Cabinet, motor controller and electronic device

Abstract

The application relates to the technical field of mechanical equipment, in particular to a machine case, a motor controller and electronic equipment. The machine case comprises a cooling assembly and a case plate assembly; the cooling assembly comprises a profile forming plate, the profile forming plate is provided with a medium inner cavity for containing a cooling medium, the profile forming plate is also provided with an inlet hole and an outlet hole, and the inlet hole and the outlet hole are respectively communicated with the medium inner cavity; the case plate assembly is matched with the profile forming plate to form a containing cavity for containing electronic components, a mold for manufacturing the profile forming plate is simple in design, short in manufacturing period and low in cost (extrusion molds are usually much simpler and cheaper than die casting molds), when the profile forming plate is formed, the medium inner cavity is formed, so that the cost can be effectively reduced and the economy can be improved in small-batch production.

Description

Technical Field

[0001] This application relates to the field of mechanical equipment technology, and more specifically, to a chassis, motor controller and electronic equipment. Background Technology

[0002] With the continuous improvement of the integration and power density of power devices, the heat generated during operation has increased significantly, and traditional air cooling methods are no longer sufficient to meet the heat dissipation requirements. Liquid cooling, as a highly efficient heat dissipation method, is widely used in high-power devices and modules in fields such as automotive power supplies, motor control, industrial power supplies, and medical power supplies. Current solutions integrate the liquid cooling channels with the housing, forming cooling channels directly inside the housing through a complex die-casting process, allowing the coolant to circulate within the channels for rapid heat conduction and dissipation. However, the die-casting process relies on complex and costly die-casting molds, resulting in huge upfront investments. In small-batch production, the expensive mold costs are difficult to amortize, leading to excessively high overall production costs, thus limiting the application of this technology in small- to medium-batch products.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0004] The purpose of this application is to provide a chassis, motor controller and electronic device, which aims to solve the technical problem that the die casting process relies on complex and high-cost molds, resulting in excessively high overall production costs.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: This application provides a chassis, including: a cooling assembly and a chassis panel assembly; The cooling assembly includes a profiled plate having a medium cavity for containing a cooling medium, and the profiled plate also has an inlet hole and an outlet hole, the inlet hole and the outlet hole being respectively connected to the medium cavity; The panel assembly mates with the profiled plate to form a cavity for accommodating electronic components.

[0006] In some implementations, the cooling assembly further includes baffles; a plurality of baffles are provided in the medium cavity at intervals, and a medium flow channel is formed between two adjacent baffles.

[0007] In some implementations, the length direction of the partition is parallel to the length direction of the profile forming plate, and the length direction of the medium flow channel is parallel to the length direction of the profile forming plate; the partition is a straight structure or a curved structure.

[0008] In some implementations, the number of the medium cavities is one or more; when the number of the medium cavities is multiple, the cooling assembly further includes a partition plate, and the multiple medium cavities are arranged along the width direction of the profile forming plate, with adjacent medium cavities isolated by the partition plate.

[0009] In some implementations, the inner cavity of the medium has openings at opposite ends along its length, and the openings are located on the end face of the profile forming plate in the thickness direction. The cooling assembly also includes a sealing plate, which is fixedly connected to the end face of the profile forming plate in the thickness direction to close the opening.

[0010] In some implementations, the cooling assembly further includes an inlet connector and an outlet connector; The liquid inlet connector is fixedly connected to the profile forming plate, and the liquid inlet connector is connected to the liquid inlet hole; The liquid outlet connector is fixedly connected to the profile forming plate, and the liquid outlet connector is connected to the liquid outlet hole; Both the liquid inlet and the liquid outlet are located on the surface formed by the length and width directions of the profile forming plate.

[0011] In some implementations, the profile forming plate has multiple mounting holes, which are not connected to the inner cavity of the medium.

[0012] In some implementations, the panel assembly includes a first side panel and a second side panel; The first side plate is connected to both sides of the profile forming plate along its length, and the first side plate is integrally formed with the profile forming plate. The second side plate is fixedly connected to both sides of the profile forming plate in the width direction.

[0013] This application provides a motor controller, including: a control motherboard and a chassis as described in any of the above implementations, wherein the control motherboard is located in the receiving cavity.

[0014] This application provides an electronic device, including: the chassis described in any of the above implementations.

[0015] The main advantages of the chassis, motor controller, and electronic equipment provided in this application are: This application uses a profiled plate as the core component of the cooling assembly. This plate can be manufactured through extrusion molding or other profile processing techniques (such as aluminum profile extrusion). Compared with the die-casting process in related technologies, the mold used in this application to manufacture the profiled plate has a simple design, short manufacturing cycle, and low cost (extrusion molds are generally far less complex and expensive than die-casting molds). The media cavity is formed during the formation of the profiled plate, which effectively amortizes costs and improves economic efficiency in small-batch production. Furthermore, the modular assembly between the profiled plate and the box assembly allows for adjustment of the size and shape of the profiled plate according to requirements. The inlet and outlet holes are connected to the media cavity, ensuring the circulation of the cooling medium (such as coolant) and facilitating heat conduction and dissipation. This design also improves production flexibility, facilitates product iteration or customization, and is suitable for the diverse needs of small to medium-batch orders. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the chassis structure provided in an embodiment of this application; Figure 2 This is a partial exploded view of the chassis provided in an embodiment of this application; Figure 3 This is a schematic diagram of the chassis without the inlet and outlet connectors provided in this application embodiment; Figure 4 yes Figure 3 An exploded diagram of the computer case; Figure 5 yes Figure 4 A magnified schematic diagram of the local structure at point A; Figure 6 This is a front view of the chassis provided in the embodiment of this application; Figure 7 It is along Figure 6 Partial view of the middle BB line; Figure 8 yes Figure 7 A magnified view of a portion of point C in the middle; Figure 9 yes Figure 6 A top view of the chassis; Figure 10 It is along Figure 9 Partial view of the DD line; Figure 11This is a schematic diagram of the structure of the partition provided in the embodiments of this application.

[0018] Explanation of key figure labels: 101. Profile forming plate; 102. Liquid inlet hole; 103. Liquid outlet hole; 104. First side plate; 105. Second side plate; 106. Opening; 107. Sealing plate; 108. Medium inner cavity; 109. Receiving cavity; 110. Liquid inlet connector; 111. Liquid outlet connector; 112. Connector seat; 113. Divider plate; 114. Guide structure; 115. Mounting hole; 116. Liquid inlet chamber; 117. Intermediate cavity; 118. Liquid outlet chamber; 119. Partition; 120. Medium flow channel; 121. Sealing plate. Detailed Implementation

[0019] In related technologies, the solution of integrating the liquid cooling channel with the casing involves directly forming the cooling channel inside the casing through a complex die-casting process, allowing the coolant to circulate within the channel for rapid heat conduction and dissipation. However, the die-casting process relies on complex and costly die-casting molds, resulting in a huge initial investment. Furthermore, the expensive mold costs are difficult to amortize during small-batch production, leading to excessively high overall production costs and limiting the application of this technology in small- to medium-batch products.

[0020] Therefore, this application provides a chassis, a motor controller, and an electronic device to solve the problems in the related art.

[0021] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0022] Combination Figure 1 , Figure 4 and Figure 5 As shown, this application embodiment provides a chassis that can be applied to vehicle power supplies, motor control systems, industrial power supplies, or medical power supplies. The chassis includes a cooling assembly and a panel assembly. The cooling assembly includes a profiled plate 101, which has a media cavity 108 for containing a cooling medium. The profiled plate 101 also has an inlet hole 102 and an outlet hole 103, which are respectively connected to the media cavity 108. The panel assembly cooperates with the profiled plate 101 to form a receiving cavity 109 for accommodating electronic components.

[0023] The chassis provided in this application uses a profiled plate 101 as the core component of the cooling assembly. The profiled plate 101, also known as a water-cooled plate, can be manufactured through extrusion molding or other profile processing techniques (such as aluminum profile extrusion). Compared to die-casting processes in related technologies, the mold used in this application to manufacture the profiled plate 101 has a simple design, short manufacturing cycle, and low cost (extrusion molds are typically far less complex and expensive than die-casting molds). When the profiled plate 101 is formed, the media cavity 108 is also formed, which effectively amortizes costs and improves economic efficiency in small-batch production. Furthermore, the modular assembly between the profiled plate 101 and the chassis assembly allows for adjustment of the size and shape of the profiled plate 101 according to requirements. The inlet hole 102 and outlet hole 103 are connected to the media cavity 108, ensuring the circulation of the cooling medium (such as coolant) and facilitating heat conduction and dissipation. This design also improves production flexibility, facilitates product iteration or customization, and is suitable for the diverse needs of small to medium-batch orders.

[0024] In some embodiments, the chassis assembly is fixedly connected to the profiled plate 101. The chassis may be cuboid in shape and may have six outer surfaces; it may also have five outer surfaces, in which case the chassis has an opening 106. The profiled plate 101 may have a certain length and width, and the profiled plate may be a planar structure; the profiled plate 101 may be manufactured by an extrusion molding process, for example, the profiled plate 101 may be manufactured by an aluminum profile extrusion molding process. It is understood that the chassis may also be cylindrical, in which case the profiled plate 101 may be a curved structure. The shape of the liquid inlet 102 may be circular, square, or elliptical; the shape of the liquid outlet 103 may be circular, square, or elliptical. The cooling medium may be water, ethylene glycol solution, propylene glycol solution, mineral oil, silicone oil, or other liquids suitable for cooling the chassis; it is understood that the cooling medium may also be gas.

[0025] For ease of description, in the embodiments of this application, the thickness direction of the chassis is defined as the ZZ direction; the width direction of the chassis is defined as the XX direction; the length direction of the chassis is defined as the YY direction; and the thickness direction, length direction, and width direction of the chassis are perpendicular to each other.

[0026] Combination Figures 2 to 4As shown, in some embodiments, the enclosure assembly includes a first side plate 104 and a second side plate 105; the first side plate 104 is connected to both sides of the profiled plate 101 along its length, and the first side plate 104 is integrally formed with the profiled plate 101; the second side plate 105 is fixedly connected to both sides of the profiled plate 101 along its width. By integrally forming the profiled plate 101 with the first side plate 104 along its length through processes such as extrusion molding, the assembly steps of the enclosure are reduced, which helps to reduce production and assembly costs. The second side plate 105, located in the width direction of the profiled plate 101, is combined with the profiled plate 101 through a fixed connection (such as bolts, welding, or clips), which facilitates the customization of the size of the profiled plate 101, thereby allowing for different sized cavities 109 to meet diverse electronic component layout requirements; this modular design significantly improves production adaptability, is suitable for the customization needs of small and medium batch orders, and overcomes the high cost and low flexibility of die-casting solutions in related technologies during design changes. For example, the second side panel 105 can also be manufactured using a profile forming process, which can greatly reduce production costs. The profile forming plate 101, the first side panel 104, and the second side panel 105 can all be made of aluminum or aluminum alloy. The second side panel 105 is connected to the first side panel 104 and the profile forming plate 101 by welding, which can improve the structural stability of the chassis. The two first side panels 104, the two second side panels 105, and the profile forming plate 101 can form an open receiving cavity 109. The chassis assembly also includes a sealing plate 121. When the first side panel 104 has a through hole, the sealing plate 121 can be connected to the first side panel 104 by screws to close the through hole.

[0027] It should be noted that in some other possible embodiments, the chassis may also include a cover plate, which may also be made using a profile forming process. It is understood that the cover plate may also be designed with the same structure as the profile forming plate 101, so that the cover plate may also have a medium cavity 108 for containing the cooling medium; the cover plate may also be designed with the same structure as the first side plate 104 and the second side plate 105, so that it does not need to contain the cooling medium.

[0028] See Figure 4As shown, in some embodiments, the media cavity 108 has openings 106 at opposite ends along its length, and the openings 106 are located on the end face of the profile forming plate 101 in the thickness direction. The cooling assembly also includes a sealing piece 107, which is fixedly connected to the end face of the profile forming plate 101 in the thickness direction to close the openings 106. This achieves the sealing of the media cavity 108, allowing the cooling medium to enter only from the inlet hole 102 and flow out from the outlet hole 103. The sealing piece 107 is welded to the end face of the profile forming plate 101 in the thickness direction. For example, the sealing piece 107 can be welded to the end face of the profile forming plate 101 in the thickness direction using friction stir welding to achieve a seal; the end face in the thickness direction is parallel to the thickness direction of the profile forming plate 101.

[0029] Combination Figure 5 and Figure 10 As shown, in some embodiments, there are multiple media cavities 108, which are arranged along the width direction of the profile forming plate 101. This allows for cooling at different locations on the profile forming plate 101, thus meeting different needs. Furthermore, this also facilitates the introduction of different cooling media into different media cavities 108. For example, when there are multiple media cavities 108, a sealing piece 107 can close multiple openings 106 located on the same end face of the profile forming plate 101, simplifying the assembly process. It should be noted that in some other possible embodiments, the number of media cavities may be only one.

[0030] Combination Figures 2 to 5As shown, in some embodiments, the cooling assembly further includes an inlet connector 110 and an outlet connector 111; the inlet connector 110 is fixedly connected to the profile forming plate 101 and communicates with the inlet hole 102; the outlet connector 111 is fixedly connected to the profile forming plate 101 and communicates with the outlet hole 103; both the inlet hole 102 and the outlet hole 103 are located on the surface formed by the length and width directions of the profile forming plate 101. By providing the inlet hole 102 and the outlet hole 103 on the surface of the profile forming plate 101, and equipped with the inlet connector 110 and the outlet connector 111, the cooling assembly can be directly connected to external cooling pipes (such as pumps or radiators); in addition, the positional design of the inlet hole 102 and the outlet hole 103 makes the processing of the profile forming plate 101 more flexible, so that the inlet hole 102 and the outlet hole 103 can be configured in different positions through subsequent drilling processes to adapt to different cooling requirements. For example, the surface formed by the length and width directions of the profile forming plate 101 is the plate surface of the profile forming plate 101. The cooling assembly also includes a connector seat 112, and both the liquid inlet hole 102 and the liquid outlet hole 103 are fixed with the connector seat 112. The connector seat 112 has a through hole that communicates with the medium cavity 108. The connector seat 112 and the profile forming plate 101 can be fixedly connected by welding; while the liquid inlet connector 110 is fixedly connected to the connector seat 112 at the liquid inlet hole 102 by screws, and the liquid outlet connector 111 is fixedly connected to the connector seat 112 at the liquid outlet hole 103 by screws.

[0031] In some embodiments, when there are multiple media cavities 108, each media cavity 108 may correspond to at least one inlet connector 110 and at least one outlet connector 111. For example, each media cavity 108 corresponds to one inlet hole 102 and one outlet hole 103, and each media cavity 108 corresponds to one inlet connector 110 and one outlet connector 111. In this way, the cooling medium enters the media cavity 108 after entering the inlet hole 102 through the inlet connector 110, then flows out through the outlet hole 103, and finally flows out through the outlet connector 111.

[0032] It is understandable that when there are multiple media cavities 108, all of them can be circulated with cooling medium, or selectively, only designated media cavities 108 can be circulated with cooling medium, while other media cavities 108 can be temporarily idle.

[0033] Combination Figure 9 and Figure 10As shown, in some embodiments, the cooling assembly further includes a partition plate 113, which isolates two adjacent media cavities 108. This allows for the separation of the cooling media within the two adjacent media cavities 108. The partition plate 113 is fixedly connected to the upper and lower inner walls of the media cavity 108, thereby achieving separation between the two adjacent media cavities 108. The partition plate 113 can be integrally formed with the profile forming plate 101. For example, the partition plate can be integrally formed with the profile forming plate 101 through processes such as extrusion molding. Both ends of the partition plate 113 are welded to corresponding sealing pieces 107 to achieve sealing, thereby achieving separation between the two adjacent media cavities 108.

[0034] Combination Figure 9 and Figure 10 As shown, in some embodiments, the cooling assembly further includes a guide structure 114. The guide structure 114 is disposed within the medium cavity 108, and its length direction is parallel to the length direction of the profile forming plate 101. One end of the guide structure 114 is welded to a sealing piece 107 to achieve a seal. Another end of the guide structure 114 is spaced apart from another sealing piece 107, allowing the cooling medium to enter from the inlet hole 102 and flow out from the outlet hole 103. The guide structure 114 is fixedly connected to the upper and lower inner walls of the medium cavity 108, and can be integrally formed with the profile forming plate 101 through processes such as extrusion molding. The guide structure 114 can be a solid structure; the guide structure 114 divides the medium cavity 108 into an inlet cavity 116, an intermediate cavity 117 and an outlet cavity 118 connected in sequence; the inlet hole 102 is connected to the inlet cavity 116 and the outlet hole 103 is connected to the outlet cavity 118; the cooling medium enters the inlet cavity 116 from the inlet hole 102, then flows into the outlet cavity 118 through the intermediate cavity 117, and finally flows from the outlet hole 103.

[0035] Combination Figure 9 and Figure 10 As shown, in some embodiments, the profile forming plate 101 has multiple mounting holes 115. The mounting holes 115 are not connected to the dielectric cavity 108, so that electronic components can be installed in the receiving cavity 109 through the mounting holes 115. The mounting holes 115 are located on the profile forming plate 101 at positions corresponding to the guide structure 114. For example, the mounting holes 115 can be in the form of through holes, so that the mounting holes 115 can penetrate through the guide structure 114.

[0036] Combination Figures 6 to 8As shown, in some embodiments, the cooling assembly further includes baffles 119; multiple baffles 119 are spaced apart in the medium cavity 108, and a medium flow channel 120 is formed between two adjacent baffles 119. This can extend the residence time of the cooling medium in the profile forming plate 101, increase the contact area with the inner wall of the profile, and thus improve the heat exchange efficiency. For example, multiple baffles 119 are provided in both the liquid inlet cavity 116 and the liquid outlet cavity 118. The baffles 119 are fixedly connected to the upper and lower inner walls of the medium cavity 108, and the baffles 119 can be integrally formed with the profile forming plate 101 through processes such as extrusion molding. It should be noted that in some other possible embodiments, the baffles 119 can also be connected to the profile forming plate by welding or interference fit to fix the baffles 119 in the medium cavity 108. In this case, the baffles 119 can be a curved structure, see [reference]. Figure 11 As shown.

[0037] Combination Figure 9 and Figure 10 As shown, in some embodiments, the length direction of the partition 119 is parallel to the length direction of the profile forming plate 101, and the length direction of the medium flow channel 120 is also parallel to the length direction of the profile forming plate 101; the partition 119 has a straight structure. This facilitates the manufacturing of the cooling assembly. Furthermore, the linear partition 119 can divide the medium cavity 108 into regular, parallel medium flow channels 120, guiding the cooling medium to flow smoothly along the length direction of the profile forming plate 101, reducing fluid resistance, avoiding turbulence or dead zones, and ensuring efficient heat conduction and dissipation. For example, the length of the partition 119 is less than the length direction of the profile forming plate 101.

[0038] This application provides a motor controller, including a control motherboard and a chassis as described in any of the above embodiments, wherein the control motherboard is located in a receiving cavity 109. The motor controller described above has the same technical effects as the chassis provided in the foregoing embodiments, and will not be repeated here.

[0039] This application provides an electronic device, including: the chassis provided in any of the above embodiments. The electronic device has the same technical effects as the chassis provided in the foregoing embodiments, and will not be described again here.

[0040] It should be understood that, in the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed connection," "contact," etc., should be interpreted broadly. Those skilled in the art can understand the specific meanings of the various terms in the embodiments of this application according to the specific circumstances.

[0041] For example, the "connection" can be a fixed connection, a rotating connection, a flexible connection, a sliding connection, a one-piece molding, an electrical connection, a contact connection, or other connection methods; it can be a direct connection, or an indirect connection through an intermediate medium, or a connection within two components or an interaction between two components.

[0042] For example, a "fixed connection" can be a component that can be directly or indirectly fixedly connected to another component; a fixed connection can include mechanical connection, welding, bonding or integral molding, etc., wherein mechanical connection can include riveting, bolting, threaded connection, keying, snap-fit ​​connection, locking connection, plugging, etc., and bonding can include adhesive bonding and solvent bonding, etc.

[0043] It should also be understood that the “parallel” or “perpendicular” described in the embodiments of this application can be understood as “approximately parallel” or “approximately perpendicular”.

[0044] It should also be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0045] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0046] It should also be understood that the terms “length,” “width,” “up,” “down,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship (if any) based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. In conclusion, the above description is merely a preferred embodiment of the technical solution of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A chassis, characterized in that, include: A cooling assembly includes a profiled plate having a medium cavity for containing a cooling medium, and the profiled plate also has an inlet hole and an outlet hole, the inlet hole and the outlet hole being respectively connected to the medium cavity; A panel assembly that mates with the profiled plate to form a cavity for accommodating electronic components.

2. The chassis as described in claim 1, characterized in that, The cooling assembly also includes baffles; multiple baffles are spaced apart in the medium cavity, and a medium flow channel is formed between two adjacent baffles.

3. The chassis as described in claim 1 or 2, characterized in that, The number of the media cavity is one or more; When there are multiple media cavities, the cooling assembly further includes a partition plate, and the multiple media cavities are arranged along the width direction of the profile forming plate, with adjacent media cavities isolated by the partition plate.

4. The chassis as described in claim 1 or 2, characterized in that, The inner cavity of the medium has openings at opposite ends along its length, and the openings are located on the end face of the profile forming plate in the thickness direction. The cooling assembly also includes a sealing plate, which is fixedly connected to the end face of the profile forming plate in the thickness direction to close the opening.

5. The chassis as described in claim 1 or 2, characterized in that, The cooling assembly also includes a liquid inlet connector and a liquid outlet connector; The liquid inlet connector is fixedly connected to the profile forming plate, and the liquid inlet connector is connected to the liquid inlet hole; The liquid outlet connector is fixedly connected to the profile forming plate, and the liquid outlet connector is connected to the liquid outlet hole; Both the liquid inlet and the liquid outlet are located on the surface formed by the length and width directions of the profile forming plate.

6. The chassis as described in claim 1 or 2, characterized in that, The profile forming plate has multiple mounting holes, which are not connected to the inner cavity of the medium.

7. The chassis as described in claim 1 or 2, characterized in that, The panel assembly includes a first side panel and a second side panel; The first side plate is connected to both sides of the profile forming plate along its length, and the first side plate is integrally formed with the profile forming plate. The second side plate is fixedly connected to both sides of the profile forming plate in the width direction.

8. The chassis as described in claim 2, characterized in that, The length direction of the partition is parallel to the length direction of the profile forming plate, and the length direction of the medium flow channel is parallel to the length direction of the profile forming plate; the partition is a straight structure or a curved structure.

9. A motor controller, characterized in that, include: The control motherboard and the chassis as described in any one of claims 1-8, wherein the control motherboard is located in the receiving cavity.

10. An electronic device, characterized in that, include: The chassis as described in any one of claims 1-8.

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