A multi-frequency combiner of a repeater

Abstract

The application provides a multi-frequency combiner of a repeater, comprising a shell, a combiner set, a radio frequency output end and a power supply component. The combiner set is composed of multiple combiner pieces which are arranged in a laminated manner along the length direction of the shell, each combiner piece corresponds to a different working frequency band, receives a corresponding frequency band signal through a respective signal input end, and converges to the same radio frequency output end through a signal output end after in-pieces processing, so as to realize the combing output of multi-band signals in a single combiner platform.

Description

Technical Field

[0001] This application relates to the field of repeaters, and more particularly to a multi-frequency combiner for repeaters. Background Technology

[0002] As mobile communication networks evolve towards multiple standards and frequency bands, repeaters are widely used in indoor distribution systems, tunnels, high-rise buildings, and densely populated urban areas to amplify downlink signals from base stations and provide coverage through public antenna feeder systems.

[0003] In existing technologies, when a repeater needs to support multiple frequency bands and multiple standards simultaneously, the common practice is to configure a single-frequency combiner for each frequency band, and achieve multi-frequency combining by cascading or paralleling multiple single-frequency combiners: the outputs of each frequency band's power amplifier module are converged to a common antenna feed port through their respective single-frequency combiners. Although this discrete solution can achieve basic multi-frequency combining functionality, it requires the installation of multiple single-frequency combiners and corresponding coaxial cables in the cabinet, resulting in a large space occupation and complex wiring within the chassis or cabinet. At the same time, after the combining link is connected in series with multiple stages of components, the overall insertion loss increases significantly, power loss is aggravated, and new intermodulation sources can easily form between each stage of combiner and connecting cables. As the number of frequency bands increases, the risk of intermodulation interference in the system increases significantly, which is not conducive to maintaining the linearity and coverage quality of signals in each frequency band.

[0004] Therefore, there is a need to provide a repeater multi-frequency combiner that can support multiple operating frequency bands on a single combiner platform. Utility Model Content

[0005] In view of this, it is necessary to provide a multi-frequency combiner for repeaters to solve the above problems.

[0006] Embodiments of this application provide a multi-frequency combiner for a repeater, the multi-frequency combiner comprising: case; The combiner assembly includes a plurality of combiner chips stacked along the length of the housing, each combiner chip having at least one signal input terminal and one signal output terminal, and each combiner chip operating at a different frequency band. A radio frequency output terminal is provided on the housing. The signal output terminal of each combiner chip is electrically connected to the radio frequency output terminal so as to output signals of multiple different operating frequency bands of multiple combiner chips through the radio frequency output terminal. The power supply assembly is located inside the housing and is electrically connected to the combiner assembly.

[0007] In at least one embodiment of this application, the multi-frequency combiner further includes a frequency band processing component disposed within the housing and electrically connected to the combiner assembly.

[0008] In at least one embodiment of this application, the plurality of combiner pieces are arranged in parallel along the length of the housing.

[0009] In at least one embodiment of this application, any two adjacent combiner segments are spaced apart.

[0010] In at least one embodiment of this application, the housing has an upper cover and a bottom shell, the upper cover and the bottom shell forming a mounting cavity. The mounting cavity has a first mounting area and a second mounting area, which are arranged adjacent to each other. The power supply assembly is located in the first mounting area, and the combiner assembly is located in the second mounting area.

[0011] In at least one embodiment of this application, one end of the combiner plate is disposed on the shell surface of the bottom shell, and the plate surface of the combiner plate is perpendicular to the shell surface of the bottom shell.

[0012] In at least one embodiment of this application, the multi-frequency combiner further includes a heat dissipation assembly disposed on both sides of the combiner group so that airflow can flow along the intervals between the plurality of combiner plates.

[0013] In at least one embodiment of this application, the housing is provided with heat dissipation holes so that the heat dissipation component can allow external airflow to enter the mounting cavity through the heat dissipation holes.

[0014] In at least one embodiment of this application, the mounting cavity further includes a third mounting area, which is adjacent to the first mounting area and the second mounting area, and the frequency band processing component is disposed in the third mounting area.

[0015] In at least one embodiment of this application, the heat dissipation component is a fan.

[0016] The multi-frequency combiner for a repeater described above arranges multiple combiner chips stacked along the length of the housing. Each chip corresponds to a different operating frequency band. Signals from each frequency band enter from the signal input terminal of the corresponding combiner chip, undergo the required processing within the chip, and then converge directly from the signal output terminal to the same RF output terminal. Therefore, multiple frequency bands are combined within the same combiner group, eliminating the need for multiple single-frequency combiners and numerous external coaxial jumpers in the cabinet. This significantly reduces the number of devices and the space occupied, simplifying cabling. At the same time, the reduced number of combining link stages correspondingly reduces insertion loss and intermodulation sources caused by multi-stage connections, which is beneficial for maintaining the linearity and coverage quality of signals in multiple frequency bands and multiple standards scenarios. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a multi-frequency combiner for a repeater in an embodiment of this application; Figure 2 This is a schematic diagram of the shell structure of this application; Figure 3 This is a side view cross-sectional diagram of a multi-frequency combiner for a repeater.

[0018] Explanation of main component symbols 100. A multi-frequency combiner for a repeater; 10. Housing; 11. Top cover; 12. Bottom shell; 13. Mounting cavity; 131. First mounting area; 132. Second mounting area; 133. Third mounting area; 14. Heat dissipation hole; 20. Combiner assembly; 21. Combiner piece; 211. Signal input terminal; 212. Signal output terminal; 30. Radio frequency output terminal; 40. Power supply assembly; 50. Frequency band processing assembly; 60. Heat dissipation assembly; F1. Length direction of the housing. Detailed Implementation

[0019] The embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0020] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have an intervening component. When a component is considered to be "placed" on another component, it can be directly placed on the other component or may also have an intervening component. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "back," and similar expressions used in this article are for illustrative purposes only.

[0021] Embodiments of this application provide a multi-frequency combiner for a repeater, the multi-frequency combiner comprising: case; The combiner assembly includes a plurality of combiner chips stacked along the length of the housing, each combiner chip having at least one signal input terminal and one signal output terminal, and each combiner chip operating at a different frequency band. A radio frequency output terminal is provided on the housing. The signal output terminal of each combiner chip is electrically connected to the radio frequency output terminal so as to output signals of multiple different operating frequency bands of multiple combiner chips through the radio frequency output terminal. The power supply assembly is located inside the housing and is electrically connected to the combiner assembly.

[0022] The multi-frequency combiner for a repeater described above arranges multiple combiner chips stacked along the length of the housing. Each chip corresponds to a different operating frequency band. Signals from each frequency band enter from the signal input terminal of the corresponding combiner chip, undergo the required processing within the chip, and then converge directly from the signal output terminal to the same RF output terminal. Therefore, multiple frequency bands are combined within the same combiner group, eliminating the need for multiple single-frequency combiners and numerous external coaxial jumpers in the cabinet. This significantly reduces the number of devices and the space occupied, simplifying cabling. At the same time, the reduced number of combining link stages correspondingly reduces insertion loss and intermodulation sources caused by multi-stage connections, which is beneficial for maintaining the linearity and coverage quality of signals in multiple frequency bands and multiple standards scenarios.

[0023] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0024] according to Figures 1-3 This application provides a multi-frequency combiner 100 for a repeater, which includes a housing 10, a combiner group 20, an RF output terminal 30, and a power supply component 40.

[0025] The combiner assembly 20 includes a plurality of combiner pieces 21 stacked along the length of the housing 10. Each combiner piece 21 has at least one signal input terminal 211 and one signal output terminal 212. Each combiner piece 21 operates at a different frequency band.

[0026] The radio frequency output terminal 30 is disposed on the housing 10. The signal output terminal 212 of each combiner chip 21 is electrically connected to the radio frequency output terminal 30 so as to output signals of multiple different operating frequency bands of multiple combiner chips 21 through the radio frequency output terminal 30.

[0027] The power supply assembly 40 is located inside the housing 10 and is electrically connected to the combiner assembly 20.

[0028] Specifically, the internal mounting space of the housing 10 is used to fix the combiner assembly 20 and the power supply component 40, and a position for the RF output terminal 30 is reserved on the panel of the housing 10, so that the internally processed multi-channel RF signals can be output externally through a unified interface. In this way, the housing 10 ensures the rigidity and vibration resistance of the overall structure, and reduces the impact of external electromagnetic interference on the internal RF channels through the metal shielding effect, which is conducive to improving the working stability of the multi-frequency combiner in complex electromagnetic environments.

[0029] Furthermore, the combiner assembly 20 is disposed in a predetermined area within the housing 10. The combiner assembly 20 is composed of multiple combiner plates 21 stacked along the length of the housing 10. Each combiner plate 21 has a plate-like structure and is fixed to the housing 10 by screws, support columns, etc. Each combiner plate 21 is provided with at least one signal input terminal 211 and one signal output terminal 212. When radio frequency signals of different operating frequency bands in the repeater are respectively sent to the corresponding signal input terminal 211, each combiner plate 21 processes the signal of the corresponding frequency band according to its own preset operating parameters and outputs it from its signal output terminal 212. Since each combiner chip 21 operates at a different frequency band, radio frequency signals of different frequency bands are spatially allocated to different combiner chips 21 for independent processing. This forms multiple independent but collaborative frequency band processing channels within the same housing 10 platform, which avoids direct coupling between frequency bands and facilitates the expansion or adjustment of the supported frequency band combinations by adding or replacing combiner chips 21, thereby improving the adaptability of the repeater in the process of multi-standard and multi-frequency band evolution.

[0030] Furthermore, the RF output terminal 30 is disposed on the outer surface of the housing 10 and is electrically connected to the signal output terminals 212 of each combiner chip 21 through internal connectors. The signal output terminals 212 of multiple combiner chips 21 converge to the RF output terminal 30 through RF connection lines or RF wiring, so that the signals of each operating frequency band processed by their respective combiner chips 21 are combined inside the housing 10 and then sent out from the unified RF output terminal 30.

[0031] Furthermore, the power supply assembly 40 is located in a region within the housing 10 that is relatively independent from the combiner assembly 20. The power supply assembly 40 is electrically connected to the combiner assembly 20 via an electrical connection, providing the DC power required for the operation of the multiple combiner chips 21 and their associated circuits.

[0032] In one specific embodiment, the multi-frequency combiner further includes a frequency band processing component 50, which is disposed within the housing 10 and is electrically connected to the combiner assembly 20.

[0033] Specifically, the frequency band processing component 50 is used to receive radio frequency signals output from different operating frequency band radio frequency channels inside the repeater, and guide the radio frequency signals of different frequency bands to the signal input terminal 211 of the corresponding combiner chip 21 in the combiner group 20 according to the pre-planned frequency band allocation relationship.

[0034] Furthermore, the frequency band processing component 50 is electrically connected to the combiner group 20. In a specific embodiment, it can be connected one-to-one with the signal input terminal 211 of each combiner chip 21 through RF connection cables, RF connectors, or printed RF transmission lines, so that each working frequency band signal enters the corresponding working frequency band combiner chip 21 along a fixed path. This ensures that RF signals of different frequency bands are clearly separated by the frequency band by the frequency band processing component 50 before entering the combiner group 20, avoiding mixing and misconnection of different frequency band signals on the access side, reducing the risk of wiring errors, and facilitating quick location of the signal path during subsequent maintenance, thus improving operation and maintenance efficiency.

[0035] Furthermore, the frequency band processing component 50 is structurally designed to form a relatively independent mounting area with the housing 10 and is arranged adjacent to the combiner group 20. This results in a shorter connection length and a more concentrated wiring path between the frequency band processing component 50 and the combiner group 20. This not only helps to maintain low transmission loss of each frequency band RF channel, but also helps to suppress external electromagnetic interference through the metal shielding structure of the housing 10, thereby improving the overall electromagnetic compatibility performance of the multi-frequency combiner.

[0036] In one specific embodiment, the plurality of combiner pieces 21 are arranged in parallel along the length direction of the housing 10.

[0037] Specifically, each combiner piece 21 is fixed to the bottom shell 12 or internal support in a plate-like structure. The plate surfaces are parallel to each other, and their length direction is consistent with the length direction of the shell 10, thus forming a regular multi-layer plate-like array structure inside the shell 10. Through this parallel arrangement, on the one hand, multiple combiner pieces 21 are stacked in an orderly manner within the limited length direction of the shell 10, realizing a compact layout of multi-band channels within a single shell 10; on the other hand, the input and output ends of each combiner piece 21 have a uniform orientation in space, which facilitates the arrangement of RF cables or internal connectors in bundles or rows, which is beneficial for standardized wiring, reducing intersections, and improving the convenience of overall assembly and maintenance.

[0038] In one specific embodiment, any two adjacent combiner pieces 21 are spaced apart.

[0039] Specifically, a gap is reserved between any two adjacent combiner pieces 21, so that a narrow gap area is formed between adjacent combiner pieces 21.

[0040] Furthermore, the existing gap area provides the necessary electrical safety distance for the device soldering surface and wiring surface on each combiner piece 21, avoiding unnecessary electromagnetic coupling between different combiner pieces 21 due to excessive proximity.

[0041] Furthermore, when the heat dissipation component 60 is working, the cooling airflow can pass through the gap between these adjacent combiner plates 21, thereby achieving simultaneous air cooling of multiple combiner plates 21.

[0042] Furthermore, the spaced arrangement structure ensures that each combiner chip 21 has a basically symmetrical airflow path, which is beneficial for different frequency band channels to maintain a relatively balanced temperature distribution during long-term operation, and avoids overheating in a certain local area, which would affect the linearity and long-term reliability of the corresponding frequency band channel.

[0043] In one specific embodiment, the housing 10 has an upper cover 11 and a bottom shell 12, and the upper cover 11 and the bottom shell 12 enclose a mounting cavity 13.

[0044] The mounting cavity 13 has a first mounting area 131 and a second mounting area 132, which are arranged adjacent to each other. The power supply assembly 40 is located in the first mounting area 131, and the combiner assembly 20 is located in the second mounting area 132.

[0045] Specifically, the bottom shell 12 is used to support and install the power supply assembly 40, the combiner assembly 20 and related mounting components. The top cover 11 covers the bottom shell 12, forming a closed mounting cavity 13. At the same time, it utilizes the properties of metal or shielding materials to provide electromagnetic shielding and mechanical protection for the radio frequency channel and power circuit inside the mounting cavity 13, thereby improving the anti-interference capability and environmental adaptability of the multi-frequency combiner when it is installed and used in the repeater cabinet.

[0046] Furthermore, the mounting cavity 13 is internally divided into a first mounting area 131 and a second mounting area 132. These two areas are spatially adjacent and distinguished by reinforcing ribs, partitions, or pre-defined boundaries within the housing 10. The first mounting area 131 primarily houses the power supply assembly 40, concentrating it on one side of the housing 10 for easy connection between the power input port and the repeater's main power supply, while also providing sufficient safety distance and insulation space for wiring. The second mounting area 132 houses the combiner assembly 20, with multiple combiner pieces 21 stacked along the length of the housing 10 within this area, making it the main area for multi-frequency combining functionality. This functional zoning approach achieves proper isolation between the power supply unit and the RF combining unit within the limited space of the housing 10, reducing mutual interference between the high-voltage power supply section and the low-voltage RF section.

[0047] Furthermore, the output of the power supply assembly 40 is electrically connected to the combiner group 20 in the second mounting area 132 via a wire or connector passing through the area between the two mounting areas, thereby providing a stable DC operating voltage for the multiple combiner pieces 21.

[0048] In one specific embodiment, one end of the combiner plate 21 is disposed on the shell surface of the bottom shell 12, and the plate surface of the combiner plate 21 is perpendicular to the shell surface of the bottom shell 12.

[0049] Specifically, each combiner piece 21 can be connected to the shell surface of the bottom shell 12 by fasteners such as screws, pressure plates or support columns, so that one end of the combiner piece 21 is fixed in space, ensuring the reliability of the connection of the radio frequency connectors and internal circuits on each combiner piece 21.

[0050] Furthermore, the surface of the combiner plate 21 is arranged perpendicularly to the surface of the bottom shell 12, that is, the combiner plate 21 is set on the bottom shell 12 in the manner of vertical insertion plates, so that multiple combiner plates 21 are stacked in the height direction inside the shell 10, which not only saves the area occupied by the shell 10 in the planar direction, but also facilitates the formation of a regular multi-layer plate array in the length direction of the shell 10, which is beneficial to integrate more combiner plates 21 with operating frequency bands within the shell 10 of limited size.

[0051] In one specific embodiment, the multi-frequency combiner further includes a heat dissipation assembly 60, which is disposed on both sides of the combiner group 20 so that airflow can flow along the intervals between the plurality of combiner plates 21.

[0052] Specifically, the heat dissipation components 60 are respectively arranged on the left and right sides of the combiner assembly 20, so that the combiner assembly 20 presents a clamp-type air-cooled ventilation layout. When the heat dissipation components 60 are working, the airflow flows directionally from one side to the other inside the housing 10. The gaps formed by the adjacent arrangement of the multiple combiner plates 21 constitute natural airflow channels. Cold air can pass through the combiner plates 21 along these gaps, realizing synchronous heat exchange on both sides of the surface of each combiner plate 21.

[0053] Furthermore, when the heat dissipation component 60 is working on the side of the housing 10, the cooling airflow can flow between the combiner plates 21 along these gaps, and simultaneously exchange heat with the components and lines on both sides of each combiner plate 21, thereby improving the overall heat dissipation efficiency and avoiding the degradation of the channel performance of a certain frequency band due to local overheating.

[0054] In one specific embodiment, the housing 10 is provided with heat dissipation holes 14 so that the heat dissipation assembly 60 can allow external airflow to enter the mounting cavity 13 through the heat dissipation holes 14.

[0055] In one specific embodiment, the heat dissipation component 60 is a fan.

[0056] Specifically, the heat dissipation holes 14 can be located on the side wall, end face, or bottom shell 12 of the housing 10. During operation, the heat dissipation assembly 60 can draw in cool outside air into the mounting cavity 13 through these heat dissipation holes 14, and then expel hot air from the other side of the housing 10. The location of the heat dissipation holes 14 generally corresponds to the air intake direction of the fan, allowing air to enter the mounting cavity 13 directly from the outside. The gaps between the combiner plates 21 form an internal airflow path, and the area where the power supply assembly 40 is located receives additional heat dissipation due to the airflow. Through the airflow structure of the external airflow, heat dissipation holes 14, mounting cavity 13, gaps between combiner plates 21, and exhaust vents of the housing 10, the air convection efficiency inside the housing 10 can be significantly improved. This allows the entire multi-frequency combiner to maintain stable heat dissipation even under long-term operation, high ambient temperature, or high cabinet sealing conditions, reducing thermal resistance accumulation and extending device life.

[0057] In one specific embodiment, the mounting cavity 13 further includes a third mounting area 133, which is adjacent to the first mounting area 131 and the second mounting area 132, and the frequency band processing component 50 is disposed in the third mounting area 133.

[0058] Specifically, since the third mounting area 133 is adjacent to the first mounting area 131, the DC voltage output by the power supply component 40 can be transmitted to the frequency band processing component 50 and each combiner piece 21 in the second mounting area 132 through a shorter wiring path, reducing voltage drop, contact loss, and potential noise coupling caused by wiring length. At the same time, the third mounting area 133 is also adjacent to the second mounting area 132, which significantly shortens the RF connection path between the frequency band processing component 50 and the combiner group 20, which helps to reduce RF transmission loss, reduce the number of exposed RF jumpers, and further improve the electromagnetic shielding effect.

[0059] Therefore, the multi-frequency combiner 100 of the repeater provided above, by setting up multiple combiner pieces 21 stacked along the length of the housing 10, each piece corresponds to a different operating frequency band. The signals of each frequency band enter from the signal input terminal 211 of the corresponding combiner piece 21. After the processing required for this frequency band is completed inside the piece, the signals are directly converged from the signal output terminal 212 to the same RF output terminal 30. Therefore, multiple frequency bands are combined in the same combiner group 20, eliminating the need to add multiple single-frequency combiners and a large number of external coaxial jumpers in the cabinet, thereby significantly reducing the number of devices and the space occupied, and simplifying the wiring. At the same time, the number of combining link stages is reduced, and the insertion loss and intermodulation sources caused by multi-stage connections are correspondingly reduced, which is beneficial to maintaining the linearity and coverage quality of each frequency band signal in multi-frequency and multi-standard scenarios.

[0060] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. A multi-frequency combiner for a repeater, characterized in that, The multi-frequency combiner includes: case; The combiner assembly includes a plurality of combiner chips stacked along the length of the housing, each combiner chip having at least one signal input terminal and one signal output terminal, and each combiner chip operating at a different frequency band. A radio frequency output terminal is provided on the housing. The signal output terminal of each combiner chip is electrically connected to the radio frequency output terminal so as to output signals of multiple different operating frequency bands of multiple combiner chips through the radio frequency output terminal. The power supply assembly is located inside the housing and is electrically connected to the combiner assembly.

2. The multi-frequency combiner for a repeater according to claim 1, characterized in that, The multi-frequency combiner further includes a frequency band processing component, which is disposed within the housing and electrically connected to the combiner assembly.

3. The multi-frequency combiner for a repeater according to claim 1, characterized in that, The multiple combiner plates are arranged in parallel along the length of the housing.

4. A multi-frequency combiner for a repeater according to claim 3, characterized in that, The two adjacent combiner segments are spaced apart.

5. A multi-frequency combiner for a repeater according to claim 2, characterized in that, The housing has an upper cover and a bottom shell, the upper cover and the bottom shell forming a mounting cavity. The mounting cavity has a first mounting area and a second mounting area, which are arranged adjacent to each other. The power supply assembly is located in the first mounting area, and the combiner assembly is located in the second mounting area.

6. A multi-frequency combiner for a repeater according to claim 5, characterized in that, One end of the combiner plate is disposed on the shell surface of the bottom shell, and the plate surface of the combiner plate is perpendicular to the shell surface of the bottom shell.

7. A multi-frequency combiner for a repeater according to claim 5, characterized in that, The multi-frequency combiner also includes a heat dissipation assembly, which is disposed on both sides of the combiner assembly to allow airflow to flow along the intervals between the multiple combiner plates.

8. A multi-frequency combiner for a repeater according to claim 7, characterized in that, The housing has heat dissipation holes so that the heat dissipation component can draw external airflow into the mounting cavity through the heat dissipation holes.

9. A multi-frequency combiner for a repeater according to claim 5, characterized in that, The mounting cavity further includes a third mounting area, which is adjacent to the first mounting area and the second mounting area, and the frequency band processing component is located in the third mounting area.

10. A multi-frequency combiner for a repeater according to claim 7, characterized in that, The heat dissipation component is a fan.

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