Expansion structure of electronic device and electronic device

Abstract

The application discloses an expansion structure of an electronic device and the electronic device. The expansion structure comprises a shell and a heat dissipation piece. The shell comprises a mounting part and an extension part which are distributed along a first direction. The mounting part is provided with a mounting cavity for mounting the electronic device. The mounting cavity is communicated to outside of the shell. The extension part is provided with a heat dissipation cavity. The heat dissipation cavity is communicated with the mounting cavity. The first direction is the length direction of the electronic device. The heat dissipation piece is arranged in the heat dissipation cavity. Through the above scheme, the electronic device disclosed by the application occupies small space and has strong heat dissipation performance.

Description

Technical Field

[0001] This application relates to the field of storage technology, and in particular to an extension structure of an electronic device and an electronic device. Background Technology

[0002] Existing electronic devices generate significant heat, requiring timely cooling systems to prevent functional impairment. However, existing cooling systems compromise the compatibility of electronic devices with external devices, especially ultra-thin devices such as ultra-thin laptops. Utility Model Content

[0003] The main technical problem this application addresses is to provide an extension structure for an electronic device and an electronic device in which the device occupies little space and has strong heat dissipation performance.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide an extension structure for an electronic device, including a housing and a heat sink, wherein the housing includes a mounting portion and an extension portion distributed along a first direction, the mounting portion is provided with a mounting cavity for mounting the electronic device, the mounting cavity is connected to the outside of the housing, the extension portion is provided with a heat sink cavity, the heat sink cavity is connected to the mounting cavity, wherein the first direction is the length direction of the electronic device; the heat sink is disposed in the heat sink cavity.

[0005] The housing has a window on one side that communicates with the mounting cavity. The window is configured to expose part of the electronic device, and the side of the housing with the window is flush with the surface of the electronic device.

[0006] The housing includes a first housing portion and a second housing portion. The second housing portion is disposed on one side of the first housing portion along the thickness direction. The first housing portion and the second housing portion are detachably connected. The first housing portion and the second housing portion together form the mounting cavity and the heat dissipation cavity.

[0007] The first housing portion and the second housing portion are engaged by a first snap-fit ​​assembly. The first snap-fit ​​assembly includes a first snap-fit ​​protrusion and a snap-fit ​​hole. The first snap-fit ​​protrusion is disposed in one of the first housing portion and the second housing portion, and the snap-fit ​​hole is disposed in the other of the first housing portion and the second housing portion.

[0008] The housing has a metal protrusion on its inner side, which is configured to be grounded and attached to the electronic device.

[0009] The housing is configured to be detachably connected to the electronic device.

[0010] The inner wall of the shell is provided with an electromagnetic shielding layer.

[0011] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide an expandable electronic device, including the expansion structure and electronic device described in any of the technical solutions, wherein the electronic device is disposed in the mounting cavity, the electronic device includes an interface, the interface is located at the end of the electronic device along the length direction, and the interface is exposed in the housing.

[0012] The electronic device and the housing are engaged via a second snap-fit ​​assembly.

[0013] The second snap-fit ​​component is configured to define the relative position of the electronic device and the housing in the first direction. The housing is provided with a limiting member that extends into the mounting cavity and is configured to define the relative position of the electronic device and the housing in the thickness direction.

[0014] The second snap-fit ​​assembly includes a snap-fit ​​groove and a second snap-fit ​​protrusion. The snap-fit ​​groove is disposed on the side wall of the electronic device, and the second snap-fit ​​protrusion is disposed on the inner side of the side wall of the housing.

[0015] The second snap-fit ​​assembly includes a snap-fit ​​groove and an elastic snap-fit ​​member. The snap-fit ​​groove is disposed on the side wall of the electronic device, and one end of the elastic snap-fit ​​member is connected to the side wall of the electronic device, while the other end extends into the mounting cavity.

[0016] The electronic device further includes a first metal positioning part disposed opposite to the interface along the length direction, the first metal positioning part being in contact with a metal protrusion.

[0017] The beneficial effects of this application are as follows: Unlike existing technologies, the expansion structure of this application is divided along its length into a mounting section for mounting electronic equipment and an extension section for expanding the size, allowing the electronic equipment to be expanded to a larger size after installation. Simultaneously, since both the extension section and the mounting section are hollow, respectively accommodating the heat sink and the electronic equipment, the heat sink and electronic equipment are distributed along the length. Because the heat sink cavity is connected to the mounting cavity, the heat sink can fit snugly against the electronic equipment. This structure ensures that the heat sink does not increase the thickness of the electronic equipment, achieving compatibility with ultra-thin devices while guaranteeing strong heat dissipation performance. Attached Figure Description

[0018] Figure 1 This is a perspective view of an embodiment of the extended structure of this application;

[0019] Figure 2 An exploded view of an embodiment of the extended structure of this application;

[0020] Figure 3 This is a perspective view of an embodiment of the electronic device of this application;

[0021] Figure 4 This is a schematic diagram of the internal structure of an embodiment of the electronic device of this application;

[0022] Figure 5 This is a schematic diagram of the internal structure of another embodiment of the electronic device of this application.

[0023] Reference numerals: 1. Extension structure; 10. Housing; 101. Mounting part; 102. Extension part; 10a. Mounting cavity; 10b. Heat dissipation cavity; 10c. Opening; 10d. Window; 11. First housing part; 111. Snap-fit ​​hole; 12. Second housing part; 121. First snap-fit ​​protrusion; 122. Metal protrusion; 123. Limiting member; 124. Second snap-fit ​​protrusion; 125. Elastic snap-fit ​​member; 20. Heat dissipation member; 21. Relief groove; 2. Electronic device; 201. Interface; 202. Substrate; 203. Snap-fit ​​groove; 204. First metal positioning part. Detailed Implementation

[0024] To make the objectives, technical solutions, and effects of this application clearer and more explicit, the following detailed description is provided with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, which is the length direction; the direction along the Y-axis is called the Y-direction, which is the width direction; and the direction along the Z-axis is called the Z-direction, which is the thickness direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, the view of various elements parallel to the plane containing the X and Y directions is called a top view.

[0026] Currently, electronic devices on the market, such as solid-state drives (SSDs), come in various forms, with the most common type being the M.2 SSD. M.2 SSDs come in various sizes, such as "2230," "2242," and "2280," where "22" refers to the width of the SSD being 22 millimeters, and "30," "42," and "80" refer to the lengths being 30 millimeters, 42 millimeters, and 80 millimeters, respectively. To accommodate expansion to different sizes, electronic devices can be connected to expansion structures to modify them into other sizes, thus increasing the overall size of the electronic device after connection.

[0027] Existing solid-state drive (SSD) heat dissipation structures all involve stacking materials on the surface of the product's physical structure, increasing the product's thickness to varying degrees. This leads to increased product thickness and affects the compatibility of SSDs with external devices, especially ultra-thin devices such as ultra-thin laptops.

[0028] To address the aforementioned issues, taking solid-state drives as an example, some embodiments of this application provide an extended structure for an electronic device. Figure 1 This is a perspective view of an embodiment of the extended structure of this application. Figure 2 This is an exploded view of an embodiment of the extended structure of this application. The extended structure 1 of this application includes a housing 10 and a heat sink 20. The housing 10 includes a mounting portion 101 and an extension portion 102 distributed along a first direction X. The mounting portion 101 has a mounting cavity 10a for mounting an electronic device 2, and the mounting cavity 10a communicates with the outside of the housing 10. The extension portion 102 has a heat sink 10b, which communicates with the mounting cavity 10a. The first direction is the length direction of the electronic device 2. The heat sink 20 is disposed within the heat sink 10b.

[0029] Specifically, the housing 10 is a hollow structure extending along a first direction, and its shape can be a rectangular sheet structure. Along the first direction X, i.e., the length direction of the housing 10, the hollow structure includes a connecting mounting cavity 10a and a heat dissipation cavity 10b. One end of the housing 10 is provided with an opening 10c, and the end of the mounting cavity 10a away from the heat dissipation cavity 10b is connected to the outside of the housing 10 through the opening 10c. The interface 201 of one end of the electronic device 2 can be exposed through the opening 10c and electrically connected to an external device. The heat dissipation cavity 10b contains a heat sink 20, and the specific material of the heat sink 20 can be a heat dissipation silicone sheet, a graphene sheet, or an aluminum alloy fin, etc., to fill the heat dissipation cavity 10b.

[0030] The expansion structure 1 of this application is divided along its length into a mounting portion 101 for mounting a solid-state drive (SSD) and an extension portion 102 for expanding its size, allowing the SSD to be expanded to a larger size after installation with the expansion structure 1. Simultaneously, since both the extension portion 102 and the mounting portion 101 are hollow, they respectively accommodate the heat sink 20 and the SSD, ensuring that the heat sink 20 and the SSD are distributed along their length. Because the heat dissipation cavity 10b is connected to the mounting cavity 10a, the heat sink 20 can fit snugly against the SSD. This structure ensures that the heat sink 20 does not increase the thickness of the SSD, achieving compatibility with ultra-thin devices while maintaining strong heat dissipation performance for the SSD.

[0031] In some embodiments, the mounting cavity 10a can be used to mount smaller solid-state drives (SSDs) such as the 2230. The extension portion 102, while maintaining its width dimension, can have different length dimensions to expand the SSD size to 2242, 2260, and 2280, etc. The longer the extension portion 102 is in the length direction, the longer the heat dissipation cavity 10b can be, accommodating a larger heat sink 20 and achieving better heat dissipation.

[0032] Optionally, a window 10d can be provided on one side of the housing 10, the window 10d connecting to the mounting cavity 10a. The window 10d exposes part of the solid-state drive on one side, and the side of the housing 10 with the window 10d is flush with the side of the solid-state drive. The above structure further reduces the thickness of the housing 10, enabling it to accommodate more ultra-thin devices.

[0033] Optionally, to further enhance heat dissipation, the surface of the housing 10 and the surface of the solid-state drive can also be coated with a heat-radiating material.

[0034] Optionally, in some embodiments, the housing 10 can be a split structure, comprising a first housing portion 11 and a second housing portion 12. The second housing portion 12 is disposed on one side of the first housing portion 11 along the thickness direction Z. The first housing portion 11 and the second housing portion 12 are detachably connected, and together they form a mounting cavity 10a and a heat dissipation cavity 10b. Specifically, both the first housing portion 11 and the second housing portion 12 are groove structures extending along a first direction. The groove structure of the first housing portion 11 opens downward, and the groove structure of the second housing portion 12 opens upward. After being fixed, they together form the mounting cavity 10a and the heat dissipation cavity 10b. The above structure is simple and easy to manufacture. The detachably connected first housing portion 11 and the second housing portion 12 facilitate disassembly and assembly, making it convenient for the installation and replacement of the heat sink 20 and the solid-state drive. The window 10d can be disposed on the first housing portion 11 or on the second housing portion 12.

[0035] In other embodiments, the housing 10 may also be a one-piece structure.

[0036] Optionally, the first housing portion 11 and the second housing portion 12 are engaged by a first snap-fit ​​assembly. The first snap-fit ​​assembly includes a first snap-fit ​​protrusion 121 and a snap-fit ​​hole 111. The first snap-fit ​​protrusion 121 is disposed in one of the first housing portion 11 and the second housing portion 12, and the snap-fit ​​hole 111 is disposed in the other of the first housing portion 11 and the second housing portion 12. Specifically, in this embodiment, the side wall of the first housing portion 11 is provided with snap-fit ​​holes 111 that penetrate the side wall, and multiple snap-fit ​​holes 111 are provided along the length direction. The outer side wall of the second housing portion 12 is provided with multiple first snap-fit ​​protrusions 121 corresponding to the snap-fit ​​holes 111, and the first snap-fit ​​protrusions 121 have a hemispherical structure. When the first housing portion 11 and the second housing portion 12 are fastened together, the side wall of the first housing portion 11 is located outside the side wall of the second housing portion 12, and at this time, the first snap-fit ​​protrusions 121 are engaged in the snap-fit ​​holes 111. In other embodiments, the snap-fit ​​hole 111 can also be a blind hole, and the first snap-fit ​​protrusion 121 can also be of other shapes. The snap-fit ​​hole 111 and the first snap-fit ​​protrusion 121 can also be interchanged and respectively disposed on the second housing part 12 and the first housing part 11. The above structure allows for the assembly of the housing 10 without tools, which is convenient and quick.

[0037] In other embodiments, the first housing portion 11 and the second housing portion 12 may also be detachably connected by bolts or other structures.

[0038] Optionally, a metal protrusion 122 is provided on the inner side of the housing 10. The metal protrusion 122 is configured to be grounded and in contact with the electronic device 2. Specifically, the metal protrusion 122 is disposed on the inner side of the second housing portion 12 and between the heat sink 20 and the electronic device 2. The metal protrusion 122 is a circular protrusion. The metal protrusion 122 can discharge static electricity from the electronic device 2, protecting the electronic device 2. At the same time, it can also cooperate with the electronic device 2 to position the electronic device 2. In other embodiments, the metal protrusion 122 may also have other shapes.

[0039] It should be noted that, in order to avoid the metal protrusion 122, the heat sink 20 is provided with a relief groove 21 corresponding to the metal protrusion 122 and fits into the electronic device 2 to ensure the heat dissipation area.

[0040] Optionally, the inner wall of the housing 10 is provided with an electromagnetic shielding layer. Specifically, the electromagnetic shielding layer can be made of anodized material and coated on the inner wall of the housing 10, but care should be taken to avoid the metal protrusions 122.

[0041] Continuing with solid-state drives as an example, some embodiments of this application provide a scalable electronic device, see [link / reference]. Figures 3 to 5 , Figure 3 This is a perspective view of an embodiment of the electronic device of this application. Figure 4 This is a schematic diagram of the internal structure of an embodiment of the electronic device of this application. Figure 5This is a schematic diagram of the internal structure of another embodiment of the electronic device of this application. The expandable electronic device includes the expansion structure 1 and the electronic device 2 of any of the foregoing embodiments. The electronic device 2 is disposed in the mounting cavity 10a. The electronic device 2 includes an interface 201, which is located at the end of the electronic device 2 along the length direction and is exposed outside the housing 10.

[0042] This application only illustrates the example of electronic device 2 being a solid-state drive and does not limit the type of electronic device 2. In some implementations, electronic device 2 may include at least one of memory, solid-state drive, motherboard, graphics card, sound card, and network card.

[0043] Optionally, the electronic device 2 and the housing 10 are engaged via a second snap-fit ​​assembly. This snap-fit ​​arrangement facilitates the disassembly and assembly of the housing 10 and the electronic device 2, and makes the installation and replacement of the electronic device 2 easier. Specifically, in this embodiment, the second snap-fit ​​assembly is respectively disposed on the side wall of the second housing portion 12 and the side wall of the electronic device 2.

[0044] Optionally, the second snap-fit ​​assembly is configured to limit the relative position of the electronic device 2 and the housing 10 in the first direction X. The housing 10 is provided with a limiting member 123 extending into the mounting cavity 10a. The limiting member 123 is configured to limit the relative position of the electronic device 2 and the housing 10 in the thickness direction Z. Specifically, in this embodiment, the limiting member 123 is disposed on the side wall of the second housing portion 12. One end of the limiting member 123 is connected to the side wall, and the other end is bent inward, such that the limiting member 123 is spaced apart from the bottom wall of the second housing portion 12. The limiting member 123 is located above the substrate 202 of the electronic device 2, limiting the electronic device 2 in the Z direction. The electronic device 2 is limited in the X direction by the second snap-fit ​​assembly, and in the Y direction by the side wall of the housing 10. The electronic device 2 can be inserted into the housing 10 along the first direction through the opening 10c until the electronic device 2 is snap-fitted into the housing 10 by the second snap-fit ​​assembly. The above structure allows for tool-free assembly of the housing 10, which is convenient and quick.

[0045] In one embodiment, see Figure 4The second snap-fit ​​assembly includes a snap-fit ​​groove 203 and a second snap-fit ​​protrusion 124. The snap-fit ​​groove 203 is disposed on the side wall of the electronic device 2, and the second snap-fit ​​protrusion 124 is disposed on the inner side wall of the housing 10. Specifically, in this embodiment, the two snap-fit ​​grooves 203 are respectively disposed on the ends of the two side walls of the substrate 202 of the electronic device 2 away from the interface 201. The second snap-fit ​​protrusion 124 is disposed on the inner side of the two side walls of the second housing portion 12 corresponding to the snap-fit ​​groove 203, and the second snap-fit ​​protrusion 124 is hemispherical. When the electronic device 2 is pushed into the mounting cavity 10a along the first direction X, the snap-fit ​​groove 203 gradually approaches the second snap-fit ​​protrusion 124 and finally completes the snap-fit ​​through elastic deformation. At this time, the electronic device 2 and the housing 10 are fixed.

[0046] In another embodiment, see Figure 5 The second snap-fit ​​assembly includes a snap-fit ​​groove 203 and an elastic snap-fit ​​member 125. The snap-fit ​​groove 203 is disposed on the side wall of the electronic device 2. One end of the elastic snap-fit ​​member 125 is connected to the side wall of the electronic device 2, and the other end extends into the mounting cavity 10a. Specifically, in this embodiment, the snap-fit ​​groove 203 can be the same as in the previous embodiment, and the elastic snap-fit ​​member 125 can be achieved by cutting a portion of the side wall of the second snap-fit ​​protrusion 124. The end of the elastic snap-fit ​​member 125 away from the heat dissipation cavity 10b is connected to the side wall, and the other end is a free end that extends obliquely towards the end closer to the heat dissipation cavity 10b. The elastic snap-fit ​​member 125 has a certain elastic deformation capability. When the electronic device 2 is pushed into the mounting cavity 10a along the first direction X, the snap-fit ​​groove 203 gradually approaches the elastic snap-fit ​​member 125. The side wall of the electronic device 2 pushes the elastic snap-fit ​​member 125 outward. When the free end of the elastic snap-fit ​​member 125 moves to correspond with the snap-fit ​​groove 203, the elastic snap-fit ​​member 125 snaps into the snap-fit ​​groove 203 inward. At this time, the electronic device 2 and the housing 10 are fixed.

[0047] The electronic device 2 also includes a first metal positioning part 204 disposed along the length direction opposite to the interface 201, the first metal positioning part 204 being in contact with the metal protrusion 122. Specifically, the first metal positioning part 204 is a concave semi-circular arc groove, and a metal layer is provided in the groove. The metal layer is in contact with the metal protrusion 122 to discharge static electricity through the metal protrusion 122, and at the same time to position the electronic device 2.

[0048] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. An extension structure for an electronic device, characterized in that, include: The housing includes a mounting portion and an extension portion distributed along a first direction. The mounting portion has a mounting cavity for mounting the electronic device, and the mounting cavity communicates with the outside of the housing. The extension portion has a heat dissipation cavity, and the heat dissipation cavity communicates with the mounting cavity. The first direction is the length direction of the electronic device. A heat sink is disposed within the heat dissipation cavity.

2. The extended structure of the electronic device according to claim 1, characterized in that, The housing has a window on one side that communicates with the mounting cavity. The window is configured to expose part of the electronic device, and the side of the housing with the window is flush with the surface of the electronic device.

3. The extended structure of the electronic device according to claim 1, characterized in that, The housing includes a first housing portion and a second housing portion. The second housing portion is disposed on one side of the first housing portion along the thickness direction. The first housing portion and the second housing portion are detachably connected. The first housing portion and the second housing portion together form the mounting cavity and the heat dissipation cavity.

4. The extended structure of the electronic device according to claim 3, characterized in that, The first housing portion and the second housing portion are engaged by a first snap-fit ​​assembly. The first snap-fit ​​assembly includes a first snap-fit ​​protrusion and a snap-fit ​​hole. The first snap-fit ​​protrusion is disposed in one of the first housing portion and the second housing portion, and the snap-fit ​​hole is disposed in the other of the first housing portion and the second housing portion.

5. The extended structure of the electronic device according to claim 3, characterized in that, The inner side of the housing has a metal protrusion, which is configured to be grounded and attached to the electronic device.

6. The extended structure of the electronic device according to claim 1, characterized in that, The housing is configured to be detachably connected to the electronic device.

7. The extended structure of the electronic device according to claim 1, characterized in that, The inner wall of the shell is provided with an electromagnetic shielding layer.

8. An expandable electronic device, characterized in that, include: The extended structure as described in any one of claims 1-7; An electronic device is disposed in the mounting cavity, the electronic device including an interface located at an end of the electronic device along its length and exposed outside the housing.

9. The expandable electronic device according to claim 8, characterized in that, The electronic device and the housing are engaged via a second snap-fit ​​assembly.

10. The expandable electronic device according to claim 9, characterized in that, The second snap-fit ​​assembly is configured to define the relative position of the electronic device and the housing in the first direction. The housing is provided with a limiting member that extends into the mounting cavity and is configured to define the relative position of the electronic device and the housing in the thickness direction.

11. The expandable electronic device according to claim 9, characterized in that, The second snap-fit ​​assembly includes a snap-fit ​​groove and a second snap-fit ​​protrusion. The snap-fit ​​groove is disposed on the side wall of the electronic device, and the second snap-fit ​​protrusion is disposed on the inner side of the side wall of the housing.

12. The expandable electronic device according to claim 9, characterized in that, The second snap-fit ​​assembly includes a snap-fit ​​groove and a resilient snap-fit ​​member. The snap-fit ​​groove is disposed on the side wall of the electronic device, and one end of the resilient snap-fit ​​member is connected to the side wall of the electronic device, while the other end extends into the mounting cavity.

13. The expandable electronic device according to claim 8, characterized in that, The electronic device further includes a first metal positioning part disposed opposite to the interface along the length direction, the first metal positioning part being in contact with a metal protrusion.

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