A server dimm slot smt pick and place nozzle

Abstract

The utility model discloses a kind of server DIMM slot SMT suction nozzle, it is connected with SMT patch technology field including suction nozzle main part, the top of suction nozzle main part is provided with the connecting part for being connected with patch machine;Vacuum pipeline is equipped in the inside of suction nozzle main part, one end of vacuum pipeline is used to be connected with patch machine, another end of vacuum pipeline extends to the bottom of suction nozzle main part and forms vacuum suction point, and patch machine is used to provide negative pressure for vacuum pipeline;The bottom of suction nozzle main part is equipped with lower pressure boss.The utility model connects stably with patch machine by the connecting part of suction nozzle main part top, ensure movement accuracy;Internal vacuum pipeline conduction negative pressure to bottom suction point, firmly adsorb DIMM slot and prevent displacement;Bottom lower pressure boss contacts and exerts vertical pressure when mounting, effectively overcome the interference fit resistance of pin and PCB, guarantee pin complete insertion.The structure realizes the high-precision, high-stability full-automatic mounting of DDR5 DIMM slot, significantly improves production efficiency and product quality.

Description

Technical Field

[0001] This utility model relates to the field of SMT placement technology, and in particular to a server DIMM slot SMT placement nozzle. Background Technology

[0002] In the field of server technology, in order to meet the development needs of higher performance and lower power consumption, DDR4 DIMM slots are being gradually replaced by DDR5 DIMM slots.

[0003] With the update of the DIMM slot's structural design, its assembly process on server motherboards has also shifted from traditional wave soldering to surface mount technology. In the past, when using wave soldering, DDR4 DIMM slots were mainly installed manually. This method was not only inefficient but also prone to quality risks due to poor operational consistency.

[0004] With the widespread application of DDR5 DIMM slots, their structural characteristics place higher demands on mounting accuracy and fit. As a large-size connector (288 pins, dimensions 144×6.1×21.3mm), the DDR5 DIMM slot has three positioning pins that are interference-fitted with the PCB. Conventional nozzles cannot meet its high-precision and high-stability mounting requirements. Utility Model Content

[0005] The technical problem to be solved by this utility model embodiment is how to meet the high precision and high stability mounting requirements of DDR5 DIMM slots.

[0006] To address the aforementioned problems, this utility model provides a server DIMM slot SMT placement nozzle, comprising: The nozzle body has a connection part on its top for connecting to a pick-and-place machine; The nozzle body has a vacuum channel inside. One end of the vacuum channel is used to connect to the pick-and-place machine, and the other end of the vacuum channel extends to the bottom of the nozzle body and forms a vacuum suction point. The pick-and-place machine is used to provide negative pressure to the vacuum channel. The bottom of the nozzle body is provided with a pressing protrusion.

[0007] A further technical solution is that the main body of the suction nozzle has a triangular structure.

[0008] A further technical solution is that the connecting part is provided with an installation interface that cooperates with the pick-and-place machine.

[0009] A further technical solution includes at least one fixing pin, which is located on the connecting part and is used to lock and fix the connecting part to the placement machine.

[0010] A further technical solution is that the bottom surface of the pressing boss is a flat pressing surface.

[0011] A further technical solution is that the number of the pressing protrusions is multiple, and the multiple pressing protrusions are evenly distributed at the bottom of the nozzle body.

[0012] A further technical solution is that the number of vacuum suction points is multiple, and the multiple vacuum suction points are evenly distributed at the bottom of the nozzle body.

[0013] A further technical solution is that the suction nozzle body, the connecting part, and the pressing boss are integrally formed.

[0014] A further technical solution is that the nozzle body is made of a rigid material.

[0015] A further technical solution is that the placement machine is connected to the vacuum pipeline via a vacuum valve.

[0016] Compared with the prior art, the technical effects achieved by the embodiments of this utility model include: This invention provides a server DIMM slot SMT placement nozzle, comprising a nozzle body with a connection portion at the top for connection to a pick-and-place machine; a vacuum channel is provided inside the nozzle body, one end of which connects to the pick-and-place machine, and the other end extends to the bottom of the nozzle body to form a vacuum suction point, the pick-and-place machine providing negative pressure to the vacuum channel; and a pressing boss is provided at the bottom of the nozzle body. This invention achieves a stable connection with the pick-and-place machine through the connection portion at the top of the nozzle body, ensuring motion accuracy; the internal vacuum channel transmits negative pressure to the bottom suction point, firmly adhering to the DIMM slot and preventing displacement; the bottom pressing boss contacts and applies vertical pressure during placement, effectively overcoming the interference fit resistance between the pins and the PCB, ensuring complete pin insertion. This structure achieves high-precision, high-stability fully automated placement of DDR5 DIMM slots, significantly improving production efficiency and product quality. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0020] Figure 1 This is a schematic diagram of the structure of a server DIMM slot SMT placement nozzle proposed in an embodiment of the present invention; Figure 2 This is a front view of a server DIMM slot SMT placement nozzle proposed in an embodiment of the present invention; Figure 3 This is a top view of a server DIMM slot SMT placement nozzle proposed in an embodiment of the present invention.

[0021] Figure Labels The nozzle body 10, the connecting part 20, the vacuum pipe 30, the vacuum suction point 40, the pressing boss 50, and the fixing pin 60. Detailed Implementation

[0022] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Similar component reference numerals in the drawings represent similar components. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0023] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0024] It should also be understood that the terminology used in this specification of embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the present invention. As used in this specification of embodiments of the present invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0025] See Figures 1-3 This utility model embodiment proposes a server DIMM slot SMT placement nozzle, including a nozzle body 10, the specific structure of which is described below: The top of the nozzle body 10 is provided with a connection part 20 for connecting to a pick-and-place machine; the inside of the nozzle body 10 is provided with a vacuum pipe 30, one end of the vacuum pipe 30 is used to connect to the pick-and-place machine, and the other end of the vacuum pipe 30 extends to the bottom of the nozzle body 10 and forms a vacuum suction point 40, and the pick-and-place machine is used to provide negative pressure to the vacuum pipe 30; the bottom of the nozzle body 10 is provided with a pressing boss 50.

[0026] In practice, the server DIMM slot SMT pick-and-place nozzle provided by this utility model systematically solves the key technical problems in the application of DDR5 DIMM slots in surface mount technology through its unique structural design.

[0027] The connector 20 at the top of the nozzle achieves a stable connection with the pick-and-place machine head, thereby ensuring the positioning accuracy and posture stability of the nozzle during high-speed movement, laying a mechanical foundation for high-precision placement.

[0028] The vacuum channel 30 inside the nozzle body 10 reliably transmits the negative pressure generated by the pick-and-place machine to the vacuum suction point 40 at the bottom, forming a uniformly distributed suction force, which can firmly pick up the DIMM slot body and effectively prevent the device from slipping or falling off during rapid movement and positioning.

[0029] The downward pressure boss 50 at the bottom of the nozzle body 10 contacts the DIMM slot housing during the mounting process. By applying controllable vertical downward pressure, it effectively overcomes the interference fit resistance between the DDR5 DIMM slot pins and the PCB pads, ensuring that all pins can be inserted into the corresponding pad holes synchronously and flatly, avoiding quality defects such as cold solder joints, lifting, or poor contact caused by pins not being fully in place.

[0030] This composite structure design, integrating precise positioning, reliable suction, and effective pressure, enables a high degree of automation and process consistency throughout the mounting process, significantly reducing the inherent inefficiency and quality fluctuation risks of traditional manual insertion methods. Through the synergistic effect of its various components, the nozzle ultimately achieves high-precision and high-stability mounting requirements for DDR5 DIMM slots, greatly improving the production efficiency and product yield of server motherboard manufacturing.

[0031] In some preferred embodiments, the nozzle body 10 has a triangular structure.

[0032] In practice, the triangular structure of the nozzle body 10 significantly improves the overall rigidity and bending resistance of the nozzle. As a stable geometric shape, the triangle can evenly distribute external loads to all parts of the nozzle body 10 under stress, thereby effectively suppressing vibration and deformation caused by high-speed movement or downward pressing operations. This structural design is particularly suitable for DIMM slot mounting scenarios with larger dimensions and heavier weights, ensuring that the nozzle maintains shape stability and functional reliability during long-term use, further guaranteeing mounting accuracy.

[0033] In some preferred embodiments, the connection portion 20 is provided with a mounting interface that mates with a pick-and-place machine.

[0034] In practice, the mounting interface provided in the connecting part 20 enables the nozzle to quickly and accurately mate with the pick-and-place machine head. This interface typically employs a standardized design, such as a slot or threaded structure, to ensure that the nozzle maintains coaxiality and perpendicularity with the pick-and-place machine after installation. This design not only improves equipment assembly efficiency but also avoids placement errors caused by loose connections or misalignment, providing a fundamental guarantee for high-precision placement.

[0035] In some preferred embodiments, at least one fixing pin 60 is also included, which is disposed on the connecting portion 20 for locking and fixing the connecting portion 20 to the pick-and-place machine.

[0036] In practice, by adding a fixing pin 60 and placing it in the connecting part 20, the connection strength between the nozzle and the pick-and-place machine head can be further strengthened. The fixing pin 60 can be inserted into the corresponding pin hole in the pick-and-place machine head to form a mechanical interlock, effectively preventing the nozzle from rotating circumferentially or loosening axially during high-speed movement or frequent start-stop operations. This dual fixing mechanism significantly improves the stability and safety of equipment operation, and is especially suitable for high-acceleration, high-frequency automated production lines.

[0037] In some preferred embodiments, the bottom surface of the pressing boss 50 is a flat pressing surface.

[0038] In practice, the bottom surface of the pressure boss 50 is designed as a flat pressure surface, ensuring that the downward pressure is evenly distributed across the contact area of ​​the DIMM slot housing during the mounting process. The flat pressure surface avoids deformation or damage to the DIMM slot plastic housing that may result from localized stress concentration, while also ensuring the smoothness and consistency of the pin insertion process. This design helps improve mounting yield and extend the service life of the DIMM slot.

[0039] In some preferred embodiments, there are multiple pressing protrusions 50, and the multiple pressing protrusions 50 are evenly distributed at the bottom of the nozzle body 10.

[0040] In practice, multiple downward pressure bosses 50 are evenly distributed at the bottom of the nozzle body 10, which further optimizes the distribution of downward pressure. The combined action of multiple downward pressure bosses 50 forms a stable support plane, ensuring that even with slight unevenness or warping of the DIMM slot housing, the pins are evenly stressed and inserted into the pad holes synchronously. This design significantly improves the adaptability of the mounting process to device manufacturing tolerances and PCB flatness.

[0041] In some preferred embodiments, there are multiple vacuum suction points 40, which are evenly distributed at the bottom of the nozzle body 10.

[0042] In practice, setting multiple evenly distributed vacuum suction points 40 increases the effective adsorption area between the nozzle and the DIMM tray housing, improving adsorption stability and reliability. The combined action of multiple suction points creates a uniform vacuum adsorption force field, maintaining a balance of adsorption forces even with slight unevenness on the DIMM tray surface or localized abnormalities in the protective film, preventing device tilting or detachment during handling. This design is particularly suitable for device mounting scenarios with large surface areas or uneven center of gravity distribution.

[0043] In some preferred embodiments, the nozzle body 10, the connecting portion 20, and the pressing boss 50 are integrally formed.

[0044] In practice, the nozzle body 10, connecting part 20, and pressing boss 50 are manufactured using a one-piece molding process, which eliminates the connection gaps and accumulated errors present in traditional assembled structures. The one-piece molding structure has higher overall rigidity and dimensional stability, and will not suffer precision loss due to minor movements between components under stress. Furthermore, this process simplifies the manufacturing process, improves product consistency and reliability, and reduces production costs.

[0045] In some preferred embodiments, the nozzle body 10 is made of a rigid material.

[0046] In practice, the nozzle body 10 is made of a rigid material to ensure that the nozzle maintains its original shape and functional integrity even under long-term pressure, vacuum suction force, and inertial force. Rigid materials effectively resist plastic deformation and fatigue damage, thereby extending the nozzle's service life and maintaining long-term stability of mounting accuracy. Commonly used rigid materials include tool steel, engineering ceramics, or high-performance engineering plastics, etc., and this invention is not specifically limited to these.

[0047] In some preferred embodiments, the placement machine is connected to the vacuum conduit 30 via a vacuum valve.

[0048] In practice, the pick-and-place machine uses a vacuum valve to control the vacuum in the vacuum pipe 30, enabling precise management of the timing of DIMM slot adsorption and release. The rapid response of the vacuum valve ensures coordinated synchronization between the adsorption action and the pick-and-place machine's movement trajectory, thereby improving the placement rhythm and overall production line efficiency.

[0049] Workflow: The pick-and-place machine controls the nozzle to move above the DIMM slot according to the preset program, and then controls the vacuum valve to open and close, so that the vacuum suction point 40 at the bottom of the nozzle generates negative pressure, thereby adsorbing the DIMM slot.

[0050] After the DIMM slot is stably picked up, the pick-and-place machine uses its integrated high-precision vision system to identify the pin position of the DIMM slot and obtain its position deviation and rotation angle deviation data in the X and Y axis directions.

[0051] Next, based on the acquired position and angle compensation data, the pick-and-place machine controls the nozzle to move the DIMM slot to the corresponding placement position on the target PCB. Through the motion control system, it achieves precise position and angle compensation, and finally accurately places the DIMM slot onto the preset pad position on the PCB.

[0052] After mounting is completed, the PCB containing the DIMM slots is transferred to a reflow oven, where the electrical and mechanical connection between the DIMM slot pins and the PCB pads is achieved through the reflow soldering process.

[0053] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0054] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0055] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0056] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0057] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0058] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0059] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Since these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

[0060] The above description describes specific embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be included within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A server DIMM slot SMT placement nozzle, characterized in that, include: The nozzle body has a connection part on its top for connecting to a pick-and-place machine; The nozzle body has a vacuum channel inside. One end of the vacuum channel is used to connect to the pick-and-place machine, and the other end of the vacuum channel extends to the bottom of the nozzle body and forms a vacuum suction point. The pick-and-place machine is used to provide negative pressure to the vacuum channel. The bottom of the nozzle body is provided with a pressing protrusion.

2. The server DIMM slot SMT placement nozzle according to claim 1, characterized in that, The nozzle body has a triangular structure.

3. The server DIMM slot SMT placement nozzle according to claim 2, characterized in that, The connecting part is provided with an installation interface that cooperates with the pick-and-place machine.

4. The server DIMM slot SMT placement nozzle according to claim 3, characterized in that, It also includes at least one fixing pin, which is disposed at the connecting part and is used to lock and fix the connecting part to the pick and place machine.

5. The server DIMM slot SMT placement nozzle according to claim 4, characterized in that, The bottom surface of the pressing boss is a flat pressing surface.

6. The server DIMM slot SMT placement nozzle according to claim 5, characterized in that, The number of the pressing protrusions is multiple, and the multiple pressing protrusions are evenly distributed at the bottom of the nozzle body.

7. The server DIMM slot SMT placement nozzle according to claim 6, characterized in that, The number of vacuum suction points is multiple, and the multiple vacuum suction points are evenly distributed at the bottom of the nozzle body.

8. The server DIMM slot SMT placement nozzle according to claim 7, characterized in that, The nozzle body, the connecting part, and the pressing boss are integrally formed.

9. The server DIMM slot SMT placement nozzle according to claim 8, characterized in that, The nozzle body is made of rigid material.

10. The server DIMM slot SMT placement nozzle according to claim 9, characterized in that, The placement machine is connected to the vacuum pipeline via a vacuum valve.

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