A housing of an integrable thin film capacitor

Abstract

The utility model discloses a kind of shell of integrated film capacitor, including shell, AC plug-in;The inner part of shell is divided into first cavity and second cavity by isolation retaining wall;Filtering assembly is installed in the first cavity, and film capacitor is installed in the second cavity, and power module is equipped with in the side of film capacitor away from filtering assembly;The side of film capacitor is connected with the power module by connecting piece, and first input terminal and second input terminal are connected with the positive and negative output copper bar on filtering assembly;Negative terminal is connected to the negative terminal of AC plug-in;High-voltage circuit area and low-voltage circuit area are separated using isolation retaining wall, and the physical path length of common-mode current propagation in shell inner surface is increased. The impedance of common-mode current propagation path is increased by isolation retaining wall, so that first cavity and second cavity form relatively independent electromagnetic shielding cabin, prevent its radiation or conduction to sensitive second cavity.

Description

Technical Field

[0001] This utility model relates to the field of electrical equipment technology, specifically to a housing that can integrate thin-film capacitors. Background Technology

[0002] In the modern electric drive of new energy vehicles, the DC-LINK capacitor (DC support capacitor) is a seemingly simple yet crucial component. It acts as the "anchor of stability" and "energy hub" of the entire system, and its performance directly determines the system's efficiency, power density, reliability, and cost. Traditional solutions use independent capacitor modules connected to busbars via bolts. Since the current path typically includes multiple interfaces such as the connection from the capacitor's internal core to the terminals, the bolted connection between the terminals and the busbar, and the bolted connection between the busbar and the power module terminals, each interface and bend in the busbar is a source of parasitic inductance, resulting in significant parasitic inductance in existing equipment. Utility Model Content

[0003] The purpose of this invention is to provide a housing for integrating thin-film capacitors to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a housing capable of integrating a thin-film capacitor, comprising a housing; an internal isolation wall within the housing, dividing the interior of the housing into a first cavity and a second cavity; a filter assembly installed in the first cavity, and a thin-film capacitor installed in the second cavity, the thin-film capacitor being potted in the second cavity, and a power module being provided on the side of the thin-film capacitor away from the filter assembly; one side of the thin-film capacitor being connected to the power module via a connector, and a first input terminal and a second input terminal being provided on the other side of the thin-film capacitor; the first input terminal and the second input terminal drawing power from the positive and negative output copper busbars on the filter assembly, and a negative terminal being provided on one side of the first input terminal.

[0005] As a preferred technical solution of this utility model: the first cavity is further provided with a third cavity, and the third cavity is provided with a mounting base for installing the high voltage plug-in.

[0006] As a preferred technical solution of this utility model: the second cavity is further provided with a mounting platform for installing a power module, and the upper surface of the mounting platform is higher than the inner bottom surface of the housing.

[0007] As a preferred technical solution of this utility model: the mounting platform is provided with a first mounting area for mounting a three-phase current sensor on the side away from the thin film capacitor, and a second mounting area for mounting a low-voltage plug is provided on the side of the first mounting area.

[0008] As a preferred technical solution of this utility model: the side of the thin film capacitor facing the housing is further provided with an aluminum plate, and the thin film capacitor and the aluminum plate are encapsulated in the second cavity using potting compound.

[0009] As a preferred technical solution of this utility model: the connector is a stacked busbar, and the thin film capacitor electrode is directly welded to the connector.

[0010] As a preferred technical solution of this utility model: the connector includes a negative copper busbar and a positive copper busbar; wherein, the thin film capacitor is connected to the negative terminal of the power module through the negative copper busbar, and the positive copper busbar is connected to the positive terminal of the power module.

[0011] The beneficial effects of this utility model by adopting the above technical solution are as follows: 1. By using an isolation barrier to separate the high-voltage circuit area from the low-voltage circuit area, the physical path length of the common-mode current propagation on the inner surface of the housing is increased. By increasing the impedance of the common-mode current propagation path through the isolation barrier, the first cavity and the second cavity form relatively independent electromagnetic shielding chambers, thereby confining the high-frequency electromagnetic noise generated by the first cavity to a local area and preventing it from radiating or being conducted into the sensitive second cavity;

[0012] 2. By filling all air gaps with potting compound, contact thermal resistance is eliminated, and an efficient downward heat dissipation main path is established from the film capacitor core to the shell. At the same time, vibration energy is absorbed and buffered by the entire potting compound and evenly distributed to the entire shell structure, avoiding stress concentration at a few bolt connection points. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the main structure of the shell of this utility model;

[0014] Figure 2 This is a schematic diagram of the front structure of the housing of this utility model;

[0015] Figure 3 This is a schematic diagram of the back structure of the housing of this utility model;

[0016] Figure 4 This is a schematic diagram showing the internal layout of electrical components within the housing.

[0017] Figure 5 This is a schematic diagram of the main structure of the thin-film capacitor of this utility model.

[0018] In the diagram: 1. First cavity; 2. Thin-film capacitor; 21. Negative copper busbar; 22. Positive copper busbar; 23. First input terminal; 24. Second input terminal; 25. Negative terminal; 3. Second cavity; 4. Mounting platform; 5. Power module; 6. Three-phase current sensor; 7. Low-voltage module; 8. Resolver module; 9. Filter assembly; 10. High-voltage module; 11. AC module; 12. Isolation barrier; 13. Mounting base; 14. Second mounting area; 15. Housing; 16. Third cavity; 17. First mounting area. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. In the description of this utility model, it should be understood that the terms "upper," "lower," "front," "upper surface," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this utility model.

[0020] Please see Figure 1-5 This utility model provides an embodiment of a housing capable of integrating a thin-film capacitor, comprising a housing 15 and an AC plug-in 11 mounted on the housing 15; an isolation barrier 12 is installed inside the housing 15, dividing the interior of the housing 15 into a first cavity 1 and a second cavity 3; a filter assembly 9 is installed in the first cavity 1, and a thin-film capacitor 2 is installed in the second cavity 3, the thin-film capacitor 2 being potted in the second cavity 3, and a power module 5 is provided on the side of the thin-film capacitor 2 away from the filter assembly 9; one side of the thin-film capacitor 2 is connected to the power module 5 via a connector, and the other side of the thin-film capacitor 2 is also provided with a first input terminal 23 and a second input terminal 24; the first input terminal 23 and the second input terminal 24 draw power from the positive and negative output copper busbars on the filter assembly 9; a negative terminal 25 is also provided on one side of the first input terminal 23, and the negative terminal 25 is connected to the negative terminal of the AC plug-in 11.

[0021] In summary, by integrating the thin-film capacitor 2, power module 5, and filter component 9 within the housing 15, and then using the isolation barrier 12 to separate the high-voltage circuit area from the low-voltage circuit area, the physical path length of the common-mode current propagation on the inner surface of the housing 15 is increased. The isolation barrier 12 increases the impedance of the common-mode current propagation path, allowing the first cavity 1 and the second cavity 3 to form relatively independent electromagnetic shielding chambers. This confines the high-frequency electromagnetic noise generated by the first cavity to a local area, preventing it from radiating or being conducted into the sensitive second cavity 3.

[0022] In addition, by integrating the film capacitor 2, power module 5, and filter component 9 into the housing 15, the film capacitor 2, power module 5, and filter component 9 do not require additional housings, internal supports, and insulation materials. This reduces the overall size of the product and improves space utilization.

[0023] To make the internal space of the housing 15 more spacious, a third cavity 16 is also provided in the first cavity 1, and the third cavity 16 is provided with a mounting seat 13 for installing the high voltage plug-in 10. The setting of the third cavity 16 has three purposes: first, it increases the distance between the high voltage plug-in 10 and the film capacitor 2 to reduce the impact of high voltage on the film capacitor 2; second, the mounting seat 13 makes the high voltage plug-in 10 have an independent installation position; and third, it facilitates the electrical connection of the filter component 9 in the third cavity 16.

[0024] Meanwhile, since the second cavity 3 is also provided with a mounting platform 4 for installing the power module 5, and the upper surface of the mounting platform 4 is higher than the inner bottom surface of the housing 15, the power module 5 not only has a reliable installation space, but the mounting platform 4 can also be used to increase the height difference between the power module 5 and the thin film capacitor 2, so as to set up water channels in the mounting platform 4, so as to use cooling water to carry away the heat of the power module 5 through the water channels, thereby reducing the accumulation of heat in the housing 15.

[0025] Because the mounting platform 4 has a first mounting area 17 for mounting the three-phase current sensor 6 on the side away from the thin-film capacitor 2, and a second mounting area 14 for mounting the low-voltage plug-in 7 on one side of the first mounting area 17, the interior of the housing 15 can also integrate the three-phase current sensor 6 and the low-voltage plug-in 7, so that the space of the housing 15 can be fully utilized. In particular, a housing can simultaneously integrate the filter component 9, the high-voltage plug-in 10, the AC plug-in 11, the thin-film capacitor 2, the power module 5, the three-phase current sensor 6, the low-voltage plug-in 7, and the resolver plug-in 8 to expand the function of the housing 15. That is, the physical integration is high, the overall height dimension is low, and it meets the vehicle boundary requirements.

[0026] Based on the above solution, since the side of the thin-film capacitor 2 facing the housing 15 is also provided with an aluminum plate, and the thin-film capacitor 2 and the aluminum plate are encapsulated in the second cavity 3 using potting compound, the potting compound fills all air gaps, eliminating contact thermal resistance and establishing an efficient downward heat dissipation main path from the core of the thin-film capacitor 2 to the housing 15. Simultaneously, vibration energy is absorbed and buffered by the entire potting compound and evenly distributed throughout the entire structure of the housing 15, avoiding stress concentration at a few bolt connection points. The core of the thin-film capacitor 2 has no relative movement with the external environment, fundamentally solving the loosening problem.

[0027] In addition, the independent plastic / metal casing of the film capacitor 2 is abandoned. The bare film capacitor 2 core is directly placed into the second cavity 3 reserved for it in the casing 15 and filled and sealed with thermally conductive potting compound. At the same time, the casing 15 is made of aluminum, so the film capacitor 2 can be fixed and the heat can be dissipated.

[0028] Furthermore, the connector is a stacked busbar, and the electrodes of the thin-film capacitor 2 are directly welded to the connector. The stacked busbar is a composite electrical connection device formed by alternating layers of conductive plates and insulating materials, and is integrally formed using conductive materials such as copper and aluminum and a PET composite insulating film through a hot-pressing process. Therefore, in terms of structural design, the capacitor core and the power module 5 are placed as close as possible physically, achieving "capacitor close to the DC input terminal," thus physically minimizing the current loop area.

[0029] Specifically, the connector includes a negative copper busbar 21 and a positive copper busbar 22; wherein, the thin film capacitor 2 is connected to the negative terminal of the power module 5 through the negative copper busbar 21, and the positive copper busbar 22 is connected to the positive terminal of the power module 5.

[0030] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model, and these variations still fall within the protection scope of this utility model.

Claims

1. A housing for integrating thin-film capacitors, characterized in that: Includes a housing (15); an isolation barrier (12) inside the housing (15) and the isolation barrier (12) divides the interior of the housing (15) into a first cavity (1) and a second cavity (3); A filter assembly (9) is installed in the first cavity (1), and a thin film capacitor (2) is installed in the second cavity (3). The thin film capacitor (2) is filled into the second cavity (3) with potting compound, and a power module (5) is provided on the side of the thin film capacitor (2) away from the filter assembly (9). One side of the thin film capacitor (2) is connected to the power module (5) via a connector, and the other side of the thin film capacitor (2) is also provided with a first input terminal (23) and a second input terminal (24); the first input terminal (23) and the second input terminal (24) draw power from the positive and negative output copper busbars on the filter component (9), and a negative terminal (25) is also provided on one side of the first input terminal (23).

2. The housing for an integrable thin-film capacitor according to claim 1, characterized in that: The first cavity (1) is further provided with a third cavity (16), and the third cavity (16) is provided with a mounting base (13) for installing a high-voltage plug (10).

3. The housing for an integrable thin-film capacitor according to claim 2, characterized in that: The second cavity (3) is also provided with a mounting platform (4) for installing the power module (5), and the upper surface of the mounting platform (4) is higher than the inner bottom surface of the housing (15).

4. The housing for an integrable thin-film capacitor according to claim 3, characterized in that: The mounting platform (4) is provided with a first mounting area (17) for mounting a three-phase current sensor (6) on the side away from the thin film capacitor (2), and a second mounting area (14) for mounting a low-voltage plug (7) is provided on the side of the first mounting area (17).

5. A housing for an integrable thin-film capacitor according to any one of claims 1-4, characterized in that: The thin film capacitor (2) is provided with an aluminum plate on the side facing the housing (15), and the thin film capacitor (2) and the aluminum plate are encapsulated in the second cavity (3) using potting compound.

6. The housing for an integrable thin-film capacitor according to claim 5, characterized in that: The connector is a stacked busbar, and the electrode of the thin film capacitor (2) is directly welded to the connector.

7. The housing for an integrable thin-film capacitor according to claim 6, characterized in that: The connector includes a negative copper busbar (21) and a positive copper busbar (22); wherein the thin film capacitor (2) is connected to the negative terminal of the power module (5) through the negative copper busbar (21), and the positive copper busbar (22) is connected to the positive terminal of the power module (5).

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