Heating control system of graphene heating module for cooking device and cooking device

Abstract

The utility model discloses a graphene heating module's heating control system and cooking device for cooking device, including control module, power supply module, switch module and with the temperature sensor of graphene heating module contact setting, control module includes control chip IC, and temperature sensor is linked with control chip IC and is controlled by it, switch module includes first interface CN1, relay HOT and triode Q1, and relay HOT is linked with control chip IC through triode Q1, and the output of graphene heating module and relay HOT is linked with first interface CN1 respectively, and the direct current output of power module is linked with relay. Make the temperature of graphene heating module get control in preset heating temperature, prevent heating temperature too high or too low, also avoid the situation that graphene heating module is damaged to cause temperature to rise unceasingly because of continuous heating.

Description

Technical Field

[0001] This utility model relates to the technical field of cooking heating control, and in particular to a heating control system for a graphene heating module for a cooking device and a cooking device. Background Technology

[0002] A cooking appliance is a device that cooks food by heating it. However, most people now prefer to bake food, which necessitates the use of appropriate cooking appliances. An oven is a device that bakes and cooks food by generating hot air; these are generally charcoal ovens, gas ovens, or microcrystalline glass graphene heating ovens. Among these, microcrystalline glass graphene heating ovens are quite popular in home use. They are currently one of the more innovative ovens on the market. Microcrystalline glass graphene heating ovens use a graphene heating layer on the surface of microcrystalline glass. By energizing the graphene, far-infrared rays are released to bake the food. However, the heat resistance of the microcrystalline glass in existing ovens is limited. Continuous energization of the graphene will cause the temperature of the microcrystalline glass to rise continuously, leading to overheating and damage. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of the aforementioned technologies by designing a heating control system for a graphene heating module in a cooking device, as well as the cooking device itself. The heating control system of the graphene heating module for cooking device designed in this utility model includes a central control module, a power supply module, a switch module, and a temperature sensor that is in contact with the graphene heating module. The central control module includes a central control chip IC, and the temperature sensor is connected to and controlled by the central control chip IC. The switching module includes a first interface CN1, a relay HOT, and a transistor Q1. The relay HOT is connected to the central control chip IC through the transistor Q1. The output terminals of the graphene heating module and the relay HOT are respectively connected to the first interface CN1. The DC output terminal of the power supply module is connected to the relay.

[0004] According to the heating control system of the graphene heating module for the cooking device described above, the power supply module includes a rectifier and transformer module, a step-down chip U1, and a voltage regulator module. The rectifier and transformer module includes a rectifier module DB1 and a transformer T1 connected to each other. The power terminal of the rectifier module DB1 is connected to the mains power. The transformer T1 is connected to the step-down chip. The step-down chip U1 is connected to the voltage regulator module. The voltage regulator module is connected to the DC output terminal of the transformer T1.

[0005] According to the heating control system of the graphene heating module for the cooking device described above, the voltage regulator module includes an optocoupler U2, a Zener diode TL431, resistors R8, R9, R11, R13, and a capacitor C6. The Zener diode TL431, resistors R8 and R11 are connected in series, and resistors R9 and R13 are connected in series. The ground terminal of resistor R9 and the anode of Zener diode TL431 are grounded. The first and second pins of the optocoupler U2 are respectively connected between resistors R8 and R11 and between Zener diode TL431 and R11. The third and fourth pins of the optocoupler U2 are respectively connected to pins FB and VCC of the step-down chip U1. The Zener diode TL431 and resistor R11 and resistors R9 and R13 are connected through capacitor C6. The reference terminal of Zener diode TL431 is connected between resistors R9 and R13. One end of resistor R8 is connected to the DC output terminal of transformer T1.

[0006] The heating control system of the graphene heating module for the cooking device described above also includes a second interface CN2 and a third interface CN3 that are interconnected. The second interface CN2 is connected to the central control chip IC, and the third interface CN3 is connected to the temperature sensor. The DC output terminal of the transformer T1 is connected to the DC input terminals of the second interface CN2 and the third interface CN3. The base of the transistor Q1 is connected to the second interface CN2 through the resistor R14. The collector of the transistor Q1 is connected to the relay HOT, and its emitter is grounded.

[0007] According to the heating control system of the graphene heating module for the cooking device described above, the third interface CN3 is interconnected with the second interface CN2 through resistor R15, resistor R16 and capacitor C9.

[0008] According to the heating control system of the graphene heating module for the cooking device described above, the central control module also includes a display and buttons, which are respectively connected to and controlled by the central control chip IC.

[0009] The heating control system of the graphene heating module for the cooking device described above also includes a buzzer BUZ1, which is connected to and controlled by the central control chip IC. As another aspect, a cooking device includes a furnace body, a graphene heating module, and a heating control system as described above. The furnace body has a heating cavity, and a wire mesh frame is provided above the heating cavity. The wire mesh frame is positioned at the opening of the heating cavity. The graphene heating module is installed inside the heating cavity and located below the wire mesh frame. The heating control system is disposed on the panel of the furnace body, and the temperature sensor of the heating control system is in contact with the graphene heating module. The display and buttons of the heating control system are located on the outside of the panel.

[0010] According to the cooking device described above, the graphene heating module includes a base, a microcrystalline glass, a temperature sensor, and an elastic element. The base includes a bottom plate, the microcrystalline glass is disposed on the base and located above the bottom plate, and a graphene heating layer is disposed on the lower surface of the microcrystalline glass. The temperature measuring part of the temperature sensor is attached to the lower surface of the graphene heating layer on the microcrystalline glass. The elastic element is used to press the temperature sensor upward onto the microcrystalline glass. The temperature sensor is provided with a downward-extending guide post, and the bottom plate is provided with a through hole. The guide post passes through the through hole downward. The elastic element is sleeved on the outer periphery of the guide post, with its upper end abutting against the temperature sensor and its lower end abutting against the bottom plate. The bottom plate is provided with an assembly hole for the temperature sensor and the elastic element to pass from below the bottom plate to above the bottom plate. The bottom plate includes a spring pressure plate, the through hole is disposed on the spring pressure plate, and the spring pressure plate is detachably disposed below the bottom plate and covers the assembly hole. The lower end of the elastic element abuts against the spring pressure plate.

[0011] According to the cooking device described above, the base plate includes two fittings, which are disposed at both ends of the base plate. Each fitting has a mounting slot and a mounting opening. The two mounting openings are arranged opposite each other. The two ends of the microcrystalline glass are respectively inserted into the mounting openings. The fittings are metal parts and are formed by bending. The fittings and the base plate are detachably connected. Each end of the microcrystalline glass is fitted with a heat insulation sleeve. The heat insulation sleeve includes a heat insulation top, a heat insulation side, and a heat insulation bottom. The heat insulation top separates the microcrystalline glass from the upper surface of the mounting slot. The heat insulation side separates the surface of the microcrystalline glass and the mounting slot away from the mounting opening. The heat insulation bottom separates the microcrystalline glass from the lower surface of the mounting slot.

[0012] According to the cooking device described above, the upper surface of the base plate is covered with a layer of heat-insulating cotton.

[0013] Compared with the prior art, the beneficial effects of this utility model are: 1. The central control chip IC has a preset heating temperature. At this time, the temperature sensor detects the temperature of the graphene heating module in real time and feeds it back to the central control chip IC. Then, the preset heating temperature is compared with the detected temperature. When the detected temperature is equal to the preset heating temperature, the central control chip IC controls the relay to open, so that the power supply to the graphene heating layer stops, thus stopping the heating of the graphene heating layer to prevent the microcrystalline glass from overheating and being damaged. When the detected temperature is lower than the preset heating temperature, the central control chip IC controls the relay to close, so that the power supply to the graphene heating layer is turned on, thus heating the graphene heating layer. Therefore, through the above repeated heating control, the temperature of the graphene heating module is controlled within the preset heating temperature, preventing the heating temperature from being too high or too low.

[0014] 2. By energizing the graphene heating layer to release far-infrared rays of 8-15μm, the far-infrared ray band is similar to the radiation wavelength of meat, resulting in a better heating effect, and can be absorbed by the deep tissues of meat.

[0015] 3. Under the elastic restoring force of the elastic element, the temperature sensor is effectively pressed to the bottom of the microcrystalline glass, so as to achieve reliable temperature detection by the temperature sensor. Attached Figure Description

[0016] Figure 1 This is a block diagram of the heating control system in Embodiment 1; Figure 2 This is a schematic diagram of the circuit structure of the heating control system in Embodiment 1; Figure 3 This is a schematic diagram of the central control chip circuit structure in Embodiment 1; Figure 4 This is a schematic diagram of the display circuit structure in Embodiment 1; Figure 5 This is a schematic diagram of the circuit structure of the four buttons in Embodiment 1; Figure 6 This is a schematic diagram of the buzzer circuit structure in Embodiment 1; Figure 7 This is a schematic diagram of the overall structure of the cooking apparatus in Embodiment 2; Figure 8 This is a schematic diagram of the graphene heating module in Example 2; Figure 9 This is an exploded view of the graphene heating module in Example 2; Figure 10 This is a schematic diagram of the cross-sectional structure of the graphene heating module in Example 2; Figure 11 This is a partial cross-sectional structural schematic diagram (I) of the graphene heating module in Example 2; Figure 12This is a partial cross-sectional structural schematic diagram (II) of the graphene heating module in Example 2; Figure 13 This is a cross-sectional structural schematic diagram (I) of the cooking device in Embodiment 2; Figure 14 This is a cross-sectional structural schematic diagram (II) of the cooking device in Embodiment 2.

[0017] In the diagram: 1. Base; 11. Base plate; 12. Spring pressure plate; 13. Assembly parts; 111. Assembly hole; 121. Through hole; 131. Assembly slot; 132. Assembly opening; 133. Recess; 2. Microcrystalline glass; 21. Graphene heating layer; 3. Temperature sensor; 31. Guide post; 4. Elastic element; 5. Heat insulation sleeve; 51. Heat insulation top; 52. Heat insulation side; 53. Heat insulation bottom; 133. Recess; 100. Furnace body; 101. Heating chamber; 102. Step; 103. Panel; 104. Mounting hole; 105. Support platform; 200. Frame; 300. Control device; 301. Button; 302. Display; 303. Outer shell; 304. PCB board; 400. Graphene heating module. Detailed Implementation

[0018] The present invention will be further described below with reference to the embodiments and accompanying drawings.

[0019] Example 1: refer to Figures 1 to 6 The heating control system for the graphene heating module of the cooking device described in this embodiment includes a central control module, a power supply module, a switch module, and a temperature sensor disposed in contact with the graphene heating module.

[0020] The central control module includes a central control chip IC, and the temperature sensor is connected to and controlled by the central control chip IC. The switching module includes a first interface CN1, a relay HOT, and a transistor Q1. The relay HOT is connected to the central control chip IC through the transistor Q1. The output terminals of the graphene heating module and the relay HOT are respectively connected to the first interface CN1. The DC output terminal of the power supply module is connected to the relay. The central control chip IC stores a preset heating temperature and a heating control program.

[0021] Specifically, the power supply module includes a rectifier transformer module, a step-down chip U1, and a voltage regulator module. The rectifier transformer module includes a rectifier module DB1 and a transformer T1 connected to each other. The power terminal of the rectifier module DB1 is connected to the mains power. The transformer T1 is connected to the step-down chip. The voltage regulator module includes an optocoupler U2, a Zener diode TL431, resistors R8, R9, R11, R13, and a capacitor C6. The Zener diode TL431, resistors R8 and R11 are connected in series, as are resistors R9 and R13. The ground terminal of resistor R9 and the anode of the Zener diode TL431 are grounded. The first and second pins of the optocoupler U2 are connected between resistors R8 and R11, and between the Zener diode TL431 and resistor R11, respectively. The third and fourth pins of the optocoupler U2 are connected to pins FB and VCC of the step-down chip U1, respectively. The TL431 is connected to resistor R11 and resistors R9 and R13 via capacitor C6. The reference terminal of the Zener diode TL431 is connected between resistors R9 and R13. One end of resistor R8 is connected to the DC output terminal of transformer T1. The power supply method of this structure is as follows: AC mains power is input to rectifier module DB1, which rectifies the AC power into DC power. The DC power is then transformed by transformer T1 and step-down chip U1 to form 5V DC power. During the step-down process, optocoupler U2 provides real-time voltage feedback to step-down chip U2. Step-down chip U2 controls the Zener diode TL431 to work, so that the 5V DC power generated by step-down can be stably output from the DC output terminal of transformer T1 to relay, second interface CN2 and third interface CN3 to power the central control module, graphene heating layer and temperature sensor.

[0022] That is, the second interface CN2 and the third interface CN3 are interconnected. The second interface CN2 is connected to the central control chip IC, and the third interface CN3 is connected to the temperature sensor. The DC output terminal of the transformer T1 is connected to the DC input terminal of the second interface CN2 and the third interface CN3. The base of the transistor Q1 is connected to the second interface CN2 through the resistor R14. The collector of the transistor Q1 is connected to the relay HOT, and its emitter is grounded.

[0023] Preferably, the third interface CN3 is interconnected with the second interface CN2 through resistors R15 and R16 and capacitor C9. Resistors R15, R16 and C9 perform filtering, making the feedback temperature signal more stable.

[0024] Furthermore, the central control module also includes a display 303 and buttons 301. The display and buttons are respectively connected to and controlled by the central control chip IC. The preset heating temperature is set by the buttons and displayed on the display. The central control chip IC saves the preset heating temperature. The buttons 301 are a power button SW1, a temperature setting button SW2, a temperature increase button SW3, and a temperature decrease button SW4.

[0025] More preferably, it also includes a buzzer BUZ1, which is connected to and controlled by the central control chip IC. The buzzer BUZ1 interacts with the user's effective operation and will issue a statement during the button operation.

[0026] The mains power is input through terminals L and CAN, and after being rectified and transformed into 5V DC by the subsequent circuit transformer module. Before being output from the DC output terminal of transformer T1, the voltage regulator module regulates the output current to provide a stable power supply to the central control module, graphene heating layer, and temperature sensor. The output current, controlled by a relay, is then output from the first interface CN1 to the graphene heating element. The central control chip IC in the central control module has a preset heating temperature. The temperature sensor connected to the third interface CN3 monitors the temperature of the graphene heating element in real time and transmits the data to the display panel for display. The central control chip IC utilizes… The control program compares the preset heating temperature with the detected temperature. When the detected temperature equals the preset heating temperature, the central control chip IC controls the relay to disconnect, stopping the power supply to the graphene heating layer and preventing the microcrystalline glass from overheating and being damaged. When the detected temperature is lower than the preset heating temperature, the central control chip IC controls the relay to close, turning on the power supply to the graphene heating layer and heating it. Therefore, through the above repeated heating control, the temperature of the graphene heating module is controlled within the preset heating temperature, preventing the heating temperature from being too high or too low.

[0027] Example 2: refer to Figures 1-14The cooking apparatus described in this embodiment includes a furnace body 100, a graphene heating module 400, and a heating control system as described in Embodiment 1. The furnace body 100 has a heating cavity 101, and a mesh frame 200 is positioned above the heating cavity 101 at its opening. The graphene heating module 400 is installed inside the heating cavity 101 and located below the mesh frame 200. The heating control system is located on the panel 103 of the furnace body 100, and its temperature sensor is in contact with the graphene heating module 400. The display 302 and buttons 301 of the heating control system are located outside the panel 103. Steps 102 are provided on opposite sides of the opening of the heating cavity 101, and the mesh frame 200 is supported by these steps at opposite ends, positioning the mesh frame 200 above the graphene heating module 400. The panel 103 of the furnace body 100 also has... There is a mounting hole 104, in which a fixed control device 300 is embedded. The control device 300 consists of a housing 303, a display 302, and a PCB board 304. The housing 303 is fitted into the mounting hole 104 and is fixedly connected to the panel 103 of the furnace body 100 by bolts. The PCB board 304, the display 302, and the buttons 301 are installed at the opening of the housing 303. The buttons 301 and the circuits involved in the heating control system are integrated on the PCB board 304. Therefore, the display 302 and the buttons 301 are arranged side by side on the outside of the opening of the housing 303, and the PCB board 304 is located behind the display 302. The PCB board 304 and the display 302 are both fixed in the housing 303 by bolts. The temperature sensor is integrated on the graphene heating module 400. In addition, the temperature sensor is connected to the third interface CN3 by wire. The display 302 and the central control chip IC are also connected to the second interface CN2 by wire.

[0028] Specifically, the graphene heating module includes a base 1, a microcrystalline glass 2, and an elastic element 4. The base 1 includes a base plate 11. The microcrystalline glass 2 is disposed on the base 1 and located above the base plate 11. A graphene heating layer 21 is disposed on the microcrystalline glass 2. The temperature measuring part of the temperature sensor 3 is attached to the lower surface of the microcrystalline glass 2. The elastic element 4 is used to press the temperature sensor 3 upward onto the microcrystalline glass 2.

[0029] Therefore, by energizing the graphene heating layer 21 to release far-infrared rays of 8-15μm, since the far-infrared ray band is similar to the radiation wavelength of meat, a better heating effect is achieved, and it can be absorbed by the deep tissue of meat; under the elastic restoring force of the elastic element 4, the temperature sensor 3 is effectively pressed to the bottom of the microcrystalline glass 2, making the temperature detection more reliable.

[0030] Preferably, the graphene heating layer 21 is disposed on the lower surface of the microcrystalline glass 2, and the graphene heating layer 21 can be a graphene heating film or a graphene coating.

[0031] Specifically, the elastic element 4 is a compression spring.

[0032] In addition, the temperature sensor 3 in this embodiment is provided with a downwardly extending guide post 31, and the base plate 11 is provided with a through hole 121. The guide post 31 passes through the through hole 121 downwardly, and the elastic member 4 is sleeved on the outer periphery of the guide post 31. The upper end of the elastic member 4 abuts against the temperature sensor 3 and the lower end abuts against the base plate 11.

[0033] Therefore, the cooperation between the guide post 31 and the transmission hole enables the temperature sensor 3 to float vertically, and the temperature sensor 3 is pressed more stably to the bottom of the microcrystalline glass 2 under the stable state of the elastic element 4 sleeved on the guide post 31.

[0034] In addition, the base plate 11 in this embodiment is provided with an assembly hole 111, which allows the temperature sensor 3 and the elastic element 4 to pass through from below the base plate 11 to above the base plate 11; correspondingly, the base plate 11 includes a spring pressure plate 12, with a through hole 121 provided on the spring pressure plate 12. The spring pressure plate 12 is detachably provided below the base plate 11 by means of bolts and nuts, and covers the assembly hole 111; the lower end of the elastic element 4 abuts against the spring pressure plate 12.

[0035] Therefore, with the spring pressure plate 12 disassembled, the temperature sensor 3 and the elastic element 4 are assembled with the assembly hole 111 facing upwards. After assembly, the spring pressure plate 12 supports the elastic element 4 while the assembly hole 111 is sealed, making assembly more convenient.

[0036] In addition, the base plate 11 includes two fittings 13, which are disposed at both ends of the base plate 11. Each fitting 13 is provided with an assembly slot 131, and each assembly slot 131 is provided with an assembly opening 132. The two assembly openings 132 are arranged opposite to each other, and the two ends of the microcrystalline glass 2 are respectively inserted into the assembly openings 132.

[0037] Preferably, the assembly 13 is a metal part, and the assembly 13 is formed by bending, which makes the processing more convenient. The assembly 13 and the base plate 11 are detachably connected by bolts and nuts.

[0038] Furthermore, heat insulation sleeves 5 are respectively fitted at both ends of the microcrystalline glass 2. Each heat insulation sleeve 5 includes a heat-insulating top 51, a heat-insulating side 52, and a heat-insulating bottom 53. The heat-insulating top 51 separates the microcrystalline glass 2 from the upper surface of the mounting slot 131; the heat-insulating side 52 separates the surface of the microcrystalline glass 2 and the mounting slot 131 away from the mounting opening 132; and the heat-insulating bottom 53 separates the microcrystalline glass 2 from the lower surface of the mounting slot 131. This design of the heat insulation sleeves 5 reduces heat loss caused by the microcrystalline glass 2 transferring heat to the mounting slot 13 via thermal conduction.

[0039] Preferably, the upper surface of the base plate 11 is covered with a thermal insulation layer, which reduces heat loss.

[0040] Specifically, temperature sensor 3 uses PT1000.

[0041] Finally, support platforms 105 are fixed to the inner walls of opposite sides of the heating cavity 101, and recesses 133 are formed on the outer sides of the two assembly parts 13 to fit the support platforms 105. Thus, recesses 133 are formed on opposite sides of the graphene heating module 400, and the support platforms 105 are inserted into the recesses 133. The upper sidewall of the recesses 133 is supported by the support platforms 105 to install and fix the graphene heating module 400.

[0042] Of course, the above are just typical examples of this utility model. In addition, this utility model may have many other specific implementation methods. All technical solutions formed by equivalent substitution or equivalent transformation fall within the scope of protection claimed by this utility model.

Claims

1. A heating control system for a graphene heating module in a cooking appliance, characterized in that, This includes a central control module, a power supply module, a switch module, and a temperature sensor that is in contact with the graphene heating module; The central control module includes a central control chip IC, and the temperature sensor is connected to and controlled by the central control chip IC. The switching module includes a first interface CN1, a relay HOT, and a transistor Q1. The relay HOT is connected to the central control chip IC through the transistor Q1. The output terminals of the graphene heating module and the relay HOT are respectively connected to the first interface CN1. The DC output terminal of the power supply module is connected to the relay.

2. The heating control system for the graphene heating module of the cooking device according to claim 1, characterized in that, The power supply module includes a rectifier transformer module, a step-down chip U1, and a voltage regulator module. The rectifier transformer module includes a rectifier module DB1 and a transformer T1 connected to each other. The power input terminal of the rectifier module DB1 is connected to the mains power. The transformer T1 is connected to the step-down chip. The step-down chip U1 is connected to the voltage regulator module. The voltage regulator module is connected to the DC output terminal of the transformer T1.

3. The heating control system for the graphene heating module of the cooking device according to claim 2, characterized in that, The voltage regulator module includes an optocoupler U2, a Zener diode TL431, resistors R8, R9, R11, R13, and a capacitor C6. The Zener diode TL431, resistors R8 and R11 are connected in series, as are resistors R9 and R13. The ground terminal of resistor R9 and the anode of the Zener diode TL431 are grounded. The first and second pins of the optocoupler U2 are connected between resistors R8 and R11, and between the Zener diode TL431 and R11, respectively. The third and fourth pins of the optocoupler U2 are connected to pins FB and VCC of the step-down chip U1, respectively. The Zener diode TL431 and resistor R11, and resistors R9 and R13 are connected through capacitor C6. The reference terminal of the Zener diode TL431 is connected between resistors R9 and R13. One end of resistor R8 is connected to the DC output terminal of the transformer T1.

4. The heating control system for the graphene heating module of the cooking device according to claim 2, characterized in that, It also includes a second interface CN2 and a third interface CN3 that are interconnected. The second interface CN2 is connected to the central control chip IC, and the third interface CN3 is connected to the temperature sensor. The DC output terminal of the transformer T1 is connected to the DC input terminal of the second interface CN2 and the third interface CN3. The base of the transistor Q1 is connected to the second interface CN2 through the resistor R14. The collector of the transistor Q1 is connected to the relay HOT, and its emitter is grounded.

5. The heating control system for the graphene heating module of the cooking device according to claim 4, characterized in that, The third interface CN3 is interconnected with the second interface CN2 through resistors R15 and R16 and capacitor C9.

6. The heating control system for the graphene heating module of the cooking device according to claim 1, characterized in that, The central control module also includes a display and buttons, which are connected to and controlled by the central control chip IC.

7. The heating control system for the graphene heating module of the cooking device according to claim 1, characterized in that, It also includes a buzzer BUZ1, which is connected to and controlled by the central control chip IC.

8. A cooking apparatus, characterized in that, The device includes a furnace body, a graphene heating module, and a heating control system as described in any one of claims 1-7. The furnace body has a heating cavity, and a mesh frame is provided above the heating cavity. The mesh frame is positioned at the opening of the heating cavity. The graphene heating module is installed inside the heating cavity and located below the mesh frame. The heating control system is disposed on the panel of the furnace body, and the temperature sensor of the heating control system is in contact with the graphene heating module. The display and buttons of the heating control system are located on the outside of the panel.

9. The cooking apparatus according to claim 8, characterized in that, The graphene heating module includes a base, a microcrystalline glass, a temperature sensor, and an elastic element. The base includes a base plate, the microcrystalline glass is disposed on the base and located above the base plate, and a graphene heating layer is disposed on the lower surface of the microcrystalline glass. The temperature measuring part of the temperature sensor is attached to the lower surface of the graphene heating layer on the microcrystalline glass, and the elastic element is used to press the temperature sensor upward onto the microcrystalline glass. The temperature sensor is provided with a downwardly extending guide post, and the base plate is provided with a through hole. The guide post passes through the through hole downwards. The elastic element is sleeved on the outer periphery of the guide post, with the upper end of the elastic element abutting against the temperature sensor and the lower end abutting against the base plate. The base plate is provided with an assembly hole, which allows the temperature sensor and the elastic element to pass from below the base plate to above the base plate. The base plate includes a spring pressure plate, and the through hole is provided on the spring pressure plate. The spring pressure plate is detachably provided below the base plate and covers the assembly hole. The lower end of the elastic element abuts against the spring pressure plate.

10. The cooking apparatus according to claim 9, characterized in that, The base plate includes two assemblies, which are located at both ends of the base plate. Each assembly has an assembly slot and an assembly opening. The two assembly openings are positioned opposite each other. The two ends of the microcrystalline glass are inserted into the assembly openings. The assembly is made of metal and is formed by bending. The assembly and the base plate are detachably connected. Each end of the microcrystalline glass is fitted with a heat insulation sleeve. The heat insulation sleeve includes a heat insulation top, a heat insulation side, and a heat insulation bottom. The heat insulation top separates the microcrystalline glass from the upper surface of the assembly slot. The heat insulation side separates the surface of the microcrystalline glass and the assembly slot away from the assembly opening. The heat insulation bottom separates the microcrystalline glass from the lower surface of the assembly slot. The upper surface of the base plate is covered with a layer of thermal insulation cotton.

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