A satellite-borne cloud computing device

Abstract

The utility model discloses a kind of spaceborne cloud computing equipment, including the equipment cabinet of fully-enclosed structure, the system backboard vertically fixed in the inside of case side plate, and two same design cloud computing modules of pluggable connection in system backboard;The cloud computing module is set in the inside of case using back-to-back mode, and its high arithmetic force chip front side corresponds the heat conduction boss of case lower plate inside, heat conduction boss and module heat dissipation interface are tightly pressed together by heat conduction gasket, form the efficient heat dissipation path of "chip-heat conduction gasket-heat conduction boss-equipment cabinet-satellite cabin wall".The utility model solves the heat dissipation problem of high-power chip under vacuum environment by targeted heat dissipation structure design;Through redundancy backup and anti-vibration fixed design, the reliability of equipment under launch strong vibration and in-orbit radiation environment is improved;While modular design is convenient for ground test and on-orbit maintenance, applicable to various satellite platform on-board real-time data processing scene.

Description

Technical Field

[0001] This utility model relates to the field of aerospace electronic equipment technology, and in particular to a spaceborne cloud computing device. Background Technology

[0002] As aerospace technology expands into areas such as high-resolution remote sensing, inter-satellite collaborative communication, and real-time mission planning, the amount of data generated on satellites is growing exponentially (e.g., the amount of data generated by a single high-orbit remote sensing satellite can reach hundreds of GB). The traditional "satellite-to-ground data backhaul - ground centralized processing" model can no longer meet the real-time requirements of scenarios such as emergency response and dynamic mission adjustment due to problems such as limited transmission bandwidth and high latency (one-way latency is usually >0.5s). Satellite cloud computing technology has emerged to address this issue—by integrating devices with distributed computing capabilities into the satellite platform, it enables "real-time processing - on-demand backhaul" of on-satellite data, significantly improving mission response efficiency (latency can be reduced to the millisecond level).

[0003] However, the unique characteristics of the space environment pose severe challenges to onboard cloud computing equipment: First, the strong vibrations and shocks during launch (vibration acceleration can reach 1500-2000g, and impact acceleration > 5000g) can easily cause loosening of internal circuit board connectors and desoldering of components; second, the vacuum environment in orbit (vacuum degree < 1×10⁻³Pa) lacks air convection cooling conditions, making it difficult to dissipate the heat generated by high-power computing chips (such as aerospace-grade CPUs with computing power ≥ 100GFLOPS) (power density can reach 50-80W / cm²), which can easily cause chip overheating and shutdown; third, extreme temperature cycles (-55℃~+85℃) and particle radiation (total dose can reach 100-300kRad) further exacerbate the risk of equipment structural failure and performance degradation.

[0004] In summary, existing spaceborne computing technologies either focus only on single heat dissipation / vibration resistance requirements or are not optimized for the combined environment of vacuum, strong vibration, and radiation. They still suffer from three major defects: low vacuum heat dissipation efficiency, unreliable structure under strong vibration, and lack of redundant radiation resistance design. These technologies cannot meet the application requirements of high-power, long-life spaceborne cloud computing equipment, and there is an urgent need for a technical solution that can solve the above problems simultaneously. Utility Model Content

[0005] This invention solves the heat dissipation problem of high-power chips in a vacuum environment through targeted heat dissipation structure design; it improves the reliability of the equipment in the environment of strong vibration during launch and on-orbit radiation through redundant backup and vibration-resistant fixing design; at the same time, the modular design facilitates ground testing and on-orbit maintenance, and is suitable for real-time data processing scenarios on various satellite platforms.

[0006] This utility model provides a spaceborne cloud computing device, characterized in that it includes: The equipment chassis, including the top plate, bottom plate and side plates, is a fully enclosed rectangular cavity structure; The system backplane is mounted on the side panel; Two cloud computing modules are arranged back-to-back parallel inside the device chassis and are plugged into the system backplane. A heat-conducting protrusion, disposed in the heat dissipation area of ​​the cloud computing module, is used to transfer heat from the cloud computing module to the device chassis; and A thermally conductive pad is disposed on the contact surface between the thermally conductive boss and the cloud computing module; The equipment chassis is provided with four mounting ears, which are evenly distributed on the side of the equipment chassis that contacts the satellite cabin wall, and are arranged symmetrically.

[0007] In one embodiment of this utility model, the system backplane is provided with a VPX port for connecting a cloud computing module.

[0008] In one embodiment of this utility model, the system backplane is provided with a DC-DC power conversion circuit and a gigabit Ethernet switching circuit, which are used to provide power supply and data interaction medium for the cloud computing module.

[0009] In one embodiment of this utility model, the cloud computing module includes a CPU unit, DDR memory, and an SSD data storage hard disk.

[0010] In one embodiment of this utility model, the cloud computing module is connected to the device chassis by multiple screws.

[0011] In one embodiment of this utility model, the upper plate, lower plate and side plate are fixed together by rivets and sealant to form a waterproof and dustproof closed structure.

[0012] In one embodiment of this utility model, the side panel includes a CAN bus interface, a debug serial port, a power supply interface, and an Ethernet interface.

[0013] In one embodiment of this utility model, a multi-dimensional vibration damping locking mechanism is further included for installing a cloud computing module. The multi-dimensional vibration damping locking mechanism includes: Guide slots are located on both sides of the cloud computing module; Guide ribs are installed inside the equipment chassis; and The locking handle is located at the rear of the cloud computing module.

[0014] In one embodiment of this utility model, a 3D heat dissipation plate is also included, which is disposed on the heat dissipation area of ​​the cloud computing module and extends to the top of the cloud computing module to form a heat dissipation interface.

[0015] This utility model has the following beneficial effects: (1) The cloud computing module is connected to the system backplane through a standardized slot and fixed to the equipment chassis with multiple screws, which ensures the structural stability during the launch phase and solves the problem of connection failure caused by vibration.

[0016] (2) Through the heat conduction path of “chip-thermal pad-thermal boss-chassis-satellite bulkhead”, efficient heat dissipation of high power density cloud computing chip is achieved in vacuum environment.

[0017] (3) Multiple cloud computing modules adopt the same design scheme, which facilitates ground production testing and on-orbit maintenance and upgrades, and improves the flexibility of the system.

[0018] (4) By setting up two cloud computing modules, system-level redundant backup was achieved, which improved the overall anti-radiation capability. Attached Figure Description

[0019] Figure 1 A schematic diagram of a spaceborne cloud computing device according to an embodiment of the present invention is shown; Figure 2 An exploded view of the spaceborne cloud computing device along the z-axis is shown in one embodiment of the present invention; and Figure 3 An exploded view of the spaceborne cloud computing device along the y-axis is shown in one embodiment of this utility model. Detailed Implementation

[0020] In the following description, the present invention is described with reference to various embodiments. However, those skilled in the art will recognize that the embodiments may be practiced without one or more specific details or with other alternatives and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure the inventive aspects of the present invention. Similarly, for illustrative purposes, specific quantities, materials, and configurations are set forth to provide a comprehensive understanding of embodiments of the present invention. However, the present invention is not limited to these specific details.

[0021] In this utility model, the various embodiments are merely intended to illustrate the solution of this utility model and should not be construed as limiting.

[0022] In this specification, references to "an embodiment" or "this embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment of the present invention. The phrase "in one embodiment" appearing throughout this specification does not necessarily refer to all of the same embodiment.

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] Figure 1A schematic diagram of a spaceborne cloud computing device according to one embodiment of the present invention is shown.

[0025] Figure 2 An exploded view of the spaceborne cloud computing device along the z-axis is shown in one embodiment of this utility model.

[0026] Figure 3 An exploded view of the spaceborne cloud computing device along the y-axis is shown in one embodiment of this utility model.

[0027] like Figure 1 , Figure 2 and Figure 3 As shown, in one embodiment of this utility model, the spaceborne cloud computing device includes: The equipment chassis 100 is a fully enclosed rectangular cavity structure, consisting of an upper plate 110 (top), a lower plate 120 (bottom, i.e. the surface in contact with the satellite cabin wall), and side plates 130 (four sides, front, back, left, and right). The interior forms a closed space to accommodate the system back panel 200 and the cloud computing module 300.

[0028] The upper plate 110, lower plate 120, and side plate 130 are fixed together with rivets and sealant to form a waterproof and dustproof enclosed structure (suitable for the vacuum environment of space). The equipment chassis 100 is rigidly fixed to the satellite cabin wall with high-strength aerospace-grade screws via four mounting ears 121 on the lower plate.

[0029] The equipment chassis 100 has a CAN bus interface 131 on its side panel 130, which interfaces with the satellite integrated information equipment to realize telemetry and remote control data communication for the cloud computing equipment; a ground debugging serial port 132, which is used for data communication with the ground debugging equipment when the cloud computing equipment chassis 100 is closed; a power input interface 133, which is connected to the system backplane 200 and provides power to the cloud computing module 300 through the DC-DC conversion circuit on the system backplane 200; and an Ethernet interface 134, which enables high-capacity, high-speed data communication between the cloud computing equipment and other single units in the satellite.

[0030] The system backplane 200 is vertically fixed inside the side panel 130 of the equipment chassis 100 (non-interface side), perpendicular to the lower panel, and has an "L" shaped layout; its position is centered to ensure that the connection distance with the two cloud computing modules 300 is consistent, thereby reducing signal attenuation.

[0031] The system backplane 200 is equipped with a standardized VPX socket 210 (compliant with aerospace-grade VPX bus specifications). The cloud computing module 300 achieves pluggable connection via a "plug-socket" connection. The socket also features a guide structure (positioning pin) to ensure precise alignment when the module is inserted, preventing pin damage. The edges of the system backplane 200 are rigidly secured to the chassis side panel 130 with 13 aerospace-grade fastening screws.

[0032] The system backplane 200 integrates a DC-DC power conversion circuit (input voltage 28V / 42V aerospace standard voltage, output 5V / 12V to adapt to module requirements) and a gigabit Ethernet switching circuit. The circuit is connected to the VPX socket 210 and external interfaces (power supply interface, Ethernet interface) via PCB copper foil traces. The system backplane 200 enables point-to-point high-speed communication (rate ≥1000Mbps) between the two cloud computing modules 300 through the gigabit Ethernet switching circuit, while simultaneously forwarding module data to the Ethernet interface to achieve data interaction with other equipment on the satellite (such as remote sensing payloads and attitude control systems). The externally input 28V voltage is converted to the module-compatible voltage via a DC-DC circuit, and then stably powered to the two cloud computing modules through the VPX socket, while also providing overcurrent and overvoltage protection functions.

[0033] In another embodiment of this utility model, the system backplane 200 has 2-4 spare VPX slots (consistent with the existing module slot structure), which can be used to expand additional cloud computing modules in a "plug and play" manner.

[0034] The cloud computing module 300 consists of two modules arranged back-to-back parallel inside the equipment chassis 100, located above the lower plate 120 and in front of the system backplate 200. Figure 2 210 is the heat dissipation area of ​​the cloud computing module 300, which is in contact with the heat-conducting boss 400 for heat dissipation.

[0035] The cloud computing module 300 integrates a VPX connector at the rear, which can be plugged into the VPX socket on the system backplane to enable signal (data, control commands) and power supply. Each side edge of the cloud computing module 300 has 2-3 screw holes for auxiliary fixation to the chassis bottom plate and side plates using aerospace-grade screws (screw tightening torque ≤ 5 N·m to prevent module deformation).

[0036] In this embodiment, the two modules form a "redundant link" through the Ethernet switching circuit on the system backplane. When one module fails due to radiation or fault, the other module automatically takes over the task through link switching without the need for physical reconnection.

[0037] In this embodiment, the cloud computing module 300 includes: High-performance aerospace-grade CPUs (such as domestically produced radiation-resistant CPUs) are used to perform real-time data processing tasks on the satellite (such as remote sensing image noise reduction, target recognition, and orbit calculation), with a computing power of ≥100 GFLOPS. DDR4 radiation-resistant memory (configurable from 8GB to 64GB) and SSD solid-state drives (configurable from 1TB to 10TB) enable temporary data caching and long-term storage, meeting the storage needs of large-volume task data.

[0038] The thermally conductive boss 400 is located in the heat dissipation area 210 of the cloud computing module, that is, the boss position is aligned with the center of the high computing power chip of the module. The thermally conductive boss 400 is made of a high thermal conductivity material (such as aluminum-copper composite alloy, thermal conductivity ≥200W / (m・K)), and the height of the boss matches the thickness of the module (to ensure that the module can be contacted after the chassis is closed).

[0039] It is integrally formed with the equipment chassis 100 without any additional connection; it is in indirect contact with the cloud computing module 300 through a thermally conductive pad (the top surface of the boss is covered with a thermally conductive pad), serving as a heat conduction intermediary between the module and the chassis, quickly conducting the heat generated by the module chip (power density ≥50W / cm²) to the equipment chassis, thus preventing heat from accumulating inside the module.

[0040] The thermal pad, located between the top surface of the thermally conductive bump and the bottom surface of the cloud computing module (chip heat dissipation interface), is a sheet-like covering the contact area between the bump and the chip. The thermal pad uses aerospace-grade flexible thermally conductive material (such as silicone thermal pads, with a thermal conductivity ≥3W / (m・K) and a thickness of 0.5-1mm), possessing a certain degree of elasticity to accommodate the minute gaps between the bump and the module. The thermal pad adheres to the top surface of the thermally conductive bump through its own adhesive properties. After the chassis is closed, the pressure of the upper plate ensures a tight seal between the pad and the bottom surface of the module (contact pressure ≥0.2MPa), eliminating the risk of loosening.

[0041] Thermal pads are used to fill the tiny gaps between thermal bosses and modules, reducing thermal resistance (thermal resistance ≤ 0.1℃・in² / W), ensuring heat conduction from modules to bosses, and avoiding a decrease in heat dissipation efficiency due to gaps.

[0042] In one embodiment of this utility model, it further includes: Multi-dimensional vibration damping locking mechanism (improved solution component, replacing traditional screws), including: Guide slots are located on both sides of the cloud computing module; Guide ribs are installed inside the equipment chassis; and The locking handle is located at the rear of the cloud computing module.

[0043] Connection method: When the module is inserted, the guide groove slides along the guide rib of the chassis to align. After it is in place, the locking handle at the tail is turned. The handle presses the module against the lower plate of the chassis through the "cam structure" to achieve mechanical locking. Compared to screw mounting, the multi-dimensional vibration damping locking mechanism can reduce module displacement caused by vibration (displacement ≤0.1mm), further improving the structural reliability during the launch phase (strong vibration environment), while simplifying module insertion and removal operations (locking / unlocking without tools).

[0044] In one embodiment of this utility model, a 3D heat spreader (an improved component for enhanced heat dissipation efficiency) is also included. It is disposed inside the cloud computing module and directly attached to the surface of the high-performance chip. The heat spreader body is embedded in the module PCB board, and the extended end extends from the top of the module, forming a heat dissipation path of "chip-heat spreader-module top". The 3D heat spreader is bonded to the chip surface with thermally conductive adhesive (thermal conductivity ≥5W / (m・K)), and the extended end contacts the thermally conductive pad on the inside of the chassis upper plate (pressed together after the chassis is closed). It is used to solve the problem of "local overheating" when multiple modules work in parallel. Through the "heat spreader effect", the concentrated heat of the chip is dispersed to the top of the module and then conducted to the chassis upper plate.

[0045] Although various embodiments of the present invention have been described above, it should be understood that they are presented by way of example only and not as limitations. It will be apparent to those skilled in the art that various combinations, modifications, and alterations can be made thereto without departing from the spirit and scope of the present invention. Therefore, the breadth and scope of the present invention disclosed herein should not be limited by the exemplary embodiments disclosed above, but should be defined solely by the appended claims and their equivalents.

Claims

1. A spaceborne cloud computing device, characterized in that, include: The equipment chassis, including the top plate, bottom plate and side plates, is a fully enclosed rectangular cavity structure; The system backplane is mounted on the side panel; Two cloud computing modules are arranged back-to-back parallel inside the device chassis and are plugged into the system backplane. A heat-conducting boss is provided in the heat dissipation area of ​​the cloud computing module to transfer heat from the cloud computing module to the device chassis. as well as A thermally conductive pad is disposed on the contact surface between the thermally conductive boss and the cloud computing module; The equipment chassis is provided with four mounting ears, which are evenly distributed on the side of the equipment chassis that contacts the satellite cabin wall, and are arranged symmetrically.

2. The spaceborne cloud computing device according to claim 1, characterized in that, The system backplane is equipped with a VPX port for connecting to a cloud computing module.

3. The spaceborne cloud computing device according to claim 1, characterized in that, The system backplane is equipped with a DC-DC power conversion circuit and a gigabit Ethernet switching circuit, which are used to provide power and data interaction medium for the cloud computing module.

4. The spaceborne cloud computing device according to claim 1, characterized in that, The cloud computing module includes a CPU unit, DDR memory, and an SSD data storage hard drive.

5. The spaceborne cloud computing device according to claim 1, characterized in that, The cloud computing module is connected to the device chassis via multiple screws.

6. The spaceborne cloud computing device according to claim 1, characterized in that, The upper plate, lower plate, and side plate are fixed together with rivets and sealant to form a waterproof and dustproof closed structure.

7. The spaceborne cloud computing device according to claim 1, characterized in that, The side panel includes a CAN bus interface, a debug serial port, a power supply interface, and an Ethernet interface.

8. The spaceborne cloud computing device according to claim 1, characterized in that, It also includes a multi-dimensional vibration damping and locking mechanism for installing the cloud computing module, the multi-dimensional vibration damping and locking mechanism comprising: Guide slots are located on both sides of the cloud computing module; Guide ribs are installed inside the equipment chassis; and The locking handle is located at the rear of the cloud computing module.

9. The spaceborne cloud computing device according to claim 1, characterized in that, It also includes a 3D heat sink, which is placed on the heat dissipation area of ​​the cloud computing module and extends to the top of the cloud computing module to form a heat dissipation interface.

Images