Mounting structure of discharge needle and refrigeration fin

Abstract

The utility model provides a discharge needle and the mounting structure of refrigeration piece, it includes semiconductor refrigeration piece, discharge needle, sealing portion, is equipped with the mounting recess on the cold end of semiconductor refrigeration piece, and discharge needle includes needle body and is equipped with the base at needle body bottom end, the base is equipped with in the inside of mounting recess, and sealing portion is connected with mounting recess and holds down the base, and sealing portion has the avoiding hole that supplies needle body to pass through. The utility model discloses through setting up the mounting recess on the cold end of semiconductor refrigeration piece, and the base of discharge needle is accommodated in the recess, makes the contact of discharge needle base and refrigeration piece cold end by traditional point or small area contact changes into the plane of large area even three -dimensional contact. This structure greatly increased the effective heat conduction area between both, makes the cold quantity of refrigeration piece cold end can more fast, more sufficient conduction to discharge needle whole, thereby has improved the cooling speed of discharge needle and the low temperature effect of final reached significantly.

Description

Technical Field

[0001] This utility model relates to an installation structure for a discharge needle and a cooling chip. Background Technology

[0002] Nano-water ions possess numerous advantages, including bioactivity, small particle size, stable performance, weak acidity, and the ability to sterilize and deodorize, attracting increasing attention. Currently, air purifiers, hair dryers, and fans on the market all utilize nano-water ion technology. Patent CN202010990164 discloses a nano-water ion generator where the discharge needle contacts the cooling element directly at the bottom. However, this contact method has drawbacks, including a small heat-conducting area and slow cooling speed of the discharge needle. Utility Model Content

[0003] The purpose of this invention is to overcome the above-mentioned problems. We provide a mounting structure for a discharge needle and a cooling plate, which improves the cooling speed of the discharge needle by modifying the mounting structure.

[0004] To achieve the above objectives, this utility model provides an installation structure for a discharge needle and a cooling chip, which includes a semiconductor cooling chip, a discharge needle, and a sealing part. The cold end of the semiconductor cooling chip is provided with an installation recess. The discharge needle includes a needle body and a base located at the bottom end of the needle body. The base is located inside the installation recess. The sealing part is connected to the installation recess and presses the base. The sealing part has an avoidance hole for the needle body to pass through.

[0005] In one or more embodiments, the sealing portion is interference-fitted with the mounting recess.

[0006] In one or more embodiments, the sealing portion is fixed to the mounting recess by thermally conductive adhesive.

[0007] In one or more embodiments, the bottom of the mounting recess is provided with a cavity that matches the size of the base, and at least a portion of the base is embedded in the cavity.

[0008] In one or more embodiments, the cavity and the base are circular or elliptical in shape.

[0009] In one or more embodiments, the inner wall of the mounting recess is provided with a slot that penetrates the side of the cold end, and the sealing part is provided with a part that connects to the slot.

[0010] In one or more embodiments, the two opposite inner sidewalls of the mounting recess are provided with slots.

[0011] Compared with the prior art, the advantages of this invention are as follows: By providing a mounting recess at the cold end of the semiconductor cooling chip and accommodating the base of the discharge needle within this recess, the contact between the discharge needle base and the cold end of the cooling chip is transformed from a traditional point or small-area contact to a large-area planar or even three-dimensional contact. This structure greatly increases the effective heat conduction area between the two, allowing the cooling energy from the cold end of the cooling chip to be conducted to the entire discharge needle more quickly and fully, thereby significantly improving the cooling speed of the discharge needle and the final low-temperature effect. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure after the discharge needle and the cooling chip are assembled in this embodiment; Figure 2 This is a schematic diagram of the structure of the discharge needle and the cooling chip before assembly in this embodiment. Detailed Implementation

[0013] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0014] See appendix Figure 1-2 This application provides a mounting structure for a discharge needle and a cooling chip, which includes a semiconductor cooling chip, a discharge needle 1, and a sealing part 2. The cold end 3 of the semiconductor cooling chip is provided with a mounting recess 4. The discharge needle 1 includes a needle body 101 and a base 102 located at the bottom end of the needle body 101. The base 102 is located inside the mounting recess 4. The sealing part 2 is connected to the mounting recess 4 and presses the base 102. The sealing part 2 has a clearance hole 5 for the needle body 101 to pass through. This structural design increases the contact area between the base 102 of the discharge needle 1 and the cold end 3 of the semiconductor cooling chip, improving the effective heat conduction area and contact tightness between the two. This allows the cooling energy generated by the semiconductor cooling chip to be conducted to the entire discharge needle 1 more efficiently and quickly, enabling it to reach and stabilize at a lower temperature more quickly, thereby optimizing the generation efficiency and stability of nano-water ions.

[0015] The sealing part 2 is interference-fitted to the mounting recess 4, or the sealing part 2 is fixed to the mounting recess 4 with thermally conductive adhesive. The two installation methods can be selected according to actual needs, and there is no restriction here.

[0016] The bottom of the mounting recess 4 is provided with a cavity 6 that matches the size of the base 102. At least a portion of the base 102 is embedded in the cavity 6. The cavity 6 increases the lateral contact area between the base 102 of the discharge needle 1 and the cold end 3 of the semiconductor cooling chip, so that the cooling energy can be conducted to the discharge needle 1 from both the bottom and the side, further improving the heat conduction efficiency. In addition, this fitting structure has a positioning function, which facilitates the accurate installation of the discharge needle 1 and can effectively resist lateral forces, prevent the discharge needle 1 from shifting or rotating, and enhance the mechanical stability of the structure.

[0017] The cavity 6 and the base 102 are circular or elliptical in shape. The circular or elliptical structure has no sharp edges, which makes it easier for the base 102 to connect with the cavity 6.

[0018] The inner wall of the mounting recess 4 is provided with a slot 7 that penetrates the side of the cold end 3. The sealing part 2 is provided with a fitting part 21 that connects to the slot 7. The cooperation between the fitting part 21 and the slot 7 can realize the pre-positioning and locking of the sealing part 2, preventing it from coming out of the mounting recess 4. Especially when subjected to vibration or accidental pulling, it enhances the firmness of the connection.

[0019] The mounting recess 4 has two opposing inner walls with slots 7. By setting connection points on two symmetrical sides, the sealing part 2 is balanced and symmetrically fixed.

[0020] The above description is only a preferred embodiment of the present utility model. The protection scope of the present utility model is not limited to the above embodiments. Any equivalent modifications or changes made by those skilled in the art based on the content disclosed in the present utility model should be included in the protection scope recorded in the claims.

Claims

1. A mounting structure for a discharge needle and a cooling chip, characterized in that: The device includes a semiconductor cooling chip, a discharge needle (1), and a sealing part (2). The cold end (3) of the semiconductor cooling chip is provided with a mounting recess (4). The discharge needle (1) includes a needle body (101) and a base (102) located at the bottom end of the needle body (101). The base (102) is located inside the mounting recess (4). The sealing part (2) is connected to the mounting recess (4) and presses the base (102). The sealing part (2) has a clearance hole (5) for the needle body (101) to pass through.

2. The mounting structure of the discharge needle and the cooling chip according to claim 1, characterized in that: The sealing part (2) is interference-fitted with the mounting recess (4).

3. The mounting structure of the discharge needle and the cooling chip according to claim 1, characterized in that: The sealing part (2) is fixed to the mounting recess (4) by thermally conductive adhesive.

4. The mounting structure of the discharge needle and the cooling chip according to claim 1, characterized in that: The bottom of the mounting recess (4) is provided with a cavity (6) that matches the size of the base (102), and at least a portion of the base (102) is embedded in the cavity (6).

5. The mounting structure of the discharge needle and the cooling chip according to claim 4, characterized in that: The cavity (6) and the base (102) are circular or elliptical in shape.

6. The mounting structure of the discharge needle and the cooling chip according to claim 1, characterized in that: The inner wall of the mounting recess (4) is provided with a slot (7) that penetrates the side of the cold end (3), and the sealing part (2) is provided with a slot (21) that connects to the slot (7).

7. The mounting structure of the discharge needle and the cooling chip according to claim 6, characterized in that: The mounting recess (4) has a slot (7) on each of the two opposite inner walls.

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