Sound production device

Abstract

The embodiment of the present application provides a sound production device, which comprises a shell, a first support, a main plate, a sliding sensor and a pressure sensing assembly. The shell encloses an inner cavity. The main plate is arranged in the inner cavity. The first support is fixed to the main plate. The sliding sensor is arranged on the first support and directly adheres to the inner wall of the shell. The pressure sensing assembly is connected to the side of the sliding sensor away from the inner wall and is supported on the main plate. The pressure sensing assembly and the main plate are electrically connected. The sound production device provided by the embodiment of the present application has the advantages that the sliding sensor and the main plate are arranged on the first support, the pressure sensing assembly is arranged on the side of the sliding sensor away from the inner wall, and various components are stacked to form an overall structure. The sliding sensor does not need to be fixed to the inner wall by adhesive and can adhere to the inner wall. During assembly, the sliding sensor, the main plate, the pressure sensing assembly and the first support can be integrally assembled, the assembly process is convenient and fast, and the sound production device is applicable to the shell with an integrated structure and the shell with a split structure.

Description

Technical Field

[0001] This application relates to the field of consumer electronics, and more specifically to a sound-generating device. Background Technology

[0002] With technological advancements, sound-producing devices such as headphones and speakers are becoming increasingly common. To control these devices, related technologies typically employ sliding or pressing controls, such as volume adjustment and power on / off functions. These technologies integrate sliding and pressure sensors within the housing to achieve these controls. Currently, the sliding and pressure sensors are glued to the housing. However, for unibody housings, it's difficult to glue the sliding and pressure sensors to the inner wall during assembly, limiting the application to modular housings. Utility Model Content

[0003] The purpose of this application is to provide a sound-generating device that at least partially solves the aforementioned technical problems.

[0004] This application provides a sound-generating device, including a housing, a first bracket, a main board, a sliding sensor, and a pressure-sensitive component. The housing forms an internal cavity, the main board is disposed within the internal cavity, the first bracket is disposed within the internal cavity and fixed to the main board, the sliding sensor is disposed on the first bracket and directly attached to the inner wall of the housing, the pressure-sensitive component is connected to the side of the sliding sensor away from the inner wall and supported on the main board, and the pressure-sensitive component and the main board are electrically connected.

[0005] The sound-generating device provided in this application embodiment has a sliding sensor and a main board both mounted on a first bracket. The pressure-sensitive component is located on the side of the sliding sensor away from the inner wall and supported by the main board. These components are stacked to form an integral structure, allowing the sliding sensor to remain in contact with the inner wall without the need for adhesive. During assembly, the sliding sensor, main board, pressure-sensitive component, and first bracket can be installed as a whole, making the assembly process convenient and quick. It can be easily assembled for both one-piece and split-type housings, broadening its application range.

[0006] These or other aspects of this application will become more apparent in the following description of the embodiments. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 This is a schematic diagram of the structure of an earphone and earphone case proposed in an embodiment of this application.

[0009] Figure 2 This is a schematic diagram of the structure of an earphone proposed in an embodiment of this application.

[0010] Figure 3 This is a partial cross-sectional structural diagram of an earphone proposed in an embodiment of this application.

[0011] Figure 4 This is a partial cross-sectional structural diagram of the shell of an earphone according to an embodiment of this application.

[0012] Figure 5 This is a partial cross-sectional structural diagram of another earphone shell proposed in an embodiment of this application.

[0013] Figure 6 for Figure 3 Enlarged view of point A in the middle.

[0014] Figure 7 This is a schematic diagram of the structure of a sliding sensor in an earphone according to an embodiment of this application.

[0015] Figure 8 This is a schematic diagram of an assembly structure of a sliding sensor and pressure-sensitive component in an earphone according to an embodiment of this application.

[0016] Figure 9 This is a schematic diagram of another assembly structure of a sliding sensor and pressure-sensitive component in an earphone according to an embodiment of this application.

[0017] Figure 10 This is a partial structural diagram of the first bracket in an earphone according to an embodiment of this application.

[0018] Figure 11 This is a partial cross-sectional structural diagram of another type of earphone proposed in an embodiment of this application.

[0019] Figure 12 yes Figure 11 Enlarged view of point B in the middle. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The embodiments, implementation methods and their technical features in this application can be combined with each other without conflict. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] For a sliding sensor to accurately recognize user commands, it needs to remain in contact with the user's operating surface. Currently, in sound-producing devices such as headphones, the sliding and pressing controls are typically located on the headphone stem. There are two types of headphone stem housings: one is a split structure, consisting of two or more separate parts assembled together. This type allows the sliding sensor to be installed by first gluing it to the headphone stem and then assembling it. The other type is a one-piece structure, usually cylindrical. Because it's difficult to apply adhesive to the inner wall of this type of housing, the sliding sensor cannot be fixed in place.

[0022] Based on this, the inventors of this application propose a sound-generating device that can adapt to different shell designs. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0023] See Figure 1 This embodiment provides a sound-generating device 10, which is an earphone. The earphone can be housed in an earphone case 20. The earphone case 20 includes a case body 21 and a case cover 22. The case cover 22 is disposed on the case body 21 and can selectively open or close the case body 21. For example, the case cover 22 can be connected to the case body 21 by a hinge or by a detachable snap-fit ​​to the case body 21. No limitation is made here.

[0024] Please continue reading. Figure 1 The sound-generating device 10 may include a first earphone 11 and a second earphone 12 for a user to wear in their left and right ears. The first earphone 11 and the second earphone 12 can communicate wirelessly or with other electronic devices (such as mobile phones, computers, tablets, smart wearable devices, etc.). It is understood that in some other embodiments, there may be only one or more sound-generating devices 10, which is not limited here.

[0025] See Figure 2 Each sound-generating device 10 may include an ear inlet 13 and a connecting rod 14, the ear inlet 13 being connected to the connecting rod 14, the ear inlet 13 being configured to be inserted into the human ear, and the connecting rod 14 being located outside the ear when worn and can be operated by the user.

[0026] In this embodiment, see Figure 3 The sound-generating device 10 includes a housing 40, a first bracket 60, a main board 50, a sliding sensor 70, and a pressure-sensitive component 80. The housing 40 forms an internal cavity 43, and the first bracket 60, the main board 50, the sliding sensor 70, and the pressure-sensitive component 80 are all disposed within the internal cavity 43 formed by the housing 40.

[0027] Specifically, in this embodiment, the outer shell 40 is the housing of the connecting rod portion 14, and the outer shell 40 has a generally cylindrical structure with an inner wall 48. Please refer to the following in this embodiment: Figure 3 and Figure 4 The outer shell 40 includes a cylindrical body 41 and a plug 42. The longitudinal section of the cylindrical body 41 is generally flat, and an inner cavity 43 is formed inside the cylindrical body 41. The plug 42 is disposed at one end of the cylindrical body 41 and closes one end of the inner cavity 43. Specifically, the plug 42 is disposed at the end of the cylindrical body 41 away from the earpiece 13. In some other embodiments, the longitudinal section of the cylindrical body 41 may also be a circular structure or other types of structures, which is not limited in this embodiment. In this embodiment, the cylindrical body 41 is an integrally formed structure, that is, the cylindrical body 41 is a continuous structure.

[0028] In some implementations, please refer to [the relevant documentation]. Figure 4 The plug 42 and the cylinder 41 can be fixed by an interference fit or by a threaded connection. In this embodiment, the plug 42 and the cylinder 41 are fixed by adhesive application. This adhesive application completely seals the gap between the plug 42 and the cylinder 41, improving the sealing performance of the inner cavity 43 and preventing external moisture and impurities from entering the inner cavity 43 and affecting the electrical components inside.

[0029] In another implementation, see Figure 5 The outer shell 40 includes a first shell 45 and a second shell 46. Both the first shell 45 and the second shell 46 have approximately semi-circular longitudinal sections and are mutually matched, allowing for detachable assembly to form a cylindrical structure. When the first shell 45 and the second shell 46 are assembled together, they form an inner cavity 43, and the ends of the inner cavity 43 are closed. In some other embodiments, the outer shell 40 may also be formed by assembling multiple parts; this embodiment does not limit this.

[0030] Please refer to it again. Figure 3The mainboard 50 is disposed within the internal cavity 43. The mainboard 50 can integrate devices such as a processor and a memory. The memory can store operation instructions, and the processor can call the stored operation instructions to control the sound-emitting device 10 to perform predetermined operations. The mainboard 50 has a generally plate-like structure and can be fixed within the internal cavity 43 in various ways, such as directly or indirectly fixed to the outer shell 40. For example, the mainboard 50 can be fixed to the plug 42 or the cylinder 41. In this embodiment, a limiting groove 44 is provided on the surface of the plug 42 facing the internal cavity 43. The structure of the limiting groove 44 can be adapted to the structure of the mainboard 50, and the mainboard 50 is at least partially embedded in the limiting groove 44 for fixation. In some embodiments, the mainboard 50 can be fixed within the limiting groove 44 by interference fit; in other embodiments, the mainboard 50 can also be fixed within the limiting groove 44 by adhesive dispensing. Of course, in other embodiments, the mainboard 50 can also be fixed to the plug 42 by snap-fit ​​or other methods.

[0031] Please refer to the following: Figure 3 and Figure 6 The first bracket 60 is disposed within the inner cavity 43 and fixed to the main board 50. The first bracket 60 is approximately located between the inner wall 48 and the main board 50, and can be used to support the sliding sensor 70. This embodiment does not limit the structure of the first bracket 60; it can be configured in any shape. The surface of the first bracket 60 away from the main board 50 can be configured as a flat structure to accommodate the sliding sensor 70.

[0032] The sliding sensor 70 is disposed on the first bracket 60 and directly abuts against the inner wall 48 of the housing 40. Specifically, in this embodiment, the sliding sensor 70 is disposed on the surface of the first bracket 60 away from the motherboard 50, and the surface of the sliding sensor 70 away from the first bracket 60 is abutted against the inner wall 48. That is, the first bracket 60 supports the sliding sensor 70, so that the sliding sensor 70 is directly abutted against the inner wall 48 and always abuts against the inner wall 48. This eliminates the need for adhesive between the sliding sensor 70 and the inner wall 48, and also ensures that the sliding sensor 70 and the inner wall 48 remain in a state of constant contact. In other words, the sliding sensor 70 is clamped between the first bracket 60 and the inner wall 48, so that the sliding sensor 70 always remains in a state of contact with the inner wall 48.

[0033] In this embodiment, the sliding sensor 70 can be directly laid on the surface of the first bracket 60, or an adhesive backing can be applied to the surface of the first bracket 60 away from the motherboard 50, allowing the sliding sensor 70 to be bonded and fixed to the first bracket 60. In other embodiments, the sliding sensor 70 can also be fixed to the first bracket 60 in other ways, such as by fastening it with screws or other fasteners, or by using clips on the first bracket; this embodiment does not limit this method. In other embodiments, a groove can be formed in the first bracket 60, so that the sliding sensor 70 is at least partially embedded in the groove during installation, thereby reducing the space occupied by the sliding sensor 70 during installation.

[0034] In this embodiment, see Figure 7 The sliding sensor 70 includes at least two sensing elements 72 and a flexible circuit board 71. The at least two sensing elements 72 are arranged side by side on the flexible circuit board 71, which is supported on the first bracket 60. When the user slides, different sensing elements 72 detect the user's touch signal in sequence, and the user's sliding direction can be determined based on the position and sequence of the touch signals. Figure 7 In the illustrated embodiment, the slide sensor 70 includes three sensing elements 72 arranged side-by-side in the same direction. It is understood that in other embodiments, the number of sensing elements 72 may be different, and this embodiment does not limit this. Furthermore, in other embodiments, at least two sensing elements 72 may be arranged side-by-side in multiple directions, allowing the slide sensor 70 to detect sliding operations by the user in multiple directions and execute corresponding control commands.

[0035] The sliding sensor 70 is electrically connected to the motherboard 50. Specifically, the flexible circuit board 71 is electrically connected to the motherboard 50 after routing. When the user slides the housing 40, the sliding sensor 70 detects the sliding signal and sends it to the processor on the motherboard 50. The processor can call the control instructions corresponding to the sliding signal stored in the memory, and then execute the corresponding operation instructions according to the user's pressing operation.

[0036] It should also be noted that, for ease of user operation, the sliding sensor 70 can be positioned below the portion of the outer shell 40 that does not contact the user's skin when worn. Of course, depending on different usage requirements, it is also feasible to position the sliding sensor 70 in other locations on the outer shell 40, and this embodiment does not limit this.

[0037] Please continue reading. Figure 3 and Figure 6The pressure-sensitive component 80 is connected to the side of the sliding sensor 70 away from the inner wall 48 and supported on the motherboard 50. Simultaneously, the pressure-sensitive component 80 is electrically connected to the motherboard 50. Thus, when a user presses within the detection area of ​​the sliding sensor 70, the pressure-sensitive component 80 can acquire the press signal and send it to the processor on the motherboard 50. The processor can then call the control instructions stored in the memory corresponding to the press signal, and execute the corresponding operation instructions based on the user's press operation.

[0038] In this embodiment, the pressure-sensitive component 80 is supported on the motherboard 50. The motherboard 50 can provide support for the pressure-sensitive component 80. When the user presses the detection area of ​​the sliding sensor 70, the pressure-sensitive component 80 deforms. Since the motherboard 50 can provide support for the pressure-sensitive component 80, the deformation of the pressure-sensitive component 80 itself can be greater, and the detection accuracy is higher.

[0039] To facilitate the installation of the pressure-sensitive component 80, in this embodiment, the first bracket 60 is also provided with a receiving portion 61, which extends through the first bracket 60. The receiving portion 61 can be a through hole in the first bracket 60, or a notch, groove, or other structure on the edge of the first bracket 60. This embodiment does not limit this.

[0040] The pressure-sensitive component 80 is located within the housing 61 and supported on the main board 50. This arrangement allows the first bracket 60 to avoid obstructing the pressure-sensitive component 80, ensuring that the sliding sensor 70 is fully supported by the first bracket 60 during installation without affecting the pressure-sensitive component 80. This increases the contact area between the sliding sensor 70 and the inner wall 48, expands the detection area, and improves detection accuracy. In other embodiments, the housing 61 may be omitted, in which case the pressure-sensitive component 80 can be positioned along the edge of the first bracket 60.

[0041] Please refer to the following in this embodiment: Figure 6 and Figure 8 The pressure-sensitive component 80 includes a sensor 81, a circuit board 82, a buffer 84, and a reinforcing member 83. The reinforcing member 83 is used to improve the structural rigidity of the entire pressure-sensitive component 80, so that during the user's pressing operation, the deformation of the pressure-sensitive component 80 is transmitted only within a limited range, avoiding the deformation from being transmitted to the motherboard 50 and causing damage to the motherboard 50. The reinforcing member 83 can be made of metal or other materials with strong structural rigidity. In this embodiment, the reinforcing member 83 is a steel sheet.

[0042] Circuit board 82 is attached to one side of the reinforcing member 83 and can be electrically connected to the main board 50 via wiring. Sensor 81 is disposed on the surface of circuit board 82 away from the reinforcing member 83. A pad 88 can also be provided between sensor 81 and circuit board 82, with sensor 81 mounted on the pad 88 for easy placement. Buffer 84 is disposed on the surface of sensor 81 away from circuit board 82. Buffer 84 provides sufficient deformation space. When the user presses the detection area of ​​sliding sensor 70, the pressure is transmitted to pressure-sensitive assembly 80. Sensor 81 detects the change in pressure signal and sends the pressing signal to the processor. During this process, buffer 84 deforms. When the pressing pressure disappears, buffer 84 returns to its original deformation, causing the entire pressure-sensitive assembly 80 to reset to its initial position.

[0043] The buffer 84 is made of a material with strong deformation properties, such as silicone, foam, etc., and this embodiment does not limit it.

[0044] In this embodiment, please continue to refer to Figure 6 and Figure 8 The surface of the reinforcing member 83 furthest from the circuit board 82 is bonded to the surface of the sliding sensor 70 furthest from the inner wall 48 via an adhesive backing layer 73. Specifically, the surface of the reinforcing member 83 furthest from the circuit board 82 is bonded to the flexible circuit board 82 of the sliding sensor 70 via an adhesive backing layer 73. The buffer member 84 is supported on the main board 50. Specifically, the buffer member 84 is bonded to the main board via an adhesive backing layer 85 and is supported on the main board 50. The advantage of this arrangement is that the rigid reinforcing member 83 is closer to the outer shell 40, the rigidity of the entire pressure-sensitive assembly 80 is stronger, and it is more conducive to protecting the pressure-sensitive assembly 80 and other components within the inner cavity 43.

[0045] In another implementation, see Figure 9 The surface of the reinforcing member 83, away from the circuit board 82, is supported on the main board 50. The buffer member 84 is bonded to the surface of the sliding sensor 70, away from the inner wall 48. That is, one end of the buffer member 84, away from the sensor 81, is bonded to the flexible circuit board 82 of the sliding sensor 70 through the adhesive layer 73. At this time, the reinforcing member 83 can be directly bonded to the surface of the main board 50. The advantage of this implementation is that the buffer member 84 is closer to the outer shell 40. Therefore, when the user performs a pressing operation, a slight force can cause the buffer member 84 to deform, and the sensor 81 can detect the change in pressure signal. Therefore, the detection is more sensitive and the user's operation is simpler.

[0046] In other embodiments, the pressure-sensitive component 80 may also be other forms of pressure-sensitive components, such as capacitive pressure-sensitive components, etc., and this embodiment does not limit it.

[0047] In this embodiment, see Figure 10The sound-emitting device 10 also includes an antenna 65, which is mounted on the first bracket 60 and electrically connected to the main board 50. That is, the antenna 65 and the sliding sensor 70 share the first bracket 60. The sliding sensor 70 utilizes the first bracket 60 for mounting the antenna 65, reducing the space occupied within the internal cavity 43 and eliminating the need for additional components, thus lowering costs. In other embodiments, the antenna 65 may be mounted on a separate bracket; this embodiment does not limit this. In terms of antenna type, the antenna 65 can be various types of antennas, such as FPC antennas, LDS antennas, etc.; this embodiment does not limit this. In terms of antenna function, the antenna 65 can be a Bluetooth antenna and / or a WiFi antenna, etc.; this embodiment does not limit this.

[0048] In some implementations, please refer to the following: Figure 11 and Figure 12 To allow sufficient deformation space for the pressure-sensitive component 80, the thickness of the buffer 84 can be set to be larger, for example, the thickness of the buffer 84 can be greater than or equal to 1 mm. At this time, the space of the receiving part 61 may not be enough to fully accommodate the pressure-sensitive component 80. Therefore, in this embodiment, the main board 50 can have a fixing groove 51, which corresponds to the receiving part 61. The pressure-sensitive component 80 can be at least partially located in the fixing groove 51. Specifically, the end of the pressure-sensitive component 80 away from the sliding sensor 70 extends into the fixing groove 51 and is supported by the main board 50. With this arrangement, the fixing groove 51 and the receiving part 61 can simultaneously accommodate the pressure-sensitive component 80, leaving more space for the pressure-sensitive component 80.

[0049] During the process of supporting the pressure-sensitive component 80 on the motherboard 50, it can be directly supported on the motherboard 50. For example, the end of the pressure-sensitive component 80 that is away from the sliding sensor 70 can be directly attached to the motherboard 50.

[0050] In this embodiment, further details can be found by referring to [the relevant documentation / reference]. Figure 11 and Figure 12 The sound-generating device 10 may also include a second bracket 90, with the end of the pressure-sensitive component 80 furthest from the sliding sensor 70 disposed on the second bracket 90, which supports the motherboard 50. By providing the second bracket 90, on the one hand, the distance between the pressure-sensitive component 80 and the motherboard 50 can be easily adjusted, ensuring that the sliding sensor 70 is precisely aligned with the inner wall 48 of the housing 40 in its initial state; on the other hand, the structure of the second bracket 90 can be precisely designed to control the contact position between the second bracket 90 and the motherboard 50, while reducing the contact area between the second bracket 90 and the motherboard 50 when supported. This avoids interference with other components mounted on the motherboard 50.

[0051] Specifically, in this embodiment, such as Figure 12 As shown, the second bracket 90 includes a support portion 91 and at least one leg 92 connected to the support portion 91. The support portion 91 can be configured as a generally flat structure. The pressure-sensitive component 80 is disposed on the surface of the support portion 91 away from the leg 92. To ensure a tight connection between the pressure-sensitive component 80 and the support portion 91, an adhesive backing can be provided between the pressure-sensitive component 80 and the support portion 91. The leg 92 supports the motherboard 50. The number of legs 92 can be one, two, or more; this embodiment does not limit this. In some embodiments, when the number of legs 92 is greater than or equal to two, at least one leg 92 can be arranged symmetrically to make the supporting force on the pressure-sensitive component 80 more uniform and balanced. In this embodiment, as shown... Figure 12 As shown, there are two support legs 92. To ensure a stable connection between the support legs 92 and the motherboard 50, adhesive backing can also be used for connection between the support legs 92 and the motherboard 50.

[0052] The second support 90 and the first support 60 can be made of the same material. In some embodiments, the first support 60 and the second support 90 can be separate and independently configured. In this embodiment, the first support 60 and the second support 90 are integrally combined, that is, the first support 60 and the second support 90 can be integrally formed during the manufacturing process. This configuration can reduce manufacturing costs and make subsequent assembly easier.

[0053] The sound-generating device 10 provided in this embodiment can be assembled in the following manner: First, assemble the motherboard 50, the first bracket 60, and the second bracket 90 into a whole. Then, assemble the sliding sensor 70 and the pressure-sensitive component 80 into a whole. Finally, install the sliding sensor 70 and the pressure-sensitive component 80 into the receiving part 61. Then, apply adhesive to the support part 91 of the second bracket 90. Place the sliding sensor 70 in a flat structure on the surface of the first bracket 60 away from the motherboard 50. The surface of the first bracket 60 away from the motherboard 50 can be coated with adhesive to bond the sliding sensor 70. At this time, the pressure-sensitive component 80 is supported on the support part 91 of the second bracket 90 and connected with the adhesive.

[0054] After assembling the above components, insert them into the inner cavity 43 from one end of the cylinder 41. Align the sliding sensor 70 with the detection area on the outer shell 40. Apply glue to the plug 42 and then insert the plug 42 into one end of the cylinder 41 so that the limiting groove 44 is aligned with the main board 50. The main board 50 is embedded in the limiting groove 44 to position the main board 50 and ensure that the sliding sensor 70 does not move.

[0055] For example Figure 5The outer casing 40 shown can be assembled by first assembling the motherboard 50, first bracket 60, second bracket 90, sliding sensor 70, and pressure-sensitive component 80 into a whole, then placing it inside the first casing 45, and then assembling the second casing 46 with the first casing 45 to form the outer casing 40. It should be noted that, although... Figure 5 Not shown in the middle. Figure 5 The outer casing 40 shown can also be provided with a limiting groove to fix the motherboard 50, but this embodiment does not limit this.

[0056] It should also be noted that, although the sliding sensor 70 is disposed inside the housing 40 of the connecting rod portion 40 in the structure shown in the above embodiments, those skilled in the art can know from the content of the foregoing embodiments that the sliding sensor 70 can also be disposed inside the housing 40 of the ear inlet portion 13, especially in the part of the ear inlet portion 13 that does not enter the user's ear when worn. This embodiment does not limit this.

[0057] The sound-generating device 10 provided in this embodiment has a sliding sensor 70 and a main board 50 both mounted on a first bracket 60. The pressure-sensitive component 80 is located on the side of the sliding sensor 70 away from the inner wall 48 and is supported by the main board 50. These components are stacked to form an integral structure, allowing the sliding sensor 70 to remain in close contact with the inner wall 48 without the need for adhesive. During assembly, the sliding sensor 70, main board 50, pressure-sensitive component 80, and first bracket 60 can be installed as a whole, making the assembly process convenient and quick. This allows for easy assembly of both one-piece and split-type housings 40, broadening its application range.

[0058] The sound-generating device 10 in this embodiment can also be a speaker, loudspeaker, etc., and this embodiment does not limit it.

[0059] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A sound-generating device, characterized in that, include: The outer shell encloses the internal cavity; A motherboard, wherein the motherboard is disposed within the content cavity; A first support is disposed within the content cavity and fixed to the motherboard; A sliding sensor is disposed on the first bracket and directly attached to the inner wall of the housing; as well as A pressure-sensitive component is connected to the side of the sliding sensor away from the inner wall and supported on the motherboard. The pressure-sensitive component and the sliding sensor are electrically connected to the motherboard.

2. The sound-generating device according to claim 1, characterized in that, The first bracket has a receiving portion that extends through the first bracket, and the pressure-sensitive component is located inside the receiving portion and supported on the motherboard.

3. The sound-generating device according to claim 2, characterized in that, The motherboard has a fixing slot, which corresponds to the receiving part, and the pressure-sensitive component is at least partially located in the fixing slot.

4. The sound-generating device according to claim 1, characterized in that, The sound-generating device further includes an antenna, which is disposed on the first bracket.

5. The sound-generating device according to claim 1, characterized in that, The sound-generating device also includes a second bracket, with one end of the pressure-sensitive component away from the sliding sensor disposed on the second bracket, and the second bracket supporting the motherboard.

6. The sound-generating device according to claim 5, characterized in that, The second bracket includes a support portion and at least one leg connected to the support portion, the pressure-sensitive component is disposed on the support portion, and the leg supports the motherboard.

7. The sound-generating device according to claim 5, characterized in that, The first bracket and the second bracket are integrated as a single unit.

8. The sound-generating device according to any one of claims 1-7, characterized in that, The pressure-sensitive component includes a sensor, a circuit board, a buffer, and a reinforcing member. The circuit board is attached to the surface of the reinforcing member, the sensor is disposed on the surface of the circuit board away from the reinforcing member, and the buffer is disposed on the surface of the sensor away from the circuit board.

9. The sound-generating device according to claim 8, characterized in that, The surface of the reinforcing member away from the circuit board is bonded to the surface of the sliding sensor away from the inner wall, and the buffer member is supported on the motherboard.

10. The sound-generating device according to claim 8, characterized in that, The surface of the reinforcing member away from the circuit board is supported by the motherboard, and the buffer is bonded to the surface of the sliding sensor away from the inner wall.

11. The sound-generating device according to any one of claims 1-7, characterized in that, The outer shell includes a cylindrical body and a plug. The inner cavity is formed inside the cylindrical body. The plug is disposed at one end of the cylindrical body and closes one end of the inner cavity. The main board is fixed to the plug or the cylindrical body.

12. The sound-generating device according to claim 11, characterized in that, The surface of the plug facing the internal cavity is provided with a limiting groove, and the main board is at least partially embedded in the limiting groove.

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