An inverter and frequency converter

Abstract

The application provides an inverter and a frequency converter. The inverter comprises a cabinet, a water-air heat exchanger, a fan, an inductive element, a liquid cooling heat sink, a capacitor assembly and an IGBT module. The cabinet is internally provided with an air-cooled heat dissipation bin and a liquid-cooled heat dissipation bin. The inductive element and the water-air heat exchanger are arranged in the air-cooled heat dissipation bin, the air-cooled heat dissipation bin has an air inlet end and an air outlet end, and the water-air heat exchanger is close to the air inlet end. The fan and the inductive element are arranged in the air-cooled heat dissipation bin, and the inductive element is close to the air outlet end. The capacitor assembly, the liquid cooling heat sink and the IGBT module are sequentially arranged in the liquid-cooled heat dissipation bin. The frequency converter comprises the above-mentioned inverter. The internal part of the cabinet is divided into the air-cooled heat dissipation bin and the liquid-cooled heat dissipation bin, so that the components with different heat dissipation requirements are arranged in different zones. The integrated structure design greatly improves the utilization rate of the internal space of the cabinet, the components are arranged compactly, the overall volume of the inverter is effectively reduced, the heat dissipation path is optimized, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This application belongs to the field of electrical equipment technology, and more specifically, relates to an inverter and a frequency converter. Background Technology

[0002] An inverter is a device that converts direct current (DC) to alternating current (AC), and it is widely used in new energy power generation, industrial drives, and power systems. With the continuous expansion of high-power applications, traditional inverters have gradually revealed some problems in terms of structural layout, heat dissipation performance, modular integration, and parallel operation. For example, in existing technologies, the core components of inverters, such as capacitors, IGBT modules, and inductors, are often installed in a distributed manner, resulting in low utilization of the internal space of the chassis, a loose overall structure, and a large footprint, which is not conducive to the compact design of high-power systems. Utility Model Content

[0003] The purpose of this application is to provide an inverter and a frequency converter to solve the technical problems of loose inverter structure and large space occupation in the prior art.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows: An inverter is provided, comprising a chassis, a water-air heat exchanger, a fan, an inductor, a liquid-cooled heat sink, a capacitor assembly, and an IGBT module; the chassis contains an air-cooled heat sink and a liquid-cooled heat sink; the water-air heat exchanger is disposed within the air-cooled heat sink, which has an air inlet and an air outlet, with the water-air heat exchanger located near the air inlet; the fan is disposed within the air-cooled heat sink; the inductor is disposed within the air-cooled heat sink and located near the air outlet; the capacitor assembly is disposed within the liquid-cooled heat sink; the liquid-cooled heat sink is disposed within the liquid-cooled heat sink and mounted on one side of the capacitor assembly; the IGBT module is disposed within the liquid-cooled heat sink and mounted on one side of the liquid-cooled heat sink.

[0005] Furthermore, the capacitor assembly includes multiple capacitors, a capacitor box, and an insulating cover. The multiple capacitors are placed inside the capacitor box, and the insulating cover covers the capacitor box and abuts against the top of the capacitors. The liquid cooling heat sink is installed and fixed on the outer side of the capacitor box.

[0006] Furthermore, the capacitors are film capacitors, and the bottom of the film capacitors is fixed inside the capacitor box by screws.

[0007] Furthermore, the plurality of capacitors are arranged in at least two columns, with adjacent columns of capacitors staggered and spaced apart.

[0008] Furthermore, the inverter also includes a PCB board, and the chassis is provided with a movable door; the PCB board is installed on the side of the movable door facing the chassis; one side of the movable door is hinged to the chassis, and the chassis is provided with a limiter, which is used to limit the opening angle of the movable door.

[0009] Furthermore, the inductor is a hollow inductor, the fan is disposed between the hollow inductor and the water-air heat exchanger, and the hollow part of the hollow inductor is arranged along the airflow direction inside the air-cooled heat dissipation chamber.

[0010] Furthermore, the water-air heat exchanger and the liquid-cooled heat sink are connected in series via pipelines; one of the water-air heat exchanger and the liquid-cooled heat sink is provided with a water inlet, and the other is provided with a water outlet.

[0011] Furthermore, multiple IGBT modules are provided, and the multiple IGBT modules are arranged along the height direction of the chassis.

[0012] Furthermore, the inverter also includes a Hall element, which is connected to the inductor via a busbar.

[0013] This application also provides a frequency converter, which includes the inverter described above.

[0014] The advantages of the inverter and frequency converter provided in this application are as follows: Compared with the prior art, the inverter of this application achieves the partitioned arrangement of components with different heat dissipation requirements by dividing the internal chassis into an air-cooled heat dissipation chamber and a liquid-cooled heat dissipation chamber. The air-cooling system, consisting of a water-air heat exchanger and a fan, is located at the air inlet of the air-cooled heat dissipation chamber, which can efficiently pre-cool the air entering the chamber, while the inductor components are close to the air outlet, which can make full use of the air-cooled airflow for heat dissipation; capacitor components and IGBT modules are respectively installed on both sides of the liquid-cooled heat dissipation plate in the liquid-cooled heat dissipation chamber, so that these two heat-generating core components can be quickly cooled down by liquid cooling. This integrated structural design greatly improves the internal space utilization of the chassis, the compact layout of each component effectively reduces the overall size of the inverter, while optimizing the heat dissipation path and improving the heat dissipation efficiency, meeting the dual requirements of high-power systems for inverter structural compactness and heat dissipation performance. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1The overall structural layout of the inverter provided in the embodiments of this application Figure 1 ;

[0017] Figure 2 The overall structural layout of the inverter provided in the embodiments of this application Figure 2 ;

[0018] Figure 3 This is a diagram showing the internal heat dissipation layout of an inverter provided in an embodiment of this application;

[0019] Figure 4 This is a schematic diagram of the internal air-cooled heat dissipation of the inverter provided in an embodiment of this application;

[0020] Figure 5 This is a schematic diagram of the structure of the inductor in the inverter provided in the embodiments of this application;

[0021] Figure 6 This is a schematic diagram of the capacitor assembly in the inverter provided in the embodiments of this application.

[0022] The following are the labeling elements in the figure:

[0023] 100 - Chassis; 101 - Access Door;

[0024] 200-Water-Air Heat Exchanger;

[0025] 300-fan;

[0026] 400 - Inductor components;

[0027] 500-Liquid Cooling Heatsink;

[0028] 600 - Capacitor assembly; 601 - Capacitor; 602 - Capacitor box; 603 - Insulating cover plate;

[0029] 700-IGBT module;

[0030] 800-PCB board;

[0031] 900-Hall element. Detailed Implementation

[0032] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0033] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0034] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0036] Please refer to the following: Figure 1 and Figure 2 The inverter provided in this application embodiment will now be described. The inverter includes a chassis 100, a water-air heat exchanger 200, a fan 300, an inductor 400, a liquid-cooled heat sink 500, a capacitor assembly 600, and an IGBT module 700. The chassis 100 contains an air-cooled heat sink and a liquid-cooled heat sink. The water-air heat exchanger 200 is disposed within the air-cooled heat sink, which has an air inlet and an air outlet, with the water-air heat exchanger 200 located near the air inlet. The fan 300 is disposed within the air-cooled heat sink. The inductor 400 is disposed within the air-cooled heat sink and located near the air outlet. The capacitor assembly 600 is disposed within the liquid-cooled heat sink. The liquid-cooled heat sink 500 is disposed within the liquid-cooled heat sink and mounted on one side of the capacitor assembly. The IGBT module 700 is disposed within the liquid-cooled heat sink and mounted on one side of the liquid-cooled heat sink 500.

[0037] Compared with the prior art, the inverter provided in this application divides the interior of the chassis 100 into an air-cooled heat dissipation chamber and a liquid-cooled heat dissipation chamber, realizing the partitioned arrangement of components with different heat dissipation requirements. The air-cooling system, composed of the water-air heat exchanger 200 and the fan 300, is located at the air inlet of the air-cooled heat dissipation chamber, which can efficiently pre-cool the air entering the chamber, while the inductor 400 is close to the air outlet, which can make full use of the air-cooled airflow for heat dissipation; the liquid-cooled heat dissipation chamber has capacitor components 600 and IGBT modules 700 installed on both sides of the liquid-cooled heat dissipation plate 500, which can quickly cool down these two heat-generating core components through liquid cooling. This integrated structural design greatly improves the internal space utilization of the chassis 100, the compact layout of each component effectively reduces the overall size of the inverter, while optimizing the heat dissipation path and improving the heat dissipation efficiency, meeting the dual requirements of high-power systems for inverter structural compactness and heat dissipation performance. It can reduce the complexity of structural design in high-power parallel systems, shorten the cabinet-making cycle of high-power systems, reduce the system cabinet-making cost, and effectively reduce the space occupied by the cabinet system.

[0038] The inverter main circuit topology of this application is as follows: DC power is input at the top, flows through capacitor assembly 600 to DC input terminal of IGBT module, and then flows from AC output terminal of IGBT module to input terminal of inductor element 400 through conductive busbar; power flows from output terminal of inductor element 400 through conductive busbar through Hall element 900, and finally to load motor.

[0039] In one embodiment of this application, please refer to the following: Figure 4 and Figure 6 The capacitor assembly 600 includes multiple capacitors 601, a capacitor box 602, and an insulating cover plate 603. The multiple capacitors 601 are placed inside the capacitor box 602, and the insulating cover plate 603 covers the capacitor box 602 and abuts against the top of the capacitors 601. The liquid cooling heat sink is installed and fixed on the outer side of the capacitor box 602.

[0040] In this embodiment, the capacitor box 602 not only serves to house and fix the capacitor 601, but its design to separate the space of the chassis 100 also effectively avoids heat interference between the air-cooled heat sink and the liquid-cooled heat sink, further improving the overall efficiency of the heat dissipation system. The insulating cover 603 provides reliable protection for the top of the capacitor 601, preventing external foreign objects from contacting the capacitor 601 pins and causing a short circuit. At the same time, by abutting against the top of the capacitor 601, it enhances the installation stability of the capacitor 601 within the capacitor box 602 and reduces the impact of vibration on the connection reliability of the capacitor 601. The connection design between the liquid-cooled heat sink 500 and the capacitor box 602 not only allows the heat generated by the capacitor 601 during operation to be quickly conducted to the liquid-cooled heat sink 500 through the capacitor box 602, achieving efficient liquid cooling of the capacitor 601 and ensuring that the capacitor 601 can still work stably in high-temperature environments, but also enables the modular design of the capacitor assembly 600, improving the utilization rate of the internal space of the chassis 100.

[0041] Specifically, the capacitor box 602 is made by bending a thin plate and is in the shape of a long box. The bottom of the capacitor 601 is fixed to the capacitor box 602 by bolts. The insulating cover plate 603 can not only restrain the vibration of the top of the film capacitor, but also take into account the positioning problem of the installation angle of the capacitor 601, saving the design and development of tooling and reducing costs.

[0042] In one embodiment of this application, the plurality of capacitors 601 are film capacitors, and the bottom of the film capacitors is fixed inside the capacitor box 602 by screws.

[0043] Film capacitors are characterized by high voltage resistance, low loss, long lifespan, and low heat generation. Compared to traditional electrolytic capacitors, film capacitors have lower inductance, allowing for a smaller current ratio and significantly reducing the number of capacitors used in inverters. This further reduces the installation size of the capacitor assembly 600. Because film capacitors generate less heat, they significantly reduce the overall heat dissipation load, eliminating the need to mount the capacitors tightly to the liquid cooling heatsink 500. Instead, they can be mounted using the capacitor box 602, resulting in a more stable and compact installation. Furthermore, film capacitors do not require additional voltage equalizing resistors, simplifying the circuit structure and saving installation space and hardware costs. This allows for higher integration of the capacitor assembly 600 and a tighter fit with the liquid cooling heatsink 500, ensuring rapid heat transfer to the cooling system.

[0044] In one embodiment of this application, please refer to the following: Figure 4 and Figure 6 Multiple capacitors 601 are arranged in at least two columns, with adjacent columns of capacitors 601 staggered and spaced apart.

[0045] In this embodiment, adjacent columns of capacitors 601 are arranged in a staggered manner, which maximizes the number of capacitors 601 within a limited installation space, while effectively reducing the gaps between capacitors 601 and improving space utilization. This staggered arrangement structure also makes the airflow distribution around the capacitors 601 more uniform, avoids local heat accumulation, and enhances the heat dissipation effect.

[0046] In one embodiment of this application, please refer to the following: Figure 1 and Figure 2 The inverter also includes a PCB board 800, and a movable door 101 is provided on the chassis 100; the PCB board 800 is installed on the side of the movable door 101 facing the chassis 100.

[0047] In this embodiment, the PCB board 800 is integrated into the side of the movable door 101 facing the chassis 100, forming an independent electrical control area inside the chassis 100 and avoiding electromagnetic interference with high-voltage components in the air-cooled and liquid-cooled heat dissipation chambers. Simultaneously, the opening and closing structure of the movable door 101 provides convenient operating space for the installation, debugging, and subsequent maintenance of the PCB board 800. When it is necessary to repair components on the PCB board 800, there is no need to disassemble other parts of the chassis 100; simply opening the movable door 101 allows for direct operation, effectively improving maintenance efficiency.

[0048] In one embodiment of this application, one side of the movable door 101 is hinged to the housing 100, and the housing 100 is provided with a limiter for limiting the opening angle of the movable door 101.

[0049] In this embodiment, the limiter effectively prevents the movable door 101 from colliding with other components of the chassis 100 or external objects due to excessive rotation during opening, thereby protecting the movable door 101 and components such as the PCB board 800 mounted on the door from damage. Simultaneously, a reasonable opening angle limit (e.g., controlling the opening angle within the range of 90°-120°) ensures that maintenance personnel have sufficient working space during operation and that the movable door 101 can be stably opened without additional support, further improving the convenience and safety of maintenance operations. The limiter can adopt a mechanical stop, a damping hinge, or a pull rod structure. Its installation position needs to be optimized according to the size of the movable door 101 and the overall layout of the chassis 100 to ensure that while achieving the angle limiting function, it does not affect the internal airflow and component layout of the chassis 100.

[0050] In one embodiment of this application, the chassis 100 has a book-like structure.

[0051] In this embodiment, the book-shaped chassis 100 design results in a neat overall shape, effectively saving installation space and facilitating placement and maintenance in confined environments. Please refer to the following: Figure 1 and Figure 3 The width (direction A) of the chassis 100 should be as narrow as possible to accommodate multiple inverters within a single cabinet. For example, an 800mm wide cabinet can accommodate three inverters. Considering both the cabinet's internal width and maintenance space, the width of the chassis 100 should not exceed 220mm. The depth (direction B) of the chassis 100 needs to be less than the standard depth of a market-standard cabinet. Considering the internal control components and heat dissipation requirements, the depth of the chassis 100 should be less than 500mm. The height (direction C) of the chassis 100 is relatively more flexible than the other two directions, but it still needs to be comprehensively considered in light of the components that may be present in the cabinet system, and the height dimension should be minimized as much as possible.

[0052] In one embodiment of this application, the inductor 400 is a hollow inductor. A fan 300 is disposed between the hollow inductor and the water-air heat exchanger 200, with the hollow portion of the hollow inductor positioned along the airflow direction within the air-cooled heat dissipation chamber. This structural design allows the cooling airflow driven by the fan 300 to directly pass through the hollow portion of the hollow inductor, significantly improving the convective heat dissipation efficiency of the inductor 400.

[0053] Understandably, high-power inverter systems require multiple inverters connected in parallel to meet demand. During operation, to ensure current sharing among multiple inverters, output reactors or current-sharing reactors are necessary. Currently, this is typically achieved by adding additional reactors within the cabinet, resulting in a large overall space requirement, complex structure, and high heat dissipation demands for the cabinet system. Therefore, the inductor element 400 in this application uses an air-core inductor for current sharing. The air-core inductor employs a spiral-wound coil structure, and its coreless design provides excellent heat dissipation performance, better adapting to the heat dissipation environment of air-cooled heat sinks. Compared to the inductor element 400 with a magnetic core, the air-core inductor does not incur additional losses due to core saturation during operation, while also reducing hysteresis and eddy current losses, thus improving the inverter's energy conversion efficiency. Furthermore, the air-core inductor has better linear characteristics, maintaining a stable inductance value even under high current conditions, ensuring the stability of the inverter's output waveform, and further optimizing the inverter's electrical performance in high-power applications.

[0054] Specifically, please refer to Figure 5 The hollow inductor is a three-phase inductor, consisting of three coils. The three coils are integrated in a straight line on a set of structural fasteners, making the overall structure more compact, increasing the utilization rate of the internal space of the chassis 100, and reducing production costs.

[0055] In one embodiment of this application, the water-air heat exchanger 200 and the liquid-cooled heat sink 500 are connected in series via pipelines; one of the water-air heat exchanger 200 and the liquid-cooled heat sink 500 is provided with a water inlet and the other is provided with a water outlet.

[0056] In this embodiment, the water-air heat exchanger 200 and the liquid-cooled heat sink 500 are connected in series via pipelines to form a closed coolant circulation system. When the coolant enters one of the components from the inlet, it absorbs the heat generated by the surrounding devices. Subsequently, the coolant carrying heat flows through the pipeline into another component, where it exchanges heat with the outside environment or further absorbs heat, and finally flows out from the outlet, completing the entire heat dissipation cycle. This series connection method allows the coolant to flow through the two core heat dissipation components sequentially, making full use of the coolant's heat dissipation capacity and improving the overall heat dissipation efficiency. At the same time, setting only one inlet and one outlet greatly simplifies the pipeline connection structure, reduces the number of interfaces, lowers the risk of leakage, and saves more space for the internal layout of the chassis 100, further enhancing the compactness of the inverter structure.

[0057] In one embodiment of this application, please refer to the following: Figure 3 and Figure 6 There are multiple IGBT modules 700, which are arranged along the height of the chassis 100.

[0058] In this embodiment, multiple IGBT modules 700 are arranged along the height direction (C direction) of the chassis 100. This fully utilizes the spatial advantage of the chassis 100 in the height direction and avoids increasing the overall size of the chassis 100 due to arranging too many modules in the depth direction (B direction), thus better adapting to the installation requirements of standard cabinet air conditioners. This vertical arrangement allows the spacing between each IGBT module 700 to be flexibly adjusted according to heat dissipation requirements, facilitating the formation of effective heat dissipation channels between modules and ensuring that each module receives uniform cooling.

[0059] In one embodiment of this application, the DC input side of the IGBT module and the electrode conductive post of the capacitor 601 are located on the same side. This same-side layout design can significantly shorten the conductive connection path between the capacitor 601 and the IGBT module 700, minimizing the length and number of bends of the connector. On the one hand, the shortened conductive path can reduce line impedance, reduce power loss, and improve the energy conversion efficiency of the inverter; on the other hand, the shortened connector length helps to reduce parasitic inductance, reduce voltage spikes generated during switching, improve the operational reliability of the IGBT module 700, and extend its service life. At the same time, the same-side arrangement also facilitates the standardized design and installation of the conductive connector, simplifies the assembly process, reduces the operational difficulty and error rate in the production process, and helps to improve the assembly efficiency and consistency of the whole machine.

[0060] In this embodiment, the IGBT module 700 is mounted on the liquid-cooled heat sink 500, and the heat it generates can be transferred away through the liquid flowing within the heat sink 500. The capacitor 601 module uses thin-film capacitors, which are few in number and have negligible losses. Therefore, only the inductor 400 remains as the main heat source inside the chassis 100. To meet the heat dissipation requirements of the inductor 400 and improve its heat dissipation efficiency, an independent airflow structure is designed in the structural layout (see [link to relevant documentation]). Figure 4 (The arrows in the diagram indicate the direction of gas flow.) In the independent air duct structure, the water-air heat exchanger 200 is located at the bottom, above which is the fan 300. The entire structure uses an upward airflow method for hollow inductive heat dissipation. The fan 300 is positioned on the cold air side of the water-air heat exchanger 200, which helps extend the lifespan of the fan 300 and enhances product reliability.

[0061] The heat dissipation principle of inductor 400 is as follows: the fan 300 rotates and drives hot air to flow through the air passage of water-air heat exchanger 200. The hot air will exchange heat with the coolant flowing inside the water passage of water-air heat exchanger 200, ensuring that the fan 300 blows out cooled air, thereby achieving higher heat dissipation efficiency.

[0062] In this embodiment, the heat dissipation power design margin of the water-air heat exchanger 200 is relatively large. This means that in addition to meeting the inverter's own heat dissipation requirements, a certain proportion of additional heat dissipation demand will be added. The main purpose is to use the redundant heat dissipation demand to improve the ambient temperature inside the cabinet when high-power parallel operation is performed, realize internal circulation within the cabinet, and thus improve the service life of internal components.

[0063] In one embodiment of this application, please refer to Figure 2 The inverter also includes a Hall element 900, which is connected to the inductor element 400 via a busbar.

[0064] In this embodiment, by setting the Hall element 900, the inverter output current can be detected in real time with high precision, providing an accurate current feedback signal to the inverter control unit. The Hall element 900 adopts a modular design and is directly connected to the output terminal of the inductor element 400 through a busbar. This not only simplifies the circuit connection and reduces interference in the signal transmission path, ensuring detection accuracy, but also adapts to the compact space layout inside the chassis 100, forming an organic whole with other components without occupying excessive installation space.

[0065] This application also provides a frequency converter that includes the inverter described above. By integrating an inverter with the above-described structural features, this frequency converter can significantly optimize the overall space layout, heat dissipation performance, and operational reliability while ensuring high power output capability.

[0066] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An inverter, characterized in that, include: The chassis contains an air-cooled heat dissipation chamber and a liquid-cooled heat dissipation chamber. A water-air heat exchanger is provided, which is installed inside the air-cooled heat dissipation chamber. The air-cooled heat dissipation chamber has an air inlet and an air outlet, and the water-air heat exchanger is located near the air inlet. The fan is disposed inside the air-cooled heat dissipation chamber; An inductor element is disposed within the air-cooled heat dissipation chamber and near the air outlet. A capacitor assembly, wherein the capacitor assembly is disposed in the liquid-cooled heat dissipation chamber; A liquid-cooled heat sink is disposed in the liquid-cooled heat sink chamber and installed on one side of the capacitor assembly; The IGBT module is disposed in the liquid cooling heat dissipation chamber and installed on one side of the liquid cooling heat dissipation plate.

2. The inverter as described in claim 1, characterized in that, The capacitor assembly includes multiple capacitors, a capacitor box, and an insulating cover. The multiple capacitors are placed inside the capacitor box, and the insulating cover covers the capacitor box and abuts against the top of the capacitors. The liquid cooling heat sink is installed and fixed on the outer side of the capacitor box.

3. The inverter as described in claim 2, characterized in that, The capacitors are film capacitors, and the bottom of the film capacitors is fixed inside the capacitor box by screws.

4. The inverter as described in claim 2, characterized in that, The capacitors are arranged in at least two columns, with adjacent columns of capacitors staggered and spaced apart.

5. The inverter as described in claim 1, characterized in that, The inverter also includes a PCB board, and the chassis is provided with a movable door; the PCB board is installed on the side of the movable door facing the chassis; One side of the movable door is hinged to the chassis, and the chassis is provided with a limiter, which is used to limit the opening angle of the movable door.

6. The inverter as described in claim 1, characterized in that, The inductor is a hollow inductor, and the fan is disposed between the hollow inductor and the water-air heat exchanger. The hollow part of the hollow inductor is arranged along the airflow direction inside the air-cooled heat dissipation chamber.

7. The inverter as described in claim 1, characterized in that, The water-air heat exchanger and the liquid-cooled heat sink are connected in series via pipelines; one of the water-air heat exchanger and the liquid-cooled heat sink is provided with a water inlet and the other with a water outlet.

8. The inverter as described in claim 1, characterized in that, The IGBT module is provided in multiple ways, and the multiple IGBT modules are arranged along the height direction of the chassis.

9. The inverter according to any one of claims 1 to 8, characterized in that, The inverter also includes a Hall element, which is connected to the inductor via a busbar.

10. A frequency converter, characterized in that, The frequency converter includes the inverter according to any one of claims 1-9.

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