Loudspeaker module and audio device

Abstract

The utility model discloses a kind of loudspeaker module and audio equipment.The loudspeaker module includes pedestal, MEMS loudspeaker and moving coil loudspeaker.The pedestal has the first surface and the second surface of opposite arrangement;MEMS loudspeaker is set to the first surface of the pedestal;Moving coil loudspeaker is set to the second surface of the pedestal, and the sound emitting surface of the moving coil loudspeaker and the MEMS loudspeaker is towards the same side.The loudspeaker module combines moving coil loudspeaker with MEMS loudspeaker, has better acoustic sensitivity and acoustic effect in sound full frequency.At the same time, since the volume of MEMS loudspeaker is smaller, so the loudspeaker module can be smaller while ensuring the acoustic sensitivity and acoustic effect of full frequency band.

Description

Technical Field

[0001] This utility model belongs to the field of audio equipment technology, specifically relating to a speaker module and audio equipment. Background Technology

[0002] Audio devices typically include speaker modules. Taking headphones as an example, they usually employ dual-driver balanced armature modules and dynamic-balanced armature composite modules. Dual-driver balanced armature modules operate by using two balanced armature drivers. These drivers rely on current flowing through a voice coil to cause a balanced armature to vibrate in a magnetic field, transmitting the vibration to a miniature diaphragm to produce sound. To achieve better high, mid, and low frequency coverage, dual-driver designs often employ crossover technology, such as using a passive crossover circuit to distribute signals of different frequency bands to different drivers for processing. Therefore, balanced armature drivers have high sensitivity and excellent transient response. However, their inherent limitation lies in insufficient low-frequency response. Even with dual balanced armature driver solutions, the response below 1000Hz is often low, resulting in a relatively limited audible spectrum.

[0003] The dynamic-balanced armature hybrid module houses both a dynamic driver (typically responsible for mid-low frequencies) and a balanced armature driver (typically responsible for high frequencies) within the earphone housing. The core advantage of this approach lies in its complementary frequency bands. The dynamic driver delivers a more natural, relaxed, and powerful mid-low frequency response, while the balanced armature driver ensures bright, high-resolution, and detailed high frequencies. However, because the dynamic driver requires space to vibrate the air and produce full bass, earphones using this hybrid approach typically have a larger housing size. This poses a significant challenge for products like earphones that prioritize miniaturization and portability.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a speaker module that can have better acoustic sensitivity and acoustic effect across the entire sound frequency range, and can be smaller in size.

[0006] To achieve the above objectives, a specific embodiment of this utility model provides the following technical solution: a speaker module, comprising a base, a MEMS speaker, and a dynamic speaker. The base has a first surface and a second surface disposed opposite to each other; the MEMS speaker is disposed on the first surface of the base; the dynamic speaker is disposed on the second surface of the base, and the sound-emitting surfaces of the dynamic speaker and the MEMS speaker face the same side.

[0007] In one or more embodiments of this utility model, the MEMS loudspeaker is located in front of the sound-emitting surface of the dynamic loudspeaker.

[0008] In one or more embodiments of this utility model, the MEMS loudspeaker and the dynamic loudspeaker are coaxially arranged.

[0009] In one or more embodiments of the present invention, the first surface is provided with a first receiving groove for accommodating the MEMS speaker, and the shape of the first receiving groove matches the MEMS speaker.

[0010] In one or more embodiments of this utility model, the base is provided with a vent hole that communicates with the first receiving groove and the second surface.

[0011] In one or more embodiments of the present invention, the second surface is provided with a second receiving groove for accommodating the dynamic loudspeaker, and the shape of the second receiving groove matches the dynamic loudspeaker.

[0012] In one or more embodiments of the present invention, there is a gap between the sound-emitting side of the moving coil loudspeaker and the bottom of the second receiving groove.

[0013] In one or more embodiments of this utility model, a sound transmission groove is provided on the base to connect the first surface and the second surface, so as to transmit the sound of the dynamic loudspeaker.

[0014] In one or more embodiments of this invention, a flexible circuit board is also included for connecting the dynamic speaker and the MEMS speaker.

[0015] In one or more embodiments of this utility model, the flexible circuit board includes:

[0016] A first connecting segment is connected to the MEMS speaker, and the first connecting segment is disposed between the MEMS speaker and the first surface;

[0017] The second connecting section is connected to the side of the moving coil speaker opposite to the base; and

[0018] The mating section extends along the side wall of the base and connects with the first connecting section and the second connecting section.

[0019] In one or more embodiments of this utility model, the side wall of the base is provided with a groove, and the mating section is arranged along the groove.

[0020] In one or more embodiments of this utility model, the first connection segment or the second connection segment is provided with multiple signal input terminals.

[0021] Compared to existing technologies, the speaker module of this invention combines a dynamic speaker and a MEMS speaker, resulting in better acoustic sensitivity and performance across the entire sound frequency range. Furthermore, due to the smaller size of the MEMS speaker, the speaker module can be made smaller while maintaining full-frequency acoustic sensitivity and performance. In addition, by employing a flexible circuit board and optimizing its layout within the speaker module, the size of the speaker module can be further controlled or reduced, making it more suitable for small audio devices.

[0022] Another specific embodiment of this utility model provides an audio device, which includes the above-described speaker module.

[0023] Compared with the prior art, the audio device of this utility model can be smaller in size while ensuring acoustic sensitivity and acoustic effect across the entire frequency band, or it can leave enough space for other modules to realize more functions of the audio device. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a perspective view of a speaker module in one embodiment of the present invention;

[0026] Figure 2 This is a first exploded view of the speaker module in one embodiment of the present invention;

[0027] Figure 3 This is a second exploded view of the speaker module in one embodiment of the present invention.

[0028] Explanation of key figure labels:

[0029] 1-Base, 11-First surface, 111-First receiving groove, 12-Second surface, 121-Second receiving groove, 13-Ventilation hole, 14-Sound transmission groove, 15-Groove, 2-MEMS speaker, 3-Dynamic speaker, 4-Flexible circuit board, 41-First connecting section, 42-Second connecting section, 43-Matching section. Detailed Implementation

[0030] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0031] Existing dual-driver balanced armature solutions in headphones often have a low response in the frequency range below 1000Hz, resulting in a relatively limited audible spectrum. Dynamic driver plus balanced armature solutions have better low-frequency response, but they are larger in size, which is not conducive to the assembly and appearance design of audio equipment, especially small audio devices such as headphones.

[0032] like Figure 1-3 As shown, a speaker module according to one embodiment of the present invention includes a base 1, a MEMS speaker 2, and a dynamic speaker 3. The base 1 has a first surface 11 and a second surface 12 disposed opposite to each other. The MEMS speaker 2 is disposed on the first surface 11 of the base 1. The dynamic speaker 3 is disposed on the second surface 12 of the base 1, and the sound-emitting surfaces of the dynamic speaker 3 and the MEMS speaker 2 face the same side.

[0033] The dynamic speaker 3 provides a more natural, relaxed, and powerful mid-low frequency response, but its high-frequency performance is insufficient. The MEMS speaker 2 uses a thin-film piezoelectric material as the driver and a thin monocrystalline silicon layer as the diaphragm. Due to the material properties, the MEMS speaker 2 has lower acoustic sensitivity in the mid-low frequency range (20Hz-4000Hz) compared to the dynamic speaker 3, but higher sound sensitivity in the high frequency range (above 4000Hz). Therefore, in the above embodiment, a MEMS (Micro-Electro-Mechanical Systems) speaker is added to the speaker module to complement the dynamic speaker 3, thereby enhancing high-frequency performance. By combining the dynamic speaker 3 and the MEMS speaker 2, this speaker module achieves good acoustic sensitivity and sound quality across the entire frequency range (20Hz to 40kHz). Furthermore, due to the smaller size of the MEMS speaker 2, the overall size of the speaker module can be reduced while maintaining good acoustic sensitivity and sound quality across the entire frequency range.

[0034] Since MEMS speaker 2 is typically responsible for reproducing mid-to-high frequency sounds, and high-frequency sound waves are more directional and easily blocked or attenuated, therefore, in one embodiment, as... Figure 2As shown, the MEMS speaker 2 is located in front of the sound-emitting surface of the dynamic speaker 3. With this configuration, when the speaker module is placed inside the headphones, the MEMS speaker 2 is positioned closest to the ear, which reduces the obstruction and reflection of high-frequency sound waves in the propagation path, ensuring clear and accurate transmission of high-frequency details and avoiding high-frequency loss due to obstruction caused by the structure of the dynamic speaker 3 when placed at the rear.

[0035] Preferably, the MEMS speaker 2 and the moving-coil speaker 3 can be coaxially arranged. In one embodiment, the MEMS speaker 2 and the moving-coil speaker 3 are coaxially arranged and can be located on opposite sides of the base 1, thereby making full use of the longitudinal space of the base 1, reducing the overall volume of the speaker module, and helping to achieve a compact structure of the speaker module.

[0036] In one implementation, such as Figure 2 and Figure 3 As shown, the first surface 11 of the base 1 has a first receiving groove 111 for accommodating the MEMS speaker 2. Preferably, the shape of the first receiving groove 111 matches the MEMS speaker 2. For example, when the MEMS speaker 2 is rectangular, the first receiving groove 111 is also approximately rectangular, thereby saving space inside the base 1 and helping to reduce the overall structure of the speaker module. The MEMS speaker 2 can also be circular, in which case the first receiving groove 111 is also circular.

[0037] Because the diaphragm of the MEMS speaker 2 is very thin and sensitive, if its installation location is completely sealed, when the air pressure or temperature of the external environment changes, the air pressure inside the sealed cavity cannot be balanced with the external pressure in time, resulting in a pressure difference on both sides of the diaphragm. This can cause the diaphragm to bulge outward or sag inward, resulting in static displacement. This can range from affecting the linearity of vibration and causing sound distortion to causing excessive stretching of the diaphragm or even damage from contact with other components. Therefore, in one embodiment, the base 1 is provided with a vent 13 that communicates with the first receiving groove 111 and the second surface 12. This arrangement allows airflow to enter the first receiving groove 111 through the vent 13, achieving uniform air pressure on both sides of the MEMS speaker 2, ensuring the acoustic performance of the MEMS speaker 2. Furthermore, by providing the vent 13 on the base 1, no additional ventilation structure is needed, which also helps to control or reduce the overall size of the speaker module.

[0038] In one embodiment, the second surface 12 of the base 1 has a second receiving groove 121 for accommodating the moving coil speaker 3. Preferably, the shape of the second receiving groove 121 matches that of the moving coil speaker 3. For example, if the moving coil speaker 3 is circular, then the second receiving groove 121 is also circular.

[0039] Furthermore, to prevent the diaphragm of the dynamic loudspeaker 3 from colliding with the base 1 structure during vibration, and to avoid generating noise or damaging the diaphragm, there is a gap between the sound output side of the dynamic loudspeaker 3 and the bottom of the second receiving groove 121.

[0040] For example, a boss is provided circumferentially on the side wall of the second receiving groove 121, forming a stepped structure on the side wall of the second receiving groove 121. When the moving coil speaker 3 is installed in the second receiving groove 121, the edge of the moving coil speaker 3 abuts against the boss, thereby forming a gap between the sound output side of the moving coil speaker 3 and the bottom of the second receiving groove 121, so that the diaphragm on the sound output side will not directly contact the bottom of the second receiving groove 121. This arrangement can avoid diaphragm damage while ensuring the tone of the moving coil speaker 3.

[0041] Since the sound-emitting side of the dynamic speaker 3 faces the MEMS speaker 2, it can be understood that the sound-emitting side of the dynamic speaker 3 also faces the base 1, that is, it is positioned towards the bottom of the second receiving groove 121. Therefore, in order to avoid the base 1 completely covering the dynamic speaker and affecting the sound output of the dynamic speaker 3, a sound transmission groove 14 connecting the first surface 11 and the second surface 12 is provided on the base 1.

[0042] Specifically, the sound transmission groove 14 is connected to the first surface 11 of the base 1 and the bottom of the second receiving groove 121 to allow sound from the moving coil speaker 3 to pass through. At the same time, the base 1 acts as a barrier between the moving coil speaker 3 and the MEMS speaker 2, which can prevent the moving coil speaker 3 from affecting the acoustic performance of the MEMS speaker 2.

[0043] Preferably, there can be two sound transmission slots 14, which are symmetrically arranged on both sides of the first receiving slot 111, so that the sound of the moving coil speaker 3 is transmitted evenly from one side of the base 1 to the other side without being affected by the acoustic effect of the base 1.

[0044] In one implementation, such as Figure 2 and Figure 3 As shown, the speaker module includes a flexible circuit board 4 for connecting the dynamic speaker 3 and the MEMS speaker 2, so that the relevant audio signals transmitted by the audio input device can be output through the dynamic speaker 3 and the MEMS speaker 2. The flexible circuit board 4 can effectively connect the dynamic speaker 3 and the MEMS speaker 2 without additional wiring.

[0045] Specifically, the flexible circuit board 4 includes a first connecting segment 41, a second connecting segment 42, and a mating segment 43. The first connecting segment 41 is connected to the MEMS speaker 2 and is disposed between the MEMS speaker 2 and the first surface 11. In one embodiment, preferably, the first connecting segment 41 can be rectangular to match the shape of the MEMS speaker 2 and the first receiving groove 111, thereby optimizing the internal structure of the speaker module and reducing the size of the speaker module.

[0046] The second connecting section 42 is connected to the side of the moving-coil speaker 3 opposite to the base 1. Preferably, the second connecting section 42 can be arc-shaped, arranged circumferentially on the surface of the moving-coil speaker 3. This arrangement can also make full use of the speaker module structure and further reduce the size of the speaker module.

[0047] The mating section 43 extends along the side wall of the base 1 and connects with the first connecting section 41 and the second connecting section 42. Preferably, a groove 15 is provided on the side wall of the base 1 so that the mating section 43 can extend from the groove 15, thereby preventing the flexible circuit board 4 from protruding from the side wall of the base 1 and reducing the volume of the entire speaker module.

[0048] In one embodiment, the flexible circuit board 4 is provided with multiple signal input terminals. Specifically, the multiple signal input terminals can be located on the first connection section 41 or the second connection section 42. Preferably, the second connection section 42 is provided with four signal input terminals, which correspond to the positive and negative terminals of the MEMS speaker 2 and the moving-coil speaker 3, respectively. With the four signal input terminals located at the same end of the flexible circuit board, audio signals can be simultaneously input to both the MEMS speaker 2 and the moving-coil speaker 3 without additional wiring, simplifying the circuit structure of the speaker module and making it easier to control the size of the speaker module.

[0049] In summary, the speaker module of this invention, by combining a dynamic speaker 3 and a MEMS speaker 2, achieves better acoustic sensitivity and performance across the entire sound frequency range. Furthermore, due to the smaller size of the MEMS speaker 2, the speaker module can be made smaller while maintaining acoustic sensitivity and performance across the entire frequency range. In addition, by employing a flexible circuit board 4 and optimizing its layout within the speaker module, the size of the speaker module can be further controlled or reduced, making it more suitable for small audio devices.

[0050] Another embodiment of this utility model discloses an audio device, which includes the speaker module of any of the above embodiments. The audio device may be, for example, in-ear headphones, over-ear headphones, etc.

[0051] While ensuring acoustic sensitivity and acoustic effect across the entire frequency range, this audio device can be smaller in size, or leave enough space for other modules to realize more functions of the audio device.

[0052] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0053] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A speaker module, characterized in that, include: The base has a first surface and a second surface arranged opposite to each other; MEMS loudspeakers are disposed on the first surface of the base; and A moving coil speaker is disposed on the second surface of the base, and the sound-emitting surfaces of the moving coil speaker and the MEMS speaker face the same side.

2. The speaker module according to claim 1, characterized in that, The MEMS speaker is located in front of the sound-emitting surface of the dynamic speaker; and / or, the MEMS speaker and the dynamic speaker are coaxially arranged.

3. The speaker module according to claim 1, characterized in that, The first surface has a first receiving groove for accommodating the MEMS speaker, and the shape of the first receiving groove matches the MEMS speaker.

4. The speaker module according to claim 3, characterized in that, The base has ventilation holes that communicate with the first receiving groove and the second surface.

5. The speaker module according to claim 1, characterized in that, The second surface has a second receiving groove for accommodating the moving coil speaker, and the shape of the second receiving groove matches the moving coil speaker.

6. The speaker module according to claim 5, characterized in that, There is a gap between the sound-emitting side of the moving coil loudspeaker and the bottom of the second receiving groove.

7. The speaker module according to claim 1, characterized in that, The base has a sound transmission groove that connects the first surface and the second surface to transmit the sound of the dynamic loudspeaker.

8. The speaker module according to claim 1, characterized in that, It also includes a flexible circuit board for connecting the dynamic speaker and the MEMS speaker; wherein the flexible circuit board includes: A first connecting segment is connected to the MEMS speaker, and the first connecting segment is disposed between the MEMS speaker and the first surface; The second connecting section is connected to the side of the moving coil speaker opposite to the base; and The mating section extends along the side wall of the base and connects with the first connecting section and the second connecting section; The first or second connection segment is provided with multiple signal input terminals.

9. The speaker module according to claim 8, characterized in that, The base has a groove on its side wall, and the mating section is arranged along the groove.

10. An audio device, characterized in that, Includes the speaker module as described in any one of claims 1-9.

Images