A device for compensating for jitter and a digital product
Patent Information
- Application Number
- CN202520891334.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-07
- Publication Date
- 2026-10-23
- Estimated Expiration
- 2035-05-07
AI Technical Summary
但是镜头组件十分沉重,相关结构非常复杂,导致其行程有限,成本较高,可靠性差,很难推广
本实用新型提供的抖动补偿装置和数码产品,通过控制活动子单元上的驱动线圈相对底座支架上的磁石组件移动,实现图像传感器芯片在垂直光轴方向的平面内移动防抖,并通过活动子单元、底座支架分别设置有彼此配合的阻尼结构,防止移动过程中产生共振,影响防抖效果,具有画质稳定、工艺简单、行程长、成本低的优点。
Smart Images

Figure CN224890716U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of camera module technology, and in particular to a shake compensation device and a digital product. Background Technology
[0002] Existing digital products, such as action cameras, law enforcement recorders, and surveillance cameras, are prone to blurry images when used in motion or in unstable environments due to shaking or tremors, failing to deliver optimal shooting results. This blurry image not only affects the user's observation and analysis of the image content but also reduces the practical value of these devices. Whether recording exciting moments in action, capturing crucial evidence during law enforcement, or conducting routine surveillance, blurry images can cause numerous inconveniences and problems.
[0003] While it's possible to use lens assemblies that move in the plane perpendicular to the optical axis Z (XY direction) within the camera modules of digital products to compensate for shake or shakiness and obtain high-quality images, these lens assemblies are very heavy and have highly complex structures, resulting in limited travel, high cost, and poor reliability, making widespread adoption difficult. Summary of the Invention
[0004] The purpose of this invention is to provide a shake compensation device and a digital product that have the advantages of strong anti-shake capability and good image quality.
[0005] To achieve the above objectives, this utility model provides a jitter compensation device, including an upper cover unit, a base unit, and a circuit board unit located between the upper cover unit and the base unit; the base unit includes a base bracket and a magnet assembly, the magnet assembly being fixed to the base bracket; the circuit board unit includes a fixed subunit and a movable subunit that are movably connected to each other, the fixed subunit being fixedly arranged relative to the upper cover unit and the base unit, the movable subunit being provided with an image sensor chip and a drive coil, the drive coil being arranged opposite to the magnet assembly, and the image sensor chip being driven to move in a plane perpendicular to the optical axis by controlling the current passing through the drive coil; the movable subunit and the base bracket are respectively provided with mutually cooperating damping structures to prevent resonance.
[0006] Preferably, the vibration compensation device further includes an electrical connection component, the two ends of which are respectively connected to the fixed subunit and the movable subunit, and the electrical connection component is disposed between the circuit board unit and the upper cover unit.
[0007] Preferably, the active subunit includes a carrier plate and an active support. The carrier plate is accommodated in the hollow area of the active support and is fixedly connected to the active support. The image sensor chip is fixed above the carrier plate, and the drive coil is fixed below the active support.
[0008] Preferably, the damping structure includes a contact post disposed on the lower surface of the movable support and a receiving groove disposed on the base support, wherein the receiving groove contains damping adhesive, and the contact post moves within the damping adhesive to prevent resonance.
[0009] Preferably, the damping structure is evenly distributed on the four sides of the active subunit and the base support.
[0010] Preferably, the base support is provided with a protruding limiting structure to limit the movement distance of the movable support.
[0011] Preferably, the active subunit is further provided with a displacement sensor for feedback on the movement distance of the active subunit relative to the magnet assembly.
[0012] Preferably, the displacement sensor is a magnetic sensor.
[0013] Preferably, the displacement sensor includes at least two displacement sensors, which are respectively disposed on adjacent sides of the active subunit.
[0014] Preferably, the magnet assembly is a Heilbeck magnet assembly.
[0015] Preferably, the base unit further includes a magnetically conductive steel sheet located below the magnet assembly, which enhances the performance of the magnet assembly and reduces magnetic leakage.
[0016] Preferably, the active subunit is further provided with a magnetic attracting plate, which is arranged opposite to the magnet assembly to generate a magnetic positive pressure.
[0017] Preferably, the active subunit is further provided with an upper support plate, and the base unit is further provided with a lower support plate. Supporting balls are provided between the upper support plate and the lower support plate to prevent deformation of the support position.
[0018] Preferably, the base unit further includes a heat sink, which is fixedly connected to the base bracket and located directly below the image sensor chip.
[0019] Preferably, the upper cover unit has an opening, and the image sensor chip is housed in the opening and protrudes from the surface of the upper cover unit.
[0020] This utility model also provides a digital product, including: a lens unit, the lens unit including a lens mount and a lens housed in the lens mount; and a shake compensation device as described above, wherein the upper cover unit of the shake compensation device is connected to the lens mount, and the optical axis of the lens is perpendicular to the photosensitive surface of the image sensor chip of the shake compensation device.
[0021] In summary, compared with the prior art, the jitter compensation device and digital product provided by this utility model have the following beneficial effects: The shake compensation device and digital product provided by this utility model achieve image sensor chip movement in the plane perpendicular to the optical axis by controlling the movement of the drive coil on the movable subunit relative to the magnet component on the base bracket. The movable subunit and the base bracket are respectively equipped with damping structures that cooperate with each other to prevent resonance during movement, which would affect the image stabilization effect. It has the advantages of stable image quality, simple process, long stroke and low cost. Attached Figure Description
[0022] Figure 1 This is an exploded view of the vibration compensation device of this utility model; Figure 2 This is an overall side view of the jitter compensation device of this utility model; Figure 3 This is a perspective view of the overall vibration compensation device of this utility model; Figure 4 This is a partial perspective view of the jitter compensation device of this utility model; Figure 5 This is a partial perspective view of the jitter compensation device of this utility model; Figure 6 This is a schematic diagram of the back of the movable support of the vibration compensation device of this utility model; Figure 7 This is a schematic diagram of the base unit of the vibration compensation device of this utility model; Figure 8 This is a cross-sectional view of the jitter compensation device of this utility model from one angle; Figure 9 This is a cross-sectional view of the vibration compensation device of this utility model from another angle. Detailed Implementation
[0023] The technical solutions, structural features, objectives, and effects of the present invention will be described in detail below with reference to the accompanying drawings of the embodiments of the present invention.
[0024] It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions. They are only used to facilitate and clarify the illustration of the embodiments of this utility model, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationship, or adjustments to the size should still fall within the scope of the technical content disclosed in this utility model, provided that they do not affect the effects and objectives that this utility model can produce.
[0025] It should be noted that in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only the expressly listed elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.
[0026] like Figures 1-3 As shown, this utility model provides a vibration compensation device, which includes an upper cover unit 100, a base unit 200, and a circuit board unit 300 located between the upper cover unit 100 and the base unit 200.
[0027] An opening 101 is provided in the center of the top cover unit 100. An image sensor chip 500 disposed on the circuit board unit 300 is accommodated in the opening 101. Light passes through the opening 101 and enters the image sensor chip 500 to form an image. Preferably, the image sensor chip 500 protrudes from the surface of the top cover unit 100 so that the photosensitive surface of the image sensor chip 500 is as close as possible to the lower surface of the lens, which meets the negative back focus requirements of some digital products.
[0028] The base unit 200 includes a base support 201 and magnet components 202 fixed to the base support 201. Preferably, four sets of magnet components 202 are evenly distributed on the four sides of the base support 201. Each set of magnet components 202 includes one bipolar magnet or at least two unipolar magnets. More preferably, each set of magnet components 202 is a Heilbeck magnet set, so as to increase the driving force by enhancing the magnetic field on one side, thereby achieving anti-shake movement during long-stroke movement, while reducing magnetic leakage and improving magnetic field stability.
[0029] To clearly illustrate the structure of circuit board unit 300, Figure 4 A schematic diagram of the vibration compensation device after removing the top cover unit 100 is shown. Figure 5A schematic diagram of the jitter compensation device after further removal of the electrical connection assembly 400 is shown.
[0030] See Figures 1-5 The circuit board unit 300 includes a fixed subunit 310 and a movable subunit 320 that are movably connected to each other. The fixed subunit 310 is fixedly disposed relative to the upper cover unit 100 and the base unit 200. The movable subunit 320 is provided with an image sensor chip 500 and a drive coil 324. The drive coil 324 is disposed opposite to the magnet assembly 202. By controlling the current passing through the drive coil 324, the movable subunit 320 is driven to move the image sensor chip 500 in the XY plane in the direction perpendicular to the optical axis Z, thereby realizing jitter compensation.
[0031] An electrical connection component 400 is disposed between the circuit board unit 300 and the upper cover unit 100 to provide sufficient space between the circuit board unit 300 and the base unit 200 for arranging the electromagnetic drive component. The two ends of the electrical connection component 400 are respectively connected to the fixed sub-unit 310 and the movable sub-unit 320. Preferably, the two ends of the electrical connection component 400 are provided with solder pads, corresponding to the solder pads of the fixed sub-unit 310 and the movable sub-unit 320 respectively, and connected using a soldering process. The electrical connection component 400 has a certain degree of freedom of movement and is capable of transmitting electrical signals. When the movable sub-unit 320 moves relative to the fixed sub-unit 310, the electrical connection component 400 can maintain a stable electrical connection between the movable sub-unit 320 and the fixed sub-unit 310 to transmit electrical signals between them. Furthermore, the electrical connection component 400 has a certain degree of freedom of movement and will not affect the movement of the movable sub-unit 320 relative to the fixed sub-unit 310.
[0032] This embodiment only shows a preferred embodiment of the electrical connection assembly 400, which includes four sets of elastic connection components evenly distributed around the four sides of the movable subunit 320. Each set of elastic connection components includes multiple conductive elastic wires, one end of which is connected to the movable subunit 320 and the other end to the fixed subunit 310. In this embodiment, the conductive elastic wires are preferably designed to be completely suspended below to avoid accidental collisions during motion stabilization that could affect product reliability. Each conductive elastic wire includes at least one conductive layer to enable electrical signal transmission; and because the conductive elastic wire is elastic, it can undergo elastic deformation during motion compensation of the movable subunit 320 and return to its initial state after motion compensation, thus driving the movable subunit 320 back to the position of the optical center. When higher signal transmission requirements are needed, a multi-layer electrical connection structure can also be used, i.e., each conductive elastic wire includes at least two conductive layers, each used to transmit different signals, with an insulating layer between each conductive layer.
[0033] In this embodiment, the specific settings of the shape, position, number of the elastic connection component and the shape, position, number of the included conductive elastic wires are only schematic diagrams for ease of understanding and do not limit the protection scope of this utility model. Various suitable modifications made by those skilled in the art based on this are within the protection scope of this utility model.
[0034] See Figures 5-9 The active subunit 320 and the base bracket 201 are respectively equipped with damping structures that cooperate with each other to prevent resonance during movement and affect the anti-shake effect. Furthermore, the image sensor chip 500 is limited in the X and Y directions by the limiting structure to improve the structural reliability.
[0035] In this embodiment, four sets of damping structures are evenly distributed on the four sides of the movable subunit 320 and the base support 201. Each set of damping structures includes a contact post 3251 disposed on the back (lower surface) of the movable support and a receiving groove 2011 disposed on the base support 201. The receiving groove 2011 contains damping adhesive. The contact post 3251 moves in the damping adhesive in the corresponding receiving groove to prevent resonance during movement and affect the anti-shaking effect.
[0036] Specifically, the active subunit 320 includes a carrier plate 321 and an active bracket 325. The carrier plate 321 is accommodated in the hollow area 3254 of the active bracket 325 and is fixedly connected to the active bracket 325. The image sensor chip 500 is fixed above the carrier plate 321, and the drive coil 324 is fixed below the active bracket 325. Preferably, four sets of drive coils 324 are respectively disposed in the grooves on the four sides of the back of the active bracket 325, and are disposed opposite to the magnet assembly 202.
[0037] The four sides of the back of the movable bracket 325 are also equipped with magnetic plates 322. The magnetic plates 322 are arranged opposite to the magnet component 202 to generate magnetic positive pressure, ensuring that the movable sub-unit 320 can move smoothly in the XY plane in three postures: horizontal upward, horizontal downward, and vertical.
[0038] A displacement sensor 323 may also be provided on the movable support 325. The displacement sensor 323 can be a magnetic sensor, such as a Hall sensor, used to detect changes in magnetic field lines to provide feedback on the movement distance of the movable subunit 320 relative to the magnet assembly 202. In this embodiment, two displacement sensors 323 are included, respectively disposed on adjacent sides of the back of the first movable support 325, and are used to provide feedback on the movement distance of the movable subunit 320 and the image sensor chip 500 along the X and Y directions, respectively.
[0039] In addition, a ball bearing assembly 327 is provided between the movable bracket 325 and the base bracket 201, including an upper support plate 3271 disposed on the back of the movable bracket 325, a lower support plate 3272 of the base bracket, and support balls 3273 between the upper support plate 3271 and the lower support plate 3272. The support balls 3273 serve to position the gap in the Z direction between the movable subunit 320 and the base unit 200 to ensure their relative horizontality. The upper support plate 3271 and the lower support plate 3272 are made of materials such as metal to prevent deformation of the support position.
[0040] In a further preferred embodiment, the four corners of the base support 201 are respectively provided with protruding limiting structures 2014. The limiting structures 2014 include protruding platforms extending along the X and Y directions, which cooperate with the movable support 325 respectively to limit the movement distance of the movable sub-unit in the X and Y directions, prevent excessive movement from causing collisions, and improve structural reliability.
[0041] The base support 201 is provided with magnet components 202 on its four sides. Preferably, a magnetic steel sheet 204 is provided below the magnet component 202 to enhance the performance of the magnet component 202 and reduce magnetic leakage.
[0042] In other embodiments not shown, a heat sink may be provided in the middle of the base bracket 201. The heat sink is located directly below the image sensor chip 500 and can effectively absorb the heat generated during the operation of the image sensor chip, thereby improving heat dissipation performance.
[0043] This invention also provides a digital product, which includes a lens unit (not shown) and a shake compensation device as described above. The lens unit typically includes a lens mount and a lens housed within the lens mount. The upper cover unit 100 of the shake compensation device is connected to the lens mount. The optical axis Z of the lens is perpendicular to the photosensitive surface (XY plane) of the image sensor chip 500 of the shake compensation device. By supplying currents of different intensities and directions to the drive coil 324 within the shake compensation device, the movable subunit 320 of the drive circuit board unit 300 moves relative to the fixed subunit 310, thereby causing the image sensor chip 500 to move within the XY plane perpendicular to the optical axis Z, compensating for the adverse effects of shake and thus obtaining a clear image.
[0044] The shake compensation device and digital product of this utility model achieve image sensor chip movement and image stabilization in the plane perpendicular to the optical axis by controlling the movement of the drive coil on the movable subunit relative to the magnet component on the base bracket. The movable subunit and the base bracket are respectively equipped with damping structures that cooperate with each other to prevent resonance during movement, which would affect the image stabilization effect. It has the advantages of stable image quality, simple process, long stroke and low cost.
[0045] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.
Claims
1. A jitter compensation device, characterized in that, It includes a top cover unit, a base unit, and a circuit board unit located between the top cover unit and the base unit; The base unit includes a base bracket and a magnet assembly, the magnet assembly being fixed to the base bracket; The circuit board unit includes a fixed subunit and a movable subunit that are movably connected to each other. The fixed subunit is fixedly arranged relative to the upper cover unit and the base unit. The movable subunit is provided with an image sensor chip and a driving coil. The driving coil is arranged opposite to the magnet assembly. By controlling the current passing through the driving coil, the image sensor chip is driven to move in a plane perpendicular to the optical axis. The active subunit and the base support are each equipped with a damping structure that works in conjunction with each other to prevent resonance.
2. The jitter compensation device as described in claim 1, characterized in that, The vibration compensation device further includes an electrical connection component, the two ends of which are respectively connected to the fixed subunit and the movable subunit, and the electrical connection component is disposed between the circuit board unit and the upper cover unit.
3. The jitter compensation device as described in claim 1, characterized in that, The active subunit includes a carrier plate and an active support. The carrier plate is accommodated in the hollow area of the active support and is fixedly connected to the active support. The image sensor chip is fixed above the carrier plate, and the drive coil is fixed below the active support.
4. The jitter compensation device as described in claim 3, characterized in that, The damping structure includes a contact post disposed on the lower surface of the movable support and a receiving groove disposed on the base support. The receiving groove contains damping adhesive, and the contact post moves within the damping adhesive to prevent resonance.
5. The jitter compensation device as described in claim 4, characterized in that, The damping structure is evenly distributed on the four sides of the active subunit and the base support.
6. The jitter compensation device as described in claim 4, characterized in that, The base support is provided with a protruding limiting structure to limit the movement distance of the movable support.
7. The jitter compensation device as described in claim 1, characterized in that, The active subunit is also equipped with a displacement sensor to provide feedback on the distance the active subunit moves relative to the magnet assembly.
8. The jitter compensation device as described in claim 7, characterized in that, The displacement sensor is a magnetic sensor.
9. The jitter compensation device as described in claim 7, characterized in that, The displacement sensor includes at least two displacement sensors, which are respectively disposed on adjacent sides of the active subunit.
10. The jitter compensation device as described in claim 1, characterized in that, The magnet assembly is a Heilbeck magnet assembly.
11. The jitter compensation device as described in claim 1, characterized in that, The base unit also includes a magnetically conductive steel sheet located below the magnet assembly, which enhances the performance of the magnet assembly and reduces magnetic leakage.
12. The jitter compensation device as described in claim 1, characterized in that, The active subunit is also provided with a magnetic absorbing plate, which is arranged opposite to the magnet assembly to generate a magnetic positive pressure.
13. The jitter compensation device as described in claim 1, characterized in that, The active subunit is also provided with an upper support plate, and the base unit is also provided with a lower support plate. Supporting balls are provided between the upper support plate and the lower support plate to prevent deformation of the support position.
14. The jitter compensation device as described in claim 1, characterized in that, The base unit also includes a heat sink, which is fixedly connected to the base bracket and located directly below the image sensor chip.
15. The jitter compensation device as described in claim 1, characterized in that, The upper cover unit has an opening, and the image sensor chip is housed in the opening and protrudes from the surface of the upper cover unit.
16. A digital product, characterized in that, include: A lens unit, the lens unit including a lens mount and a lens housed in the lens mount; The shake compensation device as described in any one of claims 1-15, wherein the upper cover unit of the shake compensation device is connected to the lens mount, and the optical axis of the lens is perpendicular to the photosensitive surface of the image sensor chip of the shake compensation device.