Wireless controller and temperature regulating device

Abstract

The application relates to the technical field of wire controllers, and discloses a wire controller and a temperature adjusting device. The wire controller comprises a master control chip and at least one touch element, and a first resistive unit is connected in series between each touch element and the master control chip. In the manner, the electrostatic protection capability of the wire controller can be improved.

Description

Technical Field

[0001] This application relates to the field of wired controller technology, and in particular to wired controllers and temperature control devices. Background Technology

[0002] The wired controller has a human-machine interface design for exchanging information. By touching the corresponding buttons (components) on the wired controller, commands are sent to the corresponding device for control.

[0003] The touch components on the wired controller are prone to false triggering of commands under strong static electricity, which affects the reliability of the product and the user experience. Utility Model Content

[0004] The wired controller and temperature control device provided in this application can improve the electrostatic protection capability of the wired controller.

[0005] In a first aspect, this application provides a wired controller, which includes: a main control chip; at least one touch element, wherein a first resistive unit is connected in series between each touch element and the main control chip.

[0006] The main control chip has a second resistive unit connected in series between its power supply pin and the power supply.

[0007] A filter unit is provided between the power supply pins of the main control chip and the power supply.

[0008] The filtering unit is an RC filter circuit.

[0009] Each of the first resistive units includes a resistor and a ferrite bead connected in series.

[0010] Each touch element and its corresponding first resistive unit are coupled to the first end of a TVS diode, and the second end of the TVS diode is grounded.

[0011] The ground wire in the wired controller uses single-point grounding.

[0012] The line width of the connection line between each touch element, the main control chip, and the first resistive unit is 5mil-8mil.

[0013] The wired controller also includes a display module, storage circuit, temperature acquisition component, infrared sensing component, sound prompt component, or communication module connected to the main control chip.

[0014] In a second aspect, this application provides a temperature regulating device, which includes a wired controller as provided in the first aspect.

[0015] The beneficial effects of this application are as follows: Unlike the prior art, the wired controller and temperature control device provided in this application connect a first resistive unit in series between the main control chip and the touch element of the wired controller. The first resistive unit has a high impedance to high-frequency signals and is specifically used to suppress high-frequency noise and spike interference on signal lines and power lines. It also has the ability to absorb electrostatic pulses. This method can effectively suppress accidental touches of the touch element of the wired controller under the action of electrostatics, improve the electrostatic protection capability of the wired controller, and reduce the problem of accidental command triggering. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the wired controller provided in this application;

[0018] Figure 2 This is a schematic diagram of another embodiment of the wired controller provided in this application;

[0019] Figure 3 This is a schematic diagram of the structure of an embodiment of the main control chip provided in this application;

[0020] Figure 4 This is a schematic diagram of another embodiment of the main control chip provided in this application;

[0021] Figure 5 This is a schematic diagram of another embodiment of the main control chip provided in this application;

[0022] Figure 6 This is a schematic diagram of another embodiment of the wired controller provided in this application;

[0023] Figure 7 This is a schematic diagram of an embodiment of the temperature regulation device provided in this application. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are only for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to this application are shown in the accompanying drawings, not all structures. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0025] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] The wired controller has a human-machine interface design for exchanging information. By touching the corresponding buttons (components) on the wired controller, commands are sent to the corresponding device for control.

[0027] The touch components on the wired controller are prone to false triggering of commands under strong static electricity, which affects the reliability of the product and the user experience.

[0028] Based on this, this application proposes connecting a first resistive unit in series between the main control chip and the touch element of the wired controller. This first resistive unit has a high impedance to high-frequency signals, specifically designed to suppress high-frequency noise and spike interference on signal and power lines. It also has the ability to absorb electrostatic pulses. This method effectively suppresses accidental touches by the touch element of the wired controller under electrostatic discharge, improving the electrostatic protection capability of the wired controller and reducing the problem of accidental command triggering. See any of the following embodiments for specific technical solutions.

[0029] See Figure 1 , Figure 1 This is a schematic diagram of an embodiment of the wired controller provided in this application. The wired controller 100 includes a main control chip 10 and at least one touch element 20. A first resistive unit 30 is connected in series between each touch element 20 and the main control chip 10.

[0030] In some embodiments, each touch element 20 may correspond to a function of a wired controller 100. For example, if the wired controller 100 is part of a temperature control device, a touch element 20 with a corresponding function can be provided on the wired controller 100. For instance, a first touch element may be provided, which has a power on / off function. A second touch element may be provided, which has a "temperature increase" function. A third touch element may be provided, which has a "temperature decrease" function. A fourth touch element may be provided, which has a mode adjustment function. The touch element 20 may be a spring-loaded button.

[0031] In some embodiments, the wired controller 100 may be embedded in a wall or the housing of a device during actual use.

[0032] In this embodiment, a first resistive unit 30 is connected in series between the main control chip 10 of the wired controller 100 and the touch element 20. The first resistive unit 30 has a high impedance to high-frequency signals and is specifically used to suppress high-frequency noise and spike interference on signal lines and power lines. It also has the ability to absorb electrostatic pulses. This method can effectively suppress accidental touches of the touch element 20 of the wired controller 100 under the action of electrostatics, improve the electrostatic protection capability of the wired controller 100, and reduce the problem of accidental command triggering.

[0033] In some embodiments, each first resistive unit 30 includes a resistor and a magnetic bead connected in series.

[0034] In some embodiments, each touch element 20 and its corresponding first resistive unit 30 are coupled to the first end of a TVS diode, and the second end of the TVS diode is grounded.

[0035] In one application scenario, combined with Figure 2 Explanation:

[0036] The first touch element is connected to the main control chip 10 via a series resistor R1 and a ferrite bead FB1, and a TVS diode is placed between the first touch element and the ferrite bead FB1. The second touch element is connected to the main control chip 10 via a series resistor R2 and a ferrite bead FB2, and a TVS diode is placed between the second touch element and the ferrite bead FB2. The third touch element is connected to the main control chip 10 via a series resistor R3 and a ferrite bead FB3, and a TVS diode is placed between the third touch element and the ferrite bead FB3. The fourth touch element is connected to the main control chip 10 via a series resistor R4 and a ferrite bead FB4, and a TVS diode is placed between the fourth touch element and the ferrite bead FB4. The fifth touch element is connected to the main control chip 10 via a series resistor R5 and a ferrite bead FB5, and a TVS diode is placed between the fifth touch element and the ferrite bead FB5. The sixth touch element is connected to the main control chip 10 via a series resistor R6 and a ferrite bead FB6, and a TVS diode is placed between the sixth touch element and the ferrite bead FB6.

[0037] In the hardware circuit design, by selecting appropriate series resistors for the touch IC and touch buttons, typically between 510Ω and 4.7KΩ, and adding ferrite beads to improve ESD resistance, this method effectively enhances ESD interference immunity. This solution mainly utilizes the high impedance of ferrite beads to high-frequency signals in the circuit, specifically designed to suppress high-frequency noise and spike interference on signal lines and power lines. It also has the ability to absorb electrostatic pulses. This method can effectively suppress accidental touches of the touch element 20 of the wired controller 100 under electrostatic effects, thereby improving the electrostatic protection capability of the wired controller 100 and reducing the problem of accidental command triggering.

[0038] See Figure 3 , Figure 3 This is a schematic diagram of an embodiment of the main control chip provided in this application. A second resistive unit 40 is connected in series between the power supply pin VCC of the main control chip 10 and the power supply 50. In some embodiments, the second resistive unit 40 may be composed of a resistor. In some embodiments, the second resistive unit 40 may be composed of a ferrite bead. In some embodiments, the second resistive unit 40 may be composed of a resistor and a ferrite bead.

[0039] It is understandable that the main control chip 10 can have multiple pins, such as the power supply pin VCC and the signal receiving pin.

[0040] In this embodiment, the main control chip 10 adopts a single-point power supply method, and a second resistive unit 40 is connected in series on the power supply 50 to suppress noise on the power supply line.

[0041] See Figure 4 , Figure 4 This is a schematic diagram of another embodiment of the main control chip 10 provided in this application. A filter unit 60 is provided between the power supply pin VCC of the main control chip 10 and the power supply 50. The filter unit 60 is an RC filter circuit. In some embodiments, the filter unit may also be an LC filter circuit.

[0042] In some embodiments, the main control chip 10 is powered by a single point, and RC filtering is used on the power supply 50 to suppress noise on the power supply line.

[0043] See Figure 5 , Figure 5 This is a schematic diagram of another embodiment of the main control chip 10 provided in this application. A second resistive unit 40 is connected in series between the power supply pin VCC and the power supply 50 of the main control chip 10, and a filter unit 60 is provided between the power supply pin VCC and the power supply 50 of the main control chip 10.

[0044] In some embodiments, the main control chip 10 is powered by a single point, and RC filtering is used on the power supply 50 to suppress noise on the power supply line.

[0045] In some embodiments, the ground wire in the wired controller 100 is grounded at a single point.

[0046] In some embodiments, the line width of the connection line between each touch element 20, the main control chip 10 and the first resistive unit 30 is 5mil-8mil.

[0047] In this application, both the main control chip 10 and the touch element 20 are mounted on a PCB (Printed Circuit Board). Therefore, the PCB layout is crucial for the anti-interference design of the touch element 20, especially the handling of the ground line GND. The ground line GND adopts a single-point grounding method to reduce the impact of power supply noise on the main control chip 10. The PCB layout must strictly follow the wiring requirements of the touch-sensitive button.

[0048] 1. The line width of the sensing signal line corresponding to the touch element 20 needs to meet the requirements, and the line width should be controlled within 5-8 mil (double-sided board).

[0049] 2. It is recommended to lay ground planes on all blank areas of the PCB and use ground planes to connect the button sensor to the IC input.

[0050] 3. The sensing signal lines corresponding to the touch element 20 should be kept away from high-speed signals, such as SPI (Serial Peripheral Interface), IIC (Inter-Integrated Circuit), SDIO (Secure Digital Input and Output) signal lines.

[0051] In some embodiments, the wired controller 100 further includes a display module, a storage circuit, a temperature acquisition component, an infrared sensing component, an audio prompt component, or a communication module connected to the main control chip 10.

[0052] In one application scenario, combined Figure 6 To explain, in Figure 6 In addition to the aforementioned touch element 20 and other components, the wired controller 100 also includes a display module 73, a storage circuit 74, a temperature acquisition component 76, an infrared sensing component 77, a sound prompt component 71, a communication module 75, and a power supply circuit 72, all connected to the main control chip 10. In some embodiments, the display module 73 may be a touchscreen display module 73 or a non-touchscreen display module 73. The storage circuit 74 may be composed of a corresponding storage chip. The temperature acquisition component 76 may be a temperature sensor. The infrared sensing component 77 may be an infrared sensor. The sound prompt component 71 may be a voice playback module and / or a buzzer. The communication module 75 may be a Bluetooth module and / or a wireless module (WIFI module). Figure 6As shown, the main control chip 10 and the display module 73 can transmit RGB signals. The main control chip 10 and the storage circuit 74 can transmit data via the SPI protocol. The main control chip 10 and the communication module 75 can transmit data via RF (Radio Frequency) signals. The main control chip 10 and the temperature acquisition component 76 can convert data via an ADC (Analog to Digital Converter). The main control chip 10 and the infrared sensing component 77 can be connected via GPIO (General Purpose Input / Output) pins. The main control chip 10 and the sound prompt component 71 can be connected via GPIO pins. The main control chip 10 and the power supply circuit 72 can transmit data via the UART (Universal Asynchronous Receiver / Transmitter) protocol.

[0053] See Figure 7 , Figure 7 This is a schematic diagram of an embodiment of the temperature control device provided in this application. The temperature control device 200 includes a wired controller 100. The wired controller 100 can be the wired controller 100 in any of the above embodiments.

[0054] In some embodiments, the temperature control device 200 may be a heating, ventilation, and air conditioning (HVAC) device such as an air conditioner.

[0055] In summary, the wired controller 100 and temperature control device 200 provided in this application connect a first resistive unit 30 in series between the main control chip 10 and the touch element 20 of the wired controller 100. The first resistive unit 30 has a high impedance to high-frequency signals and is specifically used to suppress high-frequency noise and spike interference on signal lines and power lines. It also has the ability to absorb electrostatic pulses. This method can effectively suppress accidental touches of the touch element 20 of the wired controller 100 under the action of electrostatics and improve the electrostatic protection capability of the wired controller 100.

[0056] Compared to current wired controllers that enhance ESD immunity by increasing panel thickness to improve structural protection and pass ESD tests, the static electricity can be conducted through the panel to the TK detection pin of the touch IC during ESD testing because the sensing spring button is in close contact with the panel or has a very small gap. This can lead to false triggering or damage. The solution adopted in this application can effectively improve the anti-static capability of the circuit board.

[0057] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0058] If the integrated units in the other embodiments described above are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processing circuit component (processor) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0059] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A wired controller, characterized in that, The wired controller includes: Main control chip; At least one touch element, and a first resistive unit is connected in series between each touch element and the main control chip; each first resistive unit includes a resistor and a ferrite bead connected in series; the touch element is a spring-loaded button; a first terminal of a TVS diode is coupled between each touch element and its corresponding first resistive unit, and the second terminal of the TVS diode is grounded.

2. The wired controller according to claim 1, characterized in that, A second resistive unit is connected in series between the power supply pin of the main control chip and the power supply.

3. The wired controller according to claim 1 or 2, characterized in that, A filter unit is provided between the power supply pins of the main control chip and the power supply.

4. The wired controller according to claim 3, characterized in that, The filtering unit is an RC filter circuit.

5. The wired controller according to claim 1, characterized in that, The ground wire in the wired controller is grounded at a single point.

6. The wired controller according to claim 1, characterized in that, The line width of the connection line between each of the touch elements, the main control chip, and the first resistive unit is 5mil-8mil.

7. The wired controller according to any one of claims 1, 2, 4-6, characterized in that, The wired controller also includes a display module, a storage circuit, a temperature acquisition component, an infrared sensing component, an audio prompt component, or a communication module connected to the main control chip.

8. A temperature regulating device, characterized in that, The temperature control device includes a wired controller as described in any one of claims 1-7.

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