Water-cooled conductive structure and high-power device

Abstract

The application relates to the technical field of high-power equipment, in particular to a water-cooled conductive structure which comprises a first conductive part and a second conductive part, the first conductive part is electrically connected with the second conductive part through a lapping surface; a plurality of first waterway interfaces are arranged on the lapping surface of the first conductive part, a plurality of second waterway interfaces are arranged on the lapping surface of the second conductive part, when the first conductive part and the second conductive part are connected through the lapping surface, the first waterway interfaces and the second waterway interfaces are connected in communication to make the internal flow channels of the first conductive part and the second conductive part communicate to form a continuous cooling waterway. Compared with the prior art, the first waterway interfaces and the second waterway interfaces are integrated on the electrically connected lapping surface of the first conductive part and the second conductive part, and are synchronously communicated when being connected, so that the assembly efficiency, the connection reliability of the whole water-cooled conductive structure and the maintenance convenience are greatly improved.

Description

Technical Field

[0001] This application relates to the field of high-power equipment technology, and in particular to a water-cooled conductive structure and a high-power equipment. Background Technology

[0002] In the field of power electronic equipment, high-power devices typically employ water-cooled conductive structures, such as water-cooled copper busbars, to simultaneously achieve high current transmission and efficient heat dissipation. In existing technologies, when connecting two such water-cooled conductive components, a separate assembly structure is commonly used, meaning the electrical connection and water circuit connection are performed independently: the electrical connection achieves physical contact and conductive path through bolt crimping or similar methods, while the water circuit connection relies on external independent pipes, joints, and seals to connect the inlet and outlet of each conductive component in parallel to the external cooling system, thus forming multiple independent cooling branches.

[0003] However, the aforementioned separate assembly and multi-branch design inevitably leads to a large number of system components and numerous connection interfaces. This not only increases material costs and assembly time, but also introduces multiple potential coolant leakage points and failure risks, resulting in high overall system complexity and reduced reliability. In other words, due to the complete separation of electrical and water circuit connections in structure and operation, existing technologies cannot achieve system simplification and reliability improvement while ensuring connection performance and heat dissipation. Utility Model Content

[0004] This application provides a water-cooled conductive structure and a high-power device to solve the technical problem in the prior art that, due to the complete separation of electrical connection and water connection in structure and operation, it is difficult to simplify the system structure and improve reliability while ensuring connection performance and heat dissipation effect.

[0005] In a first aspect, this application proposes a water-cooled conductive structure, including a first conductive element and a second conductive element, wherein the first conductive element and the second conductive element are electrically connected through an overlapping surface.

[0006] The first conductive component has multiple first water channel interfaces on its overlapping surface, and the second conductive component has multiple second water channel interfaces on its overlapping surface. When the first conductive component and the second conductive component are connected through the overlapping surface, the first water channel interfaces and the second water channel interfaces are connected to each other, so that the internal flow channels of the first conductive component and the internal flow channels of the second conductive component are interconnected to form a continuous cooling water channel.

[0007] Furthermore, the first or second conductive element is provided with a cooling water inlet and a cooling water outlet, and the cooling water enters the cooling water path from the cooling water inlet and flows out through the cooling water outlet.

[0008] Furthermore, the number and position of the first water channel interface and the second water channel interface are matched to each other so that the cooling water channels are connected.

[0009] Furthermore, the internal flow channel of the first conductive component includes a first water flow channel, and the internal flow channel of the second conductive component includes a second water flow channel. The first water flow channel connects the cooling water inlet, the first water interface, and the cooling water outlet, and the second water flow channel connects the second water interface.

[0010] Alternatively, the first water channel can be connected to the first water interface, and the second water channel can be connected to the cooling water inlet, the second water interface, and the cooling water outlet;

[0011] The cooling water path is formed when the first water channel and the second water channel are connected.

[0012] Furthermore, the internal flow channel of the first conductive component also includes a third water flow channel. When the cooling water inlet and the cooling water outlet are located on the first conductive component, the third water flow channel is formed by the passage from the cooling water inlet to the cooling water outlet. The water inlet end of the third water flow channel merges with the water inlet end of the first water flow channel, and the water outlet ends also merge.

[0013] When the cooling water inlet and the cooling water outlet are located at the second conductive element, the third water channel is a passageway provided along the length direction of the first conductive element. At this time, the third water channel and the first water channel are merged into an internal channel.

[0014] Furthermore, the first waterway interface and / or the second waterway interface are provided with a sealing structure.

[0015] Furthermore, the sealing structure includes a sealing ring and a sealing groove, with the sealing ring housed within the sealing groove.

[0016] Furthermore, the first conductive element and the second conductive element are conductive copper busbars or conductive aluminum busbars.

[0017] Secondly, this application also proposes a high-power device, including the water-cooled conductive structure as described in the first aspect.

[0018] The technical solutions provided in this application have the following advantages compared with the prior art:

[0019] This application integrates the first water channel interface and the second water channel interface onto the electrical connection lap surface of the first conductive component and the second conductive component, and makes them connect synchronously during docking. This integrates the separate circuit connection operation and multiple water channel connection operation in the prior art into a one-time synchronous completion. This method fundamentally simplifies the system architecture, significantly reduces the number of external pipes, joints and other components required and the potential leakage risks they bring. It not only reduces material and manufacturing costs, but also greatly improves assembly efficiency and the connection reliability and maintenance convenience of the entire water-cooled conductive structure. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0023] Figure 1 A schematic diagram of the structure of a water-cooled copper busbar provided for the prior art;

[0024] Figure 2 for Figure 1 A schematic diagram of the internal flow channel structure;

[0025] Figure 3 for Figure 2 Exploded view;

[0026] Figure 4 This is a schematic diagram of a water-cooled conductive structure provided in an embodiment of this application;

[0027] Figure 5 for Figure 4 A schematic diagram of the internal flow channel structure;

[0028] Figure 6 for Figure 5 Exploded view;

[0029] Figure 7 for Figure 6 A magnified view of a portion of point A in the middle;

[0030] Figure 8 for Figure 4 A schematic diagram of the cooling water circuit.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1. First conductive component; 11. First water channel interface; 12. Overlapping surface; 121. Sealing ring; 122. Sealing groove; 13. Cooling water inlet; 14. Cooling water outlet; 15. First water channel; 16. Third water channel;

[0033] 2. Second conductive component; 21. Second water channel interface; 22. Second water channel flow path;

[0034] 3. Cooling water circuit;

[0035] 4. First copper busbar; 41. First flow channel; 42. Inlet; 43. Outlet;

[0036] 5. Second copper busbar; 51. Second flow channel. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0039] For ease of description, spatial relative terms may be used in the text to describe the relative positional relationship or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or movement change, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0040] To address the technical problem in existing technologies where the complete separation of electrical and water circuit connections in structure and operation makes it difficult to simplify the system structure and improve reliability while ensuring connection performance and heat dissipation, this application integrates the first water circuit interface 11 and the second water circuit interface 21 onto the electrical connection lap surface 12 of the first conductive component 1 and the second conductive component 2, allowing them to connect synchronously during docking. This integrates the separate circuit connection operation and multiple water circuit connection operations in the prior art into a single, synchronous operation. This approach fundamentally simplifies the system architecture, significantly reduces the number of external pipes, connectors, and other components required, as well as the potential leakage risks they bring. It not only reduces material and manufacturing costs but also greatly improves assembly efficiency and the connection reliability and maintenance convenience of the entire water-cooled conductive structure.

[0041] like Figures 1 to 3 As shown, it discloses a water-cooled copper busbar in the prior art, wherein the first copper busbar 4 and the second copper busbar 5 are connected to each other by bolts to achieve electrical connection. The first copper busbar 4 has two first flow channels 41 inside, and the second copper busbar 5 has one second flow channel 51 inside. The two first flow channels 41 converge at the inlet 42 and the outlet 43 of the first copper busbar 4, respectively. The second flow channel 51 is formed by the passage between the inlet 42 and the outlet 43 of the second copper busbar 5. The first flow channel 41 and the second flow channel 51 are in a separate state after the water-cooled copper busbar is assembled, and the two do not interfere with each other.

[0042] Specifically, from the perspective of the structural design of water-cooled copper busbars in the existing technology, the structure will circulate water through each copper busbar. Even for two copper busbars that are connected to each other, the water path needs to have two branches. This water path connection method greatly increases the complexity of the water cooling system and also increases the demand of the water-cooled copper busbars for the system's cooling water flow, thereby increasing the heat dissipation cost.

[0043] Please see Figures 4 to 8 This application proposes a water-cooled conductive structure, including a first conductive element 1 and a second conductive element 2. The first conductive element 1 and the second conductive element 2 are electrically connected through an overlapping surface 12. The overlapping surface 12 of the first conductive element 1 is provided with a plurality of first water channel interfaces 11, and the overlapping surface 12 of the second conductive element 2 is provided with a plurality of second water channel interfaces 21. When the first conductive element 1 and the second conductive element 2 are connected through the overlapping surface 12, the first water channel interfaces 11 and the second water channel interfaces 21 are connected to each other, so that the internal flow channels of the first conductive element 1 and the internal flow channels of the second conductive element 2 are interconnected to form a continuous cooling water channel 3.

[0044] Specifically, in this embodiment, recessed or protruding structures are respectively formed on the overlapping surfaces 12 of the first conductive element 1 and the second conductive element 2 to form the first water channel interface 11 and the second water channel interface 21. When connection is required, the overlapping surfaces 12 of the first conductive element 1 and the second conductive element 2 are aligned and pressed together, and a reliable electrical connection is achieved by bolts or other fasteners. During this process, the water channels on the two overlapping surfaces 12 are also precisely aligned and tightly fitted, thereby achieving docking and connection. The first conductive element 1 has a through flow channel pre-processed inside, and similarly, the second conductive element 2 also has a flow channel processed inside. When the water channels on the two conductive elements are connected, the two flow channels are connected, and the coolant can flow in from one end of the first conductive element 1, through its internal flow channel, the first water channel interface 11, the second water channel interface 21, and finally enter the internal flow channel of the second conductive element 2 and flow out from the other end of the first conductive element 1, thereby forming a continuous cooling water channel 3. This method integrates the water circuit interface into the electrical connection lap surface 12, achieving a one-time synchronous connection between the circuit and the water circuit, which greatly simplifies the assembly process. At the same time, it merges the original multi-branch cooling system into a single series water circuit, significantly reducing the number of system components, reducing the risk of coolant leakage, and improving structural reliability.

[0045] like Figure 5 and Figure 8 As shown, the first conductive element 1 or the second conductive element 2 is provided with a cooling water inlet 13 and a cooling water outlet 14. The cooling water enters the cooling water path 3 from the cooling water inlet 13 and flows out through the cooling water outlet 14.

[0046] Specifically, in this embodiment, a cooling water inlet 13 and a cooling water outlet 14 are provided on the body of the first conductive element 1 or the second conductive element 2. The cooling water inlet 13 is connected to the corresponding water interface on the overlapping surface 12 through an internal flow channel, and the cooling water outlet 14 is connected to another corresponding water interface on the overlapping surface 12 through another internal flow channel. The cooling medium is injected from the outside through the cooling water inlet 13, flows through the internal flow channel and the continuous cooling water channel 3 after docking, and finally returns to the external loop through the cooling water outlet 14. Both are through holes formed during the processing of the internal flow channels of the first conductive element 1 or the second conductive element 2, communicating with the external environment. The cooling water inlet 13 is used to connect to an external cooling water source, and the cooling water outlet 14 is used to export the heated cooling water to the external heat dissipation system. After the cooling water flows in from the inlet, it runs through the entire first conductive element 1 and the second conductive element 2 along the internal flow channel, absorbing the heat generated by them, and finally exits from the outlet, realizing effective heat exchange. This structure allows cooling water to flow fully through the entire conductive structure, uniformly removing heat and improving heat dissipation efficiency and reliability. At the same time, compared with the multiple inlet and outlet designs in the prior art, this application uses only a simple inlet and outlet design to connect to the external cooling system, which can effectively reduce the use of external pipelines and reduce assembly costs.

[0047] like Figure 6 As shown, the number and position of the first water channel interface 11 and the second water channel interface 22 correspond to each other so that the cooling water channel 3 is connected.

[0048] Specifically, in this embodiment, there are two first water channel interfaces 11 and two second water channel interfaces 21, each disposed on a corresponding conductive component. Each interface adopts a matching geometry, such as a circular or rectangular protrusion and recess design, to ensure precise alignment during docking. When the two conductive components are pressed together by the overlapping surface 12, the first water channel interface 11 and the second water channel interface 21 are inserted into or attached to each other, allowing coolant to flow in from one interface and out from the other, thereby forming a continuous cooling water channel 3 to ensure reliable connectivity of the cooling water channel 3.

[0049] It is understood that in other embodiments, the number of the first water channel interface 11 and the second water channel interface 21 may be other, and the specific number may be set according to the distribution of the internal flow channels of the first conductive element 1 and the second conductive element 2, which is not limited here.

[0050] like Figure 4-5 and Figure 8As shown, the internal flow channel of the first conductive component 1 includes a first water flow channel 15, and the internal flow channel of the second conductive component 2 includes a second water flow channel 22. The first water flow channel 15 connects to the cooling water inlet 13, the first water interface 11, and the cooling water outlet 14, and the second water flow channel 22 connects to the second water interface 21; or the first water flow channel 15 connects to the first water interface 11, and the second water flow channel 22 connects to the cooling water inlet 13, the second water interface 21, and the cooling water outlet 14; the first water flow channel 15 and the second water flow channel 22 form a cooling water channel 3 after being connected.

[0051] Specifically, the first conductive component 1 has a first water flow channel 15 internally processed. When the cooling water inlet and outlet are located on the first conductive component 1, the flow channel includes an inflow passage extending from the cooling water inlet 13 to a first water interface 11, and an outflow passage extending from the other first water interface 11 to the cooling water outlet 14. The second conductive component 2 has a second water flow channel 22 internally processed. This flow channel directly connects the two second water interfaces 21, forming a through passage. When the cooling water inlet and outlet are located on the second conductive component 2, the first water flow channel 15 directly connects the two first water interfaces 11, forming a through passage. The second water flow channel 22 includes an inflow passage extending from the cooling water inlet 13 to a second water interface 21, and an outflow passage extending from the other second water interface 21 to the cooling water outlet 14. When the first conductive element 1 and the second conductive element 2 are connected via the overlapping surface 12, the first water channel interface 11 and the second water channel interface 21 are aligned and connected, so that the inflow passage, through passage, and outflow passage are connected in series to form a continuous cooling water channel 3. Cooling water flows in from the inlet, passes through the inflow passage, through passage, and outflow passage, and is then discharged from the outlet. This structure, by optimizing the internal flow channel layout, achieves efficient flow of cooling water and uniform heat distribution, simplifies the water channel structure, and improves heat dissipation performance and reliability.

[0052] like Figure 5 As shown, the internal flow channel of the first conductive element 1 also includes a third water flow channel 16. When the cooling water inlet 13 and the cooling water outlet 14 are located on the first conductive element 1, the third water flow channel 16 is formed by the passage from the cooling water inlet 13 to the cooling water outlet 14. The water inlet end of the third water flow channel 16 merges with the water inlet end of the first water flow channel 15, and the water outlet ends also merge. When the cooling water inlet 13 and the cooling water outlet 14 are located on the second conductive element 2, the third water flow channel 16 is a passage arranged along the length direction of the first conductive element 1. At this time, the third water flow channel 16 and the first water flow channel 15 are merged into one internal flow channel.

[0053] Specifically, in addition to the first water channel 15, a third water channel 16 is also arranged in parallel inside the first conductive component 1. When the cooling water inlet and outlet are located on the first conductive component 1, the third water channel 16 forms an independent passage directly from the cooling water inlet 13 to the cooling water outlet 14. Its inlet end and the inlet end of the first water channel 15 are connected together to the cooling water inlet 13, and its outlet end and the outlet end of the first water channel 15 are connected together to the cooling water outlet 14. After entering the inlet, the cooling water flows in two paths, passing through the first water channel 15 and the third water channel 16 respectively, and finally merges and is discharged at the outlet. When the cooling water inlet and outlet are located on the second conductive component 2, the third water channel 16 and the first water channel 15 merge into a curved channel. The cooling water flows from the cooling water inlet 13 into the curved channel, then flows through the first water interface 11 into the second water channel 22, and finally is discharged from the cooling water outlet 14. This embodiment increases the cross-sectional area and flow rate of the coolant by adding a parallel third water channel 16, thereby improving heat dissipation efficiency. At the same time, it makes the internal heat distribution of the first conductive component 1 more uniform, enhancing the reliability and stability of thermal management.

[0054] Furthermore, with the cooling water inlet and outlet located on the first conductive element 1, the inlet ends of the first water channel 15 and the third water channel 16 achieve uniform flow distribution at the cooling water inlet 13 through a flow divider structure, and the outlet ends achieve efficient flow convergence at the cooling water outlet 14 through a flow collector structure. The second water channel 22 adopts a straight-through or serpentine bend design, directly connecting the two second water channel interfaces 21 to form a through passage. When the first conductive element 1 and the second conductive element 2 are connected through the overlapping surface 12, each water channel interface is precisely aligned and connected, so that the first water channel 15 and the second water channel 22 are connected in series to form the main cooling circuit, while the third water channel 16 forms a parallel auxiliary cooling circuit, together constituting a composite cooling water circuit 3 system.

[0055] To further optimize heat dissipation performance, the cross-section of each flow channel can be designed as rectangular or circular, and the inner wall of the flow channel is smoothed to reduce flow resistance. After entering the inlet, the cooling water flow rate is automatically distributed according to the flow resistance. After completing heat exchange through different flow channels, the water converges at the outlet to achieve temperature equilibrium. This implementation significantly increases the heat dissipation surface area and coolant flow rate by introducing a parallel multi-flow channel architecture, achieving automatic flow distribution on demand. The parallel design of the dual flow channels not only greatly improves the overall heat dissipation efficiency but also reduces flow resistance through flow diversion, while making the internal temperature distribution of conductive components more uniform, effectively avoiding local overheating, and significantly improving the system's heat dissipation stability and thermal management reliability.

[0056] like Figure 6-7 As shown, the first waterway interface 11 and / or the second waterway interface 21 are provided with a sealing structure.

[0057] Specifically, the end face of the first water channel interface 11 has a circumferential groove, within which an elastic sealing structure is embedded; the corresponding mating end face of the second water channel interface 21 is a smooth raised plane. When the two interfaces are mated, the sealing structure deforms under pressure, forming a tight seal with the smooth end face. Alternatively, the end face of the second water channel interface 21 is provided with a raised sealing lip, and the end face of the first water channel interface 11 has a corresponding sealing groove to achieve an interference fit. By setting the sealing structure, coolant leakage at the interface mating point can be effectively prevented, ensuring the sealing reliability of the cooling circuit, while reducing the risk of electrical short circuits caused by leakage, thus improving system safety and service life.

[0058] like Figure 7 As shown, the sealing structure includes a sealing ring 121 and a sealing groove 122, with the sealing ring 121 housed within the sealing groove 122.

[0059] Specifically, the sealing groove 122 is an annular groove, formed circumferentially on the mating end face of the first water channel interface 11 or the second water channel interface 21. The sealing ring 121 is an elastic annular seal with a circular or rectangular cross-section, perfectly fitting within the sealing groove 122. When the two water channels are mated, the sealing ring 121 is compressed and undergoes elastic deformation, filling the assembly gap between the interfaces to form a radial or end-face seal. The sealing ring 121 is made of a high-temperature resistant and corrosion-resistant elastic material (such as high-temperature resistant rubber or silicone) to ensure long-term sealing stability.

[0060] like Figure 4 and Figure 6 As shown, the first conductive component 1 is arranged horizontally, and the second conductive component 2 is arranged vertically. The two are fixedly connected by the overlapping surface 12 to form a T-shaped structure.

[0061] Specifically, the first conductive element 1 extends laterally in the horizontal direction, and the second conductive element 2 extends vertically in the vertical direction. An overlapping surface 12 is formed in the middle of the first conductive element 1, and the overlapping surface 12 of the second conductive element 2 is formed at its end. The two overlapping surfaces 12 are joined together, with the end overlapping surface 12 of the second conductive element 2 and the middle overlapping surface 12 of the first conductive element 1 being fixed by bolts. Both the first conductive element 1 and the second conductive element 2 have several arrayed threaded holes on their overlapping surfaces 12, which are matched to allow for bolt tightening. After connection, the first conductive element 1 and the second conductive element 2 are arranged in a T-shaped structure perpendicular to each other in space. The cooling water channels 3 inside the two conductive elements are connected through the interfaces on the overlapping surfaces 12. This T-shaped structure optimizes the spatial configuration of the conductive elements, satisfying the needs of electrical connections in different directions while maintaining efficient connectivity of the cooling water channels 3, significantly improving the internal space utilization and structural compactness of the equipment.

[0062] In an optional embodiment, the first conductive element 1 and the second conductive element 2 are conductive copper busbars or conductive aluminum busbars.

[0063] Specifically, the first conductive component 1 and the second conductive component 2 are made of highly conductive metal materials, specifically conductive copper busbars or conductive aluminum busbars. When conductive copper busbars are selected, the material is pure copper or a copper alloy, and the surface can be silver-plated to enhance conductivity; when conductive aluminum busbars are selected, the material is an aluminum alloy, and the surface is anodized to form an insulating protective layer. Both types of busbars have internal cooling channels formed through extrusion molding or precision machining, and the overlapping surface 12 is milled to ensure flatness, meeting the precision requirements for simultaneous water and electricity connection. By selecting copper / aluminum busbar materials, efficient heat dissipation is achieved while ensuring excellent conductivity, balancing electrical performance and thermal management requirements. Furthermore, the aluminum option significantly reduces material costs, providing flexible choices for different application scenarios.

[0064] It is understood that, in this embodiment, the first conductive element 1 and the second conductive element 2 can be conductive copper busbars and conductive aluminum busbars, or conductive structures such as steel and composite materials. The specific choice can be made according to the actual situation, and no limitation is made here.

[0065] In an alternative embodiment, this application also proposes a high-power device including a water-cooled conductive structure as described in the first aspect.

[0066] Specifically, the high-power equipment in this embodiment includes high-power frequency converters, electrolytic furnaces, and fast charging piles for electric vehicles. This equipment comprises a power conversion module, a control unit, and a heat dissipation system. The critical power transmission path employs a water-cooled conductive structure as described in the previous embodiment. After the first conductive element 1 and the second conductive element 2 of the water-cooled conductive structure are connected via the overlapping surface 12, they are directly integrated into the main circuit connection node inside the equipment. The inlet and outlet of its cooling water path 3 are connected to the external circulating cooling system pipeline. During equipment operation, the heat generated by the high current transmission through the conductive elements is carried away in real time by the internally flowing coolant and exchanged through the heat dissipation system. This embodiment, by integrating a water-cooled conductive structure with synchronized water and electricity connections, significantly improves the equipment's power density and heat dissipation efficiency, reduces the risk of connection point failures, simplifies the internal wiring architecture, and enhances overall reliability and service life.

[0067] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0068] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0070] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0071] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0072] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0073] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0074] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A water-cooled conductive structure, characterized in that, It includes a first conductive element and a second conductive element, wherein the first conductive element and the second conductive element are electrically connected through an overlapping surface; The first conductive component has multiple first water channel interfaces on its overlapping surface, and the second conductive component has multiple second water channel interfaces on its overlapping surface. When the first conductive component and the second conductive component are connected through the overlapping surface, the first water channel interfaces and the second water channel interfaces are connected to each other, so that the internal flow channels of the first conductive component and the internal flow channels of the second conductive component are interconnected to form a continuous cooling water channel.

2. The water-cooled conductive structure according to claim 1, characterized in that, The first or second conductive element is provided with a cooling water inlet and a cooling water outlet. Cooling water enters the cooling water path from the cooling water inlet and flows out through the cooling water outlet.

3. The water-cooled conductive structure according to claim 2, characterized in that, The number and position of the first water channel interface and the second water channel interface are matched to each other so that the cooling water channel is connected.

4. The water-cooled conductive structure according to claim 3, characterized in that, The internal flow channel of the first conductive component includes a first water flow channel, and the internal flow channel of the second conductive component includes a second water flow channel. The first water flow channel is connected to the cooling water inlet, the first water interface and the cooling water outlet, and the second water flow channel is connected to the second water interface. Alternatively, the first water channel can be connected to the first water interface, and the second water channel can be connected to the cooling water inlet, the second water interface, and the cooling water outlet; The cooling water path is formed when the first water channel and the second water channel are connected.

5. The water-cooled conductive structure according to claim 4, characterized in that, The internal flow channel of the first conductive element also includes a third water flow channel. When the cooling water inlet and the cooling water outlet are located in the first conductive element, the third water flow channel is formed by the passage from the cooling water inlet to the cooling water outlet. The water inlet end of the third water flow channel merges with the water inlet end of the first water flow channel, and the water outlet ends also merge. When the cooling water inlet and the cooling water outlet are located at the second conductive element, the third water channel is a passageway provided along the length direction of the first conductive element. At this time, the third water channel and the first water channel are merged into an internal channel.

6. The water-cooled conductive structure according to claim 1, characterized in that, The first waterway interface and / or the second waterway interface are provided with a sealing structure.

7. The water-cooled conductive structure according to claim 6, characterized in that, The sealing structure includes a sealing ring and a sealing groove, with the sealing ring housed within the sealing groove.

8. The water-cooled conductive structure according to claim 1, characterized in that, The first conductive element and the second conductive element are conductive copper busbars or conductive aluminum busbars.

9. A high-power device, characterized in that, Including the water-cooled conductive structure as described in any one of claims 1-8.

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