3D heat dissipation module

Abstract

The utility model discloses a 3D radiating module, its characterized in that: including radiating base plate, connecting apron, radiating tooth piece, wherein connecting apron set up in the top surface of radiating base plate, the radiating base plate has cooling medium containing cavity, the number of radiating tooth piece is multiple, and regularly arranged set up on connecting apron, connecting apron has the insertion hole, the bottom of radiating tooth piece has the plug connector with insertion hole corresponds, the radiating tooth piece has cooling medium radiating flow channel, cooling medium radiating flow channel with cooling medium containing cavity are communicated through the inner hole of plug connector. The utility model has the beneficial effects of including: simple structure, and the manufacturing difficulty is reduced to the integrated reduction of multiple components welding, and the stable connection has the radiating medium flow radiating of 3D space, and the radiating performance is improved significantly.

Description

Technical Field

[0001] This utility model relates to the field of heat sinks, specifically to a 3D heat dissipation module. Background Technology

[0002] Currently, as electronic devices develop towards higher performance and greater integration, the requirements for heat dissipation are also increasing. Traditional finned heat sinks mainly consist of a substrate and multiple fins arranged on the substrate. Heat-generating electronic components conduct heat to the substrate, which is then dissipated through the thin fins to increase the contact area between the heat sink and the air. However, this type of heat sink has significant limitations. Heat is conducted from the substrate to the fins before being dissipated. The thermal conductivity of both the substrate and the fins is limited by the materials, resulting in poor heat dissipation and a tendency for localized overheating. Some heat sinks with heat dissipation media simply have a flowable cooling medium on the heat dissipation substrate, which solves some of the problem of localized heat accumulation, but has little effect on heat conduction to the heat dissipation fins. Summary of the Invention

[0003] To address the shortcomings of the existing technology, this utility model provides a 3D heat dissipation module in which the cooling medium can flow and exchange heat on the heat dissipation fins, thereby improving the heat dissipation effect.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A 3D heat dissipation module, characterized in that it includes a heat dissipation substrate, a connecting cover plate, and heat dissipation fins, wherein the connecting cover plate is disposed on the top surface of the heat dissipation substrate, the heat dissipation substrate has a cooling medium receiving cavity, the number of heat dissipation fins is multiple and regularly arranged on the connecting cover plate, the connecting cover plate has a plug hole, the bottom of the heat dissipation fin has a plug corresponding to the plug hole, the heat dissipation fin has a cooling medium heat dissipation channel, and the cooling medium heat dissipation channel communicates with the cooling medium receiving cavity through the inner hole of the plug.

[0006] Furthermore, the top surface of the connecting cover is provided with a liquid injection sleeve, which is used to connect to the liquid injection pipe to inject cooling medium into the cooling medium receiving cavity. After the liquid injection is completed, the liquid injection sleeve is sealed by laser welding.

[0007] Furthermore, the insertion hole has an upwardly protruding flange, and the heat dissipation fin has a slot corresponding to the flange.

[0008] Furthermore, the cooling medium receiving cavity has multiple spaced support platforms, all of which are of equal height and in contact with the bottom surface of the connecting cover plate.

[0009] The advantages of this utility model include: simple structure, multiple components welded together to reduce manufacturing difficulty, stable connection, and heat dissipation through 3D spatial heat dissipation medium flow, which significantly improves heat dissipation performance. Attached Figure Description

[0010] Figure 1 This is an exploded structural diagram of the present invention;

[0011] Figure 2 This is a cross-sectional view of the present invention. Detailed Implementation

[0012] The present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0013] One such Figure 1-2 The 3D heat dissipation module shown includes a heat dissipation substrate 1, a connecting cover plate 2, and heat dissipation fins 3, wherein the connecting cover plate 2 is disposed on the top surface of the heat dissipation substrate 1. Multiple heat dissipation fins 3 are arranged regularly on the connecting cover plate 2. The connecting cover plate 2 has insertion holes 5, and the bottom of each heat dissipation fin 3 has a connector 6 corresponding to the insertion hole 5. The heat dissipation substrate 1 and the heat dissipation fins 3 are welded together via the connecting cover plate 2 using a brazing method.

[0014] To improve connection strength and welding stability, the insertion hole 5 in this embodiment has an upwardly protruding flange, and the heat dissipation fin 3 has a groove corresponding to the flange, thereby increasing the contact area between the heat dissipation fin 3 and the connecting cover plate 2.

[0015] To improve heat dissipation performance and achieve 3D flow heat dissipation, the heat dissipation substrate 1 in this embodiment has a cooling medium receiving cavity 4. The cooling medium receiving cavity 4 has multiple spaced-apart support platforms 9, all of equal height, and all in contact with the bottom surface of the connecting cover plate 2. This ensures good support from the connecting cover plate 2 while also guaranteeing horizontal flow of the cooling medium. The heat dissipation fins 3 have cooling medium heat dissipation channels 7. The cooling medium exchanges heat with the air within the heat dissipation fins 3 to achieve condensation and reflux. The cooling medium heat dissipation channels 7 are connected to the cooling medium receiving cavity 4 through the inner hole of the connector 6.

[0016] To facilitate the welding and installation of the 3D heat dissipation module, the cooling medium is injected after welding. Specifically, an injection sleeve 8 is provided on the top surface of the connecting cover plate 2. The injection sleeve 8 is used to connect the injection pipe 10 to inject the cooling medium into the cooling medium receiving cavity 4. After the injection is completed, the injection pipe 10 is removed and the injection sleeve 8 is sealed by laser welding.

[0017] The technical solutions provided by the embodiments of this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the embodiments of this utility model. The description of the above embodiments is only for helping to understand the principles of the embodiments of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the embodiments of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A 3D heat dissipation module, characterized in that: The device includes a heat dissipation substrate (1), a connecting cover plate (2), and heat dissipation fins (3). The connecting cover plate (2) is disposed on the top surface of the heat dissipation substrate (1). The heat dissipation substrate (1) has a cooling medium receiving cavity (4). There are multiple heat dissipation fins (3) arranged regularly on the connecting cover plate (2). The connecting cover plate (2) has a plug hole (5). The bottom of the heat dissipation fins (3) has a plug connector (6) corresponding to the plug hole (5). The heat dissipation fins (3) have a cooling medium heat dissipation channel (7). The cooling medium heat dissipation channel (7) is connected to the cooling medium receiving cavity (4) through the inner hole of the plug connector (6).

2. The 3D heat dissipation module according to claim 1, characterized in that: The top surface of the connecting cover plate (2) is provided with a liquid injection sleeve (8), which is used to connect the liquid injection pipe to inject the cooling medium into the cooling medium receiving cavity (4). After the liquid injection is completed, the liquid injection sleeve (8) is sealed by laser welding.

3. The 3D heat dissipation module according to claim 1, characterized in that: The insertion hole (5) has an upwardly protruding flange, and the heat dissipation fin (3) has a slot corresponding to the flange.

4. A 3D heat dissipation module according to claim 1, characterized in that: The cooling medium receiving cavity (4) has a plurality of spaced support platforms (9), the plurality of support platforms (9) are of equal height and all are in contact with the bottom surface of the connecting cover plate (2).

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