Circuit board and power device

Abstract

The application relates to a circuit board and a power device, wherein the circuit board comprises four external terminals, a power carrier communication circuit, a communication selection welding circuit, a voltage sampling circuit and a sampling selection welding circuit, wherein, in the case that the circuit board is used for a three-phase three-wire power grid, three external terminals of the four external terminals are respectively used for connecting three fire-phase circuits in the three-phase three-wire power grid, and the remaining one external terminal remains in an unconnected state; in the case that the circuit board is used for a three-phase four-wire power grid, the four external terminals are respectively used for connecting three fire-phase circuits and one zero-phase circuit in the three-phase four-wire power grid; the communication selection welding circuit is used for coupling the power carrier communication circuit to the four external terminals; and the sampling selection welding circuit is used for connecting the voltage sampling circuit to the four external terminals. The above circuit board can be compatible with PLC functions and voltage sampling functions in different power grid scenes.

Description

Technical Field

[0001] This application relates to the field of new energy technology, and in particular to a circuit board and power equipment. Background Technology

[0002] In a three-phase three-wire power grid, there are only three live phase wires and no neutral phase wire. The grid voltage is based on the line voltage. The PLC (Power Line Carrier Communication) circuit can only couple between any two live phases. The sampling target of the voltage sampling circuit is the line voltage. In a three-phase four-wire power grid, there are three live phase wires and one neutral phase wire. The grid voltage can have both line voltage and phase voltage. Correspondingly, the PLC circuit can use the live phase-neutral phase as a coupling channel. The sampling target of the voltage sampling circuit is the phase voltage.

[0003] In related technologies, corresponding circuit boards are designed for three-phase three-wire power grids and three-phase four-wire power grids respectively, so as to realize PLC functions and voltage sampling functions under different power grid scenarios. Utility Model Content

[0004] Therefore, it is necessary to provide a circuit board and power equipment that can be compatible with PLC functions and voltage sampling functions under different power grid scenarios to address the above-mentioned technical problems.

[0005] In a first aspect, a circuit board is provided, comprising four external terminals, a power line carrier communication circuit, a communication selective soldering circuit, a voltage sampling circuit, and a sampling selective soldering circuit, wherein...

[0006] When the circuit board is used for a three-phase three-wire power grid, three of the four external terminals are used to connect the three live phase circuits in the three-phase three-wire power grid, and the remaining external terminal remains unconnected.

[0007] When the circuit board is used in a three-phase four-wire power grid, the four external terminals are used to connect the three live phase circuits and one zero phase circuit in the three-phase four-wire power grid, respectively.

[0008] The communication selective soldering circuit is used to couple the power line carrier communication circuit to four external terminals;

[0009] The sampling selection circuit is used to connect the voltage sampling circuit to four external terminals.

[0010] In one embodiment, the four external terminals are a first external terminal, a second external terminal, a third external terminal, and a fourth external terminal; wherein,

[0011] When the circuit board is used for a three-phase three-wire power grid, the first external terminal, the second external terminal and the third external terminal are used to connect the three live phase circuits in the three-phase three-wire power grid respectively, and the fourth external terminal remains unconnected.

[0012] When the circuit board is used for a three-phase four-wire power grid, the first external terminal is used to connect the zero-phase circuit in the three-phase four-wire power grid, and the second, third, and fourth external terminals are respectively connected to the three live-phase circuits in the three-phase four-wire power grid.

[0013] In one embodiment, the communication soldering circuit includes soldering resistors R11, R12, and R13, wherein,

[0014] The first set of communication ports of the power line carrier communication circuit is coupled to the first external terminal and the second external terminal;

[0015] One of the communication ports in the second group of the power line carrier communication circuit is coupled to the third external terminal, and the other communication port in the second group of the power line carrier communication circuit is coupled to the first external terminal through the selective soldering resistor R11.

[0016] One of the communication ports in the third group of the power line carrier communication circuit is coupled to the first external terminal. The other communication port in the third group of the power line carrier communication circuit is coupled to the third external terminal through selective soldering resistor R12 or to the fourth external terminal through selective soldering resistor R13.

[0017] When the circuit board is used for a three-phase three-wire power grid, the selective soldering resistors R11 and R13 are not soldered, while the selective soldering resistor R12 is soldered.

[0018] When the circuit board is used for a three-phase four-wire power grid, the selective soldering resistor R12 is not soldered, while selective soldering resistors R11 and R13 are soldered.

[0019] In one embodiment, the solder selector resistors R11, R12, and R13 are all 0-ohm solder selector resistors.

[0020] In one embodiment, the voltage sampling circuit includes a microcontroller, a first amplifier circuit, a second amplifier circuit, and a third amplifier circuit; the sampling soldering circuit includes mandatory soldering resistors R21, R22, R23, R24, and R25, and selectable soldering resistors R31, R32, R33, and R34, wherein...

[0021] The first input terminal of the first amplifier circuit is connected to the first external terminal through a solderable resistor R21, the second input terminal of the first amplifier circuit is connected to the second external terminal through a solderable resistor R22, and the output terminal of the first amplifier circuit is connected to the first input terminal of the microcontroller.

[0022] The first input terminal of the second amplifier circuit is connected to the third external terminal through a soldering resistor R23. The second input terminal of the second amplifier circuit is connected to the second external terminal through a soldering resistor R31 or to the first external terminal through a soldering resistor R32. The output terminal of the second amplifier circuit is connected to the second input terminal of the microcontroller.

[0023] The first input terminal of the third amplifier circuit is connected to the third external terminal through the mandatory soldering resistor R24 ​​and the optional soldering resistor R33, or to the fourth external terminal through the mandatory soldering resistor R24 ​​and the optional soldering resistor R34. The second input terminal of the third amplifier circuit is connected to the first external terminal through the mandatory soldering resistor R25. The output terminal of the third amplifier circuit is connected to the third input terminal of the microcontroller.

[0024] When the circuit board is used in a three-phase three-wire power grid, selective soldering resistors R31 and R33 are soldered, while selective soldering resistors R32 and R34 are not soldered.

[0025] When the circuit board is used for a three-phase four-wire power grid, the selective soldering resistors R31 and R33 are not soldered, while the selective soldering resistors R32 and R34 are soldered.

[0026] In one embodiment, the required solder resistors R21, R22, R23 and R24 are all required solder resistor strings with a resistance greater than 0 ohms, and the required solder resistor R25 is a required solder resistor with a resistance greater than 0 ohms.

[0027] The selective soldering resistor R31 is a series of selective soldering resistors with a resistance greater than 0 ohms;

[0028] Solder selector resistors R32, R33, and R34 are all solder selector resistors with a resistance greater than 0 ohms.

[0029] In one embodiment, the circuit board further includes solder selection identification circuitry, wherein...

[0030] The fourth input of the microcontroller is connected to the logic voltage source via an identification soldering circuit;

[0031] The identification soldering circuit is used to perform voltage division processing on the logic voltage source by selecting soldering resistors with different resistance values ​​to obtain the first logic voltage or the second logic voltage.

[0032] The microcontroller is used to determine whether the circuit board is used in a three-phase three-wire power grid based on a first logic voltage, and to determine whether the circuit board is used in a three-phase four-wire power grid based on a second logic voltage.

[0033] In one embodiment, the first input terminal of each amplifier circuit is a negative input terminal, and the second input terminal of each amplifier circuit is a positive input terminal.

[0034] The microcontroller is used to invert the sampled voltage input to the third input terminal of the microcontroller when the first logic voltage is obtained;

[0035] The microcontroller is used to invert the sampled voltages input to its first, second, and third input terminals when a second logic voltage is obtained.

[0036] In one embodiment, the solder selection circuit includes solder selection resistors R41 and R42, wherein,

[0037] The first terminal of the solder selector resistor R41 is connected to the logic voltage source, and the second terminal of the solder selector resistor R41 is connected to the fourth input terminal of the microcontroller and the first terminal of the solder selector resistor R42.

[0038] The second terminal of the selective soldering resistor R42 is grounded.

[0039] Secondly, this application provides an electrical device including the circuit board provided in the first aspect above.

[0040] The aforementioned circuit board and power equipment, wherein the circuit board includes four external terminals, a power line carrier communication circuit, a communication selective soldering circuit, a voltage sampling circuit, and a sampling selective soldering circuit. When the circuit board is used in a three-phase three-wire power grid, three of the four external terminals are respectively used to connect to the three live phase circuits in the three-phase three-wire power grid, and the remaining external terminal remains unconnected. When the circuit board is used in a three-phase four-wire power grid, the four external terminals are respectively used to connect to the three live phase circuits and one neutral phase circuit in the three-phase four-wire power grid. The communication selective soldering circuit is used to couple the power line carrier communication circuit to the four external terminals. The sampling selective soldering circuit is used to connect the voltage sampling circuit to the four external terminals. Thus, the aforementioned circuit board is configured with four external ports. In a three-phase three-wire power grid scenario, three of the external ports are connected, while the remaining external port remains unconnected. In a three-phase four-wire power grid scenario, all four external ports are connected. The power line carrier communication circuit is coupled to the four external ports via a communication selective soldering circuit, and the voltage sampling circuit is connected to the four external ports via a sampling selective soldering circuit. In practical applications, it is only necessary to select the selective soldering resistors in the communication selective soldering circuit and the sampling selective soldering circuit that correspond to the current scenario, without rewiring. This achieves PLC functionality and voltage sampling functionality compatible with different power grid scenarios on a single circuit board. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a block diagram of a circuit board structure for a three-phase three-wire power grid in one embodiment;

[0043] Figure 2 This is a block diagram of a circuit board structure for a three-phase four-wire power grid in one embodiment;

[0044] Figure 3 This is a schematic diagram of the circuit topology of a circuit board used in a three-phase three-wire power grid in one embodiment;

[0045] Figure 4 This is a schematic diagram of the circuit topology of a circuit board used in a three-phase four-wire power grid in one embodiment;

[0046] Figure 5 This is a schematic diagram showing the connection relationship of communication signals between the PLC chip and the three phase circuits of a three-phase three-wire power grid in one embodiment;

[0047] Figure 6 This is a schematic diagram of the circuit topology of a circuit board for a three-phase three-wire power grid in another embodiment;

[0048] Figure 7 This is a schematic diagram of the circuit topology of a circuit board for a three-phase four-wire power grid in another embodiment.

[0049] Figure label:

[0050] 100. Circuit board; 110. Power line carrier communication circuit; 111. PLC chip; 120. Communication soldering circuit; 130. Voltage sampling circuit; 131. First amplifier circuit; 132. Second amplifier circuit; 133. Third amplifier circuit; 134. Microcontroller; 140. Sampling soldering circuit; 150. Identification soldering circuit; 210. Three-phase three-wire power grid; 220. Three-phase four-wire power grid. Detailed Implementation

[0051] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0053] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0054] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0055] It is understood that the term "based on" as used in this application is used to describe one or more factors that influence the determination, but does not exclude other factors that may influence the determination. For example, the phrase "determine A based on B" means that the determination of A can be based entirely or at least partially on factor B. That is, B is a factor that influences the determination of A, but does not exclude the fact that the determination of A is also based on C.

[0056] When used herein, the singular forms of “a,” “an,” and “ / the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0057] In one exemplary embodiment, please refer to Figure 1 and Figure 2 A circuit board 100 is provided, including four external terminals (A, B, C, and D in the figure), a power line carrier communication circuit 110, a communication soldering circuit 120, a voltage sampling circuit 130, and a sampling soldering circuit 140, wherein...

[0058] Please refer to Figure 1 When circuit board 100 is used for a three-phase three-wire power grid 210, three of the four external terminals are used to connect to the three live phase circuits in the three-phase three-wire power grid 210, while the remaining external terminal remains unconnected. Please refer to... Figure 2 When the circuit board 100 is used for a three-phase four-wire power grid 220, the four external terminals are used to connect the three live phase circuits and one zero phase circuit in the three-phase four-wire power grid 220 respectively; the communication selective soldering circuit 120 is used to couple the power line carrier communication circuit 110 to the four external terminals, and the sampling selective soldering circuit 140 is used to connect the voltage sampling circuit 130 to the four external terminals.

[0059] Among them, the optional soldering circuit refers to the circuit board 100 that can achieve different circuit functions by selectively soldering certain components such as resistors, capacitors, and jumpers, according to the product usage scenario or configuration requirements, through the Bill of Materials (BOM).

[0060] In both the three-phase three-wire power grid 210 and the three-phase four-wire power grid 220 scenarios, the power line carrier communication circuit 110 has three sets of external ports. In the three-phase three-wire power grid 210 scenario, the three sets of communication ports are respectively coupled to the L1-L2 phase circuit, the L1-L3 phase circuit, and the L2-L3 phase circuit; in the three-phase four-wire power grid 220 scenario, the three sets of communication ports are respectively coupled to the N-phase circuit-L1 phase circuit, the N-phase circuit-L2 phase circuit, and the N-phase circuit-L3 phase circuit. Therefore, in this embodiment, by setting the communication selection circuit 120, the power line carrier communication circuit 110 is coupled to four external terminals. Because in the three-phase three-wire power grid 210 scenario, three of the four external terminals are connected to three live phase circuits, and the remaining terminal remains unconnected, thus enabling the power line carrier communication circuit 110 to be coupled to the three live phase circuits of the three-phase three-wire power grid.

[0061] In both the three-phase three-wire power grid 210 and the three-phase four-wire power grid 220 scenarios, the voltage sampling circuit 130 includes three amplifier circuits. In the three-phase three-wire power grid 210 scenario, the three amplifier circuits are connected to the L1-L2, L1-L3, and L2-L3 phase circuits respectively to measure line voltage. In the three-phase four-wire power grid 220 scenario, the three amplifier circuits are connected to the N-phase-L1, N-phase-L2, and N-phase-L3 phase circuits respectively to measure phase voltage. Therefore, in this embodiment, the voltage sampling circuit 130 is connected to four external terminals via the sampling selection circuit 140. Because in the three-phase three-wire power grid 210 scenario, three of the four external terminals are connected to the three live phase circuits, and the remaining terminal remains unconnected, the voltage sampling circuit 130 is coupled to the three live phase circuits of the three-phase three-wire power grid.

[0062] The circuit board 100 provided in the above embodiment includes four external terminals, a power line carrier communication circuit 110, a communication selective soldering circuit 120, a voltage sampling circuit 130, and a sampling selective soldering circuit 140. When the circuit board 100 is used for a three-phase three-wire power grid 210, three of the four external terminals are used to connect to the three live phase circuits in the three-phase three-wire power grid 210, and the remaining external terminal remains unconnected. When the circuit board 100 is used for a three-phase four-wire power grid 220, the four external terminals are used to connect to the three live phase circuits and one neutral phase circuit in the three-phase four-wire power grid 220. The communication selective soldering circuit 120 is used to couple the power line carrier communication circuit 110 to the four external terminals. The sampling selective soldering circuit 140 is used to connect the voltage sampling circuit 130 to the four external terminals. Thus, the aforementioned circuit board 100 is equipped with four external terminals. In the three-phase three-wire power grid 210 scenario, three of the external terminals are connected, while the remaining external terminal remains unconnected. In the three-phase four-wire power grid 220 scenario, all four external terminals are connected. The power line carrier communication circuit 110 is coupled to the four external terminals through the communication selective soldering circuit 120, and the voltage sampling circuit 130 is connected to the four external terminals through the sampling selective soldering circuit 140. In practical applications, it is only necessary to select the soldering resistors in the communication selective soldering circuit 120 and the sampling selective soldering circuit 140 that correspond to the current scenario, without rewiring. This achieves PLC functions and voltage sampling functions that are compatible with different power grid scenarios using a single circuit board 100.

[0063] In one exemplary embodiment, please refer to Figure 1 and Figure 2 The provided circuit board 100 has four external terminals, namely, a first external terminal A, a second external terminal B, a third external terminal C, and a fourth external terminal D. When the circuit board 100 is used for a three-phase three-wire power grid 210, the first external terminal A, the second external terminal B, and the third external terminal C are used to connect to the three live phase circuits in the three-phase three-wire power grid 210, while the fourth external terminal D remains unconnected. When the circuit board 100 is used for a three-phase four-wire power grid 220, the first external terminal A is used to connect to the zero phase circuit in the three-phase four-wire power grid 220, while the second external terminal B, the third external terminal C, and the fourth external terminal D are used to connect to the three live phase circuits in the three-phase four-wire power grid 220.

[0064] Because the sampling voltage of each phase in a three-phase four-wire power grid scenario needs to be referenced to the neutral circuit, if the external terminal corresponding to the zero-phase circuit in the three-phase four-wire power grid scenario remains unconnected, then a separate switching circuit corresponding to the zero-phase circuit needs to be set in the sampling and soldering circuit 140 for each phase voltage sampling and soldering channel. In this embodiment, the external terminal corresponding to one live phase circuit in the three-phase four-wire power grid scenario remains unconnected. Compared to the external terminal corresponding to the zero-phase circuit in the three-phase four-wire power grid scenario remaining unconnected, the sampling and soldering circuit 140 can reuse the switching circuit corresponding to the zero-phase circuit, connecting the zero-phase circuit and the live phase circuit respectively in different power grid scenarios, reducing the design complexity of the sampling and soldering circuit 140 and reducing the circuit area of ​​the sampling and soldering circuit 140.

[0065] In one possible implementation, please refer to 3 and Figure 4 The communication selective soldering circuit 120 includes selective soldering resistors R11, R12, and R13. The first set of communication ports of the power line carrier communication circuit 110 is coupled to the first external terminal A and the second external terminal B. One communication port of the second set of communication ports of the power line carrier communication circuit 110 is coupled to the third external terminal C. The other communication port of the second set of communication ports of the power line carrier communication circuit 110 is coupled to the first external terminal A via selective soldering resistor R11. One communication port of the third set of communication ports of the power line carrier communication circuit 110 is coupled to the first external terminal A. The other communication port of the third set of communication ports of the power line carrier communication circuit 110 is coupled to the third external terminal C via selective soldering resistor R12 or to the fourth external terminal D via selective soldering resistor R13.

[0066] Please refer to the following: Figure 3 and Figure 4 The power line carrier communication circuit 110 includes capacitors C1, C2, and C3, and a PLC chip 111. Among them, capacitor C1 corresponds to the first set of communication ports, capacitor C2 corresponds to the second set of communication ports, and capacitor C3 corresponds to the third set of communication ports, respectively filtering out the high-frequency signals on the power line and transmitting them to the PLC chip.

[0067] Please refer to Figure 3In the case where circuit board 100 is used for a three-phase three-wire power grid 210, selective soldering resistors R11 and R13 are not soldered, while selective soldering resistor R12 is soldered. Thus, the first set of communication ports of the power line carrier communication circuit 110 is coupled to the L1-L2 phase circuit of the three-phase three-wire power grid 210, and the third set of communication ports is coupled to the L1-L3 phase circuit of the three-phase three-wire power grid 210. One communication port of the second set of communication ports is coupled to the L3 phase circuit of the three-phase three-wire power grid 210, while the other communication port is not connected to any circuit. The L3 phase circuit corresponding to the second set of communication ports is coupled to the L1 phase circuit through the L3 phase circuit corresponding to the third set of communication ports, and then coupled to the L2 phase circuit through the L1 phase circuit corresponding to the first set of communication ports. This allows the PLC chip 111 to be coupled to the L2-L3 phase circuit of the three-phase three-wire power grid 210. Please refer to [reference needed]. Figure 5 This diagram illustrates the connection relationship between the PLC chip 111 and the three-phase circuits of the three-phase three-wire power grid 210. The L3 phase circuits corresponding to the second and third communication ports have the same potential, and the L1 phase circuit corresponding to the third communication port has the same potential as the L1 phase circuit corresponding to the first communication port. Therefore, the communication signal of the L3 phase circuit corresponding to the second communication port can be transmitted to the L1 phase circuit corresponding to the first communication port through the L3 and L1 phase circuits of the third communication port, thus forming a communication loop with the L2 phase circuit corresponding to the first communication port, transmitting the PLC communication signal corresponding to the L2-L3 phase circuits of the three-phase three-wire power grid 210.

[0068] Please refer to Figure 4 When the circuit board 100 is used for a three-phase four-wire power grid 220, the selective soldering resistor R12 is not soldered, while the selective soldering resistors R11 and R13 are soldered. Thus, the first set of communication ports of the power line carrier communication circuit 110 is coupled to the N-phase circuit - L1 phase circuit of the three-phase four-wire circuit, the second set of communication ports is coupled to the L2 phase circuit - N-phase circuit, and the third set of communication ports is coupled to the N-phase circuit - L3 phase circuit. In this way, the power line carrier communication circuit 110 realizes the control of the power line carrier communication process of the three-phase four-wire circuit.

[0069] exist Figure 3 and Figure 4 In the illustrated embodiment, optionally, the soldering resistors R11, R12, and R13 are all 0-ohm soldering resistors. By soldering the soldering resistors, the corresponding circuit is connected; by not soldering the soldering resistors, the corresponding circuit is open. Alternatively, the soldering resistors R11, R12, and R13 can also be soldering resistors with a certain resistance value.

[0070] In one possible implementation, with Figure 3 and Figure 4 The circuit board 100 shown has a similar structure, the difference being that the position of the soldering resistor in each soldering circuit is achieved using pins and jumpers. That is, a set of pins is set at the position of each soldering resistor. A set of pins includes two pins. By inserting a jumper (or jumper cap) into the two pins in the set of pins, the corresponding circuit is connected. By removing the jumper from the two pins in the set of pins, the corresponding circuit is opened.

[0071] In one exemplary embodiment, please refer to Figure 3 and Figure 4 The voltage sampling circuit 130 includes a first amplifier circuit 131, a second amplifier circuit 132, a third amplifier circuit 133, and a microcontroller 134. The sampling soldering circuit 140 includes mandatory soldering resistors R21, R22, R23, R24, and R25, and optional soldering resistors R31, R32, R33, and R34; wherein:

[0072] The first input terminal of the first amplifier circuit 131 is connected to the first external terminal B via a mandatory soldering resistor R21. The second input terminal of the first amplifier circuit 131 is connected to the second external terminal A via a mandatory soldering resistor R22. The output terminal of the first amplifier circuit 131 is connected to the first input terminal ADC1 of the microcontroller 134. The first input terminal of the second amplifier circuit 132 is connected to the third external terminal C via a mandatory soldering resistor R23. The second input terminal of the second amplifier circuit 132 is connected to the second external terminal B via a selective soldering resistor R31 or to the first external terminal A via a selective soldering resistor R32. The output terminal of the second amplifier circuit 132 is connected to the second input terminal ADC2 of the microcontroller 134. The first input terminal of the third amplifier circuit 133 is connected to the third external terminal C via a mandatory soldering resistor R24 ​​and a selective soldering resistor R33 or to the fourth external terminal D via a mandatory soldering resistor R24 ​​and a selective soldering resistor R34. The second input terminal of the third amplifier circuit 133 is connected to the first external terminal A via a mandatory soldering resistor R25. The output terminal of the third amplifier circuit 133 is connected to the third input terminal ADC3 of the microcontroller 134.

[0073] Please refer to Figure 3When the circuit board 100 is used for a three-phase three-wire power grid 210, selective soldering resistors R31 and R33 are soldered, while selective soldering resistors R32 and R34 are not soldered. Thus, the first input terminal ADC1 of the microcontroller 134 is connected to the L1-L2 phase circuit of the three-phase three-wire power grid 210 via the first amplifier circuit 131, sampling the line voltage between the L1 and L2 phase circuits. The second input terminal ADC2 of the microcontroller 134 is connected to the L2-L3 phase circuit of the three-phase three-wire power grid 210 via the second amplifier circuit 132, sampling the line voltage between the L2 and L3 phase circuits. The third input terminal ADC3 of the microcontroller 134 is connected to the L3-L1 phase circuit of the three-phase three-wire power grid 210 via the third amplifier circuit 133, sampling the line voltage between the L3 and L1 phase circuits. In this way, the voltage sampling circuit 130 samples the line voltage of the three-phase three-wire power grid 210.

[0074] In one possible implementation, the first amplifier circuit 131, the second amplifier circuit 132, and the third amplifier circuit 133 are implemented using operational amplifiers.

[0075] Please refer to Figure 4 In the case where circuit board 100 is used for a three-phase four-wire power grid 220, soldering resistors R31 and R33 are not soldered, while soldering resistors R32 and R34 are soldered. Thus, the first input terminal ADC1 of microcontroller 134 is connected to the L1-N phase circuit of the three-phase four-wire power grid 220 via the first amplifier circuit 131, sampling the phase voltage between the L1 and N phase circuits; the second input terminal ADC2 of microcontroller 134 is connected to the L2-N phase circuit of the three-phase three-wire power grid 210 via the second amplifier circuit 132, sampling the phase voltage between the L2 and N phase circuits; the third input terminal ADC3 of microcontroller 134 is connected to the L3-N phase circuit of the three-phase four-wire power grid 220 via the third amplifier circuit 133, sampling the phase voltage between the L3 and N phase circuits. In this way, the voltage sampling circuit 130 samples the line voltage of the three-phase four-wire power grid 220.

[0076] In one alternative configuration, the required solder resistors R21, R22, R23, and R24 are all required solder resistor strings with a resistance greater than 0 ohms, and the required solder resistor R25 is a required solder resistor with a resistance greater than 0 ohms; the optional solder resistor R31 is an optional solder resistor string with a resistance greater than 0 ohms, and the optional solder resistors R32, R33, and R34 are all optional solder resistors with a resistance greater than 0 ohms.

[0077] The required solder resistor R25 and the optional solder resistors R32 and R22 are all connected to the first external terminal A, and are also connected to the second input terminal of their respective amplifier circuits. In the above optional method, the second input terminal of the third amplifier circuit 133 can be connected between the second input terminal of the first amplifier circuit 131 and the required solder resistor R22 through the required solder resistor R25, and then connected to the first external terminal A. The second input terminal of the second amplifier circuit 132 can be connected between the second input terminal of the first amplifier circuit 131 and the required solder resistor R22 through the optional solder resistor R32, and then connected to the first external terminal A. After the required solder resistor string (i.e., the required solder resistor R22) set at the first input terminal of the first amplifier circuit 131 divides the voltage for the corresponding zero-phase circuit or L1 phase live wire circuit, the input terminals of the other two amplifier circuits of the same polarity type reuse the voltage division result of the required solder resistor R22. Compared with the method of using a resistor string for voltage division for the required solder resistor R25 and the optional solder resistor R32, the above optional method can save the space occupied by the optional solder resistors on the circuit board 100.

[0078] Understandably, in other alternatives, the required resistor 25 can be a series of required resistors with a resistance greater than 0 ohms, and the required resistor R22 can be a series of required resistors with a resistance greater than 0 ohms.

[0079] Among them, the optional soldering resistor R31 is connected to the second external terminal B and the second input terminal of the second amplifier circuit 132. Although the mandatory soldering resistor R21 between the second external terminal B and the first input terminal of the first amplifier circuit adopts a voltage divider, since the optional soldering resistor R31 and the mandatory soldering resistor R21 are connected to the input terminals of different polarity types of the corresponding amplifier circuits, a voltage divider resistor string needs to be set before the second input terminal of the second amplifier circuit.

[0080] Among them, the selective welding resistors R33 and R34 are connected to the third amplifier circuit 133 and the L3 phase circuit. By setting the selective welding resistor R24 ​​in the form of a resistor string, the input voltage at the first input terminal of the third amplifier circuit 133 is divided. Setting the selective welding resistors R33 and R34 as resistors facilitates switching the sampling channel to adapt to different power grid scenarios.

[0081] For example, the required solder resistors R21, R22, and R23 all have a resistance of 5225 kΩ (kiloohms) and are each composed of a string of 11 required solder resistors with a resistance of 475 kΩ; the required solder resistor R24 ​​has a resistance of 4750 kΩ and is composed of a string of 10 required solder resistors with a resistance of 475 kΩ; the required solder resistor R25 has a resistance of 1 kΩ. The optional solder resistor R31 has a resistance of 5225 kΩ and is composed of a string of 11 optional solder resistors with a resistance of 475 kΩ; the optional solder resistor R32 has a resistance of 1 kΩ; and the optional solder resistors R33 and R34 are both 475 kΩ.

[0082] In one exemplary embodiment, please refer to Figure 6 and Figure 7 The provided circuit board 100 also includes a solder selection identification circuit 150, wherein the fourth input terminal ADC4 of the microcontroller 134 is connected to the logic voltage source VCC through the solder selection identification circuit 150; the solder selection identification circuit 150 is used to perform voltage division processing on the logic voltage source VCC with different voltage division ratios by selecting solder selection resistors with different resistance values ​​to obtain a first logic voltage or a second logic voltage; the microcontroller 134 is used to determine whether the circuit board 100 is used in a three-phase three-wire power grid 210 based on the first logic voltage, and whether the circuit board 100 is used in a three-phase four-wire power grid 220 based on the second logic voltage.

[0083] In both three-phase three-wire power grid 210 and three-phase four-wire power grid 220 application scenarios, the solder selection circuit 150 identifies soldering resistors with different soldering resistance values. The solder selection circuit 150 divides the logic voltage source VCC by different ratios, causing the fourth input terminal ADC4 of the microcontroller 134 to acquire a first logic voltage or a second logic voltage of different magnitudes. Thus, the microcontroller 134 can determine whether the current connection is a three-phase three-wire power grid 210 or a three-phase four-wire power grid 220 based on the voltage magnitude acquired by the fourth input terminal ADC4.

[0084] In one possible implementation, please refer to Figure 6 and Figure 7 Each amplifier circuit has a first input terminal as a negative input terminal and a second input terminal as a positive input terminal. When the first logic voltage is obtained, the microcontroller 134 is used to invert the sampled voltage input to the third input terminal ADC3 of the microcontroller 134. When the second logic voltage is obtained, the microcontroller 134 is used to invert the sampled voltage input to the first input terminal ADC1, the second input terminal ADC2 and the third input terminal ADC3 of the microcontroller 134.

[0085] In the scenario where circuit board 100 is applied to a three-phase three-wire power grid 210, the positive input terminal of the first amplifier circuit 131 is connected to the L1 phase circuit and the negative input terminal is connected to the L2 phase circuit, sampling the line voltage of the L1 phase circuit relative to the L2 phase circuit. The positive input terminal of the second amplifier circuit 132 is connected to the L2 phase circuit and the negative input terminal is connected to the L3 phase circuit, sampling the line voltage of the L2 phase circuit relative to the L3 phase circuit. The positive input terminal of the third amplifier circuit 133 is connected to the L1 phase circuit and the negative input terminal is connected to the L3 phase circuit, sampling the line voltage of the L1 phase circuit relative to the L3 phase circuit, in the opposite direction to the sampling directions of the first amplifier circuit 131 and the second amplifier circuit 132. Thus, when the microcontroller 134 obtains the first logic voltage, it inverts the sampling voltage input to the third input terminal ADC3 of the microcontroller 134 to obtain the line voltage of the L3 phase circuit relative to the L1 phase circuit, thereby realizing the sampling of the line voltage of the three-phase three-wire power grid 210.

[0086] In the scenario where the circuit board 100 is applied to a three-phase four-wire power grid 220, the positive input terminals of each amplifier circuit are connected to the N-phase circuit, and the negative input terminals of each amplifier circuit are connected to the L1-phase circuit, L2-phase circuit, and L3-phase circuit, respectively. Thus, when the microcontroller 134 obtains the second logic voltage, it inverts the sampled voltages input to the first input terminal ADC1, the second input terminal ADC2, and the third input terminal ADC3 of the microcontroller 134 to obtain the three phase voltages of the three-phase four-wire power grid 220.

[0087] In one possible implementation, such as Figure 6 and Figure 7 As shown, the solder selection circuit 150 includes solder selection resistors R41 and R42. The first end of the solder selection resistor R41 is connected to the logic voltage source VCC, and the second end of the solder selection resistor R41 is connected to the fourth input terminal ADC4 of the microcontroller 134 and the first end of the solder selection resistor R42. The second end of the solder selection resistor R42 is grounded.

[0088] For example, the output voltage of the logic voltage source VCC is 3.3V. In a three-phase three-wire power grid scenario 210, the soldering resistor R41 corresponds to a resistor with a soldering resistance of 5.1kΩ, and the soldering resistor R42 corresponds to a resistor with a soldering resistance of 1.1kΩ. Thus, the voltage obtained by the fourth input terminal ADC4 of the microcontroller 134 should theoretically be 0.585V. Alternatively, in a three-phase four-wire power grid scenario 220, the soldering resistor R41 corresponds to a resistor with a soldering resistance of 10kΩ, and the soldering resistor R42 corresponds to a resistor with a soldering resistance of 1kΩ. Thus, the voltage obtained by the fourth input terminal ADC4 of the microcontroller 134 should theoretically be 0.3V. When the voltage input at the fourth input terminal ADC4 is 0.585V, the microcontroller 134 determines that the circuit board 100 is currently in a three-phase three-wire power grid 210 scenario, and inverts the sampling voltage input at the third input terminal ADC3. When the voltage input at the fourth input terminal ADC4 is 0.3V, the microcontroller 134 determines that the circuit board 100 is currently in a three-phase four-wire power grid 220 scenario, and inverts the sampling voltage input at the first input terminal ADC1, the second input terminal ADC2, and the third input terminal ADC3.

[0089] Optionally, when the voltage input to the fourth input terminal ADC4 falls between 0.538V and 0.6385V, the microcontroller 134 determines that the circuit board 100 is currently in a three-phase three-wire power grid scenario 210. When the voltage input to the fourth input terminal ADC4 falls between 0.274V and 0.328V, the microcontroller 134 determines that the circuit board 100 is currently in a three-phase four-wire power grid scenario 220. In this way, by setting the voltage range, the control reliability of the microcontroller is improved.

[0090] For example, the ranges corresponding to the first logic voltage and the second logic voltage are preset in advance, and the voltage division ratio of the identification soldering circuit 150 under the two power grid scenarios is determined based on this. Then, the resistance values ​​of the soldering resistor R41 and the soldering resistor R42 under different power grid scenarios are determined.

[0091] In one exemplary embodiment, each solderable resistor may be in the form of a surface mount resistor, and a surface mount pad is provided at the corresponding position of each solderable resistor.

[0092] In one exemplary embodiment, each solderable resistor is in the form of a plug-in resistor, and a through hole is provided at the corresponding position of each solderable resistor.

[0093] In one exemplary embodiment, each soldering circuit in the circuit board 100 is provided with a surface mount pad and a via. The via can be located on both sides or in the middle of the surface mount pad, and can be selected as a through-hole resistor or a surface mount resistor depending on the manufacturing method.

[0094] In one exemplary embodiment, a power device is provided, including the circuit board 100 provided in the above embodiment. Exemplarily, this power device may be a data acquisition device or a gateway, etc.

[0095] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0096] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A circuit board, characterized in that, The circuit board includes four external terminals, a power line carrier communication circuit, a communication selective soldering circuit, a voltage sampling circuit, and a sampling selective soldering circuit, wherein... When the circuit board is used for a three-phase three-wire power grid, three of the four external terminals are used to connect to the three live phase circuits in the three-phase three-wire power grid, and the remaining external terminal remains unconnected. When the circuit board is used for a three-phase four-wire power grid, the four external terminals are respectively used to connect three live phase circuits and one zero phase circuit in the three-phase four-wire power grid; The communication selective soldering circuit is used to couple the power line carrier communication circuit to the four external terminals; The sampling and soldering circuit is used to connect the voltage sampling circuit to the four external terminals.

2. The circuit board according to claim 1, characterized in that, The four external terminals are designated as the first external terminal, the second external terminal, the third external terminal, and the fourth external terminal; wherein, When the circuit board is used for the three-phase three-wire power grid, the first external terminal, the second external terminal and the third external terminal are used to connect to the three live phase circuits in the three-phase three-wire power grid respectively, and the fourth external terminal remains unconnected. When the circuit board is used for the three-phase four-wire power grid, the first external terminal is used to connect to the zero-phase circuit in the three-phase four-wire power grid, and the second external terminal, the third external terminal and the fourth external terminal are respectively connected to the three live-phase circuits in the three-phase four-wire power grid.

3. The circuit board according to claim 2, characterized in that, The communication soldering circuit includes soldering resistors R11, R12, and R13, wherein... The first set of communication ports of the power line carrier communication circuit is coupled to the first external terminal and the second external terminal; One of the communication ports in the second group of the power line carrier communication circuit is coupled to the third external terminal, and the other communication port in the second group of the power line carrier communication circuit is coupled to the first external terminal through the selective soldering resistor R11. One of the communication ports in the third group of the power line carrier communication circuit is coupled to the first external terminal, and the other communication port in the third group of the power line carrier communication circuit is coupled to the third external terminal through the selective soldering resistor R12 or to the fourth external terminal through the selective soldering resistor R13. When the circuit board is used in the three-phase three-wire power grid, the selective soldering resistors R11 and R13 are not soldered, and the selective soldering resistor R12 is soldered. When the circuit board is used for the three-phase four-wire power grid, the selective soldering resistor R12 is not soldered, while the selective soldering resistors R11 and R13 are soldered.

4. The circuit board according to claim 3, characterized in that, The soldering resistors R11, R12, and R13 are all 0-ohm soldering resistors.

5. The circuit board according to claim 2, characterized in that, The voltage sampling circuit includes a microcontroller, a first amplifier circuit, a second amplifier circuit, and a third amplifier circuit; the sampling soldering circuit includes mandatory soldering resistors R21, R22, R23, R24, and R25, and selectable soldering resistors R31, R32, R33, and R34, wherein... The first input terminal of the first amplifier circuit is connected to the first external terminal through the solderable resistor R21, the second input terminal of the first amplifier circuit is connected to the second external terminal through the solderable resistor R22, and the output terminal of the first amplifier circuit is connected to the first input terminal of the microcontroller. The first input terminal of the second amplifier circuit is connected to the third external terminal through the soldering resistor R23, the second input terminal of the second amplifier circuit is connected to the second external terminal through the soldering resistor R31 or to the first external terminal through the soldering resistor R32, and the output terminal of the second amplifier circuit is connected to the second input terminal of the microcontroller. The first input terminal of the third amplifier circuit is connected to the third external terminal through the mandatory soldering resistor R24 ​​and the optional soldering resistor R33, or connected to the fourth external terminal through the mandatory soldering resistor R24 ​​and the optional soldering resistor R34. The second input terminal of the third amplifier circuit is connected to the first external terminal through the mandatory soldering resistor R25. The output terminal of the third amplifier circuit is connected to the third input terminal of the microcontroller. When the circuit board is used in the three-phase three-wire power grid, the selective soldering resistors R31 and R33 are soldered, while the selective soldering resistors R32 and R34 are not soldered. When the circuit board is used for the three-phase four-wire power grid, the selective soldering resistors R31 and R33 are not soldered, while the selective soldering resistors R32 and R34 are soldered.

6. The circuit board according to claim 5, characterized in that, The required soldering resistors R21, R22, R23 and R24 are all required soldering resistor strings with a resistance value greater than 0 ohms, and the required soldering resistor R25 is a required soldering resistor with a resistance value greater than 0 ohms. The selective soldering resistor R31 is a series of selective soldering resistors with a resistance greater than 0 ohms. The soldering resistors R32, R33, and R34 are all soldering resistors with a resistance greater than 0 ohms.

7. The circuit board according to claim 5, characterized in that, The circuit board also includes a solder selection identification circuit, wherein... The fourth input terminal of the microcontroller is connected to the logic voltage source through the identification and soldering circuit; The identification soldering circuit is used to perform voltage division processing on the logic voltage source with different voltage division ratios by selecting soldering resistors with different resistance values ​​to obtain a first logic voltage or a second logic voltage. The microcontroller is used to determine, based on a first logic voltage, that the circuit board is used in the three-phase three-wire power grid, and based on a second logic voltage, that the circuit board is used in the three-phase four-wire power grid.

8. The circuit board according to claim 7, characterized in that, The first input terminal of each amplifier circuit is the negative input terminal, and the second input terminal of each amplifier circuit is the positive input terminal. The microcontroller is used to invert the sampled voltage input to the third input terminal of the microcontroller when the first logic voltage is obtained; The microcontroller is used to invert the sampled voltages input to its first, second, and third input terminals when the second logic voltage is obtained.

9. The circuit board according to claim 7, characterized in that, The solder selection circuit includes solder selection resistor R41 and solder selection resistor R42, wherein, The first terminal of the solder selector resistor R41 is connected to the logic voltage source, and the second terminal of the solder selector resistor R41 is connected to the fourth input terminal of the microcontroller and the first terminal of the solder selector resistor R42. The second end of the selective welding resistor R42 is grounded.

10. An electrical device, characterized in that, The power equipment includes the circuit board as described in any one of claims 1-9.

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