A computer heat dissipation module convenient for splicing and combination

CN224889127UActive Publication Date: 2026-10-23DONGGUAN CHENGZHU TECH CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202522531268.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-28
Publication Date
2026-10-23
Estimated Expiration
2035-11-28

AI Technical Summary

Technical Problem

[0003]本实用新型的实施例提供了一种便于拼接组合使用的计算机散热模组,旨在解决现有的计算机散热模组的拼装便捷性有待提高,同时散热效果不够显著的问题

Benefits of technology

在散热装置拼装使用时,只需将风冷组件中的固定框卡接在U形槽内,同时安装条滑动连接在滑槽内部,从而能够将风冷组件和水冷组件安装在紫铜板和透明塑料板之间,接着只需通过紧固机构增强紫铜板和透明塑料板之间的紧固强度即可对散热模组进行固定,同时控制伸缩弹簧将卡块弹出卡接在卡槽内部即可对固定框进行安装固定,相较于现有技术“一种用于计算机散热的组合散热装置”中的散热模组,本实用新型通过上述结构相互配合能够显著提高散热模组的拼装组合以及拆卸便捷性,进而能够提高使用便捷性;

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224889127U_ABST
    Figure CN224889127U_ABST
Patent Text Reader

Abstract

The utility model discloses a computer heat dissipation module convenient to splice combination uses belongs to computer heat dissipation field, including splicing subassembly, air cooling subassembly and water cooling subassembly, and splicing subassembly includes red copper board, and the upper end of red copper board is installed with transparent plastic plate, and the surface of red copper board and transparent plastic plate all is established with several heat dissipation holes, and the inside of red copper board and transparent plastic plate is equipped with fastening mechanism, and two buffer shafts swing installation have between red copper board and transparent plastic plate, and the opposite face of red copper board and transparent plastic plate all is installed with the clamping mechanism, the utility model discloses the splicing subassembly cooperation air cooling subassembly and water cooling subassembly not only can through the air cooling and water cooling mode to computer and carry out double heat dissipation operation, thereby can significantly enhance the practicality of heat dissipation module, and simultaneously through above -mentioned structure mutual cooperation still can be convenient for to the quick assembling combination and disassembly use of heat dissipation module, and then can improve the use convenience of heat dissipation module.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation, specifically a computer heat dissipation module that is easy to assemble and use. Background Technology

[0002] Computer cooling modules are core heat dissipation units that efficiently remove heat from devices to maintain system stability by combining components such as heat sinks, heat pipes, and fans. They are widely used in electronic products such as laptops and PCs. The "Combined Cooling Device for Computer Heat Dissipation" disclosed in application number "CN202420664453.3" is also an increasingly mature technology. This combined cooling device for computer heat dissipation uses ventilation holes to exchange air between the inside and outside of the computer host. A filter plate filters the exchanged air. When cleaning the filter plate is required, it is pressed vertically, compressing a spring. A limiting rod rotates on a rotating column, causing the limiting rod to disengage from the top of the filter plate, and the spring then... The device extends to allow the filter plate to slide between two limiting plates, thereby detaching the filter plate from the computer host for cleaning. When the filter plate becomes clogged, it allows for quick disassembly and cleaning, improving the device's heat dissipation and practicality. However, this heat dissipation device has the following drawbacks: while it does achieve heat dissipation through its ventilation holes and filter plate, the effect is not significant enough. Therefore, a heat dissipation module that significantly improves heat dissipation and enhances practicality is necessary. Furthermore, the device is inconvenient to assemble, making assembly and disassembly easier. Utility Model Content

[0003] The present invention provides a computer heat dissipation module that is easy to assemble and use, aiming to solve the problems that the assembly convenience of existing computer heat dissipation modules needs to be improved and the heat dissipation effect is not significant enough.

[0004] To achieve the above objectives, this utility model provides a computer heat dissipation module that is easy to assemble and use, including a splicing component, an air-cooling component, and a water-cooling component; The splicing assembly includes a copper plate, a transparent plastic plate is installed on the upper end of the copper plate, several heat dissipation holes are opened on the surface of both the copper plate and the transparent plastic plate, a fastening mechanism is provided inside the copper plate and the transparent plastic plate, two buffer shafts are movably installed between the copper plate and the transparent plastic plate, and a locking mechanism is installed on the opposite sides of the copper plate and the transparent plastic plate. An air-cooled assembly includes a fixed frame installed inside a copper plate and a transparent plastic plate. A micro motor is installed inside the fixed frame, and the output end of the micro motor is key-connected to a cooling fan. A dustproof mesh is installed inside the fixed frame. A water-cooling assembly includes several mounting strips installed on opposite sides of a copper plate and a transparent plastic plate. Each mounting strip has several heat dissipation fins installed at equal intervals inside. Each heat dissipation fin has a condenser tube installed inside. Each condenser tube has a heat dissipation base fixedly connected to its end.

[0005] As a preferred embodiment of this utility model, the fastening mechanism includes several through holes formed on the surfaces of a copper plate and a transparent plastic plate. A connecting rod is inserted into each of the several through holes. Fastening bolts are fixedly connected to both the upper and lower ends of the connecting rods. Fastening nuts are threaded onto the side surfaces of the fastening bolts.

[0006] As a preferred embodiment of this utility model, the locking mechanism includes several embedded grooves on the back sides of the copper plate and the transparent plastic plate, and each of the embedded grooves is equipped with a telescopic spring, the end of which is fixedly connected to a locking block.

[0007] As a preferred embodiment of this utility model, two sliding grooves are provided on the opposite surfaces of the copper plate and the transparent plastic plate, the mounting strip is slidably connected inside the sliding groove, and a U-shaped groove is provided at one end of both the copper plate and the transparent plastic plate, and the fixing frame is installed inside the U-shaped groove.

[0008] As a preferred embodiment of this utility model, two hexagonal holes are opened on the surface of both the copper plate and the transparent plastic plate, and hexagonal shafts are fixedly connected to the upper and lower ends of the two buffer shafts, with the hexagonal shafts inserted into the interior of the hexagonal holes.

[0009] As a preferred embodiment of this utility model, the upper and lower ends of the fixed frame are provided with a plurality of slots, and the card block is engaged inside the slot.

[0010] As a preferred embodiment of this utility model, the output end of the micro motor is fixedly connected to a limiting shaft, and a limiting hole is opened on the surface of the cooling fan, with the limiting shaft inserted into the limiting hole.

[0011] As a preferred embodiment of this utility model, two plug-in pieces are fixedly connected to the upper and lower ends of several heat dissipation fins, and several plug-in slots are opened on the opposite sides of several mounting strips, with the plug-in pieces inserted into the plug-in slots.

[0012] Compared with the prior art, the beneficial effects of this utility model are: When assembling and using the heat dissipation device, simply snap the fixing frame of the air-cooling component into the U-shaped groove, and simultaneously slide the mounting strip inside the groove. This allows the air-cooling component and the water-cooling component to be installed between the copper plate and the transparent plastic plate. Then, simply use the fastening mechanism to enhance the fastening strength between the copper plate and the transparent plastic plate to fix the heat dissipation module. At the same time, control the telescopic spring to pop out the clip and snap it into the slot to install and fix the fixing frame. Compared with the heat dissipation module in the existing technology "A combined heat dissipation device for computer heat dissipation", this utility model can significantly improve the assembly and disassembly convenience of the heat dissipation module through the above-mentioned structure, thereby improving the ease of use. When the heat dissipation module is used to cool a computer, the heat sink base first comes into contact with the CPU heat source. Then, the heat exchange between the heat sink base and the CPU through the heat sink fins and the condensate in the condenser tube is carried out, thus initially achieving a heat dissipation effect. At the same time, the micro motor drives the cooling fan to rotate, which further dissipates the heat emitted from the CPU surface, thus further achieving a heat dissipation effect. Compared with the heat dissipation module in the existing technology "A combined heat dissipation device for computer heat dissipation", this utility model can significantly improve the heat dissipation performance of the heat dissipation module through the above-mentioned structure, thereby enhancing the practicality of the heat dissipation module. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is an anatomical diagram of the splicing component structure of this utility model; Figure 3 This is a disassembled diagram of the air-cooled component structure of this utility model; Figure 4 This is a disassembled diagram of the water-cooled component structure of this utility model.

[0014] In the diagram: 100, splicing component; 101, copper plate; 102, transparent plastic plate; 103, heat dissipation hole; 104, fastening mechanism; 105, buffer shaft; 106, locking mechanism; 1041, through hole; 1042, connecting rod; 1043, fastening bolt; 1044, fastening nut; 1061, embedding groove; 1062, telescopic spring; 1063, locking block; 111, sliding groove; 112, U-shaped. 121. Slot; 122. Hexagonal hole; 200. Air-cooled assembly; 201. Fixing frame; 202. Micro motor; 203. Cooling fan; 204. Dust filter; 211. Slot; 221. Limiting shaft; 222. Limiting hole; 300. Water-cooled assembly; 301. Heat dissipation fins; 302. Condenser pipe; 303. Heat dissipation base; 304. Mounting strip; 311. Connecting piece; 312. Connecting slot. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0016] Please see Figures 1-4 This utility model provides a computer heat dissipation module that is easy to splice and combine, including a splicing component 100, an air cooling component 200 and a water cooling component 300. The splicing component 100 includes a copper plate 101, a transparent plastic plate 102 installed on the upper end of the copper plate 101, several heat dissipation holes 103 are opened on the surface of both the copper plate 101 and the transparent plastic plate 102, a fastening mechanism 104 is provided inside the copper plate 101 and the transparent plastic plate 102, two buffer shafts 105 are movably installed between the copper plate 101 and the transparent plastic plate 102, and a locking mechanism 106 is installed on the opposite sides of the copper plate 101 and the transparent plastic plate 102. The air-cooling assembly 200 includes a fixing frame 201 installed inside a copper plate 101 and a transparent plastic plate 102. A micro motor 202 is installed inside the fixing frame 201. The output end of the micro motor 202 is key-connected to a cooling fan 203. A dustproof mesh 204 is installed inside the fixing frame 201. The water-cooling assembly 300 includes several mounting strips 304 installed on the opposite sides of the copper plate 101 and the transparent plastic plate 102. Several heat dissipation fins 301 are installed equidistantly inside the mounting strips 304. Condensation tubes 302 are installed inside the heat dissipation fins 301. A heat dissipation base 303 is fixedly connected to the end of each of the condensation tubes 302.

[0017] In one specific embodiment, the splicing component 100, in conjunction with the air-cooling component 200 and the water-cooling component 300, not only enables dual heat dissipation of the computer through both air and water cooling, significantly enhancing the practicality of the heat dissipation module, but also facilitates quick assembly, disassembly, and use of the heat dissipation module, thereby improving its ease of use. In use, the fixing frame 201 of the air-cooling component 200 is first snapped into the U-shaped groove 112, while the mounting strip 304 is slidably connected inside the sliding groove 111, allowing the air-cooling component 200 and the water-cooling component 300 to be installed between the copper plate 101 and the transparent plastic plate 102. Subsequently, the fastening mechanism 104 reinforces the copper plate 101 and the transparent plastic plate 102. The fastening strength between the plastic plates 102 is sufficient to fix the heat dissipation module. At the same time, the telescopic spring 1062 controls the card block 1063 to pop out and engage inside the card slot 211, thereby fixing the fixing frame 201 and improving the ease of disassembly and use of the heat dissipation module. When cooling the computer, the heat sink 303 first contacts the CPU heat source. Heat exchange occurs between the condensate in the heat sink fins 301 and the condenser tube 302 and the heat sink 303, thus achieving an initial heat dissipation effect. Then, the micro motor 202 is started to rotate the cooling fan 203, which further dissipates the heat emitted from the CPU surface, further improving the heat dissipation effect and enhancing the practicality of the heat dissipation module.

[0018] Please see Figure 2 The fastening mechanism 104 includes several through holes 1041 formed on the surfaces of the copper plate 101 and the transparent plastic plate 102. Each of the several through holes 1041 is connected to a connecting rod 1042. Both the upper and lower ends of the connecting rod 1042 are fixedly connected to fastening bolts 1043. The side surface of the fastening bolts 1043 is threaded with fastening nuts 1044.

[0019] In one specific embodiment, by inserting the connecting rod 1042 into the through hole 1041 and simultaneously threading the fastening nut 1044 onto the side surface of the fastening bolt 1043, the clamping and fastening strength of the copper plate 101 and the transparent plastic plate 102 on the air-cooled component 200 and the water-cooled component 300 can be enhanced, thereby improving the installation stability of the heat dissipation module.

[0020] Please see Figure 2 The locking mechanism 106 includes several recessed slots 1061 on the back sides of the copper plate 101 and the transparent plastic plate 102. Each recessed slot 1061 is equipped with a telescopic spring 1062, and the end of the telescopic spring 1062 is fixedly connected to a locking block 1063.

[0021] In one specific embodiment, the recessed groove 1061 can improve the installation stability of the telescopic spring 1062 and the locking block 1063.

[0022] Please see Figure 2 and Figure 4 Two grooves 111 are provided on the opposite sides of the copper plate 101 and the transparent plastic plate 102. The mounting strip 304 is slidably connected inside the groove 111. A U-shaped groove 112 is provided at one end of the copper plate 101 and the transparent plastic plate 102. The fixing frame 201 is installed inside the U-shaped groove 112.

[0023] In one specific embodiment, the mounting strip 304 is slidably connected inside the groove 111 to improve the installation stability and ease of disassembly and replacement between the mounting strip 304 and the heat dissipation fins 301 and the copper plate 101 and the transparent plastic plate 102.

[0024] Please see Figure 2 Two hexagonal holes 121 are opened on the surfaces of the copper plate 101 and the transparent plastic plate 102. Hexagonal shafts 122 are fixedly connected to the upper and lower ends of the two buffer shafts 105, and the hexagonal shafts 122 are inserted into the interior of the hexagonal holes 121.

[0025] In one specific embodiment, the hexagonal shaft 122 is inserted into the hexagonal hole 121, thereby improving the installation stability and ease of disassembly and replacement of the buffer shaft 105.

[0026] Please see Figure 3 The upper and lower ends of the fixed frame 201 are provided with several slots 211, and the card block 1063 is engaged inside the slot 211.

[0027] In one specific embodiment, the card block 1063 is snapped into the card slot 211 to facilitate quick disassembly and replacement of the fixing frame 201, the copper plate 101, and the transparent plastic plate 102.

[0028] Please see Figure 3 The output end of the micro motor 202 is fixedly connected to the limiting shaft 221, and the surface of the cooling fan 203 is provided with a limiting hole 222, and the limiting shaft 221 is inserted into the inside of the limiting hole 222.

[0029] In one specific embodiment, the limiting shaft 221 is inserted into the limiting hole 222. By starting the micro motor 202 to rotate the limiting shaft 221, the cooling fan 203 can be rotated to achieve the effect of ventilation and heat dissipation.

[0030] Please see Figure 4Each of the several heat dissipation fins 301 has two plug-in pieces 311 fixedly connected to its upper and lower ends. Each of the several mounting strips 304 has several plug-in slots 312 on its opposite sides, and the plug-in pieces 311 are inserted into the plug-in slots 312.

[0031] In one specific embodiment, the plug-in piece 311 is inserted into the plug-in slot 312, thereby improving the ease of disassembly and replacement and the installation stability between the heat dissipation fins 301 and the mounting strip 304.

[0032] Working principle: In use, firstly, the fixing frame 201 of the air-cooled component 200 is snapped into the U-shaped groove 112. Then, the mounting strip 304 is slidably connected inside the slide groove 111 to install the air-cooled component 200 and the water-cooled component 300 between the copper plate 101 and the transparent plastic plate 102. At the same time, the fastening mechanism 104 enhances the fastening strength between the copper plate 101 and the transparent plastic plate 102, thus fixing the heat dissipation module. Simultaneously, the telescopic spring 1062 controls the pop-out of the clip 1063 and snaps it into the slot 211 for easy fixing. The frame 201 is used for installation and fixation, which improves the ease of disassembly and use of the heat dissipation module. When cooling the computer, the heat sink 303 first comes into contact with the CPU heat source. Heat exchange occurs between the condensate in the heat sink fins 301 and the condenser pipe 302 and the heat sink 303, which initially achieves a heat dissipation effect. At the same time, the micro motor 202 is started to rotate the cooling fan 203, which further dissipates the heat emitted from the CPU surface, thus enhancing the practicality of the heat dissipation module.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A computer heat dissipation module that is easy to assemble and use, characterized in that, include: The splicing assembly (100) includes a copper plate (101), a transparent plastic plate (102) is installed on the upper end of the copper plate (101), and a number of heat dissipation holes (103) are opened on the surface of both the copper plate (101) and the transparent plastic plate (102). Fastening mechanisms (104) are provided inside the copper plate (101) and the transparent plastic plate (102). Two buffer shafts (105) are movably installed between the copper plate (101) and the transparent plastic plate (102). Locking mechanisms (106) are installed on the opposite sides of the copper plate (101) and the transparent plastic plate (102). Air-cooled assembly (200), the air-cooled assembly (200) includes a fixed frame (201) installed inside a copper plate (101) and a transparent plastic plate (102), a micro motor (202) is installed inside the fixed frame (201), a cooling fan (203) is key-connected to the output end of the micro motor (202), and a dustproof mesh (204) is installed inside the fixed frame (201); A water-cooling assembly (300) includes several mounting strips (304) installed on the opposite sides of a copper plate (101) and a transparent plastic plate (102). Several heat dissipation fins (301) are installed at equal intervals inside the several mounting strips (304). A condenser tube (302) is installed inside the several heat dissipation fins (301). A heat dissipation base (303) is fixedly connected to the end of each of the several condenser tubes (302).

2. The computer heat dissipation module according to claim 1, characterized in that: The fastening mechanism (104) includes several through holes (1041) on the surfaces of the copper plate (101) and the transparent plastic plate (102). A connecting rod (1042) is inserted into each of the several through holes (1041). Fastening bolts (1043) are fixedly connected to both the upper and lower ends of the connecting rods (1042). Fastening nuts (1044) are threaded onto the side surfaces of the fastening bolts (1043).

3. The computer heat dissipation module according to claim 1, characterized in that: The locking mechanism (106) includes several recessed slots (1061) on the opposite sides of the copper plate (101) and the transparent plastic plate (102). Each of the recessed slots (1061) is equipped with a telescopic spring (1062), and the end of the telescopic spring (1062) is fixedly connected to a locking block (1063).

4. The computer heat dissipation module according to claim 1, characterized in that: The copper plate (101) and the transparent plastic plate (102) each have two grooves (111) on their opposite sides. The mounting strip (304) is slidably connected inside the groove (111). One end of the copper plate (101) and the transparent plastic plate (102) each has a U-shaped groove (112). The fixing frame (201) is installed inside the U-shaped groove (112).

5. The computer heat dissipation module according to claim 1, characterized in that: The surfaces of the copper plate (101) and the transparent plastic plate (102) are each provided with two hexagonal holes (121). The upper and lower ends of the two buffer shafts (105) are fixedly connected with hexagonal shafts (122), and the hexagonal shafts (122) are inserted into the interior of the hexagonal holes (121).

6. The computer heat dissipation module according to claim 3, characterized in that: The fixed frame (201) has several slots (211) at both the upper and lower ends, and the card block (1063) is engaged inside the slot (211).

7. The computer heat dissipation module according to claim 1, characterized in that: The output end of the micro motor (202) is fixedly connected to a limiting shaft (221), and a limiting hole (222) is opened on the surface of the cooling fan (203). The limiting shaft (221) is inserted into the inside of the limiting hole (222).

8. The computer heat dissipation module according to claim 1, characterized in that: Two plug-in pieces (311) are fixedly connected to the upper and lower ends of several heat dissipation fins (301), and several plug-in slots (312) are opened on the opposite sides of several mounting strips (304), and the plug-in pieces (311) are inserted into the inside of the plug-in slots (312).

Citation Information

Patent Citations

  • Combined heat dissipation device for computer heat dissipation

    CN222561978U