An air-cooled domain controller with increased heat dissipation efficiency

Abstract

The utility model provides a kind of air-cooled field controller of increasing heat dissipation efficiency, including shell, and there is accommodating space in shell;First radiating fin group and second radiating fin group, first radiating fin group and second radiating fin group are located in accommodating space;Fan assembly, fan assembly is located in accommodating space, and fan assembly is between first radiating fin group and second radiating fin group;First radiating fin group and second radiating fin group are oppositely arranged.The utility model solves the problem of low heat dissipation efficiency of air-cooled field controller in prior art.

Description

Technical Field

[0001] This utility model relates to the field of domain controller heat dissipation technology, and more specifically, to an air-cooled domain controller that increases heat dissipation efficiency. Background Technology

[0002] With the rapid development of the intelligent driving industry, the demand for intelligent driving products is increasing, leading to the diversification of in-vehicle functions, continuous improvement in the performance of in-vehicle electronic devices, and the increasing popularity of high-performance and convenient features. While pursuing diversified in-vehicle functions, higher requirements are also placed on intelligent driving computing systems, resulting in higher energy consumption for highly integrated and high-computing intelligent driving domain controllers, which in turn places higher demands on the heat dissipation of core processing chips.

[0003] In existing technologies, there are three heat dissipation methods for air-cooled domain controllers: side-blowing fans with air inlets and outlets on the left and right; heat pipes for heat dissipation; and down-draft fans with the heat source located below the fan. However, side-blowing fans require three-dimensional assembly, which limits fan size and increases the overall height and weight of the product. The embedding process of the heat pipes also increases manufacturing costs. Down-draft fans have relatively low airflow directly below them, resulting in poor heat dissipation. Therefore, all of the above solutions suffer from high cost and low heat dissipation efficiency. Utility Model Content

[0004] The problem solved by this invention is the low heat dissipation efficiency of existing air-cooled domain controllers.

[0005] To address the aforementioned problems, this utility model provides an air-cooled zone controller for increasing heat dissipation efficiency, comprising a housing, a first heat dissipation fin group, a second heat dissipation fin group, and a fan assembly. The housing contains a receiving space; both the first and second heat dissipation fin groups are located within this receiving space; the fan assembly is located within the receiving space, situated between the first and second heat dissipation fin groups; the first and second heat dissipation fin groups are arranged opposite to each other.

[0006] Compared to existing technologies, the technical effects achieved by this solution are as follows: The housing forms a accommodating space, providing a mounting platform for the first heat dissipation fin group, the second heat dissipation fin group, and the fan assembly, thus protecting the internal components. The first and second fin groups can dissipate heat from different heat-generating areas or components within the housing, increasing the overall heat dissipation area and improving heat dissipation efficiency. Furthermore, it can separate heat-generating components, reducing the risk of mutual interference. The fan assembly is located between the first and second heat dissipation fin groups. When the fan assembly is running, cooler air is drawn into the housing from the outside and flows towards the first and second heat dissipation fin groups, carrying away heat from the fin groups, thereby completing heat dissipation.

[0007] Furthermore, the housing is also provided with air vents, which are located within the projection of the fan assembly on the housing.

[0008] Compared with the prior art, the technical effect achieved by this technical solution is as follows: Since the fan assembly is set between the first heat dissipation fin group and the second heat dissipation fin group, and the air flow path passes through the heat dissipation fin group, the installation position of the fan assembly will be close to the bottom of the housing. By opening the air hole in the projection of the fan assembly on the housing, the wind pressure near the bottom of the housing can be reduced, thereby increasing the air volume flowing through the first heat dissipation fin group and the second heat dissipation fin group.

[0009] Furthermore, an air duct is provided on the housing, and the air duct is located near the side of the first heat dissipation fin group and / or the second heat dissipation fin group away from the fan assembly.

[0010] Compared with the existing technology, the technical effect achieved by this technical solution is: it can provide a smooth exhaust channel for hot air after heat exchange through the fin group, so that the hot air can be quickly discharged to the outside of the shell through the air duct under the action of the fan assembly, reducing the retention of hot air in the shell, enhancing the air flow efficiency in the shell, and allowing low temperature air to continuously flow through the fin group to absorb heat and be discharged in time, further improving the heat dissipation effect of the first heat dissipation fin group and the second heat dissipation fin group.

[0011] Furthermore, the domain controller provided by this utility model also includes a bottom cover, on which a first mounting part is provided; a second mounting part is also provided on the housing, and the first mounting part and the second mounting part cooperate through a connector; and a circuit board, which is disposed between the bottom cover and the housing.

[0012] Compared with the existing technology, the technical effect achieved by this technical solution is as follows: the bottom cover and the housing are stably connected by the connecting parts of the first mounting part and the second mounting part, forming a closed protective space, which provides reliable protection for the internal circuit board and prevents external dust, water vapor and other substances from entering and affecting the operation of the equipment. The circuit board is close to the heat dissipation fins on the housing, which facilitates the heat on the circuit board to be transferred to the heat dissipation fins through heat conduction or air convection for dissipation, thereby improving the targeting and efficiency of heat dissipation.

[0013] Furthermore, a power consumption chip is provided on the circuit board, and the power consumption chip is located within the projection of the first heat dissipation fin group and / or the second heat dissipation fin group on the circuit board.

[0014] Compared to existing technologies, the technical effects achieved by this solution are as follows: The power consumption chip is the main heat source on the circuit board. Placing it within the projection of the first and / or second heat dissipation fin groups on the circuit board can shorten the distance between the power consumption chip and the heat dissipation fin groups, allowing the heat generated by the chip to be transferred more directly and quickly to the first and / or second heat dissipation fin groups. This layout allows the heat dissipation fin groups to specifically dissipate heat from the high-heat power consumption chip, improving heat dissipation efficiency, preventing the chip from affecting its working performance due to excessive temperature, and ensuring the stable operation of the domain controller.

[0015] Furthermore, the side of the housing is provided with snap-fit ​​positions, which are used to help the edges of the housing fit the contours of the components on the circuit board.

[0016] Compared to existing technologies, this technical solution achieves the following effects: the snap-fit ​​design helps the housing edge conform to the contours of components on the circuit board, reducing the gap between the housing and the circuit board, resulting in a tighter connection and improved overall structural stability. Simultaneously, this fitting design prevents interference or collision between the housing edge and components on the circuit board, protecting the components from damage. Furthermore, the housing provides a certain degree of restraint on the components on the circuit board, preventing displacement under vibration or other conditions, ensuring the reliability of the circuit connection, and extending the equipment's lifespan.

[0017] Furthermore, a support member is provided on the side of the first heat dissipation fin group and / or the second heat dissipation fin group near the fan assembly, and the support member extends toward the air vent side; the farthest end of the support member is located within the projection of the fan assembly on the housing; the support member abuts against the fan assembly.

[0018] Compared with the existing technology, the technical effect achieved by this technical solution is that the support extends towards the air hole and abuts against the fan assembly, which can provide stable support and fixation for the fan assembly, prevent the fan assembly from shifting or loosening due to vibration during operation, and ensure the working stability of the fan assembly.

[0019] Furthermore, the air-cooled domain controller with increased heat dissipation efficiency provided by this utility model also includes a cover plate, on which a first mounting position and an air inlet window are provided. The air inlet window is used to circulate external air drawn in by the fan assembly. A second mounting position is provided on the housing. A connector cooperates with the first mounting position and the second mounting position.

[0020] Compared with existing technologies, the technical effects achieved by this technical solution are as follows: the cover plate is stably connected to the housing through the connector and the mounting position of the housing, which can seal the housing's containment space and form a complete protective structure, further blocking external dust and impurities from entering the interior, protecting core components such as heat dissipation fins, fan assembly and circuit board. At the same time, the air intake window on the cover plate allows external air to enter the housing, ensuring the heat dissipation effect of the fan assembly.

[0021] Furthermore, the cover plate is provided with a limiting component; the fan assembly is provided with a limiting groove, the limiting groove and the limiting component are correspondingly set, and the limiting component and the limiting groove cooperate with each other.

[0022] Compared with existing technologies, the technical effects achieved by this solution are as follows: the corresponding cooperation between the limiting component and the limiting groove can accurately position and fix the fan assembly, ensuring that the fan assembly is in the preset position during installation, effectively suppressing the vibration of the fan assembly during operation, reducing noise and component wear caused by vibration, improving the stability and service life of the fan assembly, and enhancing the structural correlation between the cover plate and the fan assembly, making the overall assembly more robust.

[0023] Furthermore, the housing is integrally formed with the first heat dissipation fin group and / or the second heat dissipation fin group.

[0024] Compared with existing technologies, the technical effects achieved by this solution are as follows: the shell and the heat dissipation fin assembly are integrally formed, eliminating the connection gap between the two and significantly improving the heat conduction efficiency. At the same time, the integrally formed structure simplifies the production and assembly process, reduces the number of parts and assembly steps, lowers production costs, and enhances the strength and stability of the overall structure, avoiding the decline in heat dissipation performance caused by loose connection between the heat dissipation fin assembly and the shell.

[0025] In summary, the air-cooled domain controller with increased heat dissipation efficiency provided by this utility model has the following advantages: the fan assembly is positioned between the first and second heat dissipation fin groups, and the power consumption chip is positioned within the projection range of the first and second heat dissipation fin groups on the circuit board, so that the power consumption chip is offset relative to the fan assembly, reducing the risk of mutual interference and making the heat dissipation of the entire board more uniform; the first and second heat dissipation fin groups can increase the heat dissipation area and improve the overall heat dissipation efficiency of the domain controller; the air vents are positioned within the projection of the fan assembly on the housing, reducing wind resistance and further optimizing the heat dissipation efficiency of the fan assembly. Attached Figure Description

[0026] Figure 1 The overall structural diagram of an air-cooled domain controller that increases heat dissipation efficiency is provided by this utility model; Figure 2 An exploded view of an air-cooled zone controller for increasing heat dissipation efficiency provided by this utility model; Figure 3 This is a diagram of the overall structure of the shell.

[0027] Explanation of reference numerals in the attached figures: 100 - Housing; 110 - First heat sink fin assembly; 120 - Second heat sink fin assembly; 121 - Support; 130 - Fan assembly; 131 - Air vent; 132 - Air duct; 140 - Snap-fit ​​position; 200 - Bottom cover; 210 - First mounting part; 220 - Connector; 230 - Circuit board; 231 - Power consumption chip; 300 - Cover plate; 310 - First mounting position. Detailed Implementation

[0028] The purpose of this invention is to provide an air-cooled domain controller that increases heat dissipation efficiency, thereby achieving the effect of increasing the heat dissipation efficiency of the air-cooled domain controller.

[0029] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0030] See Figures 1-3 This utility model provides an air-cooled zone controller for increasing heat dissipation efficiency, including a housing 100, a first heat dissipation fin group 110, a second heat dissipation fin group 120, and a fan assembly 130. The housing 100 contains a receiving space; both the first heat dissipation fin group 110 and the second heat dissipation fin group 120 are disposed within the receiving space; the fan assembly 130 is disposed within the receiving space and is located between the first heat dissipation fin group 110 and the second heat dissipation fin group 120; the first heat dissipation fin group 110 and the second heat dissipation fin group 120 are arranged opposite to each other.

[0031] Specifically, in this embodiment, the area covered by the first heat dissipation fin group 110 is larger than the area covered by the second heat dissipation fin group 120. If applied to a domain controller other than this embodiment, the size of the first heat dissipation fin group 110 and the second heat dissipation fin group 120 can be appropriately adjusted based on the size of the internal storage space of the domain controller housing 100.

[0032] Specifically, the first heat dissipation fin group 110 and the second heat dissipation fin group 120 are provided with a flow guiding structure on the side near the fan assembly 130. The flow guiding structure is used to guide the airflow to the fin group and reduce wind resistance.

[0033] The housing 100 forms an accommodating space, providing a mounting carrier for the first heat dissipation fin group 110, the second heat dissipation fin group 120, and the fan assembly 130, thus protecting the internal components. The first and second fin groups can dissipate heat to different heat-generating areas or components within the housing 100, increasing the overall heat dissipation area and improving heat dissipation efficiency. The fan assembly 130 is located between the first heat dissipation fin group 110 and the second heat dissipation fin group 120. When the fan assembly 130 is running, cooler air can be drawn into the housing 100 from the outside and then flow towards the first heat dissipation fin group 110 and the second heat dissipation fin group 120, carrying away the heat from the fin groups, thereby completing heat dissipation.

[0034] The housing 100 is also provided with a vent 131, which is located within the projection of the fan assembly 130 on the housing 100.

[0035] See Figure 3 Specifically, in this embodiment, three air holes 131 are provided on the housing 100, and the air holes 131 are waist-shaped holes.

[0036] Since the fan assembly 130 is located between the first heat dissipation fin group 110 and the second heat dissipation fin group 120, and the airflow path passes through the heat dissipation fin group, the installation position of the fan assembly 130 will be close to the bottom of the housing 100. By opening the air hole 131 in the projection of the fan assembly 130 on the housing 100, the wind pressure near the bottom of the housing 100 can be reduced, thereby increasing the airflow through the first heat dissipation fin group 110 and the second heat dissipation fin group 120.

[0037] The housing 100 has an air duct 132, which is located near the side of the first heat dissipation fin group 110 and / or the second heat dissipation fin group 120 away from the fan assembly 130.

[0038] Specifically, in this embodiment, air ducts 132 are provided on the sides of both the first heat dissipation fin group 110 and the second heat dissipation fin group 120.

[0039] It can provide a smooth exhaust channel for hot air after heat exchange through the fin assembly, so that the hot air can be quickly discharged to the outside of the housing 100 through the air duct 132 under the action of the fan assembly 130, reducing the retention of hot air in the housing 100, enhancing the air flow efficiency in the housing 100, and allowing low temperature air to continuously flow through the fin assembly to absorb heat and be discharged in time, further improving the heat dissipation effect of the first heat dissipation fin assembly 110 and the second heat dissipation fin assembly 120.

[0040] See Figure 2The domain controller provided by this utility model also includes a bottom cover 200, on which a first mounting part 210 is provided; a second mounting part is also provided on the housing 100, and the first mounting part 210 and the second mounting part cooperate through a connector 220; and a circuit board 230, which is disposed between the bottom cover 200 and the housing 100.

[0041] Specifically, the first mounting part 210 is a boss with a screw hole, and the second mounting part is a screw hole provided in the housing 100 corresponding to the position of the first mounting part 210.

[0042] Specifically, connector 220 is a screw.

[0043] The bottom cover 200 and the housing 100 are securely connected by the first mounting part 210 and the connector 220 of the second mounting part, forming a closed protective space to provide reliable protection for the internal circuit board 230 and prevent external dust, moisture and other substances from entering and affecting the operation of the equipment. The circuit board 230 is close to the heat dissipation fins on the housing 100, which facilitates the transfer of heat on the circuit board 230 to the heat dissipation fins through heat conduction or air convection, thereby improving the targeting and efficiency of heat dissipation.

[0044] Specifically, the first heat sink fin group 110 and the second heat sink fin group 120 are provided with heat-conducting protrusions on the side near the circuit board 230. The heat-conducting protrusions protrude towards the power consumption chip 231 and can conduct the heat of the power consumption chip 231 to the first heat sink fin group 110 and the second heat sink fin group 120 in a timely manner, thereby accelerating the heat dissipation efficiency of the domain controller.

[0045] The circuit board 230 is provided with a power consumption chip 231, which is located within the projection of the first heat dissipation fin group 110 and / or the second heat dissipation fin group 120 on the circuit board 230.

[0046] The power consumption chip 231 is the main heat source on the circuit board 230. Placing it within the projection of the first heat sink fin group 110 and / or the second heat sink fin group 120 on the circuit board 230 can shorten the distance between the power consumption chip 231 and the heat sink fin group, allowing the heat generated by the chip to be transferred more directly and quickly to the first heat sink fin group 110 and / or the second heat sink fin group 120. This layout allows the heat sink fin group to specifically dissipate heat from the power consumption chip 231, improving heat dissipation efficiency, preventing the chip from affecting its working performance due to excessive temperature, and ensuring the stable operation of the domain controller.

[0047] The housing 100 is also provided with a snap-fit ​​position 140 on the side, which is used to help the edge of the housing 100 fit the outline of the components on the circuit board 230.

[0048] The snap-fit ​​140 helps the edge of the housing 100 conform to the contours of the components on the circuit board 230, reducing the gap between the housing 100 and the circuit board 230, making the connection tighter and improving the overall structural stability. At the same time, this conformal design prevents interference or collision between the edge of the housing 100 and the components on the circuit board 230, protecting the components from damage. The housing 100 also provides a certain degree of restraint on the components on the circuit board 230, preventing displacement of the components under vibration or other conditions, ensuring the reliability of the circuit connection, and extending the service life of the equipment.

[0049] The first heat dissipation fin group 110 and / or the second heat dissipation fin group 120 are provided with a support member 121 on the side near the fan assembly 130. The support member 121 extends toward the air vent 131. The farthest end of the support member 121 is located within the projection of the fan assembly 130 on the housing 100. The support member 121 abuts against the fan assembly 130.

[0050] In this embodiment, the support member 121 extends along the inner wall of the housing 100 toward the air hole 131, which ensures that the center part of the projection of the fan assembly 130 is not blocked by any part, thus ensuring the efficiency of airflow inside the housing 100.

[0051] The support member 121 extends toward the air vent 131 and abuts against the fan assembly 130, which can provide stable support and fixation for the fan assembly 130, prevent the fan assembly 130 from shifting or loosening due to vibration during operation, and ensure the working stability of the fan assembly 130.

[0052] The domain controller provided by this utility model also includes a cover plate 300, on which a first mounting position 310 and an air inlet window are provided. The air inlet window is used to circulate the external air drawn in by the fan assembly 130. A second mounting position is provided on the housing 100. A connector 220 cooperates with the first mounting position 310 and the second mounting position.

[0053] Specifically, the first mounting position 310 and the second mounting position are screw holes.

[0054] The cover plate 300 encloses the housing 100's space and further increases the airtightness of the air duct 132, enabling the air duct 132 to concentrate airflow and optimize heat dissipation.

[0055] The cover plate 300 is securely connected to the mounting position of the housing 100 through the connector 220, which can seal the housing 100's containment space and form a complete protective structure. This further prevents external dust and impurities from entering the interior, protecting core components such as the heat sink fin assembly, fan assembly 130, and circuit board 230. At the same time, the air intake window on the cover plate 300 allows external air to enter the housing, ensuring the heat dissipation effect of the fan assembly 130.

[0056] The cover plate 300 is provided with a limiting component; the fan assembly 130 is provided with a limiting groove, the limiting groove and the limiting component are correspondingly set, and the limiting component and the limiting groove cooperate.

[0057] Specifically, the limiting member is a boss that protrudes from the cover plate 300 toward the fan assembly 130.

[0058] The corresponding fit between the limiting component and the limiting groove can accurately position and fix the fan assembly 130, ensuring that the fan assembly 130 is in the preset position during installation. This effectively suppresses the vibration of the fan assembly 130 during operation, reduces noise and component wear caused by vibration, improves the stability and service life of the fan assembly 130, and enhances the structural correlation between the cover plate 300 and the fan assembly 130, making the overall assembly more robust.

[0059] The housing 100 is integrally formed with the first heat dissipation fin group 110 and / or the second heat dissipation fin group 120.

[0060] The housing 100 and the heat dissipation fin assembly are integrally formed, eliminating the connection gap between the two and significantly improving the heat conduction efficiency. At the same time, the integrally formed structure simplifies the production and assembly process, reduces the number of parts and assembly steps, lowers production costs, and enhances the strength and stability of the overall structure, avoiding the decline in heat dissipation performance caused by loose connection between the heat dissipation fin assembly and the housing 100.

[0061] In summary, the air-cooled domain controller with increased heat dissipation efficiency provided by this utility model has the following advantages: the fan assembly 130 is disposed between the first heat dissipation fin group 110 and the second heat dissipation fin group 120, and the power consumption chip 231 is disposed within the projection range of the first heat dissipation fin group 110 and the second heat dissipation fin group 120 on the circuit board 230, so that the power consumption chip 231 is offset relative to the fan assembly 130, reducing the risk of mutual interference and making the heat dissipation more uniform; the first heat dissipation fin group 110 and the second heat dissipation fin group 120 can increase the heat dissipation area and improve the overall heat dissipation efficiency of the domain controller; the vent 131 is disposed within the projection of the fan assembly 130 on the housing 100, reducing wind resistance and further optimizing the heat dissipation efficiency of the fan assembly 130.

[0062] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A wind-cooled zone controller for increasing heat dissipation efficiency, characterized in that, include: A housing, wherein there is a receiving space within the housing; The first heat dissipation fin group and the second heat dissipation fin group are both disposed within the accommodating space. A fan assembly is disposed within the receiving space and is located between the first heat dissipation fin group and the second heat dissipation fin group; The first heat dissipation fin group and the second heat dissipation fin group are arranged opposite to each other.

2. The air-cooled zone controller for increasing heat dissipation efficiency according to claim 1, characterized in that, The housing is also provided with air vents, which are located within the projection of the fan assembly on the housing.

3. The air-cooled zone controller for increasing heat dissipation efficiency according to claim 2, characterized in that, The housing has an air duct, which is located near the side of the first heat dissipation fin group and / or the second heat dissipation fin group away from the fan assembly.

4. The air-cooled zone controller for increasing heat dissipation efficiency as described in claim 3, characterized in that, Also includes: The bottom cover has a first mounting part. The housing is also provided with a second mounting part, and the first mounting part and the second mounting part are connected by a connector. A circuit board is disposed between the bottom cover and the housing.

5. The air-cooled zone controller for increasing heat dissipation efficiency according to claim 4, characterized in that, The circuit board is equipped with a power consumption chip, which is located within the projection of the first heat dissipation fin group and / or the second heat dissipation fin group on the circuit board.

6. The air-cooled zone controller for increasing heat dissipation efficiency according to claim 5, characterized in that, The side of the housing is also provided with a snap-fit ​​position, which is used to help the edge of the housing fit the outline of the components on the circuit board.

7. The air-cooled zone controller for increasing heat dissipation efficiency according to claim 4, characterized in that, The first heat dissipation fin group and / or the second heat dissipation fin group are provided with a support member on the side near the fan assembly, and the support member extends toward the air vent side; The farthest end of the support member is located within the projection of the fan assembly onto the housing; The support member abuts against the fan assembly.

8. The air-cooled zone controller for increasing heat dissipation efficiency according to claim 7, characterized in that, The air-cooled zone controller for increasing heat dissipation efficiency also includes a cover plate, which has a first mounting position and an air inlet window, the air inlet window being used to circulate external air drawn in by the fan assembly; The housing is provided with a second mounting position; The connector mates with the first mounting position and the second mounting position.

9. The air-cooled zone controller for increasing heat dissipation efficiency according to claim 8, characterized in that, The cover plate is equipped with a limiting component; The fan assembly is provided with a limiting groove, the limiting groove is correspondingly provided with the limiting member, and the limiting member cooperates with the limiting groove.

10. The air-cooled domain controller for increasing heat dissipation efficiency according to any one of claims 1 to 9, characterized in that, The housing is integrally formed with the first heat dissipation fin group and / or the second heat dissipation fin group.

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