A PPTC chip component structure

Abstract

The utility model belongs to the technical field of fuse production and manufacture, concretely relates to a PPTC patch component structure, including patch component, the periphery edge of patch component is provided with the glue climbing area, the glue climbing area is provided with the barrier glue, the both ends of patch component in length direction are provided with the soldering pad respectively, the glue climbing area sets up in the outer edge of soldering pad, the utility model optimizes patch component structure, solves the problem that the glue material pollutes the soldering pad or the through -hole, avoids the risk that the welding strength is low or the false welding is produced.

Description

Technical Field

[0001] This utility model belongs to the technical field of fuse manufacturing, specifically relating to a PPTC chip element structure. Background Technology

[0002] PPTC surface mount components have become indispensable circuit protection products in modern electronic devices due to their self-resetting characteristics, small size, and reliable overcurrent protection capabilities. The core functional material of PPTC products is a polymer conductive composite material, mainly composed of crystalline polymers, conductive fillers, and other additives. Because PPTC surface mount components are manufactured using a lamination, lamination, and dicing process, the polymer conductive composite material of the PPTC core layer is exposed to the external environment and its performance may be affected by external factors.

[0003] To prevent the core layer from being directly exposed to the environment, a side sealing process can be used, in which an air barrier adhesive is applied around the component to prevent moisture or organic solvents from penetrating the core layer, thereby improving product reliability.

[0004] In the process of realizing this utility model, the inventors discovered that the prior art has at least the following problems:

[0005] In existing structures, adhesive residue can adhere to the pads, solder mask, and via edges during encapsulation. If the adhesive residue directly adheres to the pads or enters the vias, it can contaminate the pads or vias, leading to low solder strength or the risk of poor soldering. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies by providing a PPTC surface mount component structure, optimizing the surface mount component structure, and solving the problem of adhesive contamination of solder pads or vias.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A PPTC surface mount component structure includes a surface mount component, wherein a glue crawling area is provided around the periphery of the surface mount component, and a barrier adhesive is provided in the glue crawling area; the surface mount component has pads at both ends in the length direction, and the glue crawling area is located at the outer edge of the pads.

[0009] In some possible implementations, the patch element includes a first adhesive layer, a first electrode layer, a PTC core layer, a second electrode layer, and a second adhesive layer arranged sequentially along the thickness direction. The pads include a first pad and a second pad arranged at intervals. The first pad is connected to the first electrode layer through a first via, and the second pad is connected to the second electrode layer through a second via. Both the first via and the second via penetrate the patch element along the thickness direction.

[0010] In some possible implementations, the first through hole and the second through hole are arc-shaped holes, and the first through hole and the second through hole are respectively disposed at both ends of the patch element in the length direction.

[0011] In some possible implementations, the edges of the first pad and / or the second pad are provided with notches that mate with the arc-shaped hole, the arc length of the notches being less than the arc length of the arc-shaped hole.

[0012] In some possible implementations, the first via and the second via are circular holes, and the first via and the second via are respectively disposed on the first pad and the second pad.

[0013] In some possible implementations, the distance between the pad and the edge of the surface mount component is greater than the width of the adhesive creepage area.

[0014] In some possible implementations, solder resist ink is disposed between the first pad and the second pad, the width of the solder resist ink being equal to the width of the first pad.

[0015] In some possible implementations, the first pad includes a first top pad and a first bottom pad, the first top pad being disposed on the top surface of the first adhesive layer, the first bottom pad being disposed on the bottom surface of the second adhesive layer, and the first top pad, the first electrode layer, and the first bottom pad being connected through the first via.

[0016] In some possible implementations, the second pad includes a second top pad and a second bottom pad, the second top pad being disposed on the top surface of the first adhesive layer, the second bottom pad being disposed on the bottom surface of the second adhesive layer, and the second top pad, the second electrode layer, and the second bottom pad being connected through the second via.

[0017] In some possible implementations, the first pad and the second pad are symmetrically arranged on the surface mount element.

[0018] One of the above technical solutions has the following beneficial effects:

[0019] This invention optimizes the structure of surface mount components. By reserving a glue crawling area around the perimeter of the surface mount component, it provides a crawling distance for the sealing process. At the same time, it prevents the barrier glue from contaminating the pads or vias, thus avoiding low solder strength or poor soldering of the surface mount component. Attached Figure Description

[0020] The features, advantages and technical effects of exemplary embodiments of the present invention will now be described with reference to the accompanying drawings.

[0021] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of this utility model.

[0022] Figure 2 This is a schematic diagram of the adhesive-covered area distribution in Embodiment 1 of this utility model.

[0023] Figure 3 This is a schematic diagram of the surface mount element structure in Embodiment 1 of this utility model.

[0024] Figure 4 This is a schematic diagram of the structure of Embodiment 2 of this utility model.

[0025] Figure 5 This is a schematic diagram of the adhesive-covered area distribution in Embodiment 2 of this utility model.

[0026] Figure 6 This is a schematic diagram of the patch element structure in Embodiment 2 of this utility model.

[0027] The reference numerals in the attached figures are explained as follows:

[0028] 1- Adhesive-covered area;

[0029] 2-Barrier adhesive;

[0030] 3-First adhesive layer;

[0031] 4-First electrode layer;

[0032] 5-PTC core layer;

[0033] 6-Second electrode layer;

[0034] 7-Second adhesive layer;

[0035] 8-First pad; 81-First top pad; 82-First bottom pad;

[0036] 9 - Second pad; 91 - Second top pad; 92 - Second bottom pad;

[0037] 10 - First through hole;

[0038] 20 - Second via;

[0039] 30 - Solder resist ink;

[0040] X - Length direction;

[0041] Z - Thickness direction. Detailed Implementation

[0042] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" as used throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error.

[0043] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be interpreted as indicating or implying relative importance.

[0044] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0045] The present invention will be further described in detail below with reference to the accompanying drawings, but this is not intended to limit the present invention.

[0046] Example 1

[0047] Because in the existing structure, adhesive will stick to the pads, solder mask, and the edges of vias during the encapsulation process. If the adhesive sticks directly to the pads or enters the vias, it will lead to low solder strength or the risk of poor soldering.

[0048] like Figures 1-3 As shown, the PPTC surface mount component structure of this invention includes a surface mount component, with adhesive creepage areas 1 around its perimeter and barrier adhesive 2 in the adhesive creepage areas 1. The surface mount component has pads at both ends along its length X, with the adhesive creepage areas 1 located at the outer edges of the pads. This invention optimizes the surface mount component structure by reserving adhesive creepage areas 1 around the perimeter of the surface mount component, providing sufficient creepage distance for the encapsulation process. Simultaneously, it prevents the barrier adhesive 2 from contaminating the pads or vias, avoiding low solder strength or cold solder joints in the surface mount component.

[0049] It should be noted that by reserving the adhesive crawling area 1, the number of defective products during production is reduced. The size of the solder pads is smaller than that of the existing structure, while the overall size of the surface mount components remains unchanged. It is compatible with existing encapsulation fixtures. The barrier adhesive 2 can prevent the PPTC composite material from being exposed to air and corroded by solvents and moisture. In the existing structure, there is no adhesive crawling area 1 reserved around the perimeter. The adhesive will directly adhere to the solder pads, and the thickness of the adhesive-adhesive portion around the perimeter of the existing structure will be greater than the thickness of the unadhesive-adhesive solder pads. When components are mounted, the unadhesive-adhesive solder pads may be suspended on the circuit board and cannot make direct contact with the bottom, resulting in low solder strength or even the risk of lifting and cold solder joints.

[0050] The encapsulation process for surface mount components includes:

[0051] 1. Sealing both long surfaces: Insertion - Push down - Leveling - First sealing - Replace board - Second sealing - Unloading;

[0052] 2. Sealing on both short sides: Insertion - Leveling - Third sealing and board replacement - Fourth sealing - Unloading;

[0053] By reducing the area between the solder pads and the solder mask to allow for margins, the necessary adhesive creep distance can be provided for the four encapsulation processes, preventing adhesive contamination of the solder pads or vias and avoiding low solder strength or cold solder joints in the product. The surface mount component has four sides; the longer side is the side with the larger area, and the shorter side is the side with the smaller area.

[0054] In the PPTC surface mount element structure according to this utility model, the surface mount element includes a first adhesive layer 3, a first electrode layer 4, a PTC core layer 5, a second electrode layer 6, and a second adhesive layer 7 arranged sequentially along the thickness direction Z. The pads include a first pad 8 and a second pad 9 arranged at intervals. The first pad 8 is connected to the first electrode layer 4 through a first via 10, and the second pad 9 is connected to the second electrode layer 6 through a second via 20. Both the first via 10 and the second via 20 penetrate the surface mount element along the thickness direction Z. Specifically, the first via 10 and the second via 20 are formed using processes such as drilling followed by copper plating, achieving a double-sided electrode design, allowing soldering on both sides and improving surface mount efficiency.

[0055] In the PPTC patch element structure according to this utility model, the first through hole 10 and the second through hole 20 are arc-shaped holes, and the first through hole 10 and the second through hole 20 are respectively disposed on both ends of the patch element in the length direction X. Specifically, the edges of the first through hole 10 and the second through hole 20 are also reserved with adhesive crawling areas 1, and the adhesive crawling areas 1 of the through holes and the adhesive crawling areas 1 of the short face of the patch element have the same impregnation depth.

[0056] In the PPTC surface mount component structure according to this utility model, the edges of the first pad 8 and / or the second pad 9 are provided with notches that mate with arc-shaped holes, and the arc length of the notch is less than the arc length of the arc-shaped hole. Specifically, the notch is also arc-shaped, the center of the notch is the same as the center of the arc-shaped hole, and the arc length of the notch is slightly less than the arc length of the arc-shaped hole. That is, the edge of the notch becomes part of the top of the arc-shaped hole through the arc-shaped notch mates with the via.

[0057] In the PPTC surface mount component structure according to this utility model, the distance between the pad and the edge of the surface mount component is greater than the width of the adhesive crawling area 1, so as to prevent the adhesive of the barrier adhesive 2 from contaminating the pad or the via, and avoid the surface mount component from having low soldering strength or poor soldering.

[0058] In the PPTC surface mount component structure according to this utility model, solder resist ink 30 is provided between the first pad 8 and the second pad 9, and the width of the solder resist ink 30 is equal to the width of the first pad 8. Specifically, by reducing the area of ​​the pads and the solder resist ink 30, a glue crawling area 1 can be formed around the perimeter of the surface mount component.

[0059] In the PPTC surface mount component structure according to the present invention, the first pad 8 includes a first top pad 81 and a first bottom pad 82. The first top pad 81 is disposed on the top surface of the first adhesive layer 3, and the first bottom pad 82 is disposed on the bottom surface of the second adhesive layer 7. The first top pad 81, the first electrode layer 4 and the first bottom pad 82 are connected through the first through hole 10 to realize the double-sided electrode function, which can be soldered on both sides, thus helping to improve the surface mount efficiency.

[0060] In the PPTC surface mount component structure according to this utility model, the second pad 9 includes a second top pad 91 and a second bottom pad 92. The second top pad 91 is disposed on the top surface of the first adhesive layer 3, and the second bottom pad 92 is disposed on the bottom surface of the second adhesive layer 7. The second top pad 91, the second electrode layer 6, and the second bottom pad 92 are connected through the second through hole 20 to realize the double-sided electrode function, which can be soldered on both sides, thus helping to improve the surface mount efficiency.

[0061] The working principle of this utility model is as follows:

[0062] This invention optimizes the structure of surface mount components. By reserving a glue-climbing area 1 around the perimeter of the surface mount component, it provides a glue-climbing distance for the sealing process. At the same time, it prevents the glue of the barrier glue 2 from contaminating the pads or vias, prevents the pads from being suspended on the circuit board, and avoids the surface mount component from having low solder strength or poor soldering.

[0063] Example 2

[0064] Unlike Example 1, as follows: Figures 4-6As shown, in this embodiment, the first via 10 and the second via 20 are circular holes, respectively disposed on the first pad 8 and the second pad 9. In this embodiment, the first via 10 and the second via 20 are designed as centrally located circles, while the areas of the first pad 8 and the second pad 9 remain unchanged. This structural design completely avoids adhesive contamination of the vias during the four encapsulation processes.

[0065] The structure of the pre-reserved adhesive crawling area around the perimeter is the same as in Example 1, and will not be described again here.

[0066] Based on the disclosure and teachings of the above specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, this utility model is not limited to the specific embodiments described above, and any obvious improvements, substitutions, or modifications made by those skilled in the art based on this utility model are within the protection scope of this utility model. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on this utility model.

Claims

1. A PPTC surface mount component structure, characterized in that, Includes a patch element, wherein the patch element has a glue-crawling area (1) on its four sides, and the glue-crawling area (1) is provided with a barrier adhesive (2); The surface mount element has pads at both ends along its length, and the adhesive creepage area (1) is located at the outer edge of the pads.

2. The PPTC surface mount component structure as described in claim 1, characterized in that: The patch element includes a first adhesive layer (3), a first electrode layer (4), a PTC core layer (5), a second electrode layer (6), and a second adhesive layer (7) arranged sequentially along the thickness direction. The pads include a first pad (8) and a second pad (9) arranged at intervals. The first pad (8) is connected to the first electrode layer (4) through a first through hole (10), and the second pad (9) is connected to the second electrode layer (6) through a second through hole (20). Both the first through hole (10) and the second through hole (20) penetrate the patch element along the thickness direction.

3. The PPTC surface mount component structure as described in claim 2, characterized in that: The first through hole (10) and the second through hole (20) are arc-shaped holes, and the first through hole (10) and the second through hole (20) are respectively disposed on both ends of the patch element in the length direction.

4. The PPTC surface mount component structure as described in claim 3, characterized in that: The edges of the first pad (8) and / or the second pad (9) are provided with notches that mate with the arc-shaped hole, and the arc length of the notches is less than the arc length of the arc-shaped hole.

5. The PPTC surface mount component structure as described in claim 2, characterized in that: The first through hole (10) and the second through hole (20) are circular holes, and the first through hole (10) and the second through hole (20) are respectively disposed on the first pad (8) and the second pad (9).

6. The PPTC surface mount component structure as described in claim 1, characterized in that: The distance between the pad and the edge of the surface mount component is greater than the width of the adhesive crawling area (1).

7. The PPTC surface mount component structure as described in claim 2, characterized in that: A solder resist ink (30) is provided between the first pad (8) and the second pad (9), and the width of the solder resist ink (30) is equal to the width of the first pad (8).

8. The PPTC surface mount component structure as described in claim 2, characterized in that: The first pad (8) includes a first top pad (81) and a first bottom pad (82). The first top pad (81) is disposed on the top surface of the first adhesive layer (3), and the first bottom pad (82) is disposed on the bottom surface of the second adhesive layer (7). The first top pad (81), the first electrode layer (4) and the first bottom pad (82) are connected through the first through hole (10).

9. The PPTC surface mount component structure as described in claim 8, characterized in that: The second pad (9) includes a second top pad (91) and a second bottom pad (92). The second top pad (91) is disposed on the top surface of the first adhesive layer (3), and the second bottom pad (92) is disposed on the bottom surface of the second adhesive layer (7). The second top pad (91), the second electrode layer (6) and the second bottom pad (92) are connected through the second through hole (20).

10. The PPTC surface mount component structure as described in claim 2, characterized in that: The first pad (8) and the second pad (9) are symmetrically arranged on the surface mount component.

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