An inverter heat dissipation structure and an inverter

Abstract

The utility model discloses an inverter heat dissipation structure and inverter, wherein, the power module is set to one side of casing (10), the inductor shell (20) is located the other side of casing (10), and the radiator (30) is adjacent to the inductor shell (20) and is set, the radiator cover (40) cover is located the radiator (30), and the radiator cover (40) is adjacent to the radiator (30) and is provided with first radiating air duct (41) between, and the radiator cover (40) is adjacent to the inductor shell (20) one side and is equipped with the radiating hole (42), and first radiating air duct (41) is communicated with the radiating hole (42), the fan (50) is located casing (10), and the blowing direction of fan (50) is same with the trend of first radiating air duct (41), forms the structure that the airflow produced when fan (50) operates flows through first radiating air duct (41) and radiating hole (42) and flows through the radiator (30). The utility model has good heat dissipation effect, especially for the heat dissipation of inductance component realizes effective promotion.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure, and in particular to an inverter heat dissipation structure and an inverter. Background Technology

[0002] In existing inverter cooling designs, only the heatsink is located within the designed airflow duct, with cooling capacity enhanced by a fan installed at the bottom for forced airflow. However, the inductor housing is placed outside the airflow duct, relying solely on natural cooling. Due to the strict limitations of the inductor housing's dimensions (its height can only be flush with the airflow duct shell at most) and the difficulty in expanding its width, the size design of the heatsink fins on the inductor housing is directly limited.

[0003] This design suffers from significant heat dissipation issues: the inductor casing relies on natural heat dissipation, resulting in low convective heat transfer efficiency, while the inductor itself suffers substantial losses (especially individual unit losses), easily leading to excessive inductor temperature. This problem is particularly pronounced under high-voltage input conditions; for example, the INV inductor experiences the greatest losses and the most severe temperature rise. Consequently, the entire unit cannot achieve full power output without derating within the MPPT full-load voltage range (500~850V), making it difficult for the overall inverter thermal design to meet requirements.

[0004] Furthermore, the space in the inductor casing is limited in all directions, making it impossible to increase the heat exchange area by increasing the height of the fins. This means that there is almost no room for improvement in the inductor's heat dissipation design, and it is difficult to improve the inductor's heat dissipation performance. Although existing technologies can improve heat dissipation performance by increasing the radiative heat transfer capacity of the inductor casing (for example, by using anodizing to increase the casing emissivity to above 0.8), this process significantly increases production costs and is not economically viable. Utility Model Content

[0005] The main purpose of this utility model is to propose an inverter heat dissipation structure and an inverter, aiming to solve the above-mentioned problems such as poor heat dissipation of inductor components in the inverter heat dissipation structure, high production cost, and difficulty in structural improvement.

[0006] To achieve the above objectives, this utility model proposes an inverter heat dissipation structure, including a housing, one side of which is used to mount a power module;

[0007] An inductor housing and a heat sink, wherein the inductor housing is used to dissipate heat from the inductor and is disposed on the other side of the housing, and the heat sink is disposed adjacent to the inductor housing;

[0008] A radiator cover is provided on the radiator, and a first heat dissipation air duct is provided between the radiator cover and the radiator. A heat dissipation hole is provided on the side of the radiator cover adjacent to the inductor shell, and the first heat dissipation air duct communicates with the heat dissipation hole.

[0009] A fan is disposed in the housing. The direction of airflow from the fan is the same as that of the first heat dissipation duct. The airflow generated by the fan flows through the first heat dissipation duct, the heat dissipation holes, and the heat sink in sequence.

[0010] Optionally, the first heat dissipation duct is located between the first sidewall of the heat sink facing the inductor housing and the second sidewall of the heat sink casing facing the inductor housing.

[0011] Optionally, the heat dissipation hole is provided on the second side wall, and the inductor shell is provided with spaced heat dissipation fins on the side near the heat sink. A second heat dissipation air channel is formed between the heat dissipation fins, and the second heat dissipation air channel is connected to the heat dissipation hole and the first heat dissipation air channel.

[0012] Optionally, the heat sink cover has an opening on one side wall facing the fan, the fan is located at the opening, and the heat dissipation hole is located on the second side wall near the opening.

[0013] Optionally, the radiator has spaced heat sinks that form a third heat dissipation duct that is aligned with the airflow direction of the fan. The outer wall of the radiator casing, which is aligned with the direction of the third heat dissipation duct, also has heat dissipation holes to connect the first heat dissipation duct with the external environment.

[0014] Optionally, the width of the first heat dissipation duct is greater than or equal to 11 mm and less than or equal to 13 mm.

[0015] Optionally, the area of ​​the heat sink is larger than the area of ​​the inductor housing.

[0016] Optionally, the inverter heat dissipation structure further includes a top cover, which is fastened to the housing on one side to form a receiving space for accommodating the power module, and the inductor shell, heat sink, and heat sink cover are located on the other side of the housing to dissipate heat to the receiving space.

[0017] Optionally, the bottom wall of the housing is provided with a through hole, the through hole communicating with the receiving space, and the heat sink is connected to the through hole.

[0018] This utility model also provides an inverter, which includes an inductor, a power module and the aforementioned inverter heat dissipation structure, wherein the inductor and the power module are respectively connected to the inverter heat dissipation structure.

[0019] This utility model provides an inductor shell for heat dissipation, a heat sink for heat dissipation of the power module inside the shell, and a heat sink cover outside the heat sink. During the installation process, a first heat dissipation airflow channel of about 12mm is formed between the heat sink cover and the heat sink. The inductor shell and the heat sink are arranged adjacent to each other. The second sidewall of the heat sink cover with heat dissipation holes is located between the inductor shell and the heat sink, so that the first heat dissipation airflow channel, the second heat dissipation airflow channel and the heat dissipation holes are connected. The airflow direction of the fan is consistent with the first heat dissipation airflow channel. The airflow generated when the fan is running flows to the heat sink through the first heat dissipation airflow channel and the heat dissipation holes to dissipate heat from the inductor.

[0020] By improving the positional relationship between the inductor housing, heat sink, and heat sink cover in the inverter's heat dissipation structure, a portion of the original first heat dissipation airflow is redirected through the heat dissipation holes to the inductor housing for inductor heat dissipation. Compared to the original design which used natural heat dissipation, this improves the heat dissipation performance of the inductor housing and provides the inductor with a better heat dissipation environment.

[0021] Inverters employing an inverter heat dissipation structure maintain overall heat dissipation performance, particularly improving heat dissipation for inductor components, without increasing production costs, making them suitable for mass production. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 This is an exploded view of the inverter heat dissipation structure 100 of this utility model.

[0024] Figure 2 This is a cross-sectional view of the inverter heat dissipation structure 100 of this utility model;

[0025] Figure 3 This is a schematic diagram of the inverter heat dissipation structure 100 from a single perspective (without a fan).

[0026] Figure 4 This is a bottom view of a partial structure of the inverter heat dissipation structure 100 of this utility model;

[0027] Figure 5 This is an exploded view of a partial structure of the inverter heat dissipation structure 100 of this utility model;

[0028] Figure 6 The simulation diagram shows the temperature rise under existing technology.

[0029] Figure 7 This is a simulation of the temperature rise of the inverter heat dissipation structure of this utility model at 100°C.

[0030] Explanation of icon numbers:

[0031] 100 Inverter heat dissipation structure 40 Radiator cover 10 case 41 First heat dissipation airflow 11 Through hole 411 Second side wall 20 Inductor housing 42 Heat dissipation holes 21 Heat dissipation fins 43 Opening 211 Second heat dissipation air duct 50 fan 30 heat sink 60 Top cover 31 heat sink 61 storage space 311 First side wall 70 inductance 312 Third heat dissipation air duct 80 IGBT

[0032] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0035] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0036] During operation, inverters generate a significant amount of heat due to energy losses in power semiconductor devices (such as IGBTs and MOSFETs), inductors, capacitors, and other components. If this heat cannot be dissipated in time, it can lead to performance degradation, thermal runaway, and even safety hazards. While inverter cooling designs typically optimize airflow for main power devices (such as IGBTs), passive components like inductors and capacitors are often excluded from the airflow, resulting in uneven heat dissipation and localized overheating that reduces system efficiency.

[0037] Existing heat dissipation methods for inductors rely on natural convection. However, inductors have high losses (especially at high voltage inputs). Relying solely on natural heat dissipation can easily lead to excessive temperature rise, especially at MPPT wide voltage inputs (such as 500~850V), where inductor losses increase dramatically. Traditional heat dissipation solutions cannot effectively suppress temperature rise, resulting in derating of the entire unit and affecting output power.

[0038] Therefore, traditional inverters suffer from problems such as low heat dissipation efficiency, insufficient inductor heat dissipation, and difficulty in temperature rise control, which become system bottlenecks, especially in high-voltage and high-power scenarios. Although existing technologies can improve the heat dissipation of inductors, the size of the heat dissipation fins and air ducts is difficult to further optimize due to the limitations of the overall size. Adopting other heat dissipation solutions (such as liquid cooling and heat pipes) would significantly increase costs and is not suitable for large-scale production.

[0039] To address the problems existing in the prior art, this application proposes an inverter heat dissipation structure 100, with reference to... Figure 1 The inverter heat dissipation structure 100 has a housing 10, inside which a power module can be placed. The power module can be an IGBT component, input / output circuits, etc. An inductor housing 20 and a heat sink 30 cooperate with a fan 50 to create air convection during fan 50 operation, achieving heat dissipation for the housing 10 and the power module. The inductor is mounted on the inductor housing 20 with thermally conductive adhesive to transfer heat to the inductor housing 20 for dissipation. A first heat dissipation airflow 41 is provided between the heat sink cover 40 and the heat sink 30. Through the first heat dissipation airflow 41 and the heat dissipation holes 42, part of the airflow between the heat sink 30 and the fan 50 flows to the inductor housing 20, thereby achieving airflow cooling of the inductor housing 20 and improving the heat dissipation effect of the inductor housing 20 on the inductor. Simultaneously, the overall heat dissipation is achieved through the heat sink 30 and the fan 50, allowing the heat sink cover 100 to retain its original heat dissipation effect, and the heat dissipation effect is more balanced. Based on the above description, the inverter heat dissipation structure 100 has the following embodiments: Example

[0040] refer to Figure 2The inverter heat dissipation structure 100 has a housing 10 whose side walls enclose a housing space 61 for accommodating a power module. The power module can be a circuit composed of IGBTs, diodes, etc. The top cover 60 is fastened to the side wall of the housing 10. The housing space 61 can hold electronic circuit devices such as power modules. The housing space 61 is on one side of the housing 10, and the inductor housing 20 and heat sink 30 are on the other side of the housing. An inductor can be installed in the inductor housing 20 to dissipate heat from the inductor. The bottom wall of the housing 10 has a through hole 11 that communicates with the housing space 61. Therefore, the heat sink 30 is connected to the through hole 11 to dissipate heat from the housing space 61. The fan 50 is located on one side of the heat sink 30 to blow air to dissipate heat from the heat sink 30. The heat sink 30 and the fan 50 work together to dissipate a large amount of heat generated by the devices in the housing space 61 to the external environment when they are working.

[0041] In this configuration, the inductor housing 20 and the heat sink 30 are arranged adjacent to each other. The area of ​​the heat sink 30 is larger than that of the inductor housing 20. Due to the volume limitations of the inverter heat dissipation structure 100 and to ensure effective heat dissipation, the fan 50 mainly dissipates heat from the heat sink 30.

[0042] Further, refer to Figure 3 and Figure 4 A heatsink cover 40 is installed over the heatsink 30, and a first heat dissipation air duct 41 is provided between the heatsink cover 40 and the heatsink 30. The first heat dissipation air duct 41 is located between the first side wall 311 of the heatsink 30 facing the inductor housing 20 and the second side wall 411 of the heatsink cover 40 facing the inductor housing 20. The direction of the first heat dissipation air duct 41 can be vertical or inclined (to increase the contact area with the airflow generated by the fan 50). A heat dissipation hole 42 is provided on the side of the heatsink cover 40 adjacent to the inductor housing 20. The first heat dissipation air duct 41 is connected to the heat dissipation hole 42. It can be understood that without increasing the heat dissipation air duct 41, the first heat dissipation air duct 41 can be installed at an angle to increase the contact area with the airflow generated by the fan 50. With the heatsink cover 40 in place, the inductor housing 20 is cooled by natural heat dissipation, and the heatsink 30 is cooled by natural heat dissipation and fan-assisted heat dissipation. After the heatsink cover 40 is set and the first heat dissipation air duct 41 is set, the air blowing direction of the fan 50 is the same as the direction of the first heat dissipation air duct 41. This forms a structure in which the airflow generated by the fan 50 during operation flows through the first heat dissipation air duct 41 and the heat dissipation hole 42 and passes through the heatsink 30. Since the first heat dissipation air duct 41 has a certain volume, more gas flow passes through the first heat dissipation air duct 41, which increases the gas flow on one side of the inductor housing 20, thereby improving the heat dissipation effect of the inductor housing 20.

[0043] Preferably, the width of the first heat dissipation duct 41 is greater than or equal to 11 mm and less than or equal to 13 mm, for example, it can be 11 mm, 12 mm or 12.5 mm, etc. Alternatively, multiple first heat dissipation ducts 41 can be provided to increase the airflow to the heat sink 30, so as to further improve the heat dissipation effect of the heat sink 30 on the inductor.

[0044] By setting heat dissipation fins 21 on the inductor housing 20, the heat dissipation effect of the inductor housing 20 can be further improved. The side of the inductor housing 20 near the heat sink 30 is provided with spaced heat dissipation fins 21, and a second heat dissipation air channel 211 is formed between the heat dissipation fins 21. The second heat dissipation air channel 211 is oriented in the same direction as the first heat dissipation air channel 41, ensuring that the air flow direction is consistent, which is conducive to rapid heat dissipation. Since the heat dissipation hole 42 is located on the second side wall 411, the second heat dissipation air channel 211 is also connected to the heat dissipation hole 42 and the first heat dissipation air channel 41. Thus, when the fan 50 blows air to the heat sink 30, some airflow flows to the inductor housing 20 through the heat dissipation hole 42 and the first heat dissipation air channel 41, and achieves more effective heat dissipation through the second heat dissipation air channel 211.

[0045] In addition, the heat sink cover 40 has an opening 43 on the side wall facing the fan 50. The fan 50 is horizontally positioned at the opening 43 and perpendicular to the direction of the first heat dissipation air duct 41. The heat sink 30 has spaced heat dissipation fins 31, which form a third heat dissipation air duct 312 that is consistent with the air blowing direction of the fan 50. When the fan 50 blows air, a large amount of airflow passes through the third heat dissipation air duct 312. The heat sink cover 40 is provided with heat dissipation holes 42 corresponding to the third heat dissipation air duct 312, thereby enabling the fan 50 to exchange air through the third heat dissipation air duct 312 and the heat dissipation holes 42, achieving large-area heat dissipation.

[0046] Preferably, the heat sink cover 40 is provided with multiple heat dissipation holes 42, which are respectively provided with the first heat dissipation air duct 41 and the third heat dissipation air duct 312. The heat dissipation holes 42 provided on the second side wall 411 are close to the opening 43 and the fan 50, so that the airflow of the fan 50 can be dissipated to the second heat dissipation air duct 211 through the heat dissipation holes 42 more quickly. Of course, heat dissipation holes 42 can also be provided at other positions on the heat sink cover 40 to increase the heat exchange efficiency. Similarly, the inductor shell 20 can also be provided with multiple heat dissipation fins 21, such as heat dissipation fins 21 provided on the side walls of the inductor shell 20, to further improve the heat dissipation effect.

[0047] In this embodiment, the inductor housing 20 is made of die-cast aluminum with a thickness of approximately 2.0 mm. Its overall dimensions are approximately 417 mm long, 129 mm wide, and 98.5 mm high. A potting compound, approximately 2.0 mm thick, is filled between the inductor and the housing 20. The inductor conducts heat to the housing 20 through the potting compound, and then dissipates the heat through convective heat transfer between the housing 20 and the external air. Furthermore, the first heat dissipation duct 41 enhances airflow around the housing 20, increasing the convective heat transfer coefficient between the housing 20 and the external air, thereby reducing thermal resistance.

[0048] In this embodiment, reference Figure 5The inductor housing 20 is adjacent to the fan 50, the heat sink 30 and the heat sink cover 40 to form a first heat dissipation air duct 41. During heat dissipation, a portion of the cool air on the first heat dissipation air duct 41 can be used to blow on the inductor housing 20. Compared with completely natural heat dissipation, although most of the airflow flows through the heat sink 30 and exits from the top, a small portion of the airflow flows to the inductor housing 20 through the heat dissipation holes 42 of the heat sink cover 40. The convective heat transfer of the inductor housing 20 will be significantly enhanced, thereby greatly improving the convective heat transfer capacity of the inductor housing 20, and the temperature of the inductor itself can also be significantly reduced. Example

[0049] This embodiment provides the heat dissipation effect when the width of the first heat dissipation duct 41 is 12mm.

[0050] By measuring the temperature rise of the original technology and the inverter heat dissipation structure 100 of this solution under near-natural heat dissipation environment, it was found that the original technology could not achieve no derating at 45 degrees Celsius within the claimed MPPT full-load voltage range. The reason is that it triggered the overheating of the inductor NTC, which caused derating, which would have an adverse effect on use.

[0051] If the same structure as the existing technology is used, the problem of inductor overheating will inevitably arise. Therefore, this embodiment uses an inductor housing 20, a heat sink 30, and a heat sink cover 40, forming a first heat dissipation airflow 41 between the heat sink 30 and the heat sink cover 40. A fan 50 is positioned on one side of the first heat dissipation airflow 41 to blow air. Only a portion of the airflow needs to be introduced from the first heat dissipation airflow 41 to blow air onto the inductor housing 20, which can significantly reduce the temperature rise of the inductor body and the housing. However, the introduced airflow cannot be too large, otherwise it will seriously affect the heat dissipation of the IGBT and Diode. Therefore, by appropriately balancing the ventilation ratio of the first heat dissipation airflow 41 and the third heat dissipation airflow 312, the goal of reducing the inductor temperature without seriously affecting the heat dissipation of the IGBT and Diode can be achieved.

[0052] According to simulation experiments, when the airflow of the heat sink 30 is reduced by no more than 10% during forced air cooling, the surface temperature change of the IGBT and Diode is no more than 1%. Therefore, approximately 10% of the airflow can be allocated to inductor cooling without affecting the overall heat dissipation effect.

[0053] refer to Figure 6 and Figure 7 , Figure 6 The temperature changes of the inductor 70, IGBT 80, and inductor case 20 in the original design (without the first heat dissipation duct 41) are shown. Figure 7 The temperature changes of inductor 70, IGBT 80, and inductor case 20 in this design are shown in Table 1 below. The simulation results of the original design and the design adopted in this design are shown in Table 1 below:

[0054] Table 1:

[0055] Original design 127.5 131 103.1 3.3 68.6 This plan 128.7 125.5 95.4 5.44 102.9

[0056] The measured temperature results of the original design and the design using this scheme are shown in Table 2 below:

[0057] Table 2:

[0058] Original design 107.5 141 This plan 108.2 125

[0059] As can be seen, after adopting the structure of this embodiment, the junction temperature of IGBT80 increases by 1.2℃, which is less than 1%, and the surface temperature of IGBT80 increases by less than 1℃; while the temperature of inductor 70 decreases by nearly 5.5℃, the temperature of inductor case 20 decreases by 7.7℃, the convective heat transfer coefficient of inductor case 20 increases from 3.3 to 5.44, and the convective heat transfer with external air increases from 68.6W to 102.9W. The temperature rise of inductor 70 and inductor case 20 is significantly improved. This solution reduces the convective heat transfer thermal resistance between inductor 70 and external air, and the overall temperature rise of IGBT and Diode does not exceed 1℃, but the temperature of inductor 70 decreases by more than 15℃, and the temperature of inductor case 20 also decreases significantly.

[0060] Furthermore, the temperature rise improvement effect of inductor 70 is better than the simulation results. The main reason is that Table 1 does not simulate the rotation effect of fan 50. Therefore, the actual airflow of fan 50 to inductor housing 20 is higher than the simulated airflow. However, whether or not fan 50 is present, it can be seen that the heat dissipation of inductor 70 in this solution is better.

[0061] Therefore, by adopting this solution, while keeping the temperature rise of IGBT80 and Diode basically unchanged (with a change of less than 1%), the temperature of inductor 70 and inductor case 20 is significantly improved, and only a small increase in structural cost is added. Compared with other cooling solutions, the cost increase is relatively small.

[0062] This utility model also proposes an inverter, which includes an inductor, a power module, and an inverter heat dissipation structure 100. The specific structure of the inverter heat dissipation structure 100 is as described in the above embodiments. Since the inverter adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The inverter includes, but is not limited to, vehicle chargers, server inverters, etc. The power module includes IGBTs, diodes, etc. The inductor and IGBT are respectively disposed on both sides of the housing 10 of the inverter heat dissipation structure 100. The inverter heat dissipation structure 100 achieves heat dissipation through a fan 50, an inductor housing 20, a heat sink 30, and a heat sink cover 40, especially improving the heat dissipation effect of the inductor.

[0063] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. An inverter heat dissipation structure (100), characterized in that, include: A housing (10), one side of which is used to mount a power module; An inductor housing (20) and a heat sink (30) are provided, wherein the inductor housing (20) is used to dissipate heat from the inductor and is disposed on the other side of the housing (10), and the heat sink (30) is disposed adjacent to the inductor housing (20); A heat sink cover (40) is provided on the outside of the heat sink (30), and a first heat dissipation air duct (41) is provided between the heat sink cover (40) and the heat sink (30). A heat dissipation hole (42) is provided on the side of the heat sink cover (40) adjacent to the inductor shell (20), and the first heat dissipation air duct (41) is connected to the heat dissipation hole (42). A fan (50) is disposed on the housing (10). The blowing direction of the fan (50) is the same as that of the first heat dissipation duct (41). The airflow generated by the fan (50) passes through the first heat dissipation duct (41), the heat dissipation hole (42) and the heat sink (30) in sequence.

2. The inverter heat dissipation structure (100) as described in claim 1, characterized in that, The first heat dissipation duct (41) is located between the first side wall (311) of the heat sink (30) facing the inductor shell (20) and the second side wall (411) of the heat sink cover (40) facing the inductor shell (20).

3. The inverter heat dissipation structure (100) as described in claim 2, characterized in that, The heat dissipation hole (42) is provided on the second side wall (411). The inductor shell (20) is provided with spaced heat dissipation fins (21) on the side near the heat sink (30). A second heat dissipation air channel (211) is formed between the heat dissipation fins (211). The second heat dissipation air channel (211) is connected to the heat dissipation hole (42) and the first heat dissipation air channel (41).

4. The inverter heat dissipation structure (100) as described in claim 3, characterized in that, The heat sink cover (40) has an opening (43) on one side wall facing the fan (50), the fan (50) is located at the opening (43), and the heat dissipation hole (42) is located close to the opening (43).

5. The inverter heat dissipation structure (100) as described in claim 4, characterized in that, The radiator (30) has spaced heat sinks (31), which form a third heat dissipation duct (312) that is consistent with the air blowing direction of the fan (50). The outer wall of the radiator cover (40) corresponding to the direction of the third heat dissipation duct (312) is also provided with heat dissipation holes (42) to connect the third heat dissipation duct (312) with the external environment.

6. The inverter heat dissipation structure (100) as described in claim 2, characterized in that, The width of the first heat dissipation duct (41) is greater than or equal to 11 mm and less than or equal to 13 mm.

7. The inverter heat dissipation structure (100) as described in any one of claims 1 to 6, characterized in that, The area of ​​the heat sink (30) is larger than the area of ​​the inductor housing (20).

8. The inverter heat dissipation structure (100) as described in any one of claims 1 to 6, characterized in that, The inverter heat dissipation structure (100) also includes a top cover (60), which is fastened to the housing (10) on one side of the housing (10) to form a housing space (61) for accommodating the power module.

9. The inverter heat dissipation structure (100) as described in claim 8, characterized in that, The bottom wall of the housing (10) is provided with a through hole (11), which is connected to the accommodating space (61), and the radiator (30) is connected to the through hole (11).

10. An inverter, characterized in that, The inverter includes an inductor, a power module, and an inverter heat dissipation structure (100) as described in any one of claims 1 to 9, wherein the inductor and the power module are respectively connected to the inverter heat dissipation structure (100).

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