A heat dissipation system

Abstract

The utility model discloses a heat dissipation system, in the heat dissipation system of the present application, after putting solid state hard disk into first heat dissipation area, under the elastic force of first elastic connecting piece, first heat dissipation plate can be close and adhere to the solid state hard disk in first heat dissipation area, and first heat dissipation plate can extrude the solid state hard disk in first heat dissipation area to make the solid state hard disk adhere to second heat dissipation module, so that first heat dissipation module and second heat dissipation module can be close to the solid state hard disk in first heat dissipation area, and first heat dissipation module and second heat dissipation module can better complete the heat dissipation of solid state hard disk, and then improve the heat dissipation effect of the heat dissipation system of the present application.

Description

Technical Field

[0001] This utility model relates to the field of hard disk heat dissipation technology, and in particular to a heat dissipation system. Background Technology

[0002] Currently, with the rapid application and promotion of Internet digital technology, the demand for servers with large storage capacity, excellent performance, and high integration is growing rapidly. As the performance of servers improves, the heat dissipation requirements brought about by the high-density component layout are increasing.

[0003] In the heat dissipation system of the relevant technology, a heat dissipation zone is defined between two adjacent heat sinks. After the hard drive is placed in the heat dissipation zone, the heat dissipation plate carries away the heat dissipated by the hard drive, thereby cooling the hard drive.

[0004] However, for hard drives of different specifications, after placing the hard drive in the heat dissipation area, there is often a certain installation gap between the heat sink and the hard drive. The existence of the installation gap reduces the heat dissipation effect of the heat dissipation system on the hard drive. Utility Model Content

[0005] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and this invention provides a heat dissipation system with better heat dissipation effect.

[0006] The heat dissipation system provided according to an embodiment of the present invention includes a mounting bracket, a first heat dissipation module, and a second heat dissipation module. The first heat dissipation module includes a first heat sink and a first elastic connector. The first heat sink has a first refrigerant channel that allows refrigerant to flow. The first elastic connector is connected to the first heat sink and the mounting bracket respectively. The second heat dissipation module is disposed on the mounting bracket and located on one side of the first heat sink. A first heat dissipation area is formed between the second heat dissipation module and the first heat sink to allow the insertion of a solid-state drive. The first elastic connector is used to provide elasticity to keep the first heat sink in contact with the solid-state drive in the first heat dissipation area.

[0007] The heat dissipation system of this utility model has at least the following beneficial effects: In the heat dissipation system of this application, after the solid-state drive is placed in the first heat dissipation area, under the elastic force of the first elastic connector, the first heat dissipation plate can approach and adhere to the solid-state drive in the first heat dissipation area, and the first heat dissipation plate can squeeze the solid-state drive in the first heat dissipation area so that the solid-state drive adheres to the second heat dissipation module. Thus, both the first heat dissipation module and the second heat dissipation module can adhere tightly to the solid-state drive in the first heat dissipation area, and the first heat dissipation module and the second heat dissipation module can better complete the heat dissipation of the solid-state drive, thereby improving the heat dissipation effect of the heat dissipation system of this application.

[0008] According to the heat dissipation system described in this utility model embodiment, the second heat dissipation module includes a second heat dissipation plate and a second elastic connector. A first heat dissipation area is formed between the second heat dissipation plate and the first heat dissipation plate. A second refrigerant channel that allows refrigerant to flow is provided in the second heat dissipation plate. The second elastic connector is connected to the second heat dissipation plate and the mounting bracket respectively, and is used to provide elasticity to keep the second heat dissipation plate in contact with the solid-state drive in the first heat dissipation area.

[0009] The heat dissipation system according to the embodiment of this utility model further includes a transfer pipe, which has a first transfer cavity and a second transfer cavity. The first transfer cavity is connected to the inlet of the first refrigerant channel and the inlet of the second refrigerant channel, respectively. The second transfer cavity is connected to the outlet of the first refrigerant channel and the outlet of the second refrigerant channel, respectively. The inlet of the first transfer cavity is used to connect to the outlet of the refrigerant supply equipment, and the outlet of the second transfer cavity is used to connect to the inlet of the refrigerant supply equipment.

[0010] The heat dissipation system according to the embodiment of this utility model further includes a third heat dissipation module. The third heat dissipation module is disposed on the side of the first heat dissipation module away from the second heat dissipation module. The third heat dissipation module includes a third heat dissipation plate and a third elastic connector. The third heat dissipation plate is provided with a third refrigerant channel that allows refrigerant to flow. A second heat dissipation area that allows solid-state drives to be inserted is formed between the third heat dissipation plate and the first heat dissipation plate. The third elastic connector is connected to the third heat dissipation module and the mounting bracket respectively, and is used to provide elasticity to keep the third heat dissipation plate in contact with the solid-state drive in the second heat dissipation area.

[0011] According to the heat dissipation system described in this embodiment of the present invention, the first elastic connector is a spring sheet, the mounting bracket is provided with a plug hole, the spring sheet is detachably connected to the first heat dissipation plate, and one end of the spring sheet is plugged into the plug hole.

[0012] According to the heat dissipation system described in this utility model embodiment, the mounting bracket is provided with two oppositely arranged insertion holes, the middle part of the spring piece is detachably connected to the first heat dissipation plate, and the opposite ends of the spring piece are respectively inserted and unplugged into the two insertion holes.

[0013] According to the heat dissipation system described in this embodiment of the present invention, a receiving groove is provided on the first heat dissipation plate, the middle part of the spring piece is received in the receiving groove, and the middle part of the spring piece is detachably connected to the groove wall of the receiving groove through a threaded connector.

[0014] According to the heat dissipation system described in this embodiment of the present invention, the inlet and outlet of the first refrigerant channel are both located at the same end of the first heat dissipation plate.

[0015] According to the heat dissipation system described in this utility model embodiment, the mounting bracket includes a base plate, and a plurality of first protrusions are distributed at intervals along a preset direction on the base plate. The first heat dissipation module and the second heat dissipation module are respectively supported on two adjacent first protrusions.

[0016] According to the heat dissipation system described in the embodiment of this utility model, the mounting bracket further includes a panel disposed on the upper side of the base plate. The lower end of the panel is provided with a plurality of second protrusions spaced apart along a preset direction. The second protrusions are arranged in a one-to-one correspondence with the first protrusions. The first heat dissipation module is disposed between a corresponding set of first protrusions and second protrusions, and the second heat dissipation module is disposed between another corresponding set of first protrusions and second protrusions.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments; Figure 1 This is a schematic diagram of the heat dissipation system according to an embodiment of the present invention; Figure 2 for Figure 1 A partial enlarged view of the structure at point A of the heat dissipation system shown. Figure 3 for Figure 1 A schematic diagram of the structure of the first heat dissipation module of the heat dissipation system shown; Figure 4 for Figure 1 A cross-sectional view of the transfer pipe in the heat dissipation system shown.

[0019] Figure label: Mounting bracket 100; first heat dissipation area 101; second heat dissipation area 102; base plate 110; first protrusion 111; front panel 120; insertion hole 121; second protrusion 122; First heat dissipation module 200; first heat dissipation plate 210; receiving slot 211; first elastic connector 220; Second heat dissipation module 300; Transfer tube 400; First transfer chamber 410; Second transfer chamber 420; The third heat dissipation module is 500. Detailed Implementation

[0020] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0021] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0024] The following is for reference. Figures 1 to 4 The heat dissipation system of this application will be described in detail.

[0025] refer to Figures 1 to 3 According to an embodiment of the present invention, a heat dissipation system includes a mounting bracket 100, a first heat dissipation module 200, and a second heat dissipation module 300. The first heat dissipation module 200 includes a first heat dissipation plate 210 and a first elastic connector 220. The first heat dissipation plate 210 has a first refrigerant channel that allows refrigerant to flow. The first elastic connector 220 is connected to the first heat dissipation plate 210 and the mounting bracket 100 respectively. The second heat dissipation module 300 is disposed on the mounting bracket 100 and located on one side of the first heat dissipation plate 210. A first heat dissipation area 101 is formed between the second heat dissipation module 300 and the first heat dissipation plate 210 to allow the insertion of a solid-state drive. The first elastic connector 220 is used to provide elasticity to keep the first heat dissipation plate 210 in contact with the solid-state drive in the first heat dissipation area 101.

[0026] For example, such as Figures 1 to 3As shown, the heat dissipation system includes a mounting bracket 100, a first heat dissipation module 200, and a second heat dissipation module 300. Both the first heat dissipation module 200 and the second heat dissipation module 300 are mounted on the mounting bracket 100, and the first heat dissipation module 200 is located to the right of the second heat dissipation module 300. The first heat dissipation module 200 includes a first heat dissipation plate 210 and a first elastic connector 220. A first heat dissipation area 101 is defined between the first heat dissipation plate 210 and the second heat dissipation module 300. A first refrigerant channel is provided in the first heat dissipation plate 210. The first elastic connector 220 is connected to the mounting bracket 100 and the first heat dissipation plate 210 respectively.

[0027] Furthermore, when the heat dissipation system of this application is used, the inlet of the first refrigerant channel is connected to the outlet of the refrigerant supply equipment, and the outlet of the first refrigerant channel is connected to the inlet of the refrigerant supply equipment. When the operator places the solid-state drive in the first heat dissipation area 101, the first heat dissipation plate 210 moves to the left under the elastic force of the first elastic connector 220. The first heat dissipation plate 210 abuts against the solid-state drive in the first heat dissipation area 101 and pushes the solid-state drive to continue moving to the left, so that the solid-state drive is in contact with the second heat dissipation module 300. At this time, the first heat dissipation plate 210 and the second heat dissipation module 300 can respectively contact the left and right ends of the solid-state drive, and the first heat dissipation plate 210 and the second heat dissipation module 300 can cooperate to dissipate heat from the solid-state drive in the first heat dissipation area 101.

[0028] It is understandable that by setting the first elastic connector 220, under the elastic force of the first elastic connector 220, both the first heat sink 210 and the second heat sink module 300 can fit into the solid-state drive in the first heat sink area 101, thereby making the heat dissipation effect of the first heat sink 210 and the second heat sink module 300 on the solid-state drive in the first heat sink area 101 better, and thus improving the heat dissipation effect of the heat dissipation system of this application on the solid-state drive.

[0029] In some embodiments of this utility model, the second heat dissipation module 300 includes a second heat dissipation plate and a second elastic connector. A first heat dissipation area 101 is formed between the second heat dissipation plate and the first heat dissipation plate 210. The second heat dissipation plate is provided with a second refrigerant channel that allows refrigerant to flow. The second elastic connector is connected to the second heat dissipation plate and the mounting bracket 100 respectively, and is used to provide elasticity to keep the second heat dissipation plate in contact with the solid-state drive in the first heat dissipation area 101.

[0030] For example, such as Figure 1 and Figure 2As shown, the second heat dissipation module 300 includes a second heat dissipation plate and a second elastic connector. The second heat dissipation plate is located on the left side of the first heat dissipation plate 210. A first heat dissipation area 101 is formed between the first heat dissipation plate 210 and the second heat dissipation plate. The second elastic connector is connected to the second heat dissipation plate and the mounting bracket 100 respectively, and is used to provide elastic force to keep the second heat dissipation plate pressing against the solid-state drive in the first heat dissipation area 101.

[0031] Understandably, after the operator places the solid-state drive (SSD) into the first heat dissipation zone 101, the first heat sink 210 moves to the left under the elastic force of the first elastic connector 220 to fit against the right side wall of the SSD. During the flow of refrigerant in the first refrigerant channel, the refrigerant can more effectively remove heat from the SSD, thereby improving the cooling effect of the heat dissipation system on the SSD. Under the elastic force of the second elastic connector, the second heat sink moves to the right to fit against the left side wall of the SSD. During the flow of refrigerant in the second refrigerant channel, the refrigerant can more effectively remove heat from the SSD, thereby improving the cooling effect of the heat dissipation system on the SSD.

[0032] Furthermore, in the heat dissipation system of this application, by providing a second elastic connector, the second elastic connector can drive the second heat sink to press tightly against the surface of the solid-state drive in the first heat dissipation area 101, so as to improve the heat dissipation effect of the second heat dissipation module 300 on the solid-state drive in the first heat dissipation area 101.

[0033] In a further embodiment of this utility model, reference is made to... Figure 1 and Figure 4 The heat dissipation system also includes a transfer pipe 400, which has a first transfer chamber 410 and a second transfer chamber 420. The first transfer chamber 410 is connected to the inlet of the first refrigerant channel and the inlet of the second refrigerant channel, respectively. The second transfer chamber 420 is connected to the outlet of the first refrigerant channel and the outlet of the second refrigerant channel, respectively. The inlet of the first transfer chamber 410 is used to connect to the outlet of the refrigerant supply equipment, and the outlet of the second transfer chamber 420 is used to connect to the inlet of the refrigerant supply equipment.

[0034] Understandably, by setting up the transfer pipe 400, the refrigerant in the refrigerant supply equipment can be evenly introduced into the first refrigerant channel and the second refrigerant channel through the first transfer chamber 410, and the refrigerant output from the first refrigerant channel and the refrigerant output from the second refrigerant channel can be centrally recovered into the refrigerant supply equipment through the second transfer chamber 420; the setting of the transfer pipe 400 makes the flow of refrigerant in the first refrigerant channel and the second refrigerant channel more uniform, so that the heat dissipation of various parts of the solid-state drive in the first heat dissipation area 101 can be more uniform.

[0035] In some embodiments of this utility model, the heat dissipation system further includes a third heat dissipation module 500. The third heat dissipation module 500 is disposed on the side of the first heat dissipation module 200 away from the second heat dissipation module 300. The third heat dissipation module 500 includes a third heat dissipation plate and a third elastic connector. The third heat dissipation plate is provided with a third refrigerant channel that allows refrigerant to flow. A second heat dissipation area 102 that allows a solid-state drive to be inserted is formed between the third heat dissipation plate and the first heat dissipation plate 210. The third elastic connector is connected to the third heat dissipation module 500 and the mounting bracket 100 respectively, and is used to provide elasticity to keep the third heat dissipation plate in contact with the solid-state drive in the second heat dissipation area 102.

[0036] For example, such as Figure 1 and Figure 2 As shown, the heat dissipation system also includes a third heat dissipation module 500, which is located to the right of the first heat dissipation module 200. The third heat dissipation module 500 includes a third heat dissipation plate and a third elastic connector. A second heat dissipation area 102 is formed between the third heat dissipation plate and the first heat dissipation plate 210. A third refrigerant channel is provided in the third heat dissipation plate. The third elastic connector is connected to the third heat dissipation plate and the mounting bracket 100 respectively.

[0037] Furthermore, after the solid-state drive is placed in the second heat dissipation area 102, under the elastic force of the third elastic connector, the third heat dissipation plate adheres to the solid-state drive in the second heat dissipation area 102 to the left, and the third heat dissipation plate can push the solid-state drive to the left so that the left end of the solid-state drive adheres to the first heat dissipation plate 210. At this time, the refrigerant can carry away the heat transferred from the solid-state drive to the third heat dissipation plate during the process of flowing through the third refrigerant channel, and the refrigerant can carry away the heat transferred from the solid-state drive to the first heat dissipation plate 210 during the process of flowing through the first refrigerant channel.

[0038] It is understood that by setting up a third heat dissipation module 500, and forming a second heat dissipation area 102 between the third heat dissipation plate of the third heat dissipation module 500 and the first heat dissipation plate 210 of the first heat dissipation module 200, the heat dissipation system of this application can dissipate heat from multiple solid-state drives at the same time, thereby improving the working efficiency of the heat dissipation system of this application.

[0039] It is understandable that by setting a third elastic connector, under the elastic force of the third elastic connector, the third heat sink can push the solid-state drive in the second heat sink 102 to the left, so that the left end of the solid-state drive can be in close contact with the first heat sink 210, and the right end of the solid-state drive can be in close contact with the third heat sink, thereby improving the heat dissipation effect of the first heat sink module 200 and the third heat sink module 500 on the solid-state drive in the second heat sink 102, and thus improving the heat dissipation effect of the heat dissipation system of this application on the solid-state drive in the second heat sink 102.

[0040] It should be noted that the heat dissipation system of this application may also include a fourth heat dissipation module, a fifth heat dissipation module, or even more heat dissipation modules. When a fourth heat dissipation module is provided, it is located on the side of the third heat dissipation module 500 that is away from the first heat dissipation module 200. When a fifth heat dissipation module is provided, it is located on the side of the fourth heat dissipation module that is away from the third heat dissipation module 500. The specific structure of the fourth and fifth heat dissipation modules is the same as that of the third heat dissipation module 500.

[0041] In some embodiments of this utility model, reference is made to Figure 1 The first elastic connector 220 is a spring sheet. The mounting bracket 100 is provided with a plug hole 121. The spring sheet is detachably connected to the first heat sink 210, and one end of the spring sheet is plugged into the plug hole 121.

[0042] Understandably, shrapnel has a simple structure and is inexpensive.

[0043] In a further embodiment of the present invention, the mounting bracket 100 is provided with two oppositely arranged insertion holes 121, the middle part of the spring piece is detachably connected to the first heat sink 210, and the opposite ends of the spring piece are respectively inserted and unplugged into the two insertion holes 121.

[0044] For example, such as Figure 3 As shown, the mounting bracket 100 has two vertically distributed insertion holes 121. The spring extends vertically, and the middle part of the spring is detachably connected to the first heat sink 210. The upper and lower ends of the spring are respectively inserted into the two insertion holes 121.

[0045] It is understandable that by setting two insertion holes 121 and inserting the opposite ends of the spring into the two insertion holes 121 respectively, the connection between the spring and the mounting bracket 100 can be made more secure, reducing the probability of the spring automatically falling off the mounting bracket 100; at the same time, by inserting or removing the spring from the insertion hole 121, the operator can install or remove the first heat dissipation module 200 on the mounting bracket 100.

[0046] Understandably, since the middle part of the spring is detachably connected to the first heat sink 210, the staff can replace the spring on the first heat sink 210 according to actual needs.

[0047] In a further embodiment of this utility model, reference is made to... Figure 3 The first heat sink 210 is provided with a receiving groove 211, the middle part of the spring is received in the receiving groove 211, and the middle part of the spring is detachably connected to the groove wall of the receiving groove 211 through a threaded connector.

[0048] It is understandable that by setting a receiving groove 211 on the first heat sink 210 and accommodating the middle part of the spring piece in the receiving groove 211, the groove wall of the receiving groove 211 can protect the spring piece. At the same time, accommodating the spring piece in the receiving groove 211 can reduce the volume of the entire first heat sink module 200, making the structure of the entire first heat sink module 200 more compact.

[0049] It should be noted that the connection between the second elastic connector, the second heat sink, and the mounting bracket 100 is the same as the connection between the first elastic connector 220, the first heat sink 210, and the mounting bracket 100.

[0050] In some embodiments of this utility model, the inlet and outlet of the first refrigerant channel are both located at the same end of the first heat sink 210.

[0051] It is understandable that by setting both the inlet and outlet of the first refrigerant channel at the same end of the first heat sink 210, it is convenient for staff to use pipes to connect the first refrigerant channel and the transfer pipe 400.

[0052] In some embodiments of this utility model, the mounting bracket 100 includes a base plate 110, on which a plurality of first protrusions 111 are distributed at intervals along a preset direction, and the first heat dissipation module 200 and the second heat dissipation module 300 are respectively supported on two adjacent first protrusions 111.

[0053] For example, such as Figure 2 As shown, the mounting bracket 100 includes a base plate 110. A plurality of first protrusions 111 are spaced apart along the left and right direction on the upper surface of the base plate 110. The first heat dissipation module 200 and the second heat dissipation module 300 are respectively supported on two adjacent first protrusions 111.

[0054] It is understandable that by setting the first protrusion 111, and the first heat dissipation module 200 and the second heat dissipation module 300 respectively being supported on two adjacent first protrusions 111, the two adjacent first protrusions 111 can guide the movement of the solid-state drive during the process of the operator installing the solid-state drive into the first heat dissipation area 101, so that the solid-state drive can be smoothly placed into the first heat dissipation area 101.

[0055] In a further embodiment of this utility model, reference is made to... Figure 2The mounting bracket 100 also includes a panel 120 disposed on the upper side of the base plate 110. The lower end of the panel 120 is provided with a plurality of second protrusions 122 distributed at intervals along a preset direction. The second protrusions 122 are arranged in a one-to-one correspondence with the first protrusions 111. The first heat dissipation module 200 is disposed between a corresponding set of first protrusions 111 and second protrusions 122. The second heat dissipation module 300 is disposed between another corresponding set of first protrusions 111 and second protrusions 122.

[0056] It is understandable that by providing multiple second protrusions 122 on the panel 120 that correspond one-to-one with the first protrusions 111, when the operator places the solid-state drive into the first heat dissipation area 101, two adjacent first protrusions 111 can cooperate to guide the lower end of the solid-state drive, and two adjacent second protrusions 122 can cooperate to guide the upper end of the solid-state drive, so that the solid-state drive can be placed smoothly into the first heat dissipation area 101.

[0057] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipation system, characterized in that, include: Mounting rack; The first heat dissipation module includes a first heat dissipation plate and a first elastic connector. The first heat dissipation plate has a first refrigerant channel that allows refrigerant to flow. The first elastic connector is connected to the first heat dissipation plate and the mounting bracket respectively. The second heat dissipation module is disposed on the mounting bracket and located on one side of the first heat dissipation plate. A first heat dissipation area is formed between the second heat dissipation module and the first heat dissipation plate to allow the insertion of a solid-state drive. The first elastic connector is used to provide elasticity to keep the first heat sink in contact with the solid-state drive in the first heat dissipation area.

2. The heat dissipation system according to claim 1, characterized in that, The second heat dissipation module includes a second heat dissipation plate and a second elastic connector. A first heat dissipation area is formed between the second heat dissipation plate and the first heat dissipation plate. A second refrigerant channel that allows refrigerant to flow is provided in the second heat dissipation plate. The second elastic connector is connected to the second heat dissipation plate and the mounting bracket respectively, and is used to provide elasticity to keep the second heat dissipation plate in contact with the solid-state drive in the first heat dissipation area.

3. The heat dissipation system according to claim 2, characterized in that, It also includes a transfer pipe, which has a first transfer chamber and a second transfer chamber. The first transfer chamber is connected to the inlet of the first refrigerant channel and the inlet of the second refrigerant channel, respectively. The second transfer chamber is connected to the outlet of the first refrigerant channel and the outlet of the second refrigerant channel, respectively. The inlet of the first transfer chamber is used to connect to the outlet of the refrigerant supply equipment, and the outlet of the second transfer chamber is used to connect to the inlet of the refrigerant supply equipment.

4. A heat dissipation system according to claim 1, characterized in that, It also includes a third heat dissipation module, which is located on the side of the first heat dissipation module away from the second heat dissipation module. The third heat dissipation module includes a third heat dissipation plate and a third elastic connector. The third heat dissipation plate has a third refrigerant channel that allows refrigerant to flow. A second heat dissipation area that allows a solid-state drive to be inserted is formed between the third heat dissipation plate and the first heat dissipation plate. The third elastic connector is connected to the third heat dissipation module and the mounting bracket respectively, and is used to provide elasticity to keep the third heat dissipation plate in contact with the solid-state drive in the second heat dissipation area.

5. A heat dissipation system according to claim 1, characterized in that, The first elastic connector is a spring sheet. The mounting bracket is provided with a plug hole. The spring sheet is detachably connected to the first heat sink plate, and one end of the spring sheet is plugged into the plug hole.

6. A heat dissipation system according to claim 5, characterized in that, The mounting bracket is provided with two oppositely arranged insertion holes. The middle part of the spring is detachably connected to the first heat sink, and the opposite ends of the spring are respectively inserted and plugged into the two insertion holes.

7. A heat dissipation system according to claim 6, characterized in that, The first heat sink plate is provided with a receiving groove, the middle part of the spring piece is received in the receiving groove, and the middle part of the spring piece is detachably connected to the groove wall of the receiving groove through a threaded connector.

8. A heat dissipation system according to claim 1, characterized in that, The inlet and outlet of the first refrigerant channel are both located at the same end of the first heat sink.

9. A heat dissipation system according to claim 1, characterized in that, The mounting bracket includes a base plate, on which a plurality of first protrusions are distributed at intervals along a preset direction. The first heat dissipation module and the second heat dissipation module are respectively supported on two adjacent first protrusions.

10. A heat dissipation system according to claim 9, characterized in that, The mounting bracket also includes a panel disposed on the upper side of the base plate. The lower end of the panel is provided with a plurality of second protrusions spaced apart along the preset direction. The second protrusions are arranged in a one-to-one correspondence with the first protrusions. The first heat dissipation module is disposed between a corresponding set of the first protrusions and the second protrusions, and the second heat dissipation module is disposed between another corresponding set of the first protrusions and the second protrusions.

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