 231 and the second sealing portion 232 are integrally formed, which can eliminate the connection interface between the first sealing portion 231 and the second sealing portion 232, so as to avoid the risk of leakage caused by the loose connection between the first sealing portion 231 and the second sealing portion 232, and can enhance the overall structural integrity of the conductive sealing layer 230, so as to improve the sealing effect of the conductive sealing layer 230 on the electronic ink 220.

[0042] The conductive sealing layer 230 can be formed on the microcup layer 210 by a coating process or a bonding process. For example, by using a coating process (such as screen printing or inkjet printing, followed by curing), the conductive sealing material is simultaneously applied to the surface of the microcup layer 210 facing away from the drive backplate 100 (forming the first sealing portion 231) and filled inside the microcup 211 (forming the second sealing portion 232). Then, the conductive sealing material is cured, so that the first sealing portion 231 and the second sealing portion 232 form an integrated structure. For example, the conductive sealing layer 230 is first cured and then bonded to the microcup layer 210.

[0043] In some embodiments, in the stacking direction of the drive backplate 100 and the electrode layer 300, the thickness of the second sealing portion 232 is 5% to 20% of the depth of the microcup 211.

[0044] By limiting the filling depth of the second sealing portion 232 into the microcup 211 to 5%~20% of the depth of the microcup 211, the balance between sealing buffer and photoelectric performance can be achieved. This ensures that the second sealing portion 232 has sufficient support and buffering capacity to avoid the risk of leakage, while also preventing excessive filling from occupying the movement space of the electronic ink 220 and affecting the electric field response speed and image display effect of the electronic ink 220.

[0045] The thickness range of the second sealing portion 232 can be subdivided according to different display scenarios (such as high-resolution display and flexible display). In the high-resolution display scenario, the thickness of the second sealing portion 232 is 8% to 15% of the depth of the microcup 211, for example, 10%, 12%, and 14%. In the flexible display scenario, in order to improve the buffering performance, the thickness of the second sealing portion 232 is 12% to 20% of the depth of the microcup 211, for example, 14%, 16%, and 18%.

[0046] Please refer to Figure 2 In some embodiments, the second sealing portion 232 is attached to the inner wall of the microcup 211.

[0047] In the above embodiment, the second sealing portion 232 is attached to the inner wall of the microcup 211, which can improve the sealing performance between the second sealing portion 232 and the inner wall of the microcup 211, reduce the gap between the second sealing portion 232 and the inner wall of the microcup 211, prevent the electronic ink 220 from being retained or seeping in the gap between the second sealing portion 232 and the inner wall of the microcup 211, further block the leakage path of the electronic ink 220, and enhance the sealing effect.

[0048] In some embodiments, the inner wall of the microcup 211 is provided with a concave-convex anchoring structure, and the second sealing portion 232 fills and adheres to the surface of the concave-convex anchoring structure.

[0049] An anchoring structure with uneven surfaces can be integrally formed on the inner wall of the microcup 211 or formed through subsequent processing. The uneven anchoring structure can be achieved through mature micro-nano fabrication processes (such as photolithography, etching, plasma modification, coating molding, etc.).

[0050] A concave-convex anchoring structure is processed on the inner wall of the microcup 211, so that the second sealing part, which was originally only a planar fit, forms a composite connection structure of filling and fitting with the inner wall of the microcup 211. The mechanical interlocking effect of the concave-convex anchoring structure is used to strengthen the bonding stability between the second sealing part 232 and the inner wall of the microcup 211, and prevent the conductive sealing layer 230 from falling off or delaminating.

[0051] Please refer to Figure 3In some embodiments, the electrode layer 300 has a first main body portion 310 and a first extension portion 320. The first main body portion 310 covers the electrophoretic display assembly 200, and the first extension portion 320 extends outward from the edge of the first main body portion 310 and is suspended on one side of the driving backplate 100. The display device also includes a conductive structure 500 disposed on the driving backplate 100, the conductive structure 500 being located between the driving backplate 100 and the first extension portion 320. The driving backplate 100 is electrically connected to the conductive structure 500, and the first extension portion 320 is electrically connected to the conductive structure 500.

[0052] The conductive structure 500 can be made of conductive pastes such as conductive silver paste, conductive carbon paste, or ITO nano paste. The fabrication process for the conductive structure 500 can include screen printing, inkjet printing, and vacuum evaporation.

[0053] In the above embodiment, the driving backplate 100 and the electrode layer 300 are electrically connected through the conductive structure 500. The electrical signal of the driving backplate 100 is transmitted to the first extension 320 through the conductive structure 500, and then conducted to the first main body 310. The first main body 310 and the driving backplate 100 cooperate to form a uniform driving electric field, which ensures the display effect of the display device while improving the reliability of the electrical connection.

[0054] In the above embodiment, the driving backplate 100 and the electrode layer 300 are electrically connected through a conductive structure 500 located on one side of the electrophoretic display assembly 200. This avoids setting an electrode connection structure in the electrophoretic display area, thereby preventing the connection structure from blocking or interfering with the display area, and improving the display clarity and uniformity of the display device.

[0055] Please refer to Figure 3 In some embodiments, the display device further includes an encapsulation layer 600 disposed on the driving backplane 100, the encapsulation layer 600 surrounding the periphery of the electrophoretic display assembly 200 and the electrode layer 300.

[0056] The encapsulation layer 600 can be made of UV-curable encapsulating adhesive (such as epoxy acrylate encapsulating adhesive), thermosetting encapsulating resin (such as phenolic resin encapsulating adhesive), or flexible encapsulating adhesive (such as silicone encapsulating adhesive, suitable for flexible applications). The encapsulation layer 600 can be manufactured using processes such as screen printing, dispensing, or vacuum potting.

[0057] In the above embodiment, the encapsulation layer 600 can block moisture and impurities from entering through the gap, thereby encapsulating and protecting the conductive structure 500 and the electrophoretic display component 200.

[0058] Please refer to Figure 3In some embodiments, the first extension 320 extends outward from the edge of the first body portion 310 and protrudes beyond the side surface of the conductive structure 500 (i.e., the extension length of the first extension 320 is greater than the dimension of the conductive structure 500 in the corresponding direction, such that the side surface of the first extension 320 away from the first body portion 310 extends beyond the side surface of the conductive structure 500). A portion of the encapsulation layer 600 fills the space between the first extension 320 and the drive backplate 100, and the encapsulation layer 600 is adjacent to the side surface of the electrode layer 300.

[0059] The encapsulation layer 600 provides support for the first extension 320, reducing contact misalignment between the first extension 320 and the conductive structure 500 caused by device bending or vibration, thus ensuring the stability of the electrical connection. The encapsulation layer 600 is adjacent to the side surface of the electrode layer 300, further preventing the intrusion of external moisture and impurities, enhancing the structural integrity of the display device edges, and reducing the risk of film peeling.

[0060] Please refer to Figure 4 In some embodiments, the conductive sealing layer 230 has a second body portion 233 and a second extension portion 234. The second body portion 233 covers the microcup layer 210, and the second extension portion 234 extends outward from the edge of the second body portion 233 and is suspended on one side of the drive backplate 100. A portion of the encapsulation layer 600 fills the space between the second extension portion 234 and the drive backplate 100. The encapsulation layer 600 can fill the periphery of the microcup layer 210 to block the path of moisture and impurities from entering and contaminating the electronic ink 220 through the gaps, thereby further encapsulating and protecting the electronic ink 220.

[0061] Please refer to Figure 2 In some embodiments, the display device further includes a protective layer 700 disposed on the side of the electrode layer 300 away from the driving backplate 100.

[0062] The protective layer 700 is a protective layered structure disposed on the side of the electrode layer 300 facing away from the driving backplate 100. It is attached to the surface of the electrode layer 300 facing away from the driving backplate 100 by the second adhesive layer 800. The protective layer 700 is used to provide physical protection and auxiliary sealing for structures such as the electrode layer 300 and the conductive sealing layer 230, preventing damage to the internal structure from external scratches and impacts, and blocking the path of moisture intrusion from the upper surface of the display device. The protective layer 700 has good light transmittance (without affecting the display effect), wear resistance, and weather resistance.

[0063] The protective layer 700 is attached to the surface of the encapsulation layer 600 away from the drive backplane 100 to improve the encapsulation protection effect.

[0064] Please refer to Figure 2In some embodiments, the display device further includes a driving circuit board 900 (which may be an FPC flexible circuit board) electrically connected to the driving backplane 100 and a driving chip 1000 disposed on the driving backplane 100. An encapsulation layer 600 covers the driving chip 1000 to encapsulate and protect the driving chip 1000.

[0065] A second aspect of this application provides a display device, including the display device described in the first aspect embodiment.

[0066] By applying the display device of the first aspect embodiment described above to a display device, leakage of electronic ink 220 in the display device can be prevented.

[0067] Display devices can include e-readers, smartwatches, flexible mobile phone display panels, electronic price tags, industrial control display panels, outdoor environmental monitoring display terminals, etc.

[0068] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A display device, characterized in that, This includes a stacked drive backplate, electrophoretic display components, and electrode layers; The electrophoretic display assembly includes a microcup layer, electronic ink, and a conductive sealing layer. The microcup layer is disposed on the driving backplate, and microcuplets are formed in an array within the microcup layer. The electronic ink is filled within the microcuplets. The conductive sealing layer includes a first sealing portion and a second sealing portion. The first sealing portion is attached to the surface of the microcup layer facing away from the driving backplate, and the second sealing portion is connected to the first sealing portion and is filled within the microcuplets. The electrode layer is located on the side of the electrophoretic display assembly opposite to the driving backplate, and the electrode layer is electrically connected to the conductive sealing layer and the driving backplate.

2. The display device according to claim 1, characterized in that, The first sealing portion and the second sealing portion are integrally formed.

3. The display device according to claim 2, characterized in that, The conductive sealing layer is formed on the microcup layer by a coating process or a bonding process.

4. The display device according to any one of claims 1 to 3, characterized in that, In the stacking direction of the drive backplate and the electrode layer, the thickness of the second sealing portion is 5% to 20% of the depth of the microcup.

5. The display device according to claim 4, characterized in that, The second sealing portion is fitted to the inner wall of the microcup.

6. The display device according to claim 5, characterized in that, The inner wall of the microcup is provided with a concave-convex anchoring structure, and the second sealing part fills and adheres to the surface of the concave-convex anchoring structure.

7. The display device according to any one of claims 1 to 3, characterized in that, The electrode layer has a main body and an extension, the main body covering the electrophoretic display assembly, and the extension extending outward from the edge of the main body and suspended on one side of the drive back plate; The display device further includes a conductive structure disposed on the driving back plate, the conductive structure being located between the driving back plate and the extension; the driving back plate is electrically connected to the conductive structure, and the extension is electrically connected to the conductive structure.

8. The display device according to any one of claims 1 to 3, characterized in that, The display device further includes an encapsulation layer disposed on the driving backplane, the encapsulation layer surrounding the electrophoretic display component and the electrode layer.

9. The display device according to any one of claims 1 to 3, characterized in that, The display device further includes a protective layer disposed on the side of the electrode layer opposite to the driving backplate.

10. A display device, characterized in that, Includes the display device according to any one of claims 1 to 9.

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