An isolation device and a power supply device with heat dissipation function

Abstract

The application discloses an isolation device and a power supply device with heat dissipation function, and relates to the technical field of electronic device structure design, which comprises an isolation component and a heat sink. The isolation component comprises a base plate and an isolation plate connected with each other, and the isolation plate is used for forming physical isolation between a primary circuit area and a secondary circuit area of a circuit board. The circuit board is provided with an isolation slot hole between the primary circuit area and the secondary circuit area, and the isolation plate is arranged in the isolation slot hole. The heat sink is connected with the base plate, and the heat sink is at least partially exposed to a heat absorption window in a bonding surface of the base plate. The bonding surface represents a surface of the base plate which is bonded with the circuit board, and the heat absorption window represents a region in the bonding surface corresponding to a heating element of the primary circuit area. The isolation sheet and the heat sink which need to be respectively installed are combined in the application, so that the number of parts is reduced, the material cost is reduced, the assembly process is simplified, and the production efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of electronic device structural design technology, and in particular to an isolation device and power supply device with heat dissipation function. Background Technology

[0002] With the rapid development of electronic technology, power supply devices play an increasingly important role in various electronic devices. To meet safety standards, power supply devices typically require electrical isolation between primary and secondary circuits to prevent high-voltage circuits from damaging low-voltage circuits. Simultaneously, power supply devices generate a significant amount of heat during operation, especially power devices in the primary circuit region, such as switching transistors and rectifier bridges, which generate substantial heat during high-frequency switching and current conversion. If this heat cannot be dissipated in time, the component temperatures will rise, affecting not only the efficiency and stability of the power supply device but also accelerating component aging and even posing safety hazards.

[0003] In existing technologies, isolation and heat dissipation are typically achieved by separate components. Isolation plates, generally made of plastic, are used to form a physical isolation barrier on the circuit board; while heat dissipation relies on separately installed heat sinks or fins. This separate design has several drawbacks: firstly, the need to install isolation plates and heat sinks separately increases assembly steps and labor costs; secondly, multiple independent components occupy more space, hindering the miniaturization and integration of power supply devices. Therefore, how to achieve efficient heat dissipation while meeting electrical isolation requirements, and simplify structural design, reduce manufacturing costs, and improve assembly efficiency, has become a pressing technical problem to be solved in the field of power supply device design. Utility Model Content

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes an isolation device and a power supply device with heat dissipation function, which integrates isolation and heat dissipation functions into one unit, simplifying the structure, reducing production costs, and improving assembly efficiency.

[0005] In a first aspect, embodiments of this application provide an isolation device with heat dissipation function.

[0006] An isolation device with heat dissipation function according to an embodiment of this application includes: an isolation component including an intersecting substrate and an isolation plate, the isolation plate being used to form physical isolation between a primary circuit region and a secondary circuit region of an external circuit board, wherein the circuit board has an isolation slot between the primary circuit region and the secondary circuit region, and the isolation plate passes through the isolation slot; a heat sink connected to the base, the heat sink being at least partially exposed to a heat absorption window in the bonding surface of the substrate; wherein the bonding surface represents the surface of the substrate that is bonded to the circuit board, and the heat absorption window represents the area in the bonding surface corresponding to the heat-generating element of the primary circuit region.

[0007] The heat dissipation-enabled isolation device according to the embodiments of this application has at least the following beneficial effects: The heat dissipation-enabled isolation device integrates the isolation component and the heat sink, achieving a unified electrical isolation and heat dissipation function. Specifically, the substrate and isolation plate of the isolation component are intersected to form a three-dimensional structure. The isolation plate passes through the isolation slots of the circuit board, effectively creating physical isolation between the primary circuit area and the secondary circuit area, meeting the safety standards for creepage distance and clearance. Simultaneously, the heat sink is connected to the substrate and at least partially exposed in the heat absorption window of the substrate's bonding surface, allowing the heat sink to directly contact the heat-generating components in the primary circuit area, achieving rapid heat conduction and dissipation. This integrated design combines the isolation plate and heat sink, which originally required separate installations, into one, reducing the number of parts, lowering material costs, simplifying assembly processes, and improving production efficiency.

[0008] According to some embodiments of this application, the heat sink is at least partially exposed to a heat dissipation window in the heat dissipation surface of the substrate; wherein the heat dissipation surface represents the opposite side of the bonding surface in the substrate, and the heat dissipation window represents the area of ​​the heat sink used for heat dissipation.

[0009] According to some embodiments of this application, the area of ​​the heat dissipation window is larger than the area of ​​the heat absorption window.

[0010] According to some embodiments of this application, the area where the substrate is connected to the heat sink is recessed towards the circuit board.

[0011] According to some embodiments of this application, the heat sink and the substrate are an integral injection-molded structure.

[0012] According to some embodiments of this application, the heat sink is provided with a retaining hole, which is filled with plastic during the injection molding process to secure the connection between the heat sink and the substrate.

[0013] According to some embodiments of this application, the bonding surface of the substrate is provided with at least two support structures, which abut against the circuit board.

[0014] According to some embodiments of this application, the bonding surface of the substrate is provided with at least one clearance groove, the shape of which is adapted to the shape of the component at the corresponding position on the circuit board.

[0015] According to some embodiments of this application, the shape of the substrate matches the shape of the circuit board, and the substrate is provided with at least one positioning structure, which is used to cooperate with the circuit board for positioning during assembly.

[0016] Secondly, embodiments of this application also provide a power supply device.

[0017] A power supply device according to an embodiment of this application includes: a circuit board having a primary circuit region and a secondary circuit region; an isolation device with heat dissipation function as described in any embodiment of the first aspect; wherein the isolation device with heat dissipation function is mounted on the circuit board, the isolation plate is located between the primary circuit region and the secondary circuit region, and the heat sink covers the heat-generating element in the primary circuit region. Attached Figure Description

[0018] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the isolation device with heat dissipation function in the embodiment and the circuit board in the embodiment when not assembled; Figure 2 This is a schematic diagram of the heat dissipation isolation device and the circuit board of the embodiment after assembly. Figure 3 This is a schematic diagram of an isolation device with heat dissipation function as an example. Figure 4 This is a schematic diagram of the structure of the isolation device with heat dissipation function in the embodiment from another perspective.

[0019] Figure label: Substrate 110; heat absorption window 111; support structure 112; clearance groove 113; isolation plate 120; heat sink 200; fixing hole 210; circuit board 300; isolation slot hole 310. Detailed Implementation

[0020] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0021] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0024] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0025] In a first aspect, embodiments of this application provide an isolation device with heat dissipation function. This device integrates isolation and heat dissipation functions into one unit, simplifying the structure, reducing production costs, and improving assembly efficiency.

[0026] An isolation device with heat dissipation function includes an isolation component and a heat sink 200. For example... Figure 1 and Figure 2As shown, the isolation assembly is an integral structure formed by the intersection and connection of a substrate 110 and an isolation plate 120. The isolation plate 120 is connected to the substrate 110 vertically or at a certain angle. During assembly, an isolation slot 310 is pre-formed on the circuit board 300, which is located between the primary circuit area and the secondary circuit area of ​​the circuit board 300. The design dimensions and shape of the isolation plate 120 allow it to be precisely inserted into the isolation slot 310, thereby forming a reliable physical barrier between the two electrical areas of the circuit board 300, meeting safety requirements.

[0027] The heat sink 200 is connected to the substrate 110. The heat sink 200 can be pre-placed in a mold, and then the substrate 110 is bonded to it through injection molding to form a single unit, i.e., a one-piece injection-molded heat sink. The heat sink 200 can be made of materials with high thermal conductivity, such as metal. Figure 3 As shown, the substrate 110 has one or more heat-absorbing windows 111. The surface of the substrate 110 facing and used for bonding the circuit board 300 is called the bonding surface. The heat-absorbing window 111 is an area formed on this bonding surface, allowing a portion of the heat sink 200 to be exposed. The heat-absorbing window 111 provides a space for the thermally conductive medium. In actual assembly, thermally conductive grease or thermally conductive silicone pads are usually filled between the heat-generating components and the heat sink 200 to fill microscopic gaps and exclude air. This heat-absorbing window provides a regular and controlled cavity for these thermally conductive media. This not only prevents the thermally conductive medium from overflowing under pressure and contaminating other areas of the circuit board 300, but also ensures that the thermally conductive medium forms a uniform layer with controllable thickness, thereby guaranteeing stable and reliable thermal conductivity and avoiding the problem of increased thermal resistance caused by uneven or excessively thick thermally conductive medium application. After assembly, the exposed portion of the heat sink 200 corresponds precisely to the main heat-generating components (such as power MOSFETs) in the primary circuit area of ​​the circuit board 300, and is in direct or indirect contact with them (e.g., through thermal grease), thereby efficiently absorbing the heat generated by these components. Through this design, heat can be rapidly conducted from the heat-generating components to the heat sink 200.

[0028] The isolation device with heat dissipation function in the embodiment integrates the isolation function and the heat dissipation function into one, which simplifies the structure, reduces production costs and improves assembly efficiency.

[0029] Furthermore, to ensure that the heat absorbed by the heat sink 200 can be dissipated to the external environment in a timely and effective manner, in some embodiments, the heat sink 200 not only exposes a heat-absorbing window 111 at the bonding surface of the substrate 110, but also exposes a heat-dissipating window at the heat-dissipating surface of the substrate 110. The heat-dissipating surface refers to the other surface of the substrate 110 opposite to the bonding surface, i.e., the side away from the circuit board 300. The heat sink 200 is at least partially exposed in the heat-dissipating window of this heat-dissipating surface, allowing the heat sink 200 to directly contact the outside air, or facilitating the installation of additional heat dissipation structures (such as heat sink fins, fans, etc.), thereby efficiently dissipating the absorbed heat to the environment. In some preferred embodiments, the area of ​​the heat-dissipating window is designed to be larger than the area of ​​the heat-absorbing window 111. This "small inlet, large outlet" design has significant technical advantages: on the one hand, the smaller heat absorption window 111 can be precisely aligned with the core heat-generating element, achieving precise and efficient heat absorption; on the other hand, the larger heat dissipation window exposes a larger area of ​​the heat sink 200, significantly increasing the contact area between the heat sink 200 and the external environment, thereby greatly improving the overall heat dissipation efficiency, ensuring that heat can be quickly dissipated, and effectively preventing heat accumulation inside the device. This design makes full use of both surfaces of the substrate 110, creating a complete and efficient channel for heat from absorption to dissipation.

[0030] In some embodiments, the area on the substrate 110 connected to the heat sink 200 forms a recessed structure, meaning that this area is recessed further towards the circuit board 300 relative to other parts of the substrate 110's bonding surface. By "recessing" the entire heat sink 200 area, the heat sink 200 can be closer to, or even directly contact, the heat-generating components on the circuit board 300, minimizing heat loss from the intermediate medium (such as air or thermally conductive adhesive), thereby improving the response speed and overall efficiency of heat dissipation performance. When using a one-piece injection molding process, this recessed geometry can mechanically act as a reinforcing rib, improving the mechanical strength and deformation resistance of the bonding area between the heat sink 200 and the substrate 110. Simultaneously, the recessed structure also facilitates the positioning of the heat sink 200 in the mold, making it less prone to displacement during injection molding, ensuring product consistency and yield.

[0031] Understandably, in some embodiments, the heat sink 200 and the substrate 110 are injection molded as a single unit. The heat sink 200 and the substrate 110 are not two separate components assembled together, but rather combined into a single, complete component through injection molding. For example, in actual manufacturing, a pre-manufactured metal heat sink 200 (typically made of aluminum, copper, or their alloys, materials with good thermal conductivity) is first precisely placed as an insert at a specific position in the injection mold; then, molten plastic (such as PC, PBT+GF, or other engineering plastics with good insulation and mechanical strength) is injected under high pressure into the mold cavity. The plastic material flows around the heat sink 200, fills, and solidifies, ultimately bonding firmly with the heat sink 200 to form a single, composite structural component that combines the heat dissipation characteristics of metal with the insulation / support characteristics of plastic. The one-piece injection molding structure simplifies the production process and improves efficiency. The production process, which originally required multiple steps (such as manufacturing the isolation component, manufacturing the heat sink 200, and assembly), can be completed in a single injection molding, greatly shortening the production cycle and reducing labor costs. It also improves product reliability and consistency. Because it is a one-piece molding, there are no gaps or loosening risks between the heat sink 200 and the substrate 110, which are inherent to traditional assembly methods (such as screws, clips, and adhesives). The connection is tighter and more reliable. Furthermore, the mold ensures a high degree of dimensional consistency for each product. To further enhance the bonding strength between the heat sink 200 and the substrate 110, which are made of different materials, and to prevent separation or loosening due to differences in thermal expansion and contraction or mechanical vibration, in some preferred embodiments, the heat sink 200 is provided with retaining holes 210. Figure 4 As shown, these retaining holes 210 are typically through-holes penetrating the heat sink 200 plate. During injection molding, when molten plastic is injected into the mold, it not only covers the edges of the heat sink 200 but also flows through and fills these retaining holes 210. After the plastic cools and solidifies, multiple "plastic rivets" or "pins" are formed in the holes of the heat sink 200. The plastic filling the retaining holes 210 forms a mechanical interlock on two (or more) sides of the heat sink 200, greatly increasing the bonding force between the plastic and the metal parts in the direction perpendicular to the contact surface. Even under harsh conditions of long-term temperature cycling or external impact, it can ensure that the heat sink 200 will not detach from the substrate 110, thereby ensuring the long-term structural stability and functional reliability of the entire isolation device.

[0032] In some embodiments, to ensure a precise and uniform gap between the substrate 110 and the circuit board 300, at least two support structures 112 are integrally injection molded on the bonding surface of the substrate 110. For example... Figure 3As shown, the height of these support structures 112 is precisely designed so that, when the heat dissipation device in the embodiment is installed on the circuit board 300, their ends abut against the surface of the circuit board 300, thereby forming a preset, stable support gap between the substrate 110 and the circuit board 300. This gap serves multiple functions: firstly, it provides necessary safety space for components below the substrate 110, preventing the substrate 110 from directly pressing on these components; secondly, the gap also forms an airflow channel, facilitating convective heat dissipation for the components; and finally, it ensures that the entire isolation device is placed on the circuit board 300 in a stable, parallel posture, avoiding warping or stress concentration that may result from unevenness of the circuit board 300 or inconsistent component heights.

[0033] Considering the complexity of the component layout on the circuit board 300, especially the presence of some tall components (such as electrolytic capacitors, vertical components, etc.), to avoid physical interference during installation, in some embodiments, at least one clearance groove 113 is also provided on the bonding surface of the substrate 110. For example, as... Figure 3 As shown, these clearance slots 113 can be localized recessed areas on the substrate 110, and their position, shape, and depth are carefully designed to perfectly match the outlines of the taller components at corresponding positions on the circuit board 300. When the isolation device is installed, these taller components are perfectly accommodated in the corresponding clearance slots 113, thus achieving perfect structural compatibility. This ensures that the device can be installed smoothly while maximizing space utilization and making the overall structure more compact.

[0034] To simplify the assembly process and ensure accurate positioning in every installation, in some embodiments, the substrate 110 is further provided with one or more positioning structures. These positioning structures can take various forms; for example, they can be positioning posts extending from the substrate 110 that mate with positioning holes on the circuit board 300; or positioning holes formed on the substrate 110 that mate with positioning pins extending from the circuit board 300. During assembly, workers only need to align and insert the positioning structure of the isolation device with the corresponding structure on the circuit board 300 to achieve quick and accurate positioning without repeated adjustments.

[0035] Secondly, embodiments of this application provide a power supply device.

[0036] The power supply device in the embodiment may be, but is not limited to, a power adapter, charger, switching power supply module, etc. The power supply device in the embodiment includes a circuit board 300 and an isolation device with heat dissipation function according to any embodiment of the first aspect. According to safety standards and circuit design requirements, the circuit board 300 is divided into a primary circuit area and a secondary circuit area. The primary circuit area is typically connected to a high-voltage input terminal such as AC mains power and includes components such as power switching transistors and the primary winding of a transformer; the secondary circuit area is connected to the load terminal and provides a low-voltage output. In this embodiment, a heat dissipation isolation device is installed on the circuit board 300. After assembly, the isolation plate 120 of the heat dissipation isolation device is precisely inserted into the pre-set isolation slot 310 on the circuit board 300, physically separating the primary circuit area from the secondary circuit area, forming a robust insulating barrier that meets the safety requirements for creepage distance and clearance. The substrate 110 of the isolation device covers the circuit board 300, and the heat sink 200 on it is precisely aligned with and covers one or more major heat-generating components (such as MOSFET power transistors) in the primary circuit area through the heat absorption window 111. When the power supply is working, the huge amount of heat generated by these heat-generating components is efficiently conducted to the heat sink 200 through the thermally conductive medium (such as thermal grease). Subsequently, the heat is quickly dissipated to the external environment (such as air or casing) of the power supply through the heat dissipation window exposed on the heat dissipation surface of the substrate 110. By applying the heat dissipation isolation device of any embodiment of the first aspect to the power supply device of the embodiment, the power supply device of the embodiment becomes more compact and integrated in structure, reducing the number of internal parts and assembly steps.

[0037] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. An isolation device with heat dissipation function, characterized in that, include: An isolation assembly includes an intersecting substrate (110) and an isolation plate (120), the isolation plate (120) being used to form physical isolation between a primary circuit region and a secondary circuit region of an external circuit board (300), wherein the circuit board (300) has an isolation slot (310) between the primary circuit region and the secondary circuit region, and the isolation plate (120) passes through the isolation slot (310). A heat sink (200) is connected to the substrate (110), and the heat sink (200) is at least partially exposed to a heat-absorbing window (111) in the bonding surface of the substrate (110); wherein the bonding surface represents the surface of the substrate (110) that is bonded to the circuit board (300), and the heat-absorbing window (111) represents the area in the bonding surface corresponding to the heat-generating element of the primary circuit region.

2. The isolation device with heat dissipation function according to claim 1, characterized in that, The heat sink (200) is at least partially exposed to a heat dissipation window in the heat dissipation surface of the substrate (110); wherein the heat dissipation surface represents the opposite side of the bonding surface in the substrate (110), and the heat dissipation window represents the area of ​​the heat sink (200) used for heat dissipation.

3. The isolation device with heat dissipation function according to claim 2, characterized in that, The area of ​​the heat dissipation window is larger than the area of ​​the heat absorption window (111).

4. The isolation device with heat dissipation function according to claim 1, characterized in that, The area where the substrate (110) is connected to the heat sink (200) is recessed toward the circuit board (300).

5. The isolation device with heat dissipation function according to claim 1, characterized in that, The heat sink (200) and the substrate (110) are an integral injection-molded structure.

6. The isolation device with heat dissipation function according to claim 5, characterized in that, The heat sink (200) is provided with a retaining hole (210), which is filled with plastic during the injection molding process to secure the connection between the heat sink (200) and the substrate (110).

7. The isolation device with heat dissipation function according to any one of claims 1-6, characterized in that, The substrate (110) has at least two support structures (112) protruding from its bonding surface, and the support structures (112) abut against the circuit board (300).

8. The isolation device with heat dissipation function according to any one of claims 1-6, characterized in that, The bonding surface of the substrate (110) is provided with at least one clearance groove (113), and the shape of the clearance groove (113) is adapted to the shape of the component at the corresponding position on the circuit board (300).

9. The isolation device with heat dissipation function according to any one of claims 1-6, characterized in that, The shape of the substrate (110) matches the shape of the circuit board (300), and the substrate (110) is provided with at least one positioning structure, which is used to cooperate with the circuit board (300) for positioning during assembly.

10. A power supply device, characterized in that, include: A circuit board has a primary circuit area and a secondary circuit area; The isolation device with heat dissipation function as described in any one of claims 1 to 9; The isolation device with heat dissipation function is installed on the circuit board, the isolation plate is located between the primary circuit area and the secondary circuit area, and the heat sink covers the heat-generating element in the primary circuit area.

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