Housing assembly and electronic device

Abstract

The application relates to a shell assembly and an electronic device, the shell assembly comprising: a rear shell, the rear shell being formed with a camera area and a main chip area, the main chip area being located on one side of the camera area, and the main chip area being used for arranging a main chip; a support rib, which is arranged on the inner wall of the rear shell and is used for supporting a main board, the support rib being arranged around the edge of the main board, and the main board and the main chip being arranged in a laminated mode and being in heat-conducting contact; wherein the area of the support rib close to the camera area is arranged in a hollow mode, so as to form a heat insulation gap between the rear shell and the main board. The support rib is not in direct contact with the main board, the formed heat insulation gap reduces the heat of the main chip from being transmitted to the support rib and the rear shell through the main board, and then can to a certain extent prevent the heat from being transmitted to the camera area, thereby avoiding the problem of heat accumulation in the camera area.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to housing components and electronic equipment. Background Technology

[0002] In the field of electronic equipment, with the continuous improvement of the integration of electronic components and the gradual increase of operating power, heat dissipation has become one of the key factors restricting the improvement of equipment performance and reliability.

[0003] Currently, many electronic devices such as tablets or mobile phones have their camera areas designed as outward-protruding bumps (similar in appearance to a volcano). As a result, the camera area has changed from a flat surface to a raised top with a hollow center and curved edges, which has the problem of slow heat transfer. The heat transfer from the main chip is interrupted in the camera area, which can easily cause heat accumulation. Utility Model Content

[0004] This application provides housing components and electronic devices to solve the technical problem of heat accumulation in electronic devices.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: a housing assembly, comprising: a rear shell, wherein the rear shell forms a camera area and a main chip area, the main chip area being located on one side of the camera area and used to house the main chip; a support rib, surrounding the inner wall of the rear shell for supporting the motherboard, the support rib being arranged around the edge of the motherboard, the motherboard and the main chip being stacked and in thermally conductive contact; wherein the area of ​​the support rib near the camera area is hollowed out to form a heat-insulating gap between the rear shell and the motherboard.

[0006] According to one embodiment of this application, the rear shell has a top frame and a first side frame, the camera area is disposed close to the top frame, the main chip area is located in the area formed by the top frame and the first side frame and is located between the first side frame and the camera area; the area of ​​the support rib facing the first side frame is at least partially hollowed out to form a heat insulation gap between the rear shell and the motherboard.

[0007] According to one embodiment of this application, the height of the thermal insulation gap is greater than or equal to 1 mm.

[0008] According to one embodiment of this application, the area of ​​the supporting rib facing the top frame is provided with a plurality of first heat insulation grooves along the extension direction of the top frame.

[0009] According to one embodiment of this application, the top frame is recessed on the side facing the supporting rib to form a second heat insulation groove.

[0010] According to one embodiment of this application, the width of the supporting rib at the first heat insulation groove is 0.8mm-1.5mm; and / or, the wall thickness of the top frame at the second heat insulation groove is 0.8mm-1.5mm.

[0011] According to one embodiment of this application, the rear shell has a bottom frame and a second side frame, the second side frame being located on the side of the camera area away from the main chip area; the area of ​​the support rib facing the bottom frame and the second side frame is provided with a plurality of notches, and the shell assembly further includes: a heat-conducting sheet, the heat-conducting sheet covering the inner wall of the rear shell located in the area enclosed by the support rib, and extending through the notches toward the bottom frame and the second side frame, and beyond the camera area.

[0012] According to one embodiment of this application, the housing assembly further includes: a heat-conducting block located between the motherboard and the heat-conducting sheet, and thermally connected to the motherboard and the heat-conducting sheet respectively.

[0013] According to one embodiment of this application, the heat-conducting sheet extends from the notch of the supporting rib toward the second side frame until it passes the camera area, and then the heat-conducting sheet further extends toward the top frame.

[0014] According to one embodiment of this application, the width of the notch in the direction of extension of the support rib is greater than or equal to 15 mm.

[0015] To solve the above-mentioned technical problems, another technical solution adopted in this application is: an electronic device, comprising: a housing assembly as described above; a main screen covering the rear housing; a camera assembly disposed in the camera area; a motherboard disposed on the support rib; a main chip disposed in the main chip area and stacked with the motherboard; and a shielding cover surrounding the main chip and thermally connected to the motherboard.

[0016] According to one embodiment of this application, the electronic device further includes: a heat-conducting overlap component, the heat-conducting overlap component including a first heat-conducting part, a second heat-conducting part and a connecting part, the first heat-conducting part being heat-conductingly connected to the shielding cover, the second heat-conducting part being heat-conductingly connected to the inner side of the main screen, the first heat-conducting part and the second heat-conducting part having a height difference, and the connecting part connecting the first heat-conducting part and the second heat-conducting part; and a filler component disposed between the first heat-conducting part and the main screen.

[0017] According to one embodiment of this application, the overlapping heat-conducting component extends from the main chip area toward the bottom frame and the second side frame of the rear shell, wherein the second side frame is located on the side of the camera area opposite to the main chip area.

[0018] The beneficial effects of this application are as follows: Because the support ribs of the housing assembly are hollowed out near the camera area, a heat-insulating gap is formed between the rear shell and the motherboard. Therefore, the support ribs do not directly contact the motherboard, and the formed heat-insulating gap reduces the heat from the main chip being transferred to the support ribs and rear shell through the motherboard. This, in turn, can prevent heat transfer to the camera area to a certain extent, avoiding heat accumulation problems in the camera area. Furthermore, this application's solution solves the heat accumulation problem by creating a heat-insulating gap through the hollowed-out support ribs. The structure is simple and can eliminate the need for high-cost structures such as the VC board, reducing costs. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 This is a schematic diagram of the overall structure of a conventional electronic device; Figure 2 This is a schematic diagram of the back structure of a housing assembly provided in one embodiment of this application; Figure 3 This is a schematic diagram of the structure of the housing assembly provided in one embodiment of this application after the motherboard and main chip are assembled; Figure 4 This is a front view of a housing assembly provided in an embodiment of this application; Figure 5 This is a three-dimensional structural schematic diagram of a housing assembly provided in an embodiment of this application; Figure 6 This is a partial cross-sectional schematic diagram of a housing assembly provided in an embodiment of this application; Figure 7 This is a partial schematic diagram of an electronic device provided in one embodiment of this application; Figure 8 This is a cross-sectional schematic diagram and a partial enlarged view of an electronic device provided in an embodiment of this application; Figure 9 This is a temperature distribution diagram of the comparative scheme and specific implementation method of this application. Detailed Implementation

[0020] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0021] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0022] Please see Figure 1 , Figure 1 This is a schematic diagram of the overall structure of a conventional electronic device. Through long-term research, the applicant has discovered that the camera area 10 of many current tablets or mobile phones is designed as a protruding bulge (similar in appearance to a volcano crater). Therefore, the camera area 10 changes from a flat surface to a top protrusion, with a hollow center and curved edges. Due to limitations in the overall device layout, the CPU (Central Processing Unit) area 20 is generally located in the corner 1 / 4 position, i.e., area ①. This position can transfer heat in three directions: A, B, and C. Current electronic devices have the following problems: 1. Area B is the camera area 10 that forms a convex hull, similar to the shape of a volcano. It changes from a flat surface to a convex top. The hollow center has very low heat transfer efficiency, and there are also problems with slow heat transfer and heat accumulation at the curved transition position of the edge. 2. Area A is the frame area. Due to the heat accumulation in the camera area 10, the heat is transferred to area A. The heat accumulation will make the frame hot to the touch, which may cause low-temperature burns to the hand. 3. Area C is a narrow slit between camera area 10 and battery 30, with a narrow heat dissipation area and poor heat dissipation effect; 4. Even with the addition of a VC plate (heat spreader) or graphite sheet, the heat dissipation effect is still poor for the crater-shaped camera area. The effective area can only be in area 1, which also has the problem of heat accumulation and increases costs.

[0023] Therefore, in summary, the volcano-shaped camera area 10 causes heat buildup in the CPU area 20, camera area 10, and frame of the electronic device, making it difficult for heat to dissipate from area 1 to the other three areas, resulting in poor overall heat dissipation.

[0024] Please see Figures 2 to 5 , Figure 2 This is a schematic diagram of the back structure of a housing assembly provided in one embodiment of this application; Figure 3 This is a schematic diagram of the structure of the housing assembly provided in one embodiment of this application after assembling the motherboard and main chip; Figure 4 This is a front view of a housing assembly provided in an embodiment of this application; Figure 5 This is a three-dimensional structural schematic diagram of a housing assembly provided in an embodiment of this application.

[0025] One embodiment of this application provides a housing assembly 100, which includes a rear shell 110 and a support rib 120. The rear shell 110 forms a camera area 101 and a main chip area 102. The main chip area 102 is located on one side of the camera area 101 and is used to house a main chip 240. The support rib 120 surrounds the inner wall of the rear shell 110 and is used to support a motherboard 230. The support rib 120 is disposed around the edge of the motherboard 230, and the motherboard 230 and the main chip 240 are stacked and thermally contacted. The area of ​​the support rib 120 near the camera area 101 is hollowed out to form a heat-insulating gap 121 between the rear shell 110 and the motherboard 230.

[0026] The camera area 101 is used to house the camera assembly 220. The back cover 110 protrudes outward from the camera area 101 to form a bulge with a hollow center, resembling a volcano crater. The main chip area 102 is used to house the main chip 240, i.e., the CPU. The motherboard 230 and the main chip 240 are stacked and in thermal contact. The heat from the main chip 240 is transferred to the support rib 120 via the motherboard 230. The support rib 120 is arranged around the edge of the motherboard 230, avoiding the high-density component area in the center of the motherboard 230, which is beneficial for the even distribution of stress on the motherboard 230. This design is suitable for compact electronic devices 200 such as mobile phones and tablets. The support rib 120 is hollowed out near the camera area 101 to form a heat insulation gap 121 between the back cover 110 and the motherboard 230. Therefore, the support rib 120 at this location does not directly contact the motherboard 230. The resulting heat insulation gap 121 reduces the heat from the main chip 240 being transferred through the motherboard 230 to the support rib 120 and the back cover 110. This, in turn, can prevent heat transfer to the camera area 101 to a certain extent, avoiding heat accumulation in the camera area 101. Furthermore, the solution in this application, by hollowing out the support rib 120 to form the heat insulation gap 121, has a simple structure, solves the heat accumulation problem, and eliminates the need for high-cost structures such as the VC board, thus reducing costs.

[0027] Please continue reading. Figure 4 and Figure 5In some embodiments, the rear shell 110 has a top frame 111 and a first side frame 113. The camera area 101 is disposed near the top frame 111, and the main chip area 102 is located within the area enclosed by the top frame 111 and the first side frame 113, and is located between the first side frame 113 and the camera area 101. The area of ​​the support rib 120 facing the first side frame 113 is at least partially hollowed out to form a heat insulation gap 121 between the rear shell 110 and the motherboard 230.

[0028] After the heat generated by the main chip 240 is transferred to the motherboard 230, the heat is difficult to be transferred to the back shell 110 through the heat insulation gap 121 in the area of ​​the support rib 120 facing the first side frame 113 due to the partial hollowing. This slows down the transfer of heat from the motherboard 230 to the first side frame 113 and avoids the problem of the first side frame 113 getting too hot to touch due to heat accumulation.

[0029] Specifically, the area of ​​the support rib 120 facing the first side frame 113 is hollowed out at one end near the top frame 111. On the one hand, after the heat generated by the main chip 240 is transferred to the motherboard 230, the support rib 120 can reduce the transfer of heat to the top frame 111 and the first side frame 113. On the other hand, the area of ​​the support rib 120 facing the first side frame 113 can retain a supporting function in the area away from the top frame 111, improve the support effect of the motherboard 230, and facilitate the heat of the motherboard 230 to be transferred and dissipated in the direction away from the top frame 111.

[0030] Please continue reading. Figure 6 Furthermore, in order to achieve better heat insulation effect, the height L1 of the heat insulation gap 121 is greater than or equal to 1mm, such as 1mm, 1.5mm or 2mm. The height L1 of the heat insulation gap 121 within this range can ensure effective heat insulation. Of course, the upper limit of the heat insulation gap 121 can be adjusted according to the overall thickness of the housing assembly 100 to avoid affecting the overall structural stability between the rear shell 110 and the motherboard 230.

[0031] In some embodiments, the area of ​​the support rib 120 facing the top frame 111 is provided with a plurality of first heat insulation grooves 122 extending along the top frame 111. The first heat insulation grooves 122 block the heat transfer path from the motherboard 230 through the support rib 120 to the top frame 111, making it difficult for heat to be transferred to the rear shell 110 through the first heat insulation grooves 122, thus slowing down the transfer of heat from the motherboard 230 to the top frame 111 and avoiding the problem of the top frame 111 becoming too hot to touch due to heat accumulation.

[0032] Specifically, the width L2 of the support rib 120 at the location of the first heat insulation groove 122 is 0.8mm-1.5mm, such as 0.8mm, 1mm, 1.3mm, or 1.5mm. Setting the width L2 of the support rib 120 at the location of the first heat insulation groove 122 within this range ensures that it is neither too narrow, thus guaranteeing effective support for the main board 230, nor too wide, thus reducing heat flux and preventing rapid heat transfer to the top frame 111. Furthermore, the edges of the first heat insulation groove 122 can be designed with rounded corners to reduce stress concentration and improve the structural stability and service life of the support rib 120.

[0033] In some embodiments, a second heat insulation groove 123 is recessed on the side of the top frame 111 facing the support rib 120. The second heat insulation groove 123 further blocks the heat transfer path from the support rib 120 to the top frame 111, making it more difficult for heat to be transferred to the top frame 111.

[0034] The depth of the second heat insulation groove 123 can be determined based on actual heat dissipation requirements and the overall structural strength of the rear shell 110. Specifically, the wall thickness L3 of the top frame 111 at the second heat insulation groove 123 is 0.8mm-1.5mm, such as 0.8mm, 1mm, 1.3mm, or 1.5mm. Constraining the depth of the second heat insulation groove 123 by the wall thickness of the top frame 111 avoids the top frame 111 becoming too thin and affecting the overall structural strength, while ensuring that the second heat insulation groove 123 has sufficient depth to block the heat transfer path. Furthermore, the edges of the second heat insulation groove 123 can also be designed with rounded corners, again to reduce stress concentration and enhance the structural stability and durability of the top frame 111.

[0035] Please continue reading. Figure 4 In some embodiments, the rear shell 110 has a bottom frame 112 and a second side frame 114. The bottom frame 112 and the top frame 111 are disposed opposite to each other, and the second side frame 114 and the first side frame 113 are disposed opposite to each other. The second side frame 114 is located on the side of the camera area 101 opposite to the main chip area 102. The support rib 120 has a plurality of notches 124 respectively in the area facing the bottom frame 112 and the second side frame 114. The shell assembly 100 also includes a heat-conducting sheet 130, which covers the inner wall of the rear shell 110 in the area enclosed by the support rib 120 and extends through the notches 124 toward the bottom frame 112 and the second side frame 114.

[0036] Since the area on the back cover 110 near the second side frame 114 and the bottom frame 112 is far from the main chip area 102, there is relatively less heat accumulation and a larger heat dissipation space. By using the heat-conducting sheet 130 to guide the heat to this area, the overall heat dissipation efficiency of the housing assembly 100 and the electronic device 200 using the housing assembly 100 can be effectively improved.

[0037] Furthermore, the housing assembly 100 also includes a heat-conducting block 140 (see...) Figure 8 The heat-conducting block 140 is located between the motherboard 230 and the heat-conducting plate 130, and is thermally connected to both the motherboard 230 and the heat-conducting plate 130. The heat transferred from the main chip 240 to the motherboard 230 is transferred to the heat-conducting plate 130 through the heat-conducting block 140. The heat-conducting plate 130 extends towards the bottom frame 112 and the second side frame 114 through the notch 124 of the support rib 120, and crosses the camera area 101, thereby guiding the heat to be dissipated in the direction of the bottom frame 112 and the second side frame 114.

[0038] Specifically, the heat-conducting sheet 130 can be made of materials with high thermal conductivity, such as copper foil or graphite sheets. These materials have good thermal conductivity and can quickly transfer heat from the motherboard 230 to other areas of the back cover 110. The heat-conducting block 140 can be made of thermally conductive silicone grease or thermally conductive gel to fill the structural gaps between the motherboard 230 and the heat-conducting sheet 130, achieving efficient heat conduction.

[0039] To further enhance the heat conduction effect, thermally conductive adhesive can be used to bond and fix the heat-conducting plate 130 to the inner wall of the back shell 110. The thermally conductive adhesive not only ensures that the heat-conducting plate 130 is tightly attached to the inner wall of the back shell 110, reducing thermal resistance, but also plays a certain role in buffering.

[0040] Furthermore, the heat-conducting sheet 130 extends from the notch 124 of the support rib 120 towards the second side frame 114, passing over the camera area 101, and then further extends towards the top frame 111. The heat-conducting sheet 130 can more extensively cover the inner wall of the back cover 110, guiding heat from the motherboard 230 to a location away from the main chip area 102 and the camera area 101, further expanding the heat dissipation range. Moreover, due to the outward protrusion and the hollowed-out volcano-like design of the camera area 101, which is an area where heat easily accumulates, the heat-conducting sheet 130 extending towards the top frame 111 after passing over this area allows heat to bypass the camera area 101, preventing excessive heat accumulation in this area and thus more effectively reducing the temperature of the camera area 101.

[0041] Please continue reading. Figure 5 Specifically, the width L4 of the notch 124 in the extension direction of the support rib 120 is greater than or equal to 15mm, such as 15mm, 17mm, 19mm or 20mm, etc. The width L4 of the notch 124 in the extension direction of the support rib 120 can be adaptively adjusted according to the size of the motherboard 230 and the size of the support rib 120 used in the actual electronic device 200.

[0042] It should also be noted that, in terms of manufacturing process, the rear shell 110 and the support rib 120 can be manufactured using an integrated molding method. This reduces the assembly gap between various components, lowers thermal resistance, and improves overall heat dissipation performance. At the same time, the integrated molding structure also improves the overall strength and stability of the electronic device 200.

[0043] Please continue reading. Figure 7 and Figure 8 , Figure 7 This is a partial schematic diagram of an electronic device provided in an embodiment of this application; Figure 8 This is a cross-sectional schematic diagram and a partial enlarged view of an electronic device provided in an embodiment of this application.

[0044] Another embodiment of this application provides an electronic device 200. The electronic device 200 includes a housing assembly 100, a main screen 210, a camera assembly 220, a motherboard 230, a main chip 240, and a shielding cover 250. The housing assembly 100 adopts the housing assembly 100 of any of the above embodiments. The main screen 210 covers the rear shell 110 and together with the rear shell 110 forms the skeleton structure of the electronic device 200. The camera assembly 220 is disposed in the camera area 101. The motherboard 230 is disposed on the support rib 120. The main chip 240 is disposed in the main chip area 102 and is stacked and thermally connected to the motherboard 230. The shielding cover 250 surrounds the outer periphery of the main chip 240 and is thermally connected to the motherboard 230.

[0045] The main screen 210 serves as a display, providing users with an intuitive interactive interface. The camera assembly 220, mounted in the camera area 101, protrudes outwards to form a crater-like bulge, enabling functions such as taking photos and recording videos. The motherboard 230 is mounted on the support rib 120, which supports the motherboard 230 and ensures stable stacking and thermal contact between the motherboard 230 and the main chip 240. As the core component of the electronic device 200, the heat generated by the main chip 240 is transferred through the motherboard 230 to the support rib 120 and then dissipated through subsequent heat dissipation structures. A shielding cover 250 surrounds the main chip 240. Its main function is to shield the electromagnetic interference generated by the main chip 240 during operation, preventing it from affecting other components within the electronic device 200 and ensuring the normal and stable operation of all components. Simultaneously, the shielding cover 250 also protects the main chip 240 to a certain extent from damage caused by external physical factors.

[0046] During operation, the main chip 240 of the electronic device 200 continuously generates heat. This heat is first transferred to the motherboard 230. On one hand, it can be diffused outwards through the support rib 120. The area of ​​the support rib 120 near the camera area 101 is hollowed out to form a heat-insulating gap 121 between the back cover 110 and the motherboard 230, preventing heat accumulation in the camera area 101. Multiple first heat-insulating grooves 122 are formed along the extension direction of the top frame 111 on the area of ​​the support rib 120 facing the top frame 111. A second heat-insulating groove 123 is recessed on the side of the top frame 111 facing the support rib 120. The first and second heat-insulating grooves 122 and 123 block the heat transfer path from the support rib 120 to the top frame 111, preventing heat accumulation in the top frame 111. On the other hand, after being transferred to the motherboard 230, the heat is transferred to the heat-conducting sheet 130 through the heat-conducting block 140. The heat-conducting sheet 130 uses the notch 124 of the support rib 120 to guide heat to the bottom frame 112 and the second side frame 114 for dissipation, and extends beyond the camera area 101 to the top frame 111, expanding the heat dissipation range and effectively preventing excessive heat accumulation in the camera area 101, main chip area 102 and other locations, improving the overall heat dissipation efficiency of the electronic device 200, and ensuring the performance and stability of the electronic device 200.

[0047] Furthermore, the electronic device 200 also includes a heat-conducting overlap member 260 and a filler member 270. The heat-conducting overlap member 260 includes a first heat-conducting portion 261, a second heat-conducting portion 262, and a connecting portion 263. The first heat-conducting portion 261 is thermally connected to the shielding cover 250, and the second heat-conducting portion 262 is thermally connected to the inner side of the main screen 210. The first heat-conducting portion 261 and the second heat-conducting portion 262 have a height difference. The connecting portion 263 connects the first heat-conducting portion 261 and the second heat-conducting portion 262. The filler member 270 is disposed between the first heat-conducting portion 261 and the main screen 210 to press the first heat-conducting portion 261 onto the shielding cover 250.

[0048] Since the inner side of the main screen 210 is typically made of aluminum alloy, it has excellent thermal conductivity. The shielding cover 250 is thermally connected to the motherboard 230. The heat from the main chip 240 is transferred to the motherboard 230 and then to the shielding cover 250. One side of the overlapping heat-conducting component 260 contacts the shielding cover 250, and the other side contacts the inner side of the main screen 210, thus transferring heat to the inner side of the main screen 210. This rapidly conducts heat from the motherboard 230 towards the main screen 210 to the main screen 210 and dissipates it evenly. The first heat-conducting part 261 and the connecting part 263 of the overlapping heat-conducting component 260 can cooperate with the internal structure of the electronic device 200 to effectively thermally connect the shielding cover 250 and the main screen 210, which have a height difference.

[0049] Specifically, the overlapping heat-conducting component 260 is made of a high thermal conductivity material such as copper foil or graphite. The filler 270 can be made of foam. The foam has a certain degree of elasticity, ensuring that the first heat-conducting part 261 is in close contact with the shielding cover 250, thus ensuring efficient heat conduction. At the same time, the foam also acts as a buffer, reducing the impact of vibration or impact on components such as the overlapping heat-conducting component 260 and the shielding cover 250 when the electronic device 200 is subjected to vibration or impact, and protecting these components from damage.

[0050] Furthermore, the overlapping heat-conducting component 260 extends from the main chip area 102 towards the bottom frame 112 and the second side frame 114 of the rear cover 110. The second side frame 114 is located on the side of the camera area 101 opposite to the main chip area 102. The extended design of the overlapping heat-conducting component 260 can expand the heat conduction range and diffuse heat to the low-heat area of ​​the main screen 210 away from the main chip 240, which can effectively improve the overall heat dissipation efficiency. The extension direction of the overlapping heat-conducting component 260 is consistent with the extension direction of the heat-conducting sheet 130.

[0051] In one specific embodiment, this embodiment provides an electronic device 200. The housing assembly 100 of the electronic device 200 includes a rear shell 110 and a support rib 120. The area of ​​the support rib 120 near the camera area 101 is hollowed out to form a heat insulation gap 121 between the rear shell 110 and the motherboard 230. The portion of the support rib 120 facing the first side frame 113 is also hollowed out to form the heat insulation gap 121 between the rear shell 110 and the motherboard 230. The height L1 of the heat insulation gap 121 is 1 mm. A first heat insulation groove 122 is formed in the area of ​​the support rib 120 facing the top frame 111, and the width L2 of the support rib 120 at this location is 1.1 mm. A second heat insulation groove 123 is recessed on the side of the top frame 111 facing the support rib 120. The wall thickness L3 of the top frame 111 at the second heat insulation groove 123 is 1.1 mm. The support rib 120 has notches 124 in the areas facing the bottom frame 112 and the second side frame 114. The housing assembly 100 also includes a heat-conducting sheet 130 made of graphite material and a heat-conducting block 140 made of silicone grease. The heat-conducting sheet 130 covers the inner wall of the rear housing 110 within the area enclosed by the support rib 120 and extends towards the bottom frame 112 and the second side frame 114 through the notches 124. The width L4 of the notch 124 in the direction of extension of the support rib 120 is 15 mm. The electronic device 200 also includes an overlapping heat-conducting component 260 and a filler component 270.

[0052] Please see Figure 9 , Figure 9 This is a temperature distribution diagram of the comparative scheme and specific implementation method of this application.

[0053] The comparison scheme is Figure 1In the standard solution, under a room temperature of 25℃, after the same amount of time, the highest temperature on the front of the comparison solution was 46.5℃, with heat concentrated in the corner 1 / 4 area, and the highest temperature on the back was 48.1℃, with the highest temperature in the camera area 10.

[0054] In this embodiment, the highest temperature on the front is 42.4°C, and the heat source radiation is larger and more uniform. The highest temperature on the back is 43.4°C, and the heat accumulation in the camera area 101 is greatly reduced.

[0055] Compared to the comparative solution, the front temperature of this implementation is reduced by 3.2℃ and the back temperature is reduced by 4.7℃; the problem of excessive temperature in the camera area 101 is solved; the overall temperature distribution of the electronic device 200 is more uniform, and it no longer accumulates in the main chip area 102 and the motherboard 230.

[0056] It should be noted that the terms "horizontal" and "vertical" do not imply that the components must be absolutely horizontal or vertical, but rather that they can be slightly tilted. Similarly, the terms "parallel" and "perpendicular" do not imply that the components are absolutely parallel or perpendicular, but rather that they can have a certain angular deviation. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted. In addition, the orientations or positional relationships indicated by terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" are based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships that are commonly used when the product of this application is in use. They are only for the purpose of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0057] It is understood that in this document, "multiple" means at least two, such as two, three, etc., unless otherwise specified. Furthermore, the terms "including" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. The term "and / or" merely describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0058] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A housing assembly, characterized in that, include: The rear cover has a camera area and a main chip area, the main chip area being located on one side of the camera area and used to house the main chip. Support ribs are arranged around the inner wall of the rear shell to support the motherboard. The support ribs are arranged around the edge of the motherboard. The motherboard and the main chip are stacked and thermally contacted. The area of ​​the support rib near the camera area is hollowed out to form a heat insulation gap between the back cover and the motherboard.

2. The housing assembly according to claim 1, characterized in that, The rear shell has a top frame and a first side frame. The camera area is located near the top frame. The main chip area is located in the area formed by the top frame and the first side frame, and is located between the first side frame and the camera area. The area of ​​the support rib facing the first side frame is at least partially hollowed out to form a heat insulation gap between the rear shell and the motherboard.

3. The housing assembly according to claim 1 or 2, characterized in that, The height of the insulation gap is greater than or equal to 1 mm.

4. The housing assembly according to claim 2, characterized in that, The area of ​​the supporting rib facing the top frame has multiple first heat insulation grooves extending along the top frame.

5. The housing assembly according to claim 4, characterized in that, The top frame has a second heat insulation groove recessed on the side facing the supporting rib.

6. The housing assembly according to claim 5, characterized in that, The width of the supporting rib at the first heat insulation groove is 0.8mm-1.5mm; and / or, the wall thickness of the top frame at the second heat insulation groove is 0.8mm-1.5mm.

7. The housing assembly according to claim 1, characterized in that, The rear shell has a bottom frame and a second side frame, the second side frame being located on the side of the camera area facing away from the main chip area; the supporting ribs have several notches in the areas facing the bottom frame and the second side frame, and the shell assembly further includes: A heat-conducting sheet covers the inner wall of the rear shell located within the area enclosed by the supporting ribs, extends through the notch toward the bottom frame and the second side frame, and crosses the camera area.

8. The housing assembly according to claim 7, characterized in that, The housing assembly also includes: A heat-conducting block is located between the motherboard and the heat-conducting sheet, and is thermally connected to both the motherboard and the heat-conducting sheet.

9. The housing assembly according to claim 7, characterized in that, The heat-conducting sheet extends from the notch of the supporting rib toward the second side frame, and after passing the camera area, the heat-conducting sheet further extends toward the top frame.

10. The housing assembly according to claim 7, characterized in that, The width of the notch in the direction of extension of the support rib is greater than or equal to 15 mm.

11. An electronic device, characterized in that, include: The housing assembly as described in any one of claims 1-10; The main screen covers the back cover; A camera assembly is disposed in the camera area; The motherboard is mounted on the support rib. The main chip is located in the main chip area and is stacked with the motherboard. A shielding cover is placed around the main chip and is thermally connected to the motherboard.

12. The electronic device according to claim 11, characterized in that, The electronic device also includes: An overlapping heat-conducting component is provided, comprising a first heat-conducting part, a second heat-conducting part, and a connecting part. The first heat-conducting part is thermally connected to the shielding cover, and the second heat-conducting part is thermally connected to the inner side of the main screen. The first heat-conducting part and the second heat-conducting part have a height difference, and the connecting part connects the first heat-conducting part and the second heat-conducting part. A filler is disposed between the first heat-conducting part and the main screen.

13. The electronic device according to claim 12, characterized in that, The overlapping heat-conducting component extends from the main chip area toward the bottom frame and the second side frame of the rear shell, with the second side frame located on the side of the camera area opposite to the main chip area.

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