An integrated suspension type computer case

CN224889106UActive Publication Date: 2026-10-23GUANGZHOU XUEXINGSI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202522086830.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-28
Publication Date
2026-10-23
Estimated Expiration
2035-09-28

AI Technical Summary

Technical Problem

例如,当机箱底部通风口贴近地面时,进风效率大幅下降,导致CPU、GPU等核心硬件温度升高,影响性能稳定性

Benefits of technology

[0012]综上所述,本实用新型具有以下有益效果:本实用新型一种一体悬空式的电脑机箱,悬空设计使机箱底部与放置面之间形成畅通的散热风道,从根本上解决了因贴近地面、地毯等柔软表面导致的进风口堵塞问题。配合机箱上盖板设置的多个散热槽,构成了立体、高效的主动散热系统,能显著降低CPU、GPU等核心硬件的工作温度,有效防止因过热导致的性能降频,延长设备使用寿命。

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Abstract

The utility model discloses an integral suspension formula's computer machine case, including the machine case subassembly and the suspension subassembly, the suspension subassembly is located the inside wall of machine case subassembly, the suspension subassembly includes the suspension support and the suspension groove, the suspension support is located the inside wall of machine case subassembly, the suspension groove is set up in the inside wall of machine case subassembly, and the suspension design makes the machine case bottom and the placement surface between the formation of the unobstructed heat dissipation air duct, fundamentally solved the air inlet blockage problem caused by close to the ground, carpet etc. Soft surface. The multiple heat dissipation grooves of cooperation machine case upper cover plate setting constitute the three -dimensional, and the efficient initiative heat dissipation system can significantly reduce CPU, GPU etc. The working temperature of core hardware, effectively prevent the performance of the frequency reduction because of overheating, prolong the service life of equipment.
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Description

Technical Field

[0001] This utility model relates to the field of chassis technology, specifically an integrated suspended computer chassis. Background Technology

[0002] Traditional computer cases often suffer from poor heat dissipation design, leading to dust accumulation around devices and impacting hardware lifespan. For example, when a computer is placed on a soft surface like a carpet, the bottom vents can easily become blocked, causing internal heat buildup that even high-performance fans struggle to dissipate effectively. Furthermore, traditional cases present complex cable management issues, with exposed cables for monitors, computers, keyboards, and other devices, further exacerbating desktop clutter. Traditional computer case cooling designs primarily rely on passive cooling through internal fans and vents. However, due to the case's structure, airflow is often obstructed. For example, when the bottom vents are close to the ground, airflow efficiency drops significantly, leading to increased temperatures in core hardware such as the CPU and GPU, impacting performance stability. To address this issue, the inventors have proposed an integrated, suspended computer case. Summary of the Invention

[0003] To address the shortcomings of the aforementioned technologies, this utility model provides an integrated suspended computer chassis.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: an integrated suspended computer chassis, comprising a chassis assembly and a suspended assembly, wherein the suspended assembly is disposed on the inner side wall of the chassis assembly, and the suspended assembly includes a suspended bracket and a suspended groove, wherein the suspended bracket is disposed on the inner side wall of the chassis assembly, and the suspended groove is formed on the inner side wall of the chassis assembly.

[0005] As further explained, the chassis assembly includes support feet and a base, the base being disposed on the upper surface of the support feet, the support feet being provided in multiple and spaced apart, and the suspended bracket being located on the inner sidewall of the base.

[0006] As a further explanation, it also includes a base plate and a rear cover plate, wherein the base plate is disposed on the upper surface of the suspended bracket and the rear cover plate is disposed on the upper surface of the base plate.

[0007] As a further explanation, the upper surface of the base plate is provided with a front cover plate corresponding to the rear cover plate, and the upper surface of the front cover plate is provided with an upper cover plate.

[0008] As further explained, one end of the upper cover plate is provided with a side plate, which is located between the upper cover plate and the bottom plate.

[0009] As a further explanation, it also includes a control panel and a graphics card placement plate, wherein the control panel is located at one end of the base and the graphics card placement plate is located on the inner side wall of the rear cover.

[0010] As a further explanation, it also includes a power supply placement slot and a motherboard. The power supply placement slot is located on the inner side wall of the rear cover to facilitate the placement of the power supply body, and the motherboard is located on the inner side wall of the side panel.

[0011] As a further explanation, the inner wall of the upper cover is provided with heat dissipation slots for heat dissipation of the chassis, and there are multiple heat dissipation slots arranged at intervals.

[0012] In summary, this utility model has the following beneficial effects: The integrated suspended computer chassis of this utility model features a suspended design that creates a smooth airflow channel between the bottom of the chassis and the surface it is placed on, fundamentally solving the problem of air intake blockage caused by proximity to soft surfaces such as the ground or carpet. Combined with multiple heat dissipation slots on the chassis's top cover, it forms a three-dimensional, highly efficient active cooling system, which can significantly reduce the operating temperature of core hardware such as the CPU and GPU, effectively preventing performance throttling due to overheating and extending the lifespan of the equipment. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of an integrated suspended computer chassis according to the present invention; Figure 2 This is a rear view of an integrated suspended computer chassis according to the present invention. Figure 3 This is a schematic diagram of the internal structure of an integrated suspended computer chassis according to the present invention.

[0014] The diagram is labeled as follows: 1. Heatsink; 11. Support foot; 12. Base plate; 13. Rear cover; 14. Top cover; 15. Side plate; 16. Front cover; 17. Base; 101. Control panel; 102. Graphics card mounting plate; 103. Power supply mounting slot; 104. Motherboard; 21. Suspended bracket; 22. Suspended slot. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] like Figure 1-3As shown, the present invention provides an integrated suspended computer chassis, including a chassis assembly and a suspended assembly. The suspended assembly is disposed on the inner side wall of the chassis assembly. The suspended assembly includes a suspended bracket 21 and a suspended groove 22. The suspended bracket 21 is disposed on the inner side wall of the chassis assembly, and the suspended groove 22 is formed on the inner side wall of the chassis assembly.

[0017] Specifically, the inner wall of the chassis assembly is equipped with a suspended bracket 21 and a suspended groove 22 to form a three-dimensional support frame. The main body of the chassis is suspended above the base 17 via the suspended bracket 21, creating a physical isolation space between the bottom of the chassis and the ground / desktop. This design avoids the risk of the bottom ventilation opening of the traditional chassis being blocked by carpets or desktop clutter, and fundamentally solves the problem of airflow obstruction caused by the closed contact surface.

[0018] The chassis assembly includes support feet 11 and a base 17. The base 17 is located on the upper surface of the support feet 11. Multiple support feet 11 are provided and spaced apart. The suspended bracket 21 is located on the inner side wall of the base 17. It also includes a bottom plate 12 and a rear cover plate 13. The bottom plate 12 is located on the upper surface of the suspended bracket 21. The rear cover plate 13 is located on the upper surface of the bottom plate 12. The upper surface of the bottom plate 12 is provided with a front cover plate 16 corresponding to the rear cover plate 13. The upper surface of the front cover plate 16 is provided with an upper cover plate 14. One end of the upper cover plate 14 is provided with a side plate 15. The side plate 15 is located between the upper cover plate 14 and the bottom plate 12.

[0019] Specifically, multiple spaced support feet 11 support the base 17, and a suspended bracket 21 is fixed to the inner wall of the base 17, forming a stable suspended support structure. This layout not only ensures the stability of the chassis, but also creates a natural ventilation channel at the bottom through the gaps between the support feet 11, further enhancing air circulation efficiency in conjunction with the suspended structure.

[0020] The base plate 12, rear cover plate 13, front cover plate 16, top cover plate 14, and side plates 15 together form a three-dimensional heat dissipation cavity. Multiple heat dissipation slots 1 spaced apart on the inner wall of the top cover plate 14 serve as the main air outlets, forming a vertical airflow channel of "bottom intake - top exhaust" with the bottom suspended area. Air enters from the open space below the suspended bracket 21, passes over the surface of internal hardware (such as the CPU and GPU), and is exhausted through the heat dissipation slots 1, forming an efficient heat dissipation cycle. Compared to the passive cooling of traditional chassis, this design significantly improves the smoothness of the airflow path and reduces the temperature of the core hardware.

[0021] It also includes a control panel 101 and a graphics card mounting plate 102. The control panel 101 is located at one end of the base 17, and the graphics card mounting plate 102 is located on the inner side wall of the rear cover 13. It also includes a power supply mounting slot 103 and a motherboard 104. The power supply mounting slot 103 is located on the inner side wall of the rear cover 13 to facilitate the placement of the power supply unit, and the motherboard 104 is located on the inner side wall of the side panel 15.

[0022] Specifically, the inner wall of the rear cover 13 is provided with a graphics card placement plate 102 and a power supply placement slot 103, and the inner wall of the side plate 15 is fixed with a motherboard 104, forming a partitioned hardware layout.

[0023] The inner side wall of the top cover plate 14 is provided with heat dissipation slots 1 for heat dissipation of the chassis, and there are multiple heat dissipation slots 1 arranged at intervals.

[0024] Specifically, the multiple heat dissipation slots 1 spaced apart on the inner side wall of the upper cover plate 14 serve as the main air outlets, forming a vertical air duct of "bottom air inlet - top air outlet" with the bottom suspended area.

[0025] The suspended design creates a smooth airflow channel between the bottom of the chassis and the surface it is placed on, fundamentally solving the problem of air intake blockage caused by proximity to the ground, carpets, or other soft surfaces. Combined with the multiple heat dissipation slots 1 on the chassis top cover 14, this forms a three-dimensional, highly efficient active cooling system that significantly reduces the operating temperature of core hardware such as the CPU and GPU, effectively preventing performance throttling due to overheating and extending the lifespan of the equipment.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0027] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A one-piece suspended computer chassis, characterized in that: Including chassis components; A suspended assembly, wherein the suspended assembly is disposed on the inner side wall of the chassis assembly; The suspended assembly includes a suspended bracket and a suspended groove. The suspended bracket is disposed on the inner side wall of the chassis assembly, and the suspended groove is formed on the inner side wall of the chassis assembly. The chassis assembly includes support feet and a base. The base is located on the upper surface of the support feet. Multiple support feet are provided and spaced apart. A suspended bracket is located on the inner side wall of the base. The assembly also includes a bottom plate and a rear cover plate. The bottom plate is located on the upper surface of the suspended bracket. The rear cover plate is located on the upper surface of the bottom plate. A front cover plate corresponding to the rear cover plate is located on the upper surface of the front cover plate. A top cover plate is located on the upper surface of the front cover plate. A side plate is located at one end of the top cover plate and is located between the top cover plate and the bottom plate. The assembly also includes a control panel and a graphics card placement plate. The control panel is located at one end of the base. The graphics card placement plate is located on the inner side wall of the rear cover plate. The assembly also includes a power supply placement slot and a motherboard. The power supply placement slot is located on the inner side wall of the rear cover plate to facilitate the placement of the power supply unit. The motherboard is located on the inner side wall of the side plate.

2. The integrated suspended computer chassis according to claim 1, characterized in that: The inner wall of the top cover is provided with heat dissipation slots for heat dissipation of the chassis, and there are multiple heat dissipation slots arranged at intervals.