Embedded system and terminal device

Abstract

The application discloses an embedded system and a terminal device, and relates to the technical field of power management, wherein the embedded system comprises: a power over Ethernet module configured to provide an input voltage; a primary voltage conversion module connected with the power over Ethernet module and configured to convert the input voltage into a first target voltage; a system-level chip connected with the primary voltage conversion module, and the first target voltage is used for power supply of the system-level chip; a secondary voltage conversion module connected with the primary voltage conversion module and configured to convert the first target voltage into at least two paths of second target voltages; and a load module connected with each path of the second target voltages in the secondary voltage conversion module, and each path of the second target voltages is used for independent power supply of a corresponding load in the load module. The application realizes stable power supply for multiple different loads, avoids mutual interference of power supply paths among multiple loads, and improves power supply reliability and overall performance of the embedded system in a complex scene.

Description

Technical Field

[0001] This application relates to the field of power management technology, and in particular to an embedded system and terminal device. Background Technology

[0002] With the rapid development of IoT technology, embedded systems are increasingly being used in complex scenarios such as industrial control, smart homes, and asset tracking. These scenarios often place comprehensive and high demands on the communication capabilities and location services of devices. Not only do devices need to support short-range Bluetooth communication, long-range low-power Halow connectivity, and high-precision indoor and outdoor positioning, but they also need to have stable and reliable wired network access as a redundancy backup or high-speed data transmission channel.

[0003] However, existing embedded systems are typically designed with communication modules that offer only limited functionality or support only a few communication modes. Furthermore, the communication and positioning functions are often independent, and this architectural limitation makes it difficult for devices to adapt to real-time changing scenario requirements. To meet the demands of such complex scenarios, multiple load modules supporting different communication modes or positioning functions need to be integrated into the embedded system. In this case, due to the varying power requirements of different loads, existing power management systems struggle to provide stable power to embedded systems with complex loads. This fails to meet the integrated and intelligent requirements of modern embedded systems for data transmission and location services in complex scenarios, thus hindering the performance and reliability of embedded systems. Utility Model Content

[0004] The main purpose of this application is to propose an embedded system and terminal device, which aims to solve the technical problem that current embedded systems are difficult to stably power for various different loads.

[0005] To achieve the above objectives, the embedded system proposed in this application includes: Power over Ethernet (PoE) module, used to provide input voltage; A primary voltage conversion module, connected to the Power over Ethernet module, is used to convert the input voltage into a first target voltage; A system-on-a-chip (SoC) is connected to the primary voltage conversion module, and the first target voltage is used to power the SoC. A secondary voltage conversion module, connected to the primary voltage conversion module, is used to convert the first target voltage into at least two second target voltages; A load module is connected to each of the second target voltages in the secondary voltage conversion module, and each of the second target voltages is used to independently power the corresponding load in the load module.

[0006] In one embodiment, the primary voltage conversion module includes: A first voltage conversion chip, the input terminal of which is connected to the Ethernet power supply module, is used to convert the input voltage into a first DC voltage; A step-down chip, the input terminal of which is connected to the output terminal of the first voltage conversion chip, and the output terminal of which is connected to the system-on-a-chip and the secondary voltage conversion module respectively, for converting the first DC voltage into a second DC voltage, so as to use the second DC voltage as the first target voltage.

[0007] In one embodiment, the primary voltage conversion module further includes: The first indicator light is connected to the output terminal of the first voltage conversion chip and is used to indicate the power supply status of the first voltage conversion chip. The second indicator light is connected to the output terminal of the step-down chip and is used to indicate the power supply status of the step-down chip.

[0008] In one embodiment, the load module includes a positioning module, a Halow module, and a WIFI and Bluetooth module, and the secondary voltage conversion module includes: The second voltage conversion chip has its input terminal connected to the primary voltage conversion module and its output terminal connected to the positioning module. It is used to convert the first target voltage into a first channel second target voltage so as to independently power the positioning module through the first channel second target voltage. A third voltage conversion chip, the input terminal of which is connected to the primary voltage conversion module, and the output terminal of which is connected to the Halow module, is used to convert the first target voltage into a second target voltage, so as to independently power the Halow module through the second target voltage; A fourth voltage conversion chip is provided, with its input terminal connected to the primary voltage conversion module and its output terminal connected to the WIFI and Bluetooth module. The fourth voltage conversion chip is used to convert the first target voltage into a third second target voltage, so as to independently power the WIFI and Bluetooth module through the third second target voltage.

[0009] In one embodiment, the secondary voltage conversion module further includes: A first voltage divider circuit, one end of which is connected to the output terminal of the third voltage conversion chip, and the other end of which is connected to the system-on-a-chip (SoC), is used to step down the second target voltage for voltage monitoring by the SoC. The SoC is connected to the third voltage conversion chip so that the SoC can enable the third voltage conversion chip based on the voltage monitoring results. The second voltage divider circuit has one end connected to the output terminal of the fourth voltage conversion chip and the other end connected to the system-on-a-chip (SoC). It is used to step down the third target voltage for voltage monitoring by the SoC. The SoC is connected to the fourth voltage conversion chip so that the SoC can enable the fourth voltage conversion chip based on the voltage monitoring results.

[0010] In one embodiment, the first voltage divider circuit includes: A first resistor, the first end of which is connected to the output terminal of the third voltage conversion chip, and the second end of which is connected to the system-on-a-chip; The second resistor has its first end connected to the second end of the first resistor, and its second end grounded. A first capacitor, wherein a first terminal of the first capacitor is connected to a second terminal of the first resistor, and the second terminal of the first capacitor is grounded; The second voltage divider circuit includes: The third resistor has its first end connected to the output terminal of the fourth voltage conversion chip and its second end connected to the system-on-a-chip. A fourth resistor, wherein the first end of the fourth resistor is connected to the second end of the third resistor, and the second end of the fourth resistor is grounded; The second capacitor has its first terminal connected to the second terminal of the third resistor, and its second terminal is grounded.

[0011] In one embodiment, the secondary voltage conversion module further includes: The third indicator light is connected to the output terminal of the second voltage conversion chip and is used to indicate the power supply status of the second voltage conversion chip; The fourth indicator light is connected to the output terminal of the third voltage conversion chip and is used to indicate the power supply status of the third voltage conversion chip. The fifth indicator light is connected to the output terminal of the fourth voltage conversion chip and is used to indicate the power supply status of the fourth voltage conversion chip.

[0012] In one embodiment, the Power over Ethernet module includes: A lightning surge protection circuit is provided, which is connected to the network cable interface via a differential transmission line. A network transformer, which is connected to the lightning surge protection circuit, is used to separate the AC power signal from the network differential signal of the network cable interface; A rectifier bridge, connected to the network transformer, is used to convert the AC power signal into a DC power signal. A standard specification unit, connected to the rectifier bridge, is used to standardize the power supply standard of the DC signal to provide a standardized input voltage for the primary voltage conversion module.

[0013] In one embodiment, the embedded system further includes: A clock source, used to generate a crystal oscillator signal; A real-time clock chip, which is connected to both the clock source and the system-on-a-chip, is used to generate a time reference signal corresponding to the crystal oscillator signal and transmit the time reference signal to the system-on-a-chip. A first diode, the anode of which is connected to the system-on-a-chip and the cathode of which is connected to the real-time clock chip, is used to provide a first path power supply to the real-time clock chip; The second diode, the positive terminal of which is connected to the system-on-a-chip; A backup battery, wherein the first terminal of the backup battery is connected to the negative terminal of the second diode via a fifth resistor; The third diode has its anode connected to the second terminal of the backup battery and its cathode connected to the real-time clock chip, thus providing a second path of power to the real-time clock chip.

[0014] This application also proposes a terminal device, which is equipped with a communication system and an embedded system as described above. The communication system connects the system-on-a-chip in the embedded system to each corresponding load in the load module. The communication system is used to provide the system-on-a-chip with the communication path corresponding to each corresponding load.

[0015] The embedded system of this application provides input voltage through an Ethernet power supply module. A primary voltage conversion module is connected to the Ethernet power supply module and converts the input voltage into a first target voltage. A system-on-a-chip is connected to the primary voltage conversion module and powered by the first target voltage. A secondary voltage conversion module is connected to the primary voltage conversion module and converts the first target voltage into at least two second target voltages. A load module is connected to each of the second target voltages of the secondary voltage conversion module. Each second target voltage independently powers the corresponding load in the load module, thereby achieving stable power supply for multiple different loads, avoiding mutual interference between power supply paths of multiple loads, and improving the power supply reliability and overall performance of the embedded system in complex scenarios. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of an embodiment of the embedded system provided in this application; Figure 2 A schematic diagram of the primary voltage conversion module structure of an embodiment of the embedded system provided in this application; Figure 3 A schematic diagram of an indicator light structure according to an embodiment of the embedded system provided in this application; Figure 4 A schematic diagram of the secondary voltage conversion module structure of an embodiment of the embedded system provided in this application; Figure 5 A schematic diagram of a voltage divider circuit structure of an embodiment of the embedded system provided in this application; Figure 6 A power-on timing diagram of an embodiment of the embedded system provided in this application; Figure 7 A schematic diagram of another indicator light structure according to an embodiment of the embedded system provided in this application; Figure 8 A schematic diagram of the Ethernet power supply module structure of an embodiment of the embedded system provided in this application; Figure 9 This is a schematic diagram of the clock module structure of an embodiment of the embedded system provided in this application.

[0018] Explanation of icon numbers:

[0019] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0023] Existing embedded systems are typically designed with communication modules that offer only limited functionality or support only a few communication modes. Furthermore, communication and positioning functions are often independent, and this architectural limitation makes it difficult for devices to adapt to real-time changing scenario requirements. To meet the demands of such complex scenarios, multiple load modules supporting different communication modes or positioning functions need to be integrated into the embedded system. However, due to the varying power requirements of different loads, existing power management systems struggle to provide stable power to embedded systems with complex loads. This fails to meet the integrated and intelligent demands of modern embedded systems for data transmission and location services in complex scenarios, thus hindering the performance and reliability of embedded systems.

[0024] Based on this, this application proposes an embedded system and terminal device. The embedded system includes: an Ethernet power supply module for providing an input voltage; a primary voltage conversion module connected to the Ethernet power supply module for converting the input voltage into a first target voltage; a system-on-a-chip (SoC) connected to the primary voltage conversion module, wherein the first target voltage powers the SoC; a secondary voltage conversion module connected to the primary voltage conversion module for converting the first target voltage into at least two second target voltages; and a load module connected to each of the second target voltages in the secondary voltage conversion module, wherein each second target voltage independently powers a corresponding load in the load module.

[0025] The embedded system of this application provides input voltage through an Ethernet power supply module. A primary voltage conversion module is connected to the Ethernet power supply module and converts the input voltage into a first target voltage. A system-on-a-chip is connected to the primary voltage conversion module and powered by the first target voltage. A secondary voltage conversion module is connected to the primary voltage conversion module and converts the first target voltage into at least two second target voltages. A load module is connected to each of the second target voltages of the secondary voltage conversion module. Each second target voltage independently powers the corresponding load in the load module, thereby achieving stable power supply for multiple different loads, avoiding mutual interference between power supply paths of multiple loads, and improving the power supply reliability and overall performance of the embedded system in complex scenarios.

[0026] This application proposes an embedded system.

[0027] Please see Figure 1 In one embodiment of this application, the embedded system includes: Power over Ethernet module 10 is used to provide input voltage; Primary voltage conversion module 20, which is connected to the Ethernet power supply module 10, is used to convert the input voltage into a first target voltage; A system-on-a-chip 30 is connected to the primary voltage conversion module 20, and the first target voltage is used to power the system-on-a-chip 30. Secondary voltage conversion module 40, which is connected to the primary voltage conversion module 20, is used to convert the first target voltage into at least two second target voltages; The load module 50 is connected to each of the second target voltages in the secondary voltage conversion module 40. Each of the second target voltages is used to independently power the corresponding load in the load module 50.

[0028] It should be noted that the Power over Ethernet (PoE) module 10 is a hardware structure module that receives and provides power to the device through a standard Ethernet cable. The input end of the module is connected to the external network through the network cable interface, and its output end is connected to the primary voltage conversion module 20. Its function is to obtain power from the network cable and output an initial input voltage.

[0029] The primary voltage conversion module 20 is a circuit structure unit that performs a single-stage voltage conversion. Physically, its input terminal is connected to the output terminal of the Power over Ethernet (PoE) module 10, and its output terminal is connected to both the system-on-a-chip (SoC) 30 and the secondary voltage conversion module 40. Its function is to convert the input voltage provided by the PoE module 10 into a stable, first target voltage with a different value. The first target voltage refers to a specific, stable DC voltage generated by the primary voltage conversion module 20. This voltage is simultaneously supplied to the power input terminal of the SoC 30 and the input terminal of the secondary voltage conversion module 40, serving as the power supply for these two circuits.

[0030] The system-on-a-chip (SoC) 30 is a large-scale integrated circuit chip that integrates a central processing unit, a memory unit, and various peripheral control interfaces. In terms of physical connection, its power supply pins are connected to the output of the primary voltage conversion module 20, and it is directly powered by the first target voltage. It is the core computing and control unit of the embedded system.

[0031] The secondary voltage conversion module 40 is a circuit structure unit that performs secondary voltage distribution and conversion. Physically, its input terminal is connected to the output terminal of the primary voltage conversion module 20. Its function is to convert the input first target voltage into at least two electrically independent second target voltages. These second target voltages refer to multiple stable DC voltages generated by the secondary voltage conversion module 40. The secondary voltage conversion module 40 outputs at least two such voltages, each of which is independently connected to a specific load in the load module, dedicated to powering that load.

[0032] The load module is a collective term for all functional units in an embedded system that require power to operate. In terms of physical connection, each load contained within this module is directly connected to the respective second target voltage output from the secondary voltage conversion module 40, thereby receiving electrical energy.

[0033] For example, the embedded system structurally includes a Power over Ethernet (PoE) module 10, a primary voltage conversion module 20, a secondary voltage conversion module 40, and a load module 50 connected in sequence. It also includes a system-on-a-chip (SoC) 30 directly powered by the primary voltage conversion module, and an RGB module, where the RGB module is used to meet the power consumption requirements of the embedded system's lighting display. Specifically, the PoE module 10 obtains power from an external source via a network cable interface and outputs an input voltage of 24V. This input voltage is sent to the connected primary voltage conversion module 20, which converts and stabilizes the input voltage to a unified first target voltage of 5V. This first target voltage directly powers the SoC 30 (e.g., 5V 1A) and the RGB (Red, Green, Blue) module (e.g., 5V 500mA). Simultaneously, it is sent to the secondary voltage conversion module 40, which converts the input first target voltage into multiple independent second target voltages, such as 3.3V 200mA, 3.3V 600mA, and 3.3V 800mA. Each load in the load module 50 is physically connected to one of the second target voltages output by the secondary voltage conversion module 40, thereby enabling each load to be independently powered by a dedicated voltage path.

[0034] The embedded system of this application provides input voltage through the Ethernet power supply module 10. The primary voltage conversion module 20 is connected to the Ethernet power supply module 10 and converts the input voltage into a first target voltage. The system-on-a-chip 30 is connected to the primary voltage conversion module 20 and is powered by the first target voltage. The secondary voltage conversion module 40 is connected to the primary voltage conversion module 20 and converts the first target voltage into at least two second target voltages. The load module 50 is connected to each of the second target voltages of the secondary voltage conversion module 40. Each second target voltage independently powers the corresponding load in the load module 50, thereby achieving stable power supply for multiple different loads, avoiding mutual interference between power supply paths of multiple loads, and improving the power supply reliability and overall performance of the embedded system in complex scenarios.

[0035] In one feasible implementation, please refer to Figure 2 The primary voltage conversion module 20 includes: The first voltage conversion chip 21 has its input terminal connected to the Ethernet power supply module 10 and is used to convert the input voltage into a first DC voltage. A step-down chip 22 is provided, the input terminal of which is connected to the output terminal of the first voltage conversion chip 21, and the output terminal of the step-down chip 22 is connected to the system-on-a-chip 30 and the secondary voltage conversion module 40, respectively, for converting the first DC voltage into a second DC voltage, so as to use the second DC voltage as the first target voltage.

[0036] It should be noted that the first voltage conversion chip 21 is a dedicated integrated circuit used to perform preliminary voltage conversion. Physically, its input terminal is directly connected to the output terminal of the Power over Ethernet (PoE) module 10. Its function is to convert the input voltage provided by the PoE module 10, which is typically the voltage of the Ethernet line, and output a first DC voltage different from the input voltage as the primary voltage source for subsequent power conversion. In one embodiment, the first voltage conversion chip 21 can be a DC (Direct Current) to DC converter chip of model MP4541.

[0037] The step-down chip 22 is a voltage regulator integrated circuit used to reduce the voltage value. Physically, its input terminal is directly connected to the output terminal of the first voltage conversion chip 21, and its output terminal is connected to the power input terminal of the system-on-a-chip 30 and the input terminal of the secondary voltage conversion module 40, respectively. Its function is to step down and regulate the first DC voltage output by the first voltage conversion chip 21, converting it into a lower and more stable second DC voltage, and using this second DC voltage as the first target voltage to power both the system-on-a-chip 30 and the secondary voltage conversion module 40. In one embodiment, the step-down chip 22 can be a DC-DC converter chip of model MP2491.

[0038] Understandably, since a single voltage conversion structure often cannot simultaneously meet the requirements of a wide input voltage range and high output accuracy, a hardware connection structure in which the first voltage conversion chip 21 and the step-down chip 22 are cascaded is adopted to complete the voltage conversion task in two stages. This avoids the problem of unstable system power supply caused by input voltage fluctuations or low conversion efficiency, and achieves more efficient and precise control of the first target voltage, further improving the power supply quality of the system-on-a-chip 30 and the secondary voltage conversion module 40.

[0039] In one feasible implementation, please refer to Figure 3 The primary voltage conversion module 20 further includes: The first indicator light 23 is connected to the output terminal of the first voltage conversion chip 21 and is used to indicate the power supply status of the first voltage conversion chip 21. The second indicator light 24 is connected to the output terminal of the step-down chip 22 and is used to indicate the power supply status of the step-down chip 22.

[0040] It should be noted that the first indicator light 23 is a light-emitting device used to display the circuit status. In terms of physical connection, this indicator light is directly connected to the output terminal of the first voltage conversion chip 21, and its function is to visually indicate whether the first voltage conversion chip 21 is outputting the first DC voltage normally by illuminating or extinguishing the light.

[0041] The second indicator light 24 is another light-emitting device used to display the circuit status. Physically, this indicator light is directly connected to the output terminal of the buck chip 22, and its function is to visually indicate whether the buck chip 22 is normally outputting a second DC voltage as the first target voltage by illuminating or extinguishing the light.

[0042] Understandably, since the working status of the two-stage conversion circuit inside the primary voltage conversion module 20 cannot be intuitively judged, it is not conducive to system debugging and fault diagnosis. Therefore, by directly connecting the first indicator light 23 and the second indicator light 24 to the output terminal of the first voltage conversion chip 21 and the output terminal of the step-down chip 22 respectively, the maintenance difficulties and technical blind spots caused by unclear power supply status are avoided. This enables real-time and intuitive indication of the power supply status of key nodes of the primary voltage conversion module 20, improving the maintainability and stability of the system.

[0043] For example, in the hardware structure of the primary voltage conversion module 20, the positive pin of the first indicator light 23 is directly connected to the voltage output pin of the first voltage conversion chip 21 through a circuit, and its negative pin is grounded, so that the presence or absence of the first DC voltage can be intuitively displayed by the lighting or extinguishing of the indicator light; at the same time, the positive pin of the second indicator light 24 is directly connected to the voltage output pin of the step-down chip 22 through a circuit, and its negative pin is grounded, so that the presence or absence of the second DC voltage (i.e. the first target voltage) can be intuitively displayed by the lighting or extinguishing of the indicator light, thereby forming an independent hardware indication structure for the two-stage output status of the primary voltage conversion module.

[0044] In one feasible implementation, please refer to Figure 4 The load module 50 includes a positioning module 51, a Halow module 52, and a WIFI and Bluetooth module 53. The secondary voltage conversion module 40 includes: The second voltage conversion chip 41 has its input terminal connected to the primary voltage conversion module 20 and its output terminal connected to the positioning module 51. It is used to convert the first target voltage into a first-path second target voltage so as to independently power the positioning module 51 through the first-path second target voltage. The third voltage conversion chip 42 has its input terminal connected to the primary voltage conversion module 20 and its output terminal connected to the Halow module 52. It is used to convert the first target voltage into a second target voltage so as to independently power the Halow module 52 through the second target voltage. The fourth voltage conversion chip 43 has its input terminal connected to the primary voltage conversion module 20 and its output terminal connected to the WIFI and Bluetooth module 53. It is used to convert the first target voltage into a third second target voltage so as to independently power the WIFI and Bluetooth module 53 through the third second target voltage.

[0045] It should be noted that the second voltage conversion chip 41 is a dedicated voltage conversion integrated circuit. Physically, its input terminal is connected to the output terminal of the primary voltage conversion module 20, and its output terminal is connected to the power input terminal of the positioning module 51. Its function is to convert the first target voltage from the primary voltage conversion module 20 to generate a first second target voltage. The positioning module 51 is an independent hardware unit with location calculation and acquisition functions, such as a GPS (Global Positioning System) module or a BeiDou module. Physically, its power input terminal is directly connected to the output terminal of the second voltage conversion chip 41, and it is powered by the first second target voltage to achieve its positioning function. The first second target voltage refers to a stable DC voltage generated after the second voltage conversion chip 41 converts the first target voltage. This voltage exists independently in the circuit and is specifically supplied to the positioning module 51 as its operating voltage. In one embodiment, the second voltage conversion chip 41 can be a DC-DC converter chip of model MP1603C.

[0046] The third voltage conversion chip 42 refers to another dedicated voltage conversion integrated circuit. Physically, its input terminal is connected to the output terminal of the primary voltage conversion module 20, and its output terminal is connected to the power input terminal of the Halow module 51. Its function is to convert the first target voltage to generate a second target voltage. The Halow module 51 is an independent hardware unit supporting the IEEE 802.11ah standard for long-range low-power wireless communication. Physically, its power input terminal is directly connected to the output terminal of the third voltage conversion chip 42, and it is powered by the second target voltage to achieve its long-range low-power WiFi communication function. The second target voltage is a stable DC voltage generated after the third voltage conversion chip 42 converts the first target voltage. This voltage exists independently in the circuit and is specifically supplied to the Halow module 52 as its operating voltage. In one embodiment, the third voltage conversion chip 42 can also be another DC-DC converter chip, model MP1603C, different from the second voltage conversion chip 41.

[0047] The fourth voltage conversion chip 43 is another dedicated voltage conversion integrated circuit. Physically, its input terminal is connected to the output terminal of the primary voltage conversion module 20, and its output terminal is connected to the power input terminal of the WiFi and Bluetooth module 53. Its function is to convert the first target voltage to generate a third, second target voltage. The WiFi and Bluetooth module 53 is an independent composite hardware unit supporting conventional WiFi and Bluetooth standard communication. Physically, its power input terminal is directly connected to the output terminal of the fourth voltage conversion chip 43, and it is powered by the third, second target voltage to achieve its short-range wireless communication function. The third, second target voltage is a stable DC voltage generated by the fourth voltage conversion chip 43 after converting the first target voltage. This voltage exists independently in the circuit and is specifically supplied to the WiFi and Bluetooth module 53 as its operating voltage. In one embodiment, the fourth voltage conversion chip 43 can also be another DC-DC conversion chip, model MP1603C, different from the second voltage conversion chip 41 and the third voltage conversion chip 42.

[0048] Understandably, since the load module 50 contains multiple core loads with different functions and power consumption, such as the positioning module 51, the Halow module 52, and the WiFi and Bluetooth module 53, a single second target voltage cannot meet the independent power supply requirements of all loads. Therefore, by using three independent hardware circuits—the second voltage conversion chip 41, the third voltage conversion chip 42, and the fourth voltage conversion chip 43—which are connected to the primary voltage conversion module 20 respectively, each outputs a dedicated second target voltage to independently power its corresponding load module. This avoids the mutual interference and stability degradation that may occur when different loads share the same power supply, and achieves accurate, independent, and stable power supply for the key communication and positioning loads in the system, ensuring their stable operation at the same time.

[0049] For example, the secondary voltage conversion module 40 includes three independent voltage conversion chips in its hardware structure. The input terminal of the second voltage conversion chip 41 is connected to the output terminal of the primary voltage conversion module 20, and its output terminal generates a first second target voltage and is directly connected to the power interface of the positioning module 51 to provide independent power. The input terminal of the third voltage conversion chip 42 is also connected to the output terminal of the primary voltage conversion module 20, and its output terminal generates a second second target voltage and is directly connected to the power interface of the Halow module 52 to provide independent power. The input terminal of the fourth voltage conversion chip 43 is also connected to the output terminal of the primary voltage conversion module 20, and its output terminal generates a third second target voltage and is directly connected to the power interface of the WiFi and Bluetooth module 53 to provide independent power. Thus, stable and non-interfering power is provided to three different types of load modules through three parallel dedicated power paths.

[0050] In one feasible implementation, please refer to Figure 5 The secondary voltage conversion module 40 further includes: A first voltage divider circuit 44, one end of which is connected to the output terminal of the third voltage conversion chip 42, and the other end of which is connected to the system-on-a-chip 30, is used to step down the second target voltage for voltage monitoring by the system-on-a-chip 30. The system-on-a-chip 30 is connected to the third voltage conversion chip 42 so that the system-on-a-chip 30 can enable the third voltage conversion chip 42 based on the voltage monitoring results. The second voltage divider circuit 45 has one end connected to the output terminal of the fourth voltage conversion chip 43 and the other end connected to the system-on-a-chip 30. It is used to step down the third second target voltage for voltage monitoring by the system-on-a-chip 30. The system-on-a-chip 30 is connected to the fourth voltage conversion chip 43 so that the system-on-a-chip 30 can enable the fourth voltage conversion chip 43 based on the voltage monitoring results.

[0051] It should be noted that the first voltage divider circuit 44 is a hardware detection circuit composed of passive components such as resistors and capacitors. Physically, one end of this circuit is connected to the output terminal of the third voltage conversion chip 42, and the other end is connected to the analog signal detection pin of the system-on-a-chip 30. Its function is to proportionally reduce the second target voltage output from the third voltage conversion chip 42 to a range that the system-on-a-chip 30 can safely read, using the principle of resistor voltage division, so that the system-on-a-chip 30 can monitor this voltage.

[0052] The second voltage divider circuit 44 is another hardware detection circuit composed of passive components such as resistors and capacitors. Physically, one end of this circuit is connected to the output of the fourth voltage conversion chip 43, and the other end is connected to another analog signal detection pin of the system-on-a-chip 30. Its function is to proportionally reduce the third target voltage output by the fourth voltage conversion chip 43 to a range that the system-on-a-chip can safely read, so that the system-on-a-chip 30 can monitor this voltage.

[0053] Understandably, due to the need to monitor the power supply status of critical communication loads in real time and achieve intelligent power management, two independent hardware sampling networks, the first voltage divider circuit 44 and the second voltage divider circuit 45, are used. These networks are directly connected to the output terminals of the third voltage conversion chip 42 and the fourth voltage conversion chip 43, as well as the monitoring pins of the system-on-a-chip 30, respectively. This constructs a voltage feedback path from the power output to the system-on-a-chip 30, avoiding communication instability or module damage caused by the inability to detect abnormal power supply of the Halow module 52 and the WiFi and Bluetooth modules 53 in real time. This enables the system-on-a-chip 30 to perform hardware-level monitoring of the power supply of specific loads and precise enable control based on the monitoring results, thereby improving the intelligence and reliability of the system power supply.

[0054] In specific implementation, the first voltage divider circuit 44 includes: A first resistor R1, the first end of which is connected to the output terminal of the third voltage conversion chip 42, and the second end of which is connected to the system-on-a-chip 30; The second resistor R2 has its first end connected to the second end of the first resistor R1, and its second end is grounded (GND). A first capacitor C1, the first end of the first capacitor C1 is connected to the second end of the first resistor R1, and the second end of the first capacitor C1 is grounded to GND. The second voltage divider circuit 45 includes: The third resistor R3 has its first end connected to the output terminal of the fourth voltage conversion chip 43, and its second end connected to the system-on-a-chip 30. The fourth resistor R4 has its first end connected to the second end of the third resistor R3, and its second end is grounded (GND). The second capacitor C2 has its first terminal connected to the second terminal of the third resistor R3, and its second terminal is grounded to GND.

[0055] in, Figure 6 This diagram illustrates the power-on timing controlled by the system-on-chip 30 in this embodiment. In this diagram, 24V represents the first DC voltage, 5V represents the second DC voltage (i.e., the first target voltage), VDD represents the first path of the second target voltage, VDDB represents the second path of the second target voltage, and VDDC represents the third path of the second target voltage. The 5V voltage is not output immediately after the 24V voltage is powered on. Instead, it is delayed for more than 100ms under the control of the system-on-chip 30 or the buck converter 22, allowing the 24V power supply to stabilize first and preventing voltage fluctuations from affecting the stability of the subsequent 5V conversion. After the 5V voltage is powered on, the system-on-chip 30 begins initialization. After initialization, the system-on-chip 30 outputs a power enable signal after a delay of, for example, 50ms. Figure 5 The dashed path in the diagram. After the system-on-a-chip 30 outputs the power enable signal, the three power supplies, such as the 3.3V supply, VDD, VDDB, and VDDC, will be powered on.

[0056] Understandably, allowing the system-on-a-chip 30 to complete its own initialization first ensures that it can properly control and monitor subsequent power supplies, thus avoiding surge current impacts caused by multiple power supplies being powered on simultaneously, thereby protecting the power supply chip and the load.

[0057] This embodiment employs a hardware scheme that uses a first voltage divider circuit 44 consisting of a first resistor R1, a second resistor R2, and a first capacitor C1 connected in a specific series and ground connection, and a second voltage divider circuit 45 consisting of a third resistor R3, a fourth resistor R4, and a second capacitor C2 connected in a specific series and ground connection. This avoids the problem of voltage monitoring signal distortion or instability caused by signal noise or load changes in simple voltage divider circuits, and achieves a stable, reliable, and interference-resistant voltage sampling signal for the system-on-a-chip 30, thereby ensuring the accuracy of enable control.

[0058] In one feasible implementation, please refer to Figure 7 The secondary voltage conversion module 40 further includes: The third indicator light 46 is connected to the output terminal of the second voltage conversion chip 41 and is used to indicate the power supply status of the second voltage conversion chip 41. The fourth indicator light 47 is connected to the output terminal of the third voltage conversion chip 42 and is used to indicate the power supply status of the third voltage conversion chip 42. The fifth indicator light 48 is connected to the output terminal of the fourth voltage conversion chip 43 and is used to indicate the power supply status of the fourth voltage conversion chip 43.

[0059] It should be noted that the third indicator light 46 is a light-emitting device used to display the circuit status. In terms of physical connection, this indicator light is directly connected to the output terminal of the second voltage conversion chip 41. Its function is to visually indicate whether the second voltage conversion chip 41 is normally outputting the first channel second target voltage by illuminating or extinguishing the light, thereby reflecting the power supply status of the positioning module 51.

[0060] The fourth indicator light 47 is another light-emitting device used to display the circuit status. Physically, this indicator light is directly connected to the output terminal of the third voltage conversion chip 42. Its function is to visually indicate whether the third voltage conversion chip 42 is normally outputting the second target voltage by illuminating or extinguishing the light, thereby reflecting the power supply status of the Halow module 52.

[0061] The fifth indicator light 48 is another light-emitting device used to display the circuit status. Physically, this indicator light is directly connected to the output terminal of the fourth voltage conversion chip 43. Its function is to visually indicate whether the fourth voltage conversion chip 43 is normally outputting the third second target voltage by illuminating or extinguishing the light, thereby reflecting the power supply status of the WiFi and Bluetooth module 53.

[0062] Understandably, the inability to quickly locate the operating status of each power supply in the secondary voltage conversion module 40 often poses difficulties for system debugging and troubleshooting. Therefore, by directly connecting the three independent light-emitting devices, the third indicator light 46, the fourth indicator light 47, and the fifth indicator light 48, to the output terminals of the second voltage conversion chip 41, the third voltage conversion chip 42, and the fourth voltage conversion chip 43 respectively, the hardware structure avoids the low maintenance efficiency and technical blind spots caused by the inability to intuitively determine the real-time power supply status of the positioning module 51, the Halow module 52, and the WiFi and Bluetooth module 53. This achieves independent, real-time, and intuitive indication of the power supply status of each key load, significantly improving the system's on-site maintainability and operational status transparency.

[0063] For example, in the hardware structure of the secondary voltage conversion module 40, the positive pin of the third indicator light 46 is directly connected to the voltage output pin of the second voltage conversion chip 41 through a circuit, and its negative pin is grounded, so that the presence or absence of the first second target voltage can be intuitively displayed by the lighting or extinguishing of the indicator light; the positive pin of the fourth indicator light 47 is directly connected to the voltage output pin of the third voltage conversion chip 42 through a circuit, and its negative pin is grounded, so that the presence or absence of the second second target voltage can be intuitively displayed by the lighting or extinguishing of the indicator light; the positive pin of the fifth indicator light 48 is directly connected to the voltage output pin of the fourth voltage conversion chip 43 through a circuit, and its negative pin is grounded, so that the presence or absence of the third second target voltage can be intuitively displayed by the lighting or extinguishing of the indicator light, thereby forming an independent hardware indication structure for the status of the three load power supplies.

[0064] In one feasible implementation, please refer to Figure 8 The Ethernet power supply module 10 includes: Lightning surge protection circuit 11, which is connected to network cable interface 15 via differential transmission line; Network transformer 12, the network transformer 12 being used to separate the power AC signal from the network differential signal of the network cable interface 15; A rectifier bridge 13 is connected to the network transformer 12 and is used to convert the AC power signal into a DC power signal. The standard specification unit 14 is connected to the rectifier bridge 13 and is used to standardize the power supply standard of the DC signal to provide the standardized input voltage to the primary voltage conversion module 20.

[0065] It should be noted that the lightning surge protection circuit 11 refers to a hardware protection circuit composed of transient voltage suppression diodes or gas discharge tubes, and protective components such as varistors. Physically, one end of this circuit is directly connected to the differential transmission line of the network cable interface 15, and the other end is connected to the primary side of the network transformer 12. Its function is to quickly conduct and discharge the overvoltage energy to the ground when the network cable is subjected to high-voltage spike pulses such as lightning strikes or power grid surges, thereby protecting the subsequent network transformer 12 and the entire Ethernet power supply module 10 from damage. Specifically, when the gas discharge tube encounters a high-voltage surge generated by lightning, it will quickly break down and conduct, diverting a large current to the ground, thus limiting the voltage peak. The varistor, when the voltage exceeds its threshold, will experience a sharp drop in resistance, similar to a short circuit, which can quickly discharge the surge current and clamp the voltage to prevent excessive voltage from being transmitted to subsequent circuits.

[0066] The network transformer 12 is a magnetic component used for Ethernet signal coupling and power isolation. Physically, its primary side is connected to the network cable interface 15 via a differential transmission line, and a set of coils on the secondary side is connected to the rectifier bridge 13. Its function is to separate the AC power signal from the mixed signal transmitted through the network cable and provide electrical isolation.

[0067] The rectifier bridge 13 is a bridge rectifier circuit composed of multiple diodes. In terms of physical connection, its AC input terminal is connected to the corresponding output terminal of the network transformer 12, and its DC output terminal is connected to the standard specification unit 14. Its function is to perform full-wave rectification of the AC power signal separated by the network transformer 12 and convert it into a DC power signal with pulsating characteristics.

[0068] The standard specification unit 14 is an integrated circuit or circuit module used to implement PoE (Power over Ethernet) power contracts and protection. Physically, its input is connected to the DC output of the rectifier bridge 13, and its output is connected to the input of the primary voltage conversion module 20. Its function is to detect and standardize the DC power signal from the rectifier bridge 13 to conform to specific PoE power supply standards, such as IEEE 802.3 at, thereby providing a stable and protected standardized input voltage for subsequent circuits. Furthermore, the standard specification unit 14 can also connect to the negative terminal of a diode, with the positive terminal grounded, thus forming the power supply negative terminal.

[0069] Understandably, since the Ethernet power supply signal mixes data and power, and its voltage is fluctuating and non-standard, direct use may damage subsequent circuits. Therefore, by adopting a hardware structure in which the network transformer 12, rectifier bridge 13 and standard specification unit 14 are connected in sequence, the network transformer 12 performs signal separation and electrical isolation, the rectifier bridge 13 converts AC power to DC power, and the standard specification unit 14 finally identifies and standardizes the voltage. This avoids the problems of system instability or even hardware damage caused by impure power supply signals, non-standard voltage, or insufficient electrical isolation, and provides a stable, safe and industry-standard compliant input voltage for the primary voltage conversion module 20.

[0070] For example, the Power over Ethernet (PoE) module 10 includes, in its hardware structure, a lightning surge protection circuit 11, a network transformer 12, a rectifier bridge 13, and a standard specification unit 14 connected in sequence. The lightning surge protection circuit 11 includes multiple gas discharge tubes and multiple varistors. One end of each gas discharge tube is connected across a set of differential transmission lines of the network cable interface 15, and the other end is connected to one end of a varistor, while the other end of the varistor is grounded. This forms a multi-stage coordinated overvoltage discharge path. When a surge voltage arrives, the gas discharge tubes first break down to discharge the amplified current, while the varistors provide precise voltage clamping. Together, they conduct overvoltage energy into the ground; the primary side pins of the network transformer 12 are connected to the lightning surge protection circuit 11 through a differential transmission line, and a set of coil output terminals on the secondary side are connected to the AC input pins of the rectifier bridge 13; the DC output pins of the rectifier bridge 13 are connected to the power input pins of the standard specification unit 14; the power output pins of the standard specification unit 14 are connected to the input terminal of the primary voltage conversion module 20. Thus, through the sequential connection and coordinated operation of this series of hardware circuits, the AC power signal is extracted from the network cable interface 15, isolated, rectified and specified, and then a stable and reliable specified input voltage is output to the subsequent circuits.

[0071] In one feasible implementation, please refer to Figure 9 The embedded system further includes: Clock source 61, which is used to generate crystal oscillator signals; Real-time clock chip 62 is connected to clock source 61 and system-on-chip 30 respectively, and is used to generate time reference signal corresponding to crystal oscillator signal and transmit time reference signal to system-on-chip 30. A first diode D1, the positive terminal of which is connected to the system-on-a-chip 30, and the negative terminal of which is connected to the real-time clock chip 62, are used to provide a first path power supply to the real-time clock chip 62. The second diode D2, the positive terminal of the second diode D2 is connected to the system-on-a-chip 30; A backup battery 63, the first terminal of which is connected to the negative terminal of the second diode D2 via a fifth resistor R5; The third diode D3 has its positive terminal connected to the second terminal of the backup battery 63 and its negative terminal connected to the real-time clock chip 62, thereby providing a second path of power to the real-time clock chip 62.

[0072] It should be noted that clock source 61 refers to a hardware component used to generate a stable frequency clock signal, typically a crystal oscillator. Physically, the output pin of this component is connected to the clock input pin of the real-time clock chip 62, and its function is to provide a high-precision crystal oscillator signal as the time and frequency reference for the entire system.

[0073] The real-time clock chip 62 is a dedicated integrated circuit chip with independent timing function, capable of continuously recording time and date. Physically, its power supply pins receive power through a power supply circuit composed of a first diode D1 and a third diode D3. Its clock input is connected to the clock source 61, and its data interface is connected to the corresponding input / output pins of the system-on-a-chip 30. Its function is to generate a precise time reference signal using the crystal oscillator signal provided by the clock source 61 and transmit this signal to the system-on-a-chip 30.

[0074] The backup battery 63 refers to an independent power source that provides backup power to a specific circuit when the main power supply fails. Specifically, it can be a coin cell battery. Physically, the positive terminal of this battery is connected to the power supply pin of the real-time clock chip 62 via a path formed by the second diode D2 and the third diode D3. Its function is to automatically provide a second path of power to the real-time clock chip 62 when the system's main power supply (i.e., the first target voltage) fails, so as to maintain its continuous timing without losing time data.

[0075] Understandably, since a power outage of the system's main power supply would cause the real-time clock chip 62 to lose timing information, thus affecting the continuity of the system's time base, two independent hardware power supply circuits are adopted. One circuit consists of a first-path power supply composed of a first diode D1, and the other circuit consists of a second-path power supply composed of a backup battery 63, a fifth resistor R5, a second diode D2, and a third diode D3. Their outputs are connected to the power supply pins of the real-time clock chip 62. This avoids the problem of the real-time clock chip 62 stopping working and losing time information due to a power outage of the system-on-a-chip 30 or a failure of the main power supply. It achieves continuous and stable operation of the real-time clock chip under the condition of automatic and seamless switching between the main and backup power supplies, ensuring the uninterrupted operation of the system's time base.

[0076] For example, the embedded system adds a clock source 61, a real-time clock chip 62, a backup battery 63, and a power switching circuit composed of a first diode D1, a second diode D2, a third diode D3, and a fifth resistor R5 to its hardware structure. The output pin of the clock source 61 is connected to the clock input pin of the real-time clock chip 62, and the data interface of the real-time clock chip 62 is connected to the general-purpose input / output pin of the system-on-a-chip 30. The anode of the first diode D1 is connected to a first target voltage network provided by the primary voltage conversion module 20 and supplied to the system-on-a-chip 30, and its cathode is connected to the power supply pin of the real-time clock chip 62. The anode of the second diode D2 is also connected to the first target voltage network, and its cathode is connected to the cathode of the backup battery 63 through a current-limiting fifth resistor R5. The anode of the backup battery 63 is connected to the anode of the third diode D3, and the cathode of the third diode D3 is connected to the power supply pin of the real-time clock chip 62. Thus, the unidirectional conductivity of these three diodes forms an automatic power switching circuit, realizing a hardware connection structure in which the first target voltage is powered by the diode when it is normal and the backup battery provides seamless power when the power is lost.

[0077] This application also proposes a terminal device equipped with a communication system and an embedded system. The specific structure of the embedded system is as described in the above embodiments. Since this terminal device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here. The communication system connects the system-on-a-chip (SoC) in the embedded system to each corresponding load in the load module, and the communication system provides the SoC with communication paths corresponding to each load.

[0078] The above description is merely an exemplary embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the technical concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. An embedded system, characterized in that, The embedded system includes: Power over Ethernet (PoE) module, used to provide input voltage; A primary voltage conversion module, connected to the Power over Ethernet module, is used to convert the input voltage into a first target voltage; A system-on-a-chip (SoC) is connected to the primary voltage conversion module, and the first target voltage is used to power the SoC. A secondary voltage conversion module, connected to the primary voltage conversion module, is used to convert the first target voltage into at least two second target voltages; A load module is connected to each of the second target voltages in the secondary voltage conversion module, and each of the second target voltages is used to independently power the corresponding load in the load module.

2. The embedded system as described in claim 1, characterized in that, The primary voltage conversion module includes: A first voltage conversion chip, the input terminal of which is connected to the Ethernet power supply module, is used to convert the input voltage into a first DC voltage; A step-down chip, the input terminal of which is connected to the output terminal of the first voltage conversion chip, and the output terminal of which is connected to the system-on-a-chip and the secondary voltage conversion module respectively, for converting the first DC voltage into a second DC voltage, so as to use the second DC voltage as the first target voltage.

3. The embedded system as described in claim 2, characterized in that, The primary voltage conversion module also includes: The first indicator light is connected to the output terminal of the first voltage conversion chip and is used to indicate the power supply status of the first voltage conversion chip. The second indicator light is connected to the output terminal of the step-down chip and is used to indicate the power supply status of the step-down chip.

4. The embedded system as described in claim 1, characterized in that, The load module includes a positioning module, a Halow module, and a WIFI and Bluetooth module; the secondary voltage conversion module includes: The second voltage conversion chip has its input terminal connected to the primary voltage conversion module and its output terminal connected to the positioning module. It is used to convert the first target voltage into a first channel second target voltage so as to independently power the positioning module through the first channel second target voltage. A third voltage conversion chip, the input terminal of which is connected to the primary voltage conversion module, and the output terminal of which is connected to the Halow module, is used to convert the first target voltage into a second target voltage, so as to independently power the Halow module through the second target voltage; A fourth voltage conversion chip is provided, with its input terminal connected to the primary voltage conversion module and its output terminal connected to the WIFI and Bluetooth module. The fourth voltage conversion chip is used to convert the first target voltage into a third second target voltage, so as to independently power the WIFI and Bluetooth module through the third second target voltage.

5. The embedded system as described in claim 4, characterized in that, The secondary voltage conversion module also includes: A first voltage divider circuit, one end of which is connected to the output terminal of the third voltage conversion chip, and the other end of which is connected to the system-on-a-chip (SoC), is used to step down the second target voltage for voltage monitoring by the SoC. The SoC is connected to the third voltage conversion chip so that the SoC can enable the third voltage conversion chip based on the voltage monitoring results. The second voltage divider circuit has one end connected to the output terminal of the fourth voltage conversion chip and the other end connected to the system-on-a-chip (SoC). It is used to step down the third target voltage for voltage monitoring by the SoC. The SoC is connected to the fourth voltage conversion chip so that the SoC can enable the fourth voltage conversion chip based on the voltage monitoring results.

6. The embedded system as described in claim 5, characterized in that, The first voltage divider circuit includes: A first resistor, the first end of which is connected to the output terminal of the third voltage conversion chip, and the second end of which is connected to the system-on-a-chip; The second resistor has its first end connected to the second end of the first resistor, and its second end grounded. A first capacitor, wherein a first terminal of the first capacitor is connected to a second terminal of the first resistor, and the second terminal of the first capacitor is grounded; The second voltage divider circuit includes: The third resistor has its first end connected to the output terminal of the fourth voltage conversion chip and its second end connected to the system-on-a-chip. A fourth resistor, wherein the first end of the fourth resistor is connected to the second end of the third resistor, and the second end of the fourth resistor is grounded; The second capacitor has its first terminal connected to the second terminal of the third resistor, and its second terminal is grounded.

7. The embedded system as described in claim 4, characterized in that, The secondary voltage conversion module also includes: The third indicator light is connected to the output terminal of the second voltage conversion chip and is used to indicate the power supply status of the second voltage conversion chip; The fourth indicator light is connected to the output terminal of the third voltage conversion chip and is used to indicate the power supply status of the third voltage conversion chip. The fifth indicator light is connected to the output terminal of the fourth voltage conversion chip and is used to indicate the power supply status of the fourth voltage conversion chip.

8. The embedded system as described in claim 1, characterized in that, The Power over Ethernet module includes: A lightning surge protection circuit is provided, which is connected to the network cable interface via a differential transmission line. A network transformer, which is connected to the lightning surge protection circuit, is used to separate the AC power signal from the network differential signal of the network cable interface; A rectifier bridge, connected to the network transformer, is used to convert the AC power signal into a DC power signal. A standard specification unit, connected to the rectifier bridge, is used to standardize the power supply standard of the DC signal to provide a standardized input voltage for the primary voltage conversion module.

9. The embedded system as described in claim 1, characterized in that, The embedded system also includes: A clock source, which is used to generate a crystal oscillator signal; A real-time clock chip, which is connected to both the clock source and the system-on-a-chip, is used to generate a time reference signal corresponding to the crystal oscillator signal and transmit the time reference signal to the system-on-a-chip. A first diode, the anode of which is connected to the system-on-a-chip and the cathode of which is connected to the real-time clock chip, is used to provide a first path power supply to the real-time clock chip; The second diode, the positive terminal of which is connected to the system-on-a-chip; A backup battery, wherein the first terminal of the backup battery is connected to the negative terminal of the second diode via a fifth resistor; The third diode has its anode connected to the second terminal of the backup battery and its cathode connected to the real-time clock chip, thus providing a second path of power to the real-time clock chip.

10. A terminal device, wherein the terminal device is configured with a communication system and an embedded system as described in any one of claims 1 to 9, wherein the communication system connects a system-on-a-chip in the embedded system to corresponding loads in a load module, and the communication system is used to provide the system-on-a-chip with communication paths corresponding to the corresponding loads.

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