Chassis module and computer

Abstract

The application belongs to the technical field of computers, and specifically provides a case module and a computer. The case module comprises a case and a heat dissipation module. The case has a through hole and a supporting surface. The heat dissipation module has a connecting part. The connecting part passes through the through hole. The heat dissipation module can rotate relative to the case through the cooperation of the connecting part and the through hole, so as to switch between a first position and a second position. When the heat dissipation module is in the first position, the heat dissipation module is fixed on the case. When the heat dissipation module is in the second position, the heat dissipation module is in contact with the supporting surface under the action of its own gravity to realize hovering. When the electronic mainboard is installed in the case, the heat dissipation module does not need to be completely detached from the case. Moreover, the heat dissipation module can hover by relying on the supporting surface without manual support, so that the convenience of assembly can be improved. In addition, the electric wire of the heat dissipation module can be shortened, the cost can be reduced, the electric wire is not easy to interfere with other components in the case, and the inside of the case is more tidy and beautiful.

Description

Technical Field

[0001] This application belongs to the field of computer technology, specifically relating to a chassis module and a computer. Background Technology

[0002] During the assembly of some chassis modules, the heatsink module is first installed on the chassis. Then, the assembled heatsink module and chassis are transported to the motherboard installation station. When installing the motherboard, the heatsink module needs to be completely removed from the chassis first. Then, the motherboard is installed inside the chassis, the heatsink module's cables are connected to the motherboard, and finally, the heatsink module is reinstalled on the chassis. This process is inconvenient. In addition, because the heatsink module needs to be completely removed from the chassis before the motherboard can be installed, the heatsink module's cables are usually made longer to facilitate connection to the motherboard. Longer cables not only increase costs but also easily interfere with other components inside the chassis, posing a potential short circuit risk. Utility Model Content

[0003] The purpose of this application is to provide a chassis module and a computer, which aims to solve the technical problems in the prior art where the assembly of chassis, heat dissipation module and electronic motherboard is inconvenient, and the long wires of heat dissipation module are prone to interfering with the components inside the chassis.

[0004] On the one hand, to achieve the above objectives, the technical solution adopted in this application is: a chassis module, including a chassis and a heat dissipation module. The chassis has a through hole and a support surface. The heat dissipation module has a connecting part that passes through the through hole. The heat dissipation module can rotate relative to the chassis through the cooperation of the connecting part and the through hole to switch between a first position and a second position. When the heat dissipation module is in the first position, the heat dissipation module is fixed on the chassis. When the heat dissipation module is in the second position, the heat dissipation module is suspended by its own gravity against the support surface.

[0005] Compared with existing technologies, the beneficial effects of the chassis module provided in this application are as follows: When the electronic motherboard needs to be installed into the chassis, it is not necessary to completely remove the heat dissipation module from the chassis. The heat dissipation module is rotated from a first position to a second position by the cooperation of its connecting part with the through-hole in the chassis, thus preventing the electronic motherboard from being installed. In the second position, the heat dissipation module can be suspended by its own weight against the support surface of the chassis, requiring no manual support. Then, the electronic motherboard is installed into the chassis, and the heat dissipation module's wires are connected to it. Next, the heat dissipation module is reset, rotating from the second position to the first position, and then fixed to the chassis, thus completing the assembly. Since it is not necessary to completely remove the heat dissipation module from the chassis, and the heat dissipation module is suspended by the support surface without manual support, the convenience of assembly is improved. In addition, the heat dissipation module's wires can be shortened, reducing costs and preventing the wires from interfering with other components inside the chassis, resulting in a cleaner and more aesthetically pleasing interior.

[0006] Furthermore, the chassis has a first support portion and a second support portion. The first support portion has a first notch on one side, and the second support portion has a second notch on one side. The first support portion and the second support portion are connected intersectingly so that the first notch and the second notch enclose a bent through hole. The chassis has an accommodating space communicating with the through hole. The side of the second support portion facing away from the accommodating space has a supporting surface. When the heat dissipation module is in the first position, the connecting portion passes through the first notch and extends into the accommodating space. When the heat dissipation module is in the second position, the connecting portion passes through the second notch and extends into the accommodating space.

[0007] Furthermore, the direction in which the heat dissipation module rotates from the first position to the second position is the first direction, and the rotation angle is greater than 90°. The side of the first support facing the accommodating space has a locking surface. When the heat dissipation module is in the second position, the heat dissipation module is in an inclined state, and the locking surface abuts against the connecting part to restrict the heat dissipation module from rotating in the first direction.

[0008] Furthermore, the support surface is perpendicular to the positioning surface; one side of the connecting part has a first surface and a second surface, with an obtuse angle α between the first surface and the second surface, and the other side of the connecting part has a third surface, with an acute angle b between the third surface and the second surface, where ab = 90°; when the heat dissipation module is in the second position, the first surface is in contact with the support surface so that the heat dissipation module is suspended, and the third surface is in contact with the positioning surface.

[0009] Furthermore, the direction in which the connecting part is inserted into the receiving space through the first notch is the second direction; the side of the connecting part facing away from the first surface also has a fourth surface, the fourth surface and the third surface are arranged sequentially along the second direction, the distance between the third surface and the first surface gradually decreases in the second direction, and the distance between the fourth surface and the first surface gradually decreases in the opposite direction to the second direction.

[0010] Furthermore, when the heat dissipation module is in the first position, the heat dissipation module is connected to the chassis by snap-fit ​​and / or threaded fasteners, so that the heat dissipation module is fixed to the chassis.

[0011] Furthermore, the chassis includes a mounting base plate, mounting side panels, and a support frame. The mounting side panels are connected to the mounting base plate and enclose it to form a mounting cavity. The mounting side panels include a first side panel and a second side panel that are spaced apart from each other. One end of the support frame is connected to the end of the first side panel away from the mounting base plate, and the other end of the support frame is connected to the end of the second side panel away from the mounting base plate. The support frame has a through hole, and the side of the support frame facing away from the mounting base plate has a support surface.

[0012] Furthermore, when the heat dissipation module is in the first position, its projected area on the mounting base is S1; when the heat dissipation module is in the second position, its projected area on the mounting base is S2. <S1。

[0013] Furthermore, the chassis module also includes an electronic motherboard, which is located inside the chassis. The heat dissipation module is connected to wires, which are connected to the electronic motherboard.

[0014] On the other hand, in order to achieve the above objectives, the technical solution adopted in this application is: a computer, including the aforementioned chassis module.

[0015] Compared with existing technologies, the computer provided in this application has the following advantages: Using the aforementioned chassis module, when the motherboard needs to be installed into the chassis, it is not necessary to completely remove the heat dissipation module from the chassis. The heat dissipation module's connection point mates with the chassis's through-hole, allowing it to rotate from a first position to a second position to avoid obstructing the motherboard's installation. In the second position, the heat dissipation module can hover against the chassis's support surface under its own weight, requiring no manual support. The motherboard is then installed into the chassis, and the heat dissipation module's wires are connected to it. The heat dissipation module is then reset, rotating from the second position to the first position, and the heat dissipation module and chassis are secured, thus completing the assembly. Because it is not necessary to completely remove the heat dissipation module from the chassis, and the module hovers against the support surface without manual support, assembly convenience is improved. Furthermore, the heat dissipation module's wires can be shortened, reducing costs and minimizing interference with other components inside the chassis, resulting in a cleaner and more aesthetically pleasing interior. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the chassis module provided in the embodiments of this application when the heat dissipation module is in the first position; Figure 2 This is a schematic diagram of the chassis module provided in the embodiments of this application when the heat dissipation module is in the second position; Figure 3 for Figure 1 The exploded view of the heat dissipation module and support frame of the chassis module shown; Figure 4 for Figure 3 The diagram shows the structure of the heat dissipation module. Figure 5 for Figure 1 A cross-sectional view of the heat dissipation module and support frame of the chassis module shown; Figure 6 for Figure 2 The diagram shows a cross-sectional view of the heat dissipation module and support frame of the chassis module.

[0018] 10. Chassis; 11. Mounting base plate; 12. Mounting side panel; 121. First side panel; 122. Second side panel; 13. Support frame; 131. Through hole; 132. First support part; 1321. First notch; 1322. Locking surface; 133. Second support part; 1331. Support surface; 1332. Second notch; 134. Accommodation space; 20. Heat dissipation module; 21. Heat dissipation bracket; 211. Connecting part; 2111. First surface; 2112. Second surface; 2113. Third surface; 2114. Fourth surface; 212. Buckle; 22. Cooling fan; 30. Threaded fasteners; 40. Electronic motherboard. Detailed Implementation

[0019] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0020] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] Combination Figure 1 , Figure 2 and Figure 3 As shown, this application embodiment provides a chassis module, including a chassis 10 and a heat dissipation module 20. The chassis 10 has a through hole 131 and a support surface 1331. The heat dissipation module 20 has a connecting part 211 that passes through the through hole 131. The heat dissipation module 20 can rotate relative to the chassis 10 through the cooperation of the connecting part 211 and the through hole 131, so as to switch between a first position and a second position. Figure 1 The heat dissipation module 20 is in the first position. When the heat dissipation module 20 is in the first position, it is fixed to the chassis 10. Figure 2 The heat dissipation module 20 is in the second position. When the heat dissipation module 20 is in the second position, it is suspended by its own gravity against the support surface 1331.

[0024] When the electronic motherboard 40 needs to be installed into the chassis 10, it is not necessary to completely remove the heat dissipation module 20 from the chassis 10. Simply use the connection part 211 of the heat dissipation module 20 to cooperate with the through hole 131 of the chassis 10 to rotate the heat dissipation module 20 from the first position to the second position, so as to avoid the electronic motherboard 40 from being installed into the chassis 10. The heat dissipation module 20 in the second position can be suspended by its own weight against the support surface 1331 of the chassis 10 without manual support. Then, the electronic motherboard 40 is installed into the chassis 10 and the wires of the heat dissipation module 20 are connected to the electronic motherboard 40. Then, the heat dissipation module 20 is reset, rotating the heat dissipation module 20 from the second position to the first position, and the heat dissipation module 20 and the chassis 10 are fixed. This completes the assembly. Since it is not necessary to completely remove the heat dissipation module 20 from the chassis 10, and the heat dissipation module 20 is suspended by the support surface 1331 without manual support, the ease of assembly can be improved. In addition, the power cord of the heat dissipation module 20 can be shortened, reducing costs and making it less likely for the power cord to interfere with other components inside the chassis 10. As a result, the interior of the chassis 10 is also cleaner and more aesthetically pleasing.

[0025] In some embodiments, combined with Figure 3 , Figure 5 and Figure 6As shown, the chassis 10 has a first support portion 132 and a second support portion 133. The first support portion 132 has a first notch 1321 on one side, and the second support portion 133 has a second notch 1332 on one side. The first support portion 132 and the second support portion 133 are connected intersectingly, so that the first notch 1321 and the second notch 1332 enclose a through hole 131. The through hole 131 is bent. The chassis 10 has an accommodating space 134 that communicates with the through hole 131. The side of the second support portion 133 facing away from the accommodating space 134 has a supporting surface 1331. When the heat dissipation module 20 is in the first position, the connecting portion 211 passes through the first notch 1321 and extends into the accommodating space 134. When the heat dissipation module 20 is in the second position, the connecting portion 211 passes through the second notch 1332 and extends into the accommodating space 134. Because the via 131 formed by the first notch 1321 and the second notch 1332 is bent, the connecting part 211 can move between the first notch 1321 and the second notch 1332 to change the angle. That is, the heat dissipation module 20 can rotate relative to the chassis 10 through the cooperation of the connecting part 211 and the via 131. The included angle between the first support part 132 and the second support part 133 can be 90°, that is, the first support part 132 and the second support part 133 are perpendicular to each other. At this time, the via 131 is L-shaped. The included angle between the first support part 132 and the second support part 133 can also be other angles, and the via 131 is V-shaped. When the heat dissipation module 20 rotates relative to the chassis 10, the heat dissipation module 20 can be regarded as a lever, with one end located inside the receiving space 134 and the other end located outside the receiving space 134. The connection between the hole wall of the via 131 and the connecting part 211 is equivalent to the fulcrum of the lever, so that the heat dissipation module 20 can rotate around the fulcrum. During assembly, the orientation of the chassis 10 needs to be adjusted so that the support surface 1331 of the second support 133 faces upward. This allows the heat dissipation module 20 to hover on the support surface 1331 under its own weight when it rotates from the first position to the second position. Specifically, both the first support 132 and the second support 133 can be flat structures. The first notch 1321 can be formed by cutting and folding a portion of the first support 132 onto the side of the first support 132 facing the receiving space 134. Similarly, the second notch 1332 can be formed by cutting and folding a portion of the second support 133 onto the side of the second support 133 facing the receiving space 134.

[0026] In some embodiments, such as Figure 6As shown, the direction in which the heat dissipation module 20 rotates from the first position to the second position is the first direction, and the rotation angle is greater than 90°. The first support portion 132 has a locking surface 1322 on the side facing the receiving space 134. When the heat dissipation module 20 is in the second position, the heat dissipation module 20 is in an inclined state, and the locking surface 1322 abuts against the connecting portion 211 to restrict the heat dissipation module 20 from rotating in the first direction. In some other embodiments, when the heat dissipation module 20 is in the second position, the heat dissipation module 20 can also be in a vertical state, that is, placed upright on the support surface 1331, which can also achieve the suspension of the heat dissipation module 20. Considering that when the heat dissipation module 20 is in a vertical state, it is easy for the heat dissipation module 20 to tilt to both sides, resulting in poor hovering stability, in this embodiment, the rotation angle of the heat dissipation module 20 from the first position to the second position is designed to be greater than 90°, so that the heat dissipation module 20 is in a tilted state when it is in the second position, thereby preventing the heat dissipation module 20 from rotating and tilting in the opposite direction of the first direction. At the same time, a locking surface 1322 is provided on the side of the first support part 132 facing the receiving space 134, so that the connecting part 211 abuts against the locking surface 1322 of the first support part 132, thereby restricting the heat dissipation module 20 from rotating and tilting in the first direction, thereby effectively preventing the heat dissipation module 20 from tilting to both sides and improving the hovering stability of the heat dissipation module 20.

[0027] In some embodiments, combined with Figure 4 , Figure 5 and Figure 6As shown, the support surface 1331 is perpendicular to the locking surface 1322; one side of the connecting part 211 has a first surface 2111 and a second surface 2112, forming an obtuse angle α between the first surface 2111 and the second surface 2112, and the other side of the connecting part 211 has a third surface 2113, forming an acute angle b between the third surface 2113 and the second surface 2112, where ab = 90°; when the heat dissipation module 20 is in the second position, the first surface 2111 is in contact with the support surface 1331 to allow the heat dissipation module 20 to hover, and the third surface 2113 is in contact with the locking surface 1322. Specifically, during the assembly process, when the heat dissipation module 20 is in the first position, the heat dissipation module 20 is set to be installed horizontally on the chassis 10, and the second surface 2112 is horizontal and facing upwards. By forming an obtuse angle α between the first surface 2111 and the second surface 2112, the rotation angle of the heat dissipation module 20 from the first position to the second position is greater than 90°. This means that when the heat dissipation module 20 is in the second position and the first surface 2111 is in contact with the support surface 1331, the heat dissipation module 20 is tilted, preventing it from rotating and tipping over in the opposite direction to the first direction. When the support surface 1331 is perpendicular to the locking surface 1322, by forming an acute angle b between the third surface 2113 and the second surface 2112, where α and b satisfy ab = 90°, the third surface 2113 can also contact the locking surface 1322 while the first surface 2111 is in contact with the support surface 1331, thus limiting the heat dissipation module 20 from rotating and tipping over in the first direction, thereby improving the stability of the heat dissipation module 20 during suspension.

[0028] In some embodiments, combined with Figure 3 and Figure 4As shown, the direction in which the connecting part 211 is inserted into the receiving space 134 through the first notch 1321 is the second direction; the side of the connecting part 211 facing away from the first surface 2111 also has a fourth surface 2114, the fourth surface 2114 and the third surface 2113 are arranged sequentially along the second direction, the distance between the third surface 2113 and the first surface 2111 gradually increases in the second direction, and the distance between the fourth surface 2114 and the first surface 2111 gradually decreases in the opposite direction of the second direction. When installing the heat dissipation module 20, the connecting part passes through the first notch 1321 along the second direction and is inserted into the receiving space 134. During this process, the third surface 2113 passes through the first notch 1321 first, and the fourth surface 2114 passes through the first notch 1321 afterward. By making the distance between the third surface 2113 and the first surface 2111 gradually decrease in the second direction, that is, the part of the connecting part 211 located between the third surface 2113 and the first surface 2111 has a gradually decreasing shape in the second direction, so that the connecting part 211 can pass through the first notch 1321 and be inserted into the receiving space 134. When disassembling the heat dissipation module 20, the connecting part 211 is withdrawn out of the receiving space 134 in the opposite direction of the second direction. During this process, the fourth surface 2114 first passes through the first notch 1321, and the third surface 2113 then passes through the first notch 1321. By making the distance between the fourth surface 2114 and the first surface 2111 gradually decrease in the opposite direction of the second direction, that is, the part of the connecting part 211 located between the fourth surface 2114 and the first surface 2111 gradually decreases in the opposite direction of the second direction, so that the connecting part 211 can easily pass through the first notch 1321 and withdraw out of the receiving space 134.

[0029] In some embodiments, when the heat dissipation module 20 is in the first position, the heat dissipation module 20 is connected to the chassis 10 via a snap-fit ​​212, so that the heat dissipation module 20 is fixed to the chassis 10. Specifically, in conjunction with Figure 1 and Figure 3As shown, the heat dissipation module 20 has a latch 212. When the heat dissipation module 20 is in the first position, it can be fastened to the chassis 10 via the latch 212, thus fixing the heat dissipation module 20 to the chassis 10. More specifically, the chassis 10 has a locking hole. When the heat dissipation module 20 is in the first position, the latch 212 of the heat dissipation module 20 is aligned with the locking hole, allowing the latch 212 to engage with the locking hole. The connection between the heat dissipation module 20 and the chassis 10 via the latch 212 facilitates the assembly and disassembly of the heat dissipation module 20 and the chassis 10, improving the assembly and disassembly efficiency. When it is necessary to install the electronic motherboard 40, the latch 212 is disengaged from the locking hole, and the heat dissipation module 20 changes from a fixed state to a freely movable state, allowing the heat dissipation module 20 to be rotated from the first position to the second position. Subsequently, the electronic motherboard 40 can be installed inside the chassis 10. Of course, in some other embodiments, the positions of the buckle 212 and the buckle hole can be interchanged. That is, the buckle 212 is located on the chassis 10, and the buckle hole is located on the heat dissipation module 20. The heat dissipation module 20 and the chassis 10 can also be fastened together by the buckle 212.

[0030] In some embodiments, such as Figure 1 As shown, the chassis module also includes a threaded fastener 30. When the heat dissipation module 20 is in the first position, the heat dissipation module 20 and the chassis 10 are connected by the threaded fastener 30, so that the heat dissipation module 20 is fixed to the chassis 10. Specifically, the chassis 10 is provided with a first connecting hole, and the heat dissipation module 20 is provided with a second connecting hole. The first connecting hole is a through hole, and the second connecting hole is a threaded hole. When the heat dissipation module 20 is in the first position, the through hole and the threaded hole are aligned, and the threaded fastener 30 passes through the through hole and is threadedly connected to the threaded hole, so that the heat dissipation module 20 is fixed to the chassis 10. By providing a through hole in the chassis 10 and a threaded hole in the heat dissipation module 20, and using a threaded fastener 30 to pass through the through hole and be threadedly connected to the threaded hole, the heat dissipation module 20 can be securely fixed to the chassis 10, effectively preventing the heat dissipation module 20 from becoming loose. When the electronic motherboard 40 needs to be installed, first loosen the threaded fastener 30 so that it exits the threaded hole and through hole. Then, disengage the latch 212 from the latch hole, allowing the heat dissipation module 20 to move freely from a fixed state. This allows the heat dissipation module 20 to be rotated from the first position to the second position, after which the electronic motherboard 40 can be installed inside the chassis 10. In some other embodiments, the latch 212 design can be omitted, and the chassis 10 and the heat dissipation module 20 are fixed only by the threaded fastener 30. Additionally, the first connecting hole can be a threaded hole, and the second connecting hole can be a through hole.

[0031] In some embodiments, such as Figure 1as shown, the chassis 10 includes a mounting base plate 11, a mounting side coaming 12 and a support frame 13. The mounting side coaming 12 is connected with the mounting base plate 11 and encloses to form a mounting cavity. The mounting side coaming 12 includes a first side plate 121 and a second side plate 122 disposed opposite to and spaced apart from each other. One end of the support frame 13 is connected to an end of the first side plate 121 facing away from the mounting base plate 11, and the other end of the support frame 13 is connected to an end of the second side plate 122 facing away from the mounting base plate 11. The support frame 13 is provided with a through hole 131, and a side of the support frame 13 facing away from the mounting base plate 11 has a support surface 1331. The mounting cavity enclosed and formed by the mounting side coaming 12 and the mounting base plate 11 can be used to accommodate components such as the electronic mainboard 40. During assembly, it is necessary to adjust the posture of the chassis 10 so that the mounting base plate 11 is located directly below the support frame 13, the mounting base plate 11 can be placed on a tabletop, and the chassis 10 is supported by the tabletop. By arranging the support surface 1331 on the side of the support frame 13 facing away from the mounting base plate 11, that is, the support surface 1331 is arranged on the upper surface of the support frame 13, so that when the heat dissipation module 20 is rotated to the second position, it can abut against the support surface 1331 under the action of its own gravity to achieve hovering. The heat dissipation module 20 is located above the mounting cavity, does not occupy the space of the mounting cavity, and facilitates loading components such as the electronic mainboard 40 into the mounting cavity. Specifically, the electronic mainboard 40 is configured to be mounted on the mounting base plate 11. When the heat dissipation module 20 is in the first position, the heat dissipation module 20 is in a horizontal state, and the projection area of the heat dissipation module 20 on the mounting base plate 11 is S1. When the heat dissipation module 20 is in the second position, the heat dissipation module 20 is in an inclined state, and the projection area of the heat dissipation module 20 on the mounting base plate 11 is S2, where S2<S1. Therefore, by rotating the heat dissipation module 20 from the first position to the second position, it is convenient for the electronic mainboard 40 to be placed into the mounting cavity from top to bottom and fixed on the mounting base plate 11.

[0032] In some embodiments, such as Figure 3As shown, the heat dissipation module 20 includes a heat dissipation bracket 21 and a heat dissipation fan 22. The heat dissipation fan 22 is mounted on the heat dissipation bracket 21, and the heat dissipation bracket 21 has a connecting part 211. When the heat dissipation fan 22 operates, it can drive airflow to carry the heat inside the chassis 10 to the outside of the chassis 10, thereby achieving heat dissipation inside the chassis 10. The heat dissipation bracket 21 also has a buckle 212 and a second connecting hole. Specifically, the heat sink bracket 21 has a buckle 212 and a second connecting hole on both sides of its opposite sides. The first side plate 121 and the second side plate 122 of the chassis 10 are provided with a buckle hole and a first connecting hole. The buckle 212 on one side of the heat sink bracket 21 is used to engage with the buckle hole of the first side plate 121, and the buckle 212 on the other side of the heat sink bracket 21 is used to engage with the buckle hole of the second side plate 122. A threaded fastener 30 passes through the first connecting hole of the first side plate 121 and is threadedly connected to the second connecting hole on one side of the heat sink bracket 21. Another threaded fastener 30 passes through the first connecting hole of the second side plate 122 and is threadedly connected to the second connecting hole on the other side of the heat sink bracket 21.

[0033] In some embodiments, such as Figure 1 As shown, the chassis module also includes an electronic motherboard 40, which is located inside the chassis 10, specifically mounted on the mounting base plate 11. The heat dissipation module 20 is connected to wires (not shown), which are connected to the electronic motherboard 40. When it is necessary to install the electronic motherboard 40 into the chassis 10, it is not necessary to completely remove the heat dissipation module 20 from the chassis 10. Simply by using the connection part 211 of the heat dissipation module 20 to cooperate with the through hole 131 of the chassis 10, the heat dissipation module 20 can be rotated from the first position to the second position to avoid the electronic motherboard 40 from being installed into the chassis 10. The heat dissipation module 20 in the second position can be suspended by its own weight against the support surface 1331 of the chassis 10 without manual support. Then, the electronic motherboard 40 is installed into the chassis 10 and the wires of the heat dissipation module 20 are connected to the electronic motherboard 40. Then, the heat dissipation module 20 is reset, rotating from the second position to the first position, and the heat dissipation module 20 and the chassis 10 are fixed, thus completing the assembly. Since it is not necessary to completely remove the heat dissipation module 20 from the chassis 10, and the heat dissipation module 20 is suspended by the support surface 1331 without manual support, the ease of assembly can be improved. In addition, the power cord of the heat dissipation module 20 can be shortened, reducing costs and making it less likely for the power cord to interfere with other components inside the chassis 10. As a result, the interior of the chassis 10 is also cleaner and more aesthetically pleasing.

[0034] In some embodiments, the chassis module further includes a central processing unit, memory, hard disk, graphics card, power supply, sound card, network card, etc. disposed within the chassis 10.

[0035] This application also provides a computer, including the chassis module of any of the above embodiments. The type of computer is not limited and can be a personal computer, server, industrial control computer, etc. When the computer uses the chassis module described above, it is not necessary to completely remove the heat dissipation module 20 from the chassis 10 when installing the electronic motherboard 40 into the chassis 10. The heat dissipation module 20 can be rotated from a first position to a second position by engaging the connecting part 211 of the heat dissipation module 20 with the through hole 131 of the chassis 10, thus preventing the electronic motherboard 40 from being installed into the chassis 10. The heat dissipation module 20 in the second position can be suspended by its own weight against the support surface 1331 of the chassis 10 without manual support. Then, the electronic motherboard 40 is installed into the chassis 10, and the wires of the heat dissipation module 20 are connected to the electronic motherboard 40. Next, the heat dissipation module 20 is reset, rotating from the second position to the first position, and the heat dissipation module 20 and chassis 10 are fixed, thus completing the assembly. Since it is not necessary to completely remove the heat dissipation module 20 from the chassis 10, and the heat dissipation module 20 is suspended by the support surface 1331 without manual support, the ease of assembly can be improved. In addition, the power cord of the heat dissipation module 20 can be shortened, reducing costs and making it less likely for the power cord to interfere with other components inside the chassis 10. As a result, the interior of the chassis 10 is also cleaner and more aesthetically pleasing.

[0036] It should be noted that the above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A chassis module, characterized in that, The device includes a chassis and a heat dissipation module. The chassis has a through hole and a support surface. The heat dissipation module has a connecting part that passes through the through hole. The heat dissipation module can rotate relative to the chassis through the cooperation of the connecting part and the through hole to switch between a first position and a second position. When the heat dissipation module is in the first position, it is fixed to the chassis. When the heat dissipation module is in the second position, it is suspended by its own weight against the support surface.

2. The chassis module according to claim 1, characterized in that: The chassis has a first support portion and a second support portion. The first support portion has a first notch on one side, and the second support portion has a second notch on one side. The first support portion and the second support portion are connected intersectingly so that the first notch and the second notch enclose a bent through hole. The chassis has an accommodating space communicating with the through hole, and the second support portion has a supporting surface on the side facing away from the accommodating space. When the heat dissipation module is in the first position, the connecting part passes through the first notch and extends into the receiving space; when the heat dissipation module is in the second position, the connecting part passes through the second notch and extends into the receiving space.

3. The chassis module according to claim 2, characterized in that: The direction in which the heat dissipation module rotates from the first position to the second position is the first direction, and the rotation angle is greater than 90°. The side of the first support facing the accommodating space has a locking surface. When the heat dissipation module is in the second position, the heat dissipation module is in an inclined state, and the locking surface abuts against the connecting part to restrict the heat dissipation module from rotating in the first direction.

4. The chassis module according to claim 3, characterized in that: The supporting surface is perpendicular to the locking surface; one side of the connecting part has a first surface and a second surface, with an obtuse angle α between the first surface and the second surface, and the other side of the connecting part has a third surface, with an acute angle b between the third surface and the second surface, where ab = 90°; when the heat dissipation module is in the second position, the first surface is in contact with the supporting surface to allow the heat dissipation module to hover, and the third surface is in contact with the locking surface.

5. The chassis module according to claim 4, characterized in that: The direction in which the connecting part is inserted into the receiving space through the first notch is the second direction; the side of the connecting part facing away from the first surface also has a fourth surface, the fourth surface and the third surface are arranged sequentially along the second direction, the distance between the third surface and the first surface gradually decreases in the second direction, and the distance between the fourth surface and the first surface gradually decreases in the opposite direction to the second direction.

6. The chassis module according to any one of claims 1-5, characterized in that: When the heat dissipation module is in the first position, the heat dissipation module is connected to the chassis by snap-fit ​​and / or threaded fasteners, so that the heat dissipation module is fixed on the chassis.

7. The chassis module according to any one of claims 1-5, characterized in that: The chassis includes a mounting base plate, mounting side panels, and a support frame. The mounting side panels are connected to the mounting base plate and enclose it to form a mounting cavity. The mounting side panels include a first side panel and a second side panel that are spaced apart from each other. One end of the support frame is connected to the end of the first side panel away from the mounting base plate, and the other end of the support frame is connected to the end of the second side panel away from the mounting base plate. The support frame is provided with the through hole, and the side of the support frame facing away from the mounting base plate has the support surface.

8. The chassis module according to claim 7, characterized in that: When the heat dissipation module is in the first position, its projected area on the mounting base is S1; when the heat dissipation module is in the second position, its projected area on the mounting base is S2. <S1。 9. The chassis module according to any one of claims 1-5, characterized in that: The chassis module also includes an electronic motherboard, which is located inside the chassis. The heat dissipation module is connected to a wire, which is connected to the electronic motherboard.

10. A computer, characterized in that, Includes the chassis module as described in any one of claims 1-9.

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