A circuit board embedded heat dissipation structure

Abstract

The utility model relates to a kind of circuit board inner-embedded heat dissipation structure, comprising: plate body, the plate body has first surface and second surface being set back, the first surface is set with sink, the sink bottom is formed with multiple through holes, the through hole penetrates the plate body and extends to the second surface;Heat conduction piece, the heat conduction piece includes main body, the main body one side is equipped with multiple heat conduction columns, the main body is embedded in the sink, and each heat conduction column respectively extends into corresponding one through hole;And fin, the fin is attached to the second surface, and the end of heat conduction column is connected with the fin.The utility model compact and reasonable structure is conducive to the thin type of circuit board, and it has good heat dissipation effect simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and more specifically, to a heat dissipation structure embedded in a circuit board. Background Technology

[0002] In the field of electronic equipment, as the power of electronic components on circuit boards, especially chips, continues to increase, the heat generated during their operation also increases. Therefore, heat dissipation efficiency has become the key to ensuring stable equipment performance and extending service life.

[0003] Traditional heat dissipation structures typically employ external metal heat sinks, which are applied to the surface of heat-generating components using thermal grease. This method increases the height of one side of the circuit board, failing to meet the trend towards thinner and lighter circuit boards. Furthermore, its heat dissipation efficiency is significantly affected by the assembly process, potentially impacting the consistency of heat dissipation performance across the entire product. Utility Model Content

[0004] The purpose of this utility model is to provide a heat dissipation structure embedded in a circuit board, which has a compact and reasonable structure, which is conducive to the thinning of the circuit board, and at the same time has a good heat dissipation effect.

[0005] A heat dissipation structure embedded in a circuit board includes: The plate has a first surface and a second surface arranged opposite to each other. A groove is formed on the first surface, and a plurality of through holes are formed at the bottom of the groove. The through holes penetrate the plate and extend to the second surface. A heat-conducting component, comprising a main body, a plurality of heat-conducting pillars on one side of the main body, the main body being embedded in the recess, and each heat-conducting pillar extending into a corresponding through hole; and A heat sink is attached to the second surface, and the end of the heat-conducting pillar is connected to the heat sink.

[0006] In the above technical solution, by creating a recessed groove inside the board and embedding a heat-conducting component, the heat-conducting pillars of the component pass through through holes and connect to the heat sink, thus forming a heat dissipation path inside the board. This allows the heat generated by the heat-generating device on the first surface to be transferred to the second surface and dissipated outwards, eliminating the need for additional heat sinks on the device surface. This reduces the overall thickness and makes the circuit board structure more compact while ensuring heat dissipation. The recessed groove provides positioning and support for the heat-conducting component, preventing its displacement. By creating through holes at the bottom of the groove for the heat-conducting pillars to pass through and retaining the solid portion between the through holes, the structural stability of the board at the recessed groove position is effectively maintained, avoiding deformation that might occur due to large-area cutouts.

[0007] Furthermore, a heating element is provided on the first surface corresponding to the sink, and a thermally conductive material layer is provided between the heating element and the main body.

[0008] In the above technical solution, by setting a thermally conductive material layer between the heating device and the heat-conducting component body, heat can be quickly transferred from the heating device to the heat-conducting component and dissipated to the outside through the heat sink, thus ensuring heat dissipation performance.

[0009] Furthermore, the first surface near the periphery of the sink is provided with pads for connecting the heating device.

[0010] In the above technical solution, the pads arranged around the sink provide positioning and electrical connection points for the heat-generating device, ensuring that the heat-generating device can cover the heat-conducting component and be opposite to the main body of the heat-conducting component, thereby optimizing the heat transfer path and ensuring the reliability of heat dissipation.

[0011] Furthermore, the surface of the heat sink facing the main body is provided with a plurality of countersunk holes, and the end of each heat-conducting pillar extends into a corresponding countersunk hole.

[0012] In the above technical solution, the countersunk holes on the heat sink allow the ends of the heat-conducting pillars to be embedded therein, increasing the contact area between the two and facilitating their positioning, thereby strengthening the stability of the connection and improving the heat transfer efficiency from the heat-conducting pillars to the heat sink.

[0013] Furthermore, the heat sink has multiple fins arranged on the surface opposite to the plate.

[0014] In the above technical solution, fins are arranged on the surface of the heat sink, which can increase the heat dissipation surface area and improve the heat dissipation capacity, thereby achieving better heat dissipation effect while maintaining a thin and light design.

[0015] Furthermore, the surface of the main body is flush with the first surface.

[0016] In the above technical solution, the surface of the heat-conducting component is formed to be flush with the first surface of the circuit board, avoiding the protruding structure and providing a flat mounting plane for the heat-generating device, which is conducive to the stable mounting of the component and the thinning of the overall structure.

[0017] Furthermore, the diameter of the heat-conducting pillar matches the aperture of the through hole.

[0018] In the above technical solution, the close matching between the diameter of the heat-conducting column and the diameter of the through hole in the plate reduces the gap between them, making the structure more stable and reliable.

[0019] Furthermore, the space between the main body and the wall of the settling tank is filled with resin.

[0020] In the above technical solution, filling the space between the heat-conducting component body and the wall of the settling tank with resin can fix the heat-conducting component, prevent it from loosening or shifting, and ensure the stability of the structure.

[0021] Compared with existing technologies, the advantages of this invention are as follows: By creating a recessed groove inside the board and embedding a heat-conducting component, with the heat-conducting pillars of the component passing through through holes and connecting to the heat sink, a heat dissipation path is formed inside the board. This allows the heat generated by the heat-generating device on the first surface to be transferred to the second surface and dissipated outwards, eliminating the need for additional heat sinks on the device surface. This reduces the overall thickness and makes the circuit board structure more compact while ensuring heat dissipation. The recessed groove provides positioning and support for the heat-conducting component, preventing its displacement. By creating through holes at the bottom of the groove for the heat-conducting pillars to pass through and retaining the solid portion between the through holes, the structural stability of the board at the recessed groove position is effectively maintained, avoiding deformation that may occur due to large-area hollowing. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the heat dissipation structure embedded in the circuit board according to an embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of the plate body according to an embodiment of the present utility model.

[0024] Figure 3 This is a schematic diagram of the bottom structure of the heat-conducting component according to an embodiment of the present invention.

[0025] Explanation of icon numbers: 1. Plate body, 11. First surface, 12. Second surface, 13. Slot, 14. Through hole, 15. Pad, 2. Thermal conductive component, 21. Main body, 22. Thermal conductive pillar, 3. Heat sink, 31. Slot, 32. Heat-generating device, 4. Thermal conductive material layer, 5. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0028] Please refer to Figures 1 to 3In a preferred embodiment, the circuit board embedded heat dissipation structure of this utility model mainly includes a board body 1, a heat-conducting component 2, and a heat sink 3. The board body 1 has a first surface 11 and a second surface 12 arranged opposite to each other. A groove 13 is formed on the first surface 11, and multiple through holes 14 are formed at the bottom of the groove 13, penetrating the board body 1 and extending to the second surface 12. The heat-conducting component 2 includes a main body 21, with multiple heat-conducting pillars 22 on one side. The main body 21 is embedded in the groove 13, and each heat-conducting pillar 22 extends into a corresponding through hole 14. The heat sink 3 is attached to the second surface 12, and the ends of the heat-conducting pillars 22 are connected to the heat sink 3.

[0029] For example, the board body 1 can be a multilayer circuit board made of existing materials. The first surface 11 of the board body 1 is formed into a recess 13 by controlled-depth milling, and then multiple through holes 14 are drilled in the bottom of the recess 13 using existing drilling processes. The heat-conducting component 2 can be made of existing heat-conducting materials, such as commonly used heat-conducting metals or alloys. The main body 21 of the heat-conducting component 2 is embedded in the recess 13, while the heat-conducting pillars 22 pass through the corresponding through holes 14 and extend to the second surface 12. The heat sink 3 can also be made of existing heat-conducting materials, and it can be fixed to the second surface 12 by bonding or welding and connected to the heat-conducting pillars 22.

[0030] By creating a recessed groove 13 inside the board body 1 and embedding a heat-conducting component 2, the heat-conducting pillars 22 of the heat-conducting component 2 pass through through holes 14 and connect to the heat sink 3, a heat dissipation path is formed inside the board body 1. This allows the heat generated by the heat-generating device 4 located on the first surface 11 to be transferred to the second surface 12 and dissipated outwards, eliminating the need for additional heat sinks on the device surface. This reduces the overall thickness and makes the circuit board structure more compact while ensuring heat dissipation. The recessed groove 13 provides positioning and support for the heat-conducting component 2, preventing its displacement. By providing through holes 14 at the bottom of the groove for the heat-conducting pillars 22 to pass through and retaining the solid portion between the through holes 14, the structural stability of the board body 1 at the location of the recessed groove 13 is effectively maintained, avoiding deformation that may occur due to large-area hollowing.

[0031] In this embodiment, a heating element 4 is provided on the first surface 11 corresponding to the sink 13, and a thermally conductive material layer 5 is provided between the heating element 4 and the main body 21. It is understood that the heating element 4 is an electronic component that generates heat during operation, such as a high-power chip. The thermally conductive material layer 5 can be any existing material, such as thermal grease, which is filled between the main body 21 and the heating element 4. By providing the thermally conductive material layer 5 between the heating element 4 and the main body 21 of the heat-conducting component 2, heat can be quickly conducted from the heating element 4 to the heat-conducting component 2 and dissipated to the outside through the heat sink 3, ensuring heat dissipation performance.

[0032] In this embodiment, the first surface 11 is provided with pads 15 for connecting the heating element 4 near the periphery of the sink 13. The pads 15 arranged around the periphery of the sink 13 provide positioning and electrical connection points for the heating element 4, ensuring that the heating element 4 can cover the heat-conducting component 2 and face the main body 21 of the heat-conducting component 2, thereby optimizing the heat transfer path and ensuring the reliability of heat dissipation.

[0033] In this embodiment, the surface of the heat sink 3 facing the main body 21 is provided with a plurality of countersunk holes 31, and the end of each heat-conducting pillar 22 extends into a corresponding countersunk hole 31. The countersunk holes 31 provided on the heat sink 3 allow the end of the heat-conducting pillar 22 to be embedded therein, increasing the contact area between the two and facilitating their positioning, thereby strengthening the stability of the connection and improving the heat conduction efficiency from the heat-conducting pillar 22 to the heat sink 3.

[0034] In this embodiment, a plurality of fins 32 are arranged on the surface of the heat sink 3 away from the plate 1. For example, the fins 32 are arranged at intervals on the surface of the heat sink 3, and the extension directions of the plurality of fins 32 are parallel. By arranging fins 32 on the surface of the heat sink 3, the heat dissipation surface area can be increased, the heat dissipation capacity can be improved, and thus better heat dissipation effect can be achieved while maintaining a thin and light design.

[0035] In this embodiment, the surface of the main body 21 is flush with the first surface 11. The surface of the main body 21 of the heat-conducting component 2 is formed to be flush with the first surface 11 of the circuit board, avoiding the protruding structure and providing a flat mounting plane for the heat-generating device 4, which is beneficial to the stable mounting of the component and the thinning of the overall structure.

[0036] In this embodiment, the diameter of the heat-conducting pillar 22 matches the aperture of the through hole 14. This close matching of the diameter of the heat-conducting pillar 22 with the aperture of the through hole 14 in the plate 1 reduces the gap between them, making the structure more stable and reliable.

[0037] In this embodiment, resin is filled between the main body 21 and the wall of the sink 13. Filling the space between the main body 21 of the heat-conducting component 2 and the wall of the sink 13 with resin can fix the heat-conducting component 2, prevent it from loosening or shifting, and ensure the stability of the structure.

[0038] In the description of this utility model, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure embedded in a circuit board, characterized in that, include: The plate has a first surface and a second surface arranged opposite to each other. A groove is formed on the first surface, and a plurality of through holes are formed at the bottom of the groove. The through holes penetrate the plate and extend to the second surface. A heat-conducting component, comprising a main body, with a plurality of heat-conducting pillars on one side of the main body, the main body being embedded in the recess, and each heat-conducting pillar extending into a corresponding through hole; as well as A heat sink is attached to the second surface, and the end of the heat-conducting pillar is connected to the heat sink.

2. The circuit board embedded heat dissipation structure according to claim 1, characterized in that, The first surface is provided with a heating device corresponding to the sink, and a thermally conductive material layer is provided between the heating device and the main body.

3. The circuit board embedded heat dissipation structure according to claim 2, characterized in that, The first surface has pads for connecting the heating device near the periphery of the sink.

4. The circuit board embedded heat dissipation structure according to claim 1, characterized in that, The heat sink has multiple countersunk holes on its surface facing the main body, and the end of each heat-conducting pillar extends into a corresponding countersunk hole.

5. The circuit board embedded heat dissipation structure according to claim 1, characterized in that, The heat sink has multiple fins arranged on the surface opposite to the plate.

6. The circuit board embedded heat dissipation structure according to claim 1, characterized in that, The surface of the main body is flush with the first surface.

7. The circuit board embedded heat dissipation structure according to claim 1, characterized in that, The diameter of the heat-conducting column matches the diameter of the through hole.

8. The circuit board embedded heat dissipation structure according to claim 1, characterized in that, The space between the main body and the wall of the settling tank is filled with resin.

Images