Submersible electronic device

Abstract

The utility model discloses an immersion type electronic equipment, contain a heat abstractor and install in the heat abstractor one portable computer. The portable computer contains a casing, a power module and a host module. The casing fluid coupling is in the heat abstractor, and the power module is installed with the host module in the casing. The host module contains electrically coupled the processing unit of power module and electrically coupled the signal port of processing unit. The signal port is exposed to the heat abstractor, is used for at least one external electronic component plug joint and electrically coupled to the processing unit. The injection port of casing is used for a cooling liquid injection, so that the cooling liquid can immerse the processing unit and form a circulating liquid flow through the heat abstractor. Therefore, realize the personalization of the immersion type electronic equipment, to help reduce the overall cost and benefit widely used.

Description

Technical Field

[0001] This utility model relates to an electronic device, and more particularly to an immersion electronic device. Background Technology

[0002] Existing immersion workstations are large in size and require large amounts of expensive cooling fluids (such as electronic fluorinated fluids or silicone oils), which hinders their widespread application. Therefore, the applicant believes that these shortcomings can be improved and proposes this utility model with a reasonable design that effectively addresses these deficiencies. Utility Model Content

[0003] This utility model provides an immersion electronic device that can effectively improve the defects that may occur in existing immersion workstations.

[0004] This utility model discloses an immersion electronic device, comprising: a heat dissipation device including: a housing having a receiving cavity and a base located outside the receiving cavity; a power module including a power supply disposed within the receiving cavity and a power supply port mounted on the base and electrically coupled to the power supply; a circulating heat dissipation module disposed within the receiving cavity and including multiple pipes; a portable computer detachably mounted on the base in a preset direction to selectively be in a combined mode or a separate mode; wherein the portable computer includes: a housing having a cooling cavity and multiple inlet / outlet ports and an injection port connected to the cooling cavity; a host module including: a processing unit mounted on the cooling cavity. Inside the cooling chamber: a switching unit, installed in the cooling chamber and electrically coupled to the processing unit; a power port, installed on the bottom wall of the cooling chamber and electrically coupled to the processing unit; a signal port, installed on the side wall of the cooling chamber and electrically coupled to the processing unit, for allowing at least one external electronic component to be plugged in and electrically coupled to the processing unit; wherein, when the portable computer is set in the chassis and in the combined mode, the power port is plugged into the power supply port so that the processing unit is electrically coupled to the power supply; multiple inlet and outlet ports are respectively connected to multiple pipelines so that the cooling chamber is fluidly coupled to the circulating heat dissipation module; and an injection port is used to inject a cooling liquid into the cooling chamber so that the cooling liquid can submerge the processing unit and form a circulating liquid flow within the cooling chamber through the circulating heat dissipation module.

[0005] Optionally, the receiving cavity has a first section and a second section connected to the first section, and the base is connected to the bottom end of the inner edge of the first section and the bottom end of the inner edge of the second section to jointly define a plug-in space; wherein, when the portable computer is disposed on the base and is in a combined mode, the housing is located in the plug-in space.

[0006] Optionally, the preset direction is perpendicular to the base, and the shape of the housing is complementary to the shape of the outer shell.

[0007] Optionally, an operating groove is recessed on the outer surface of the cooling cavity, and multiple inlet and outlet ports and injection ports are located in the operating groove; wherein, when the portable computer is mounted on the base and in the combined mode, the operating groove is adjacent to the second section of the receiving cavity.

[0008] Optionally, the cooling cavity includes a first cavity and a second cavity that are interconnected, and the first cavity and the second cavity together define an operating slot. Multiple inlet and outlet ports are installed in the first cavity, and an injection port is installed in the second cavity. When the portable computer is set on the base and in the combined mode, the second cavity is located at a corner formed by the inner edge of the first section and the inner edge of the second section.

[0009] Optionally, the processing unit includes: a motherboard electrically coupled to a switching unit, a power port, and a signal port; a central processing unit and a display adapter mounted on the motherboard.

[0010] Optionally, the housing includes a flow tube located within the cooling cavity, with one end of the flow tube mounted on one of the inlet / outlet ports and the other end of the flow tube facing the central processing unit.

[0011] Optionally, the housing includes a cover over the central processing unit, and the other end of the flow tube is mounted and connected to the cover.

[0012] Optionally, the multiple pipelines include an output pipeline and at least one input pipeline respectively connected to multiple inlet and outlet ports, and the circulating heat dissipation module includes: a circulating pump connected to the output pipeline; a heat dissipation unit connected to the circulating pump and at least one input pipeline; wherein, when the portable computer is set in a dock and in a combined mode, the heat dissipation unit faces the projection area formed by the front projection of the motherboard, which covers at least 50% of the area of ​​the motherboard.

[0013] Optionally, the main unit module includes a handle mounted on the top wall of the cooling chamber for handheld mobile computer use.

[0014] Alternatively, when the portable computer is not mounted on the chassis and is in a detached mode, the cooling chamber is not used to contain cooling liquid, and the portable computer can be connected to an external power module via the power port to operate.

[0015] This utility model also discloses an immersion electronic device, comprising: a heat dissipation device including: a housing; a circulating heat dissipation module disposed within the housing, and the circulating heat dissipation module including multiple pipes; a portable computer installed within the housing; wherein the portable computer includes: a chassis having a cooling cavity, and multiple inlet / outlet ports and an injection port connected to the cooling cavity; wherein the multiple inlet / outlet ports are respectively connected to multiple pipes to fluidly couple the cooling cavity to the circulating heat dissipation module; a power module including a power supply disposed within the cooling cavity; a host module including: a processing unit installed within the cooling cavity and electrically coupled to the power supply; a signal port installed within the cooling cavity and exposed outside the housing, and the signal port electrically coupled to the processing unit for allowing at least one external electronic component to be plugged in and electrically coupled to the processing unit; wherein the injection port is used to inject a cooling liquid into the cooling cavity so that the cooling liquid can immerse the processing unit and form a circulating liquid flow within the cooling cavity through the circulating heat dissipation module.

[0016] Optionally, the cooling cavity includes: a first cavity for accommodating the processing unit, and a plurality of inlet and outlet ports and injection ports connected to the bottom side of the first cavity; a second cavity connected to the bottom side of the first cavity and communicating with each other, and the second cavity accommodating a power supply; and a third cavity communicating with the first cavity and the second cavity, and the third cavity being located on one side of the first cavity and the second cavity; wherein, the signal port and the injection port are installed in the third cavity, and the injection port is located within a notch surrounded by the first cavity, the second cavity, and the third cavity.

[0017] Optionally, the processing unit includes: a motherboard electrically coupled to a signal port and a power supply, with the power supply located directly below the motherboard; a central processing unit and a display adapter mounted on the motherboard.

[0018] Optionally, the multiple pipelines include an output pipeline and two input pipelines respectively connected to multiple inlet and outlet ports, and the circulating heat dissipation module includes: a circulating pump connected to the output pipeline; and a heat dissipation unit connected to the circulating pump and the two input pipelines.

[0019] Optionally, the housing includes: two air ducts located within the cooling cavity, with one end of each air duct mounted to two inlet / outlet ports, and the other ends of each air duct facing the central processing unit and a graphics processor of the display adapter, respectively; and two covers covering the central processing unit and the graphics processor, with the other ends of each air duct mounted and connected to the two covers, respectively.

[0020] Optionally, the housing includes two air ducts located within the cooling cavity, with one end of each air duct mounted to two inlet / outlet ports, and the other end of each air duct facing the central processing unit and a graphics processor of the display adapter. Optionally, the housing includes two covers that respectively cover the central processing unit and the graphics processing unit, and the other ends of the two air ducts are respectively installed and connected to the two covers. This utility model also discloses an immersion electronic device, comprising: a heat dissipation device including: a housing having a receiving cavity and a base located outside the receiving cavity; a power module including a power supply disposed within the receiving cavity and a power supply port mounted on the base and electrically coupled to the power supply; a circulating heat dissipation module disposed within the receiving cavity; a portable computer including: a casing having a cooling cavity and an injection port connected to the cooling cavity; and a host module including: a processing unit mounted within the cooling cavity. A power port is mounted on the bottom wall of the cooling chamber and electrically coupled to the processing unit; a signal port is mounted on the side wall of the cooling chamber and electrically coupled to the processing unit; wherein the portable computer can be inserted into the power supply port in a preset direction to be in a combined mode, so that the processing unit is electrically coupled to the power supply, and the cooling chamber can be fluidly coupled to the circulating heat dissipation module so that the injection port is used to inject a coolant into the cooling chamber; wherein the portable computer can be in a disassembled mode without being mounted on the chassis, so that the cooling chamber is not used to contain coolant.

[0021] Optionally, the preset direction is perpendicular to the base, and the shape of the housing is complementary to the shape of the outer shell.

[0022] In summary, the immersion electronic device disclosed in this utility model embodiment enables the application of cooling liquid within the portable computer through the structural configuration of the portable computer and its combination with a heat dissipation device, thereby achieving the personalization of the immersion electronic device, which helps to reduce the overall cost and facilitates its widespread application.

[0023] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, these descriptions and drawings are only used to illustrate this utility model and are not intended to limit the scope of protection of this utility model in any way. Attached Figure Description

[0024] Figure 1 This is a three-dimensional schematic diagram of an immersion electronic device according to Embodiment 1 of this utility model. Figure 2 for Figure 1 A 3D diagram showing the door panel after it is opened. Figure 3 for Figure 2 A schematic diagram of its breakdown. Figure 4 for Figure 2 A three-dimensional schematic diagram of the heat dissipation device. Figure 5 for Figure 2 A three-dimensional sectional view of a portable computer. Figure 6 This is a functional block diagram (I) of the immersion electronic device according to Embodiment 1 of this utility model. Figure 7 This is a functional block diagram (II) of the immersion electronic device according to Embodiment 1 of this utility model. Figure 8 for Figure 1 A schematic cross-sectional view along section line VIII-VIII. Figure 9 for Figure 1 A cross-sectional view along section line IX-IX. Figure 10 for Figure 8 A schematic diagram of an immersion electronic device after being injected with cooling liquid. Figure 11 This is a three-dimensional schematic diagram of the immersion electronic device according to Embodiment 2 of this utility model. Figure 12 for Figure 11 A schematic diagram of its breakdown. Figure 13 for Figure 11 A breakdown diagram from another perspective. Figure 14 for Figure 12 An exploded view of a portable computer. Figure 15 This is a functional block diagram (I) of the immersion electronic device according to Embodiment 2 of this utility model. Figure 16 for Figure 13 An exploded view of a portable computer. Figure 17 for Figure 11 A cross-sectional view along section line XVII-XVII. Figure 18 for Figure 11 A schematic cross-sectional view along section line XVIII-XVIII. Figure 19 for Figure 11 A cross-sectional view along section line XIX-XIX. Figure 20 for Figure 9 A schematic diagram of an immersion electronic device after being injected with cooling liquid. Detailed Implementation The following specific embodiments illustrate the implementation of the "immersion electronic device" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0025] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various elements or features, these elements or features should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one feature from another. Furthermore, the term "or" as used herein may, as appropriate, include any combination of one or more of the related listed items.

[0026] [Example 1] Please see Figures 1 to 10 As shown, this is one embodiment of the present invention. Figures 1 to 3 As shown, this embodiment discloses an immersion electronic device 100, which includes a heat dissipation device 1 and a portable computer 2 detachably mounted on the heat dissipation device 1. It should be noted that the immersion electronic device 100 in this embodiment can be configured near a user and can be directly operated by the user (e.g., a personal computer); that is, any immersion system that cannot be directly operated by a user is different from the immersion electronic device 100 referred to in this embodiment.

[0027] In this embodiment, the heat dissipation device 1 includes a housing 11, a power module 12 installed in the housing 11, and a circulating heat dissipation module 13 located inside the housing 11. The power module 12 can be used to provide the power required for the operation of the circulating heat dissipation module 13, but this invention is not limited thereto.

[0028] More specifically, such as Figures 3 to 6As shown, the outer casing 11 has a receiving cavity 111 and a base 112 located outside the receiving cavity 111, and the outer surface of the receiving cavity 111 and the base 112 can together form a plug-in space 113. In this embodiment, the receiving cavity 111 is generally L-shaped and has a first section 1111 and a second section 1112 connected to and communicating with the first section 1111, and the first section 1111 and the second section 1112 are both generally cuboid and connected perpendicularly to each other.

[0029] Furthermore, the base 112 is generally rectangular in shape, and it is connected to the bottom end of the inner edge of the first section 1111 and the bottom end of the inner edge of the second section 1112 to jointly define the insertion / removal space 113. In addition, the receiving cavity 111 may further include a door panel 1113, which is mounted at the end of the second section 1112 away from the first section 1111. The door panel 1113 is pivotally connected to the second section 1112 and partially protrudes from it.

[0030] The power module 12 includes a power supply 121 disposed within the receiving cavity 111 and a power supply port 122 mounted on the base 112 and electrically coupled to the power supply 121. In this embodiment, the power supply 121 may be configured in a corner of the receiving cavity 111 (e.g., in the second section 1112 away from the door panel 1113), and the power module 12 connects the power supply 121 to the power supply port 122 via multiple transmission lines 123. The power supply 121 can obtain power by being directly or indirectly connected to mains power, and the number of power supplies 121 can be adjusted according to actual needs; this invention does not impose any limitations on this.

[0031] The circulating heat dissipation module 13 is disposed within the receiving cavity 111, and the circulating heat dissipation module 13 includes multiple pipes 131. In this embodiment, the multiple pipes 131 can be functionally divided into an output pipe 1311 and at least one input pipe 1312, and the circulating heat dissipation module 13 includes a circulating pump 132 connected to the output pipe 1311, and a heat dissipation unit 133 connected to the circulating pump 132 and at least one input pipe 1312.

[0032] Furthermore, the circulation pump 132 of the multiple pipes 131 is generally located in the second section 1112 and adjacent to the door panel 1113, while the heat dissipation unit 133 is generally located in the first section 1111. Moreover, the number of at least one input pipe 1312 is stated as two, and the heat dissipation unit 133 includes multiple heat sinks 1331 (e.g., heat pipes and cooling fins) and multiple fans 1332 configured corresponding to the multiple heat sinks 1331.

[0033] In addition, such as Figure 7 As shown, in order to improve the operating efficiency of the heat dissipation device 1, the heat dissipation device 1 may also be configured with an independent power supply 14 electrically coupled to the circulation pump 132 and the plurality of fans 1332, and a programmable logic controller (PLC) 15, which can be used to control the operation of the circulation pump 132 and the plurality of fans 1332, thereby effectively improving the operating efficiency of the circulation pump 132 and the plurality of fans 1332.

[0034] The portable computer 2 can be detachably mounted on the base 112 along a preset direction D, and can be selectively in a combination mode (e.g.: Figure 1 ) or a separation mode (e.g.: Figure 3 In this embodiment, the preset direction D is perpendicular to the base 112, and the shape of the portable computer 2 generally corresponds to the plug-in space 113, so that the portable computer 2 can be combined with the heat dissipation device 1 to form a generally rectangular parallelepiped structure.

[0035] like Figures 3 to 6 As shown, the portable computer 2 in this embodiment includes a housing 21, a handle 22 mounted outside the housing 21, and a host module 23 mounted inside the housing 21. The shape of the housing 21 is generally complementary to the shape of the outer shell 11, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the shape of the housing 21 may not be complementary to the shape of the outer shell 11; or, the handle 22 may be omitted or replaced by other components according to actual needs.

[0036] In this embodiment, the housing 21 has a cooling cavity 211 and a plurality of inlet / outlet ports 212 and an injection port 213 connected to the cooling cavity 211. An operating groove 214 is recessed on the outer surface of one corner of the cooling cavity 211, and the plurality of inlet / outlet ports 212 and the injection port 213 are located in the operating groove 214.

[0037] Furthermore, the cooling cavity 211 includes a first cavity 2111 and a second cavity 2112 that are interconnected, and the first cavity 2111 and the second cavity 2112 together define the operating slot 214. The second cavity 2112 is located at another corner of the cooling cavity 211 adjacent to the operating slot 214. A plurality of inlet / outlet ports 212 are installed in the first cavity 2111, and the injection port 213 is installed in the second cavity 2112.

[0038] Furthermore, the handle 22 is installed on the top wall of the cooling cavity 211 (e.g., the first cavity 2111) for hand-held movement of the portable computer 2. Additionally, the cooling cavity 211 may be equipped with a transparent window 2113 to facilitate viewing the host module 23 within the cooling cavity 211, and the cooling cavity 211 may also be equipped with a supplementary port 2114 on the top wall of the second cavity 2112, but this invention is not limited thereto.

[0039] It should be further noted that, in this embodiment, the cooling cavity 211 can be sealed by a corresponding sealing mechanism (not shown in the figure); that is, the internal space of the cooling cavity 211 can only be connected to the outside through the multiple inlet and outlet ports 212, the injection port 213, and the supplement port 2114.

[0040] The host module 23 includes a processing unit 231, and a switching unit 232, a power port 233, and a signal port 234 electrically coupled to the processing unit 231. The processing unit 231 is installed inside the cooling cavity 211, the switching unit 232 is installed on the cooling cavity 211 (e.g., the top wall), the power port 233 is installed on the bottom wall of the cooling cavity 211, and the signal port 234 is installed on the side wall of the cooling cavity 211.

[0041] More specifically, the processing unit 231 includes a motherboard 2311, a central processing unit 2312 mounted on the motherboard 2311, and a display adapter 2313. The motherboard 2311 is electrically coupled to the switching unit 232, the power port 233, and the signal port 234. The motherboard 2311 is disposed within the first cavity 2111 and the second cavity 2112, and the central processing unit 2312 is more adjacent to the plurality of input / output ports 212 than the display adapter 2313.

[0042] The switch unit 232 is located on the top wall of the first cavity 2111, away from the second cavity 2112 (e.g., the handle 22 is generally located between the switch unit 232 and the supplementary port 2114). In this embodiment, the switch unit 232 is described as including two switch buttons exposed outside the cooling cavity 211, and multiple transmission lines electrically coupled to the two switch buttons and the motherboard 2311, so that the switch unit 232 can be used to control the opening and closing of the processing unit 231, but this utility model is not limited thereto.

[0043] The signal port 234 is located on the side wall of the first cavity 2111 away from the second cavity 2112 (e.g., the transparent window 2113 is generally located between the signal port 234 and the plurality of input / output ports 212), for inserting at least one external electronic component (not shown) and electrically coupling it to the processing unit 231. In this embodiment, the signal port 234 is described as including a plurality of electrical connectors exposed outside the cooling cavity 211, and a plurality of transmission lines electrically coupling the plurality of electrical connectors to the motherboard 2311, and the types of the plurality of electrical connectors can be adjusted and varied according to actual needs, which is not limited herein.

[0044] The above describes the structure of the heat dissipation device 1 and the portable computer 2. The following section will first describe the combined configuration of the portable computer 2 relative to the heat dissipation device 1 (e.g., ...). Figure 1 The connection relationship when the portable computer 2 is in the separated mode relative to the heat dissipation device 1 is explained, and then the connection relationship when the portable computer 2 is in the separated mode relative to the heat dissipation device 1 is explained (e.g.: Figure 3 The connection relationship when ().

[0045] Please see Figures 8 to 10 and take into account as appropriate. Figure 4 and Figure 5As shown, when the portable computer 2 is mounted on the base 112 and is in the combined mode, the power port 233 is inserted into the power supply port 122 to electrically couple the processing unit 231 to the power supply 121. Multiple input / output ports 212 are respectively connected to multiple pipelines 131 (e.g., multiple input / output ports 212 are respectively connected to the output pipeline 1311 and at least one input pipeline 1312) to fluidly couple the cooling chamber 211 to the circulating heat dissipation module 13. The injection port 213 is used to inject a cooling liquid L into the cooling chamber 211 so that the cooling liquid L can immerse the processing unit 231 and form a circulating liquid flow F within the cooling chamber 211 through the circulating heat dissipation module 13. Furthermore, although the injection port 213 is described in this embodiment as providing the cooling liquid L to be injected into the cooling cavity 211, in other embodiments not shown in this utility model, the injection port 213 may also provide the cooling liquid L to flow out of the cooling cavity 211.

[0046] Furthermore, when the portable computer 2 is disposed on the base 112 and is in the combined mode, the housing 21 is located in the plug-in space 113 (e.g., a projection area formed by the heat dissipation unit 133 projecting onto the motherboard 2311, which covers at least 50% of the area of ​​the motherboard 2311), the second cavity 2112 is located at a corner 1114 formed by the inner edge of the first section 1111 and the inner edge of the second section 1112, the operation slot 214 is adjacent to the second section 1112 of the receiving cavity 111, and the door panel 1113 can be used to close the slot of the operation slot 214.

[0047] It should be further noted that, in order to enable the processing unit 231 to have optional heat dissipation, the housing 21 may further include a guide pipe 215 located within the cooling cavity 211 and a cover 216 covering the central processing unit 2312. One end of the guide pipe 215 is installed at one of the inlet / outlet ports 212 to connect to one of the input pipes 1312, while the other end of the guide pipe 215 (installed and connected to the cover 216) faces the central processing unit 2312 (that is, the cooling liquid L flows to the central processing unit 2312 via the guide pipe 215 and then flows out from the periphery of the cover 216). However, this invention is not limited to this. For example, in other embodiments not shown in this invention, the cover 216 (and the guide pipe 215) may be omitted or replaced with other structures depending on actual needs.

[0048] Furthermore, the inlet / outlet port 212 connected to another input pipe 1312 may not be connected to any of the guide pipes 215, allowing the cooling liquid L to flow directly into the cooling chamber 211, but this invention is not limited to this. For example, in other embodiments not shown in this invention, the inlet / outlet port 212 connected to another input pipe 1312 may also be connected to a pipe within the cooling chamber 211, facing the graphics processor of the display adapter 2313, depending on actual needs.

[0049] Please see Figure 3 and Figure 5 As shown, when the portable computer 2 is not installed on the base 112 and is in the detached mode, the cooling cavity 211 is not used to accommodate, for example, Figure 10 The present coolant L is present, and the portable computer 2 can operate by being plugged into an external power module (not shown) via the power port 233, but this invention is not limited thereto. For example, in other embodiments not shown in this invention, the portable computer 2 may also be limited to operating only when the coolant L is present.

[0050] In summary, in this embodiment, the immersion electronic device 100, through the structural configuration of the portable computer 2 and its combination with the heat dissipation device 1, enables the cooling liquid L to be applied within the portable computer 2, thereby achieving personalization of the immersion electronic device 100, which helps to reduce overall costs and facilitates its widespread application.

[0051] Furthermore, in this embodiment, the immersion electronic device 100 achieves electrical and fluid coupling between the portable computer 2 and the heat dissipation device 1 through a pluggable configuration, thereby meeting a wider range of usage needs and facilitating the promotion of the immersion electronic device 100.

[0052] [Example 2] Please see Figures 11 to 20 As shown, this is Embodiment Two of the present invention. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The main differences between this embodiment and Embodiment One are explained below: like Figures 11 to 13As shown, this embodiment discloses an immersion electronic device 100, which includes a heat dissipation device 1 and a portable computer 2 installed within the heat dissipation device 1. It should be noted that the immersion electronic device 100 in this embodiment can be configured near a user and can be directly operated by the user (e.g., a personal computer); that is, any immersion system that cannot be directly operated by a user is different from the immersion electronic device 100 referred to in this embodiment.

[0053] In this embodiment, the heat dissipation device 1 does not include the power module of Embodiment 1, and the heat dissipation device 1 includes a housing 11 and a circulating heat dissipation module 13 installed inside the housing 11. The housing 11 is generally cuboid and has multiple holes (not shown in the figure) to expose some components of the portable computer 2.

[0054] The circulating heat dissipation module 13 includes multiple pipes 131. In this embodiment, the multiple pipes 131 can be functionally divided into an output pipe 1311 and two input pipes 1312, and the circulating heat dissipation module 13 includes a circulating pump 132 connected to the output pipe 1311 and a heat dissipation unit 133 connected to the circulating pump 132 and the two input pipes 1312.

[0055] Furthermore, the heat dissipation unit 133 is generally located on one side of the portable computer 2, the circulation pump 132, and the multiple pipes 131, and the heat dissipation unit 133 includes multiple heat sinks 1331 (such as heat pipes and heat dissipation fins) and multiple fans 1332 configured corresponding to the multiple heat sinks 1331, but the present invention is not limited thereto.

[0056] In addition, in other embodiments not shown in this utility model, the heat dissipation device 1 may also be configured with an independent power supply electrically coupled to the circulation pump 132 and the plurality of fans 1332, and a programmable logic controller (PLC) according to actual needs. The PLC can be used to control the operation of the circulation pump 132 and the plurality of fans 1332, thereby effectively improving the operating efficiency of the circulation pump 132 and the plurality of fans 1332 of the heat dissipation unit 133.

[0057] like Figures 13 to 19As shown, in this embodiment, the portable computer 2 is installed (e.g., locked) inside the housing 11, and the portable computer 2 includes a housing 21, a power supply 241 disposed inside the housing 21, and a host module 23 installed inside the housing 21 and electrically coupled to the power supply 241.

[0058] like Figure 14 ,and Figures 17 to 19 As shown, the housing 21 has a cooling cavity 211 and a plurality of inlet / outlet ports 212 and an injection port 213 connected to the cooling cavity 211. In this embodiment, the plurality of inlet / outlet ports 212 and the injection port 213 are spaced apart from each other and connected to the bottom side of the cooling cavity 211, and the plurality of inlet / outlet ports 212 are respectively connected to a plurality of pipes 131 (e.g., the plurality of inlet / outlet ports 212 are respectively connected to the output pipe 1311 and two input pipes 1312) so that the cooling cavity 211 can be fluidly coupled to the circulating heat dissipation module 13.

[0059] It should be noted that the cooling cavity 211 in this embodiment is generally stepped, which is used to match the configuration of the power module 24 and the host module 23 and to make proper use of space. More specifically, the cooling cavity 211 includes a first cavity 2111, a second cavity 2112 connected to and communicating with the bottom side of the first cavity 2111, and a third cavity 2115 communicating with the first cavity 2111 and the second cavity 2112. The top of the cooling cavity 211 (e.g., the top of the first cavity 2111 and the third cavity 2115) is transparent and exposed to the outside through one of the holes in the outer shell 11, so as to facilitate viewing the host module 23 inside the cooling cavity 211, but the present invention is not limited thereto.

[0060] In this embodiment, the plurality of inlet / outlet ports 212 and the injection port 213 are connected to the bottom side of the first cavity 2111, and the cooling cavity 211 may be further configured with a supplementary port 2114 on the side wall of the first cavity 2111, which is preferably adjacent to the plurality of inlet / outlet ports 212 and the injection port 213, but the present invention is not limited thereto.

[0061] Furthermore, the third cavity 2115 is located on one side of the first cavity 2111 and the second cavity 2112, and the first cavity 2111, the second cavity 2112, and the third cavity 2115 together form a first notch 2116 and a second notch 2117, which are located on opposite sides of the second cavity 2112, respectively. The injection port 213 is installed in the third cavity 2115 and located at the first notch 2116.

[0062] It should be further noted that, in this embodiment, the cooling cavity 211 can be sealed by a corresponding sealing mechanism (not shown in the figure); that is, the internal space of the cooling cavity 211 can only be connected to the outside through the multiple inlet and outlet ports 212, the injection port 213, and the supplement port 2114.

[0063] The power module 24 includes a power supply 241 disposed within the cooling cavity 211 and a socket 242 electrically coupled to the power supply 241. The power supply 241 is housed within the second cavity 2112, the socket 242 is installed in the third cavity 2115 with its socket located at the second notch 2117, and the power supply 241 can obtain power by being directly or indirectly electrically coupled to utility power through the socket 242.

[0064] The host module 23 includes a processing unit 231, and a switching unit 232 and a signal port 234 electrically coupled to the processing unit 231. The processing unit 231 is installed within the cooling cavity 211 and electrically coupled to the power supply 241. The switching unit 232 and the signal port 234 are installed within the cooling cavity 211 and exposed outside the housing 11, and the switching unit 232 and the signal port 234 are electrically coupled to the processing unit 231.

[0065] More specifically, the processing unit 231 is housed within the first cavity 2111, and the processing unit 231 includes a motherboard 2311, a central processing unit 2312, and a display adapter 2313 mounted on the motherboard 2311. The motherboard 2311 is electrically coupled to the switching unit 232, the power supply 241, and the signal port 234, with the power supply 241 located directly below the motherboard 2311, and the central processing unit 2312 and the display adapter 2313 located above the motherboard 2311.

[0066] The switching unit 232 and the signal port 234 are installed in the third cavity 2115 and away from the heat dissipation unit 133, and the switching unit 232 and the signal port 234 are exposed to the outside through one of the holes in the housing 11. In this embodiment, the switching unit 232 is described as including two switch buttons exposed outside the cooling cavity 211, and multiple transmission lines electrically coupled to the two switch buttons and the motherboard 2311, so that the switching unit 232 can be used to control the opening and closing of the processing unit 231, but the present invention is not limited thereto.

[0067] Furthermore, the signal port 234 is used to allow at least one external electronic component (not shown) to be connected and electrically coupled to the processing unit 231. In this embodiment, the signal port 234 is described as including multiple electrical connectors exposed outside the cooling cavity 211, and multiple transmission lines electrically coupled to the multiple electrical connectors and the motherboard 2311. The types of the multiple electrical connectors can be adjusted and varied according to actual needs, and this utility model does not limit them.

[0068] Based on the above, as Figure 20 As shown, the immersion electronic device 100 can be injected into the cooling cavity 211 via the injection port 213, so that the cooling liquid L can immerse the processing unit 231 (and the power supply 241) and form a circulating liquid flow F in the cooling cavity 211 through the circulating heat dissipation module 13.

[0069] It should be noted that, as Figure 14 and Figure 20 As shown, in order to enable the processing unit 231 to have optional heat dissipation effect, the housing 21 may further include two guide pipes 215 and two covers 216 located in the cooling cavity 211, and the two covers 216 respectively cover the central processing unit 2312 and the graphics processor 2314 of the display adapter 2313.

[0070] In this embodiment, one end of each of the two flow guide pipes 215 is respectively installed on the two inlet / outlet ports 212 (connecting the two input pipes 1312), while the other ends of each of the two flow guide pipes 215 face the central processing unit 2312 and the graphics processor 2314 of the display adapter 2313, respectively. The other ends of each of the two flow guide pipes 215 are respectively installed on and connected to the two housings 216. That is, the cooling liquid L flows through the two flow guide pipes 215 to the central processing unit 2312 and the graphics processor 2314, and then flows out from the periphery of the two housings 216. However, this invention is not limited to this. For example, in other embodiments of this invention not shown, either housing 216 (and any of the flow guide pipes 215) may be omitted or replaced with other structures according to actual needs.

[0071] [Technical Effects of the Embodiments of this Utility Model] In summary, the immersion electronic device disclosed in this utility model embodiment enables the application of cooling liquid within the portable computer through the structural configuration of the portable computer and its combination with a heat dissipation device, thereby achieving the personalization of the immersion electronic device, which helps to reduce the overall cost and facilitates its widespread application.

[0072] Furthermore, the immersion electronic device disclosed in this embodiment of the present invention achieves electrical and fluid coupling between the portable computer and the heat dissipation device through a pluggable configuration, thereby meeting a wider range of usage needs and facilitating the promotion of immersion electronic devices.

[0073] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the patent scope of the present utility model. Therefore, all equivalent technical changes made based on the contents of the present utility model specification and drawings are included in the patent scope of the present utility model.

Claims

1. An immersion electronic device, characterized in that, The immersion electronic device includes: A heat dissipation device, comprising: An outer casing having a receiving cavity and a base located outside the receiving cavity; A power module includes a power supply disposed within the receiving cavity, and a power supply port mounted on the base and electrically coupled to the power supply; and A circulating heat dissipation module is disposed within the receiving cavity, and the circulating heat dissipation module includes multiple pipes; and A portable computer, detachably mounted on the base along a predetermined direction, selectively in a combined mode or a detached mode; wherein the portable computer comprises: A housing having a cooling cavity, and a plurality of inlet / outlet ports and an injection port connected to the cooling cavity; and A host module, comprising: A processing unit is installed inside the cooling cavity; A switching unit is installed in the cooling cavity and electrically coupled to the processing unit; A power port is mounted on the bottom wall of the cooling cavity and electrically coupled to the processing unit; and A signal port is installed on the side wall of the cooling cavity and electrically coupled to the processing unit for at least one external electronic component to be plugged into and electrically coupled to the processing unit. When the portable computer is mounted on the base and in the combined mode, the power port is plugged into the power supply port so that the processing unit is electrically coupled to the power supply. The multiple inlet and outlet ports are respectively connected to multiple pipelines so that the cooling cavity is fluidly coupled to the circulating heat dissipation module. The injection port is used to inject a cooling liquid into the cooling cavity so that the cooling liquid can immerse the processing unit and form a circulating liquid flow in the cooling cavity through the circulating heat dissipation module.

2. The immersion electronic device according to claim 1, characterized in that, The receiving cavity has a first section and a second section connected to the first section, and the base is connected to the bottom end of the inner edge of the first section and the bottom end of the inner edge of the second section to jointly define a plug-in space; wherein, when the portable computer is disposed on the base and is in the combined mode, the housing is located in the plug-in space.

3. The immersion electronic device according to claim 2, characterized in that, The preset direction is perpendicular to the base, and the shape of the housing is complementary to the shape of the outer shell.

4. The immersion electronic device according to claim 2, characterized in that, An operating groove is recessed on the outer surface of the cooling cavity, and a plurality of the inlet / outlet ports and the injection port are located in the operating groove; wherein, when the portable computer is mounted on the base and is in the combined mode, the operating groove is adjacent to the second section of the receiving cavity.

5. The immersion electronic device according to claim 4, characterized in that, The cooling cavity includes a first cavity and a second cavity that are interconnected, and the first cavity and the second cavity together define the operating slot. A plurality of the inlet and outlet ports are installed in the first cavity, and the injection port is installed in the second cavity. When the portable computer is set on the base and is in the combined mode, the second cavity is located at a corner formed by the inner edge of the first section and the inner edge of the second section.

6. The immersion electronic device according to claim 1, characterized in that, The processing unit includes: A motherboard, electrically coupled to the switching unit, the power port, and the signal port; and A central processing unit and a display adapter are mounted on the motherboard.

7. The immersion electronic device according to claim 6, characterized in that, The housing includes a flow guide tube located within the cooling cavity, with one end of the flow guide tube mounted on one of the inlet / outlet ports and the other end of the flow guide tube facing the central processing unit.

8. The immersion electronic device according to claim 7, characterized in that, The housing includes a cover that covers the central processing unit, and the other end of the flow tube is mounted and communicates with the cover.

9. The immersion electronic device according to claim 6, characterized in that, The plurality of pipelines include an output pipeline and at least one input pipeline respectively connected to the plurality of inlet and outlet ports, and the circulating heat dissipation module includes: A circulating pump is connected to the output pipeline; and A heat dissipation unit is connected to the circulation pump and at least one of the input pipes; When the portable computer is mounted on the stand and in the combined mode, the projection area formed by the heat dissipation unit projecting onto the motherboard covers at least 50% of the area of ​​the motherboard.

10. The immersion electronic device according to claim 1, characterized in that, The host module includes a handle mounted on the top wall of the cooling cavity for hand-holding and moving the portable computer.

11. The immersion electronic device according to claim 1, characterized in that, When the portable computer is not mounted on the base and is in the detached mode, the cooling chamber is not used to contain the cooling liquid, and the portable computer can be connected to an external power module via the power port to operate.

12. An immersion electronic device, characterized in that, The immersion electronic device includes: A heat dissipation device, comprising: A shell; and A circulating heat dissipation module is disposed within the housing, and the circulating heat dissipation module includes multiple pipes; and A portable computer is installed within the casing; wherein the portable computer comprises: A housing having a cooling cavity, and a plurality of inlet / outlet ports and an injection port connected to the cooling cavity; wherein the plurality of inlet / outlet ports are respectively connected to a plurality of pipelines so that the cooling cavity is fluidly coupled to the circulating heat dissipation module; A power module, comprising a power supply disposed within the cooling cavity; and A host module, comprising: A processing unit, installed within the cooling cavity and electrically coupled to the power supply; and A signal port is installed in the cooling cavity and exposed outside the housing, and the signal port is electrically coupled to the processing unit for allowing at least one external electronic component to be plugged in and electrically coupled to the processing unit; The injection port is used to inject a cooling liquid into the cooling cavity so that the cooling liquid can submerge the processing unit and form a circulating liquid flow within the cooling cavity through the circulating heat dissipation module.

13. The immersion electronic device according to claim 12, characterized in that, The cooling chamber includes: A first cavity is provided to house the processing unit, and a plurality of the inlet and outlet ports and the injection port are connected to the bottom side of the first cavity; A second cavity is connected to and communicates with the bottom side of the first cavity, and the second cavity houses the power supply; and A third cavity is connected to the first cavity and the second cavity, and the third cavity is located on one side of the first cavity and the second cavity; wherein the signal port and the injection port are installed in the third cavity, and the injection port is located within a notch surrounded by the first cavity, the second cavity and the third cavity.

14. The immersion electronic device according to claim 12, characterized in that, The processing unit includes: A motherboard electrically coupled to the signal port and the power supply, wherein the power supply is located directly below the motherboard; and A central processing unit and a display adapter are mounted on the motherboard.

15. The immersion electronic device according to claim 14, characterized in that, The multiple pipelines include an output pipeline and two input pipelines respectively connected to the multiple inlet and outlet ports, and the circulating heat dissipation module includes: A circulating pump is connected to the output pipeline; and A heat dissipation unit is connected to the circulating pump and the two input pipes.

16. The immersion electronic device according to claim 15, characterized in that, The housing includes: Two flow guides are located inside the cooling cavity, with one end of each flow guide installed at one of the two inlet / outlet ports, and the other ends of each flow guide facing the central processing unit and a graphics processor of the display adapter, respectively. and Two covers are respectively covering the central processing unit and the graphics processing unit, and the other ends of the two flow tubes are respectively installed and connected to the two covers.

17. The immersion electronic device according to claim 14, characterized in that, The housing includes two flow channels located within the cooling cavity, with one end of each flow channel mounted to one of the two inlet / outlet ports, and the other end of each flow channel facing the central processing unit and a graphics processor of the display adapter.

18. The immersion electronic device according to claim 17, characterized in that, The housing includes two covers that respectively cover the central processing unit and the graphics processing unit, and the other ends of the two flow tubes are respectively installed and connected to the two covers.

19. An immersion electronic device, characterized in that, The immersion electronic device includes: A heat dissipation device, comprising: An outer casing having a receiving cavity and a base located outside the receiving cavity; A power module includes a power supply disposed within the receiving cavity, and a power supply port mounted on the base and electrically coupled to the power supply; and A circulating heat dissipation module is disposed within the receiving cavity; and A portable computer, comprising: A housing having a cooling cavity and an injection port connected to the cooling cavity; and A host module, comprising: A processing unit is installed inside the cooling cavity; A power port is mounted on the bottom wall of the cooling cavity and electrically coupled to the processing unit; and A signal port is installed on the side wall of the cooling cavity and electrically coupled to the processing unit; The portable computer can be inserted into the power supply port in a preset direction to be in a combined mode, so that the processing unit is electrically coupled to the power supply, and the cooling cavity can be fluidly coupled to the circulating heat dissipation module, so that the injection port is used to inject a cooling liquid into the cooling cavity. The portable computer can be in a detached mode without being mounted on the base, so that the cooling cavity is not used to contain the cooling liquid.

20. The immersion electronic device according to claim 19, characterized in that, The preset direction is perpendicular to the base, and the shape of the housing is complementary to the shape of the outer shell.

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