A heat sink structure with shielding function

Abstract

The utility model belongs to the electron and electric heat dissipation technical field especially relates to a radiator structure with shielding function, include: form a plurality of shielding cavities on base, first heat pipe is welded with base, second heat pipe is welded with base, and the heat dissipation mechanism includes the base plate and fin of integrated mould, and the fin has a plurality and is arranged on the base plate, and the surface of base plate is away from the fin respectively with first heat pipe, second heat pipe welding. This radiator structure forms a plurality of shielding cavities on base, these shielding cavities can cover on the heating electronic component, play electromagnetic shielding effect, and the base is welded between the heat dissipation mechanism through two heat pipes, and the heat also passes through heat pipe transmission, and such design can increase the heat transfer flux, and be applicable to high -power device.

Description

Technical Field

[0001] This application relates to the field of electronic and electrical heat dissipation technology, and in particular to a heat sink structure with shielding function. Background Technology

[0002] As the power consumption of electronic components increases, heat generation also becomes more severe, especially in high-performance electronic and electrical products, where temperature has become a crucial factor affecting performance. Most common electronic and electrical products on the market employ air cooling, making heat sinks a key component for heat dissipation in electronic components.

[0003] In existing technologies, heat sinks and shielding structures are mostly designed separately. One approach is to first assemble a heat sink around the electronic components to dissipate heat, and then add an additional metal shielding cover to achieve shielding. This approach requires a separate assembly space, which increases the size of the equipment. Furthermore, the assembly gap between the heat sink and the shielding cover can easily create an electromagnetic leakage channel. At the same time, the shielding cover can obstruct airflow and reduce heat dissipation efficiency. Another approach is to coat the surface of the heat sink with an electromagnetic shielding coating. However, this coating is prone to wear and peeling due to long-term high temperatures and vibrations, which leads to a decrease in shielding performance. Moreover, if the coating is too thick, it will increase thermal resistance and affect the heat dissipation effect. If it is too thin, it will not meet the shielding requirements, making it difficult to balance the long-term reliability of heat dissipation and shielding.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] In view of at least one of the above technical problems, this application provides a heat sink structure with shielding function.

[0006] This application provides a heat sink structure with shielding function, including: The base has multiple shielding cavities formed on it. The first heat pipe is welded to the base. The second heat pipe is welded to the base. The heat dissipation mechanism includes an integrally formed substrate and fins. The fins are multiple and arranged in an array on the substrate. The surface of the substrate opposite to the fins is welded to a first heat pipe and a second heat pipe, respectively.

[0007] This heat sink structure features multiple shielding cavities formed on the base, which can cover heat-generating electronic components to provide electromagnetic shielding. The base and the heat dissipation mechanism are connected by two heat pipes, and heat is also transferred through the heat pipes. This design increases the heat transfer flux, making it suitable for high-power devices. Furthermore, the base and heat dissipation mechanism are welded to the heat pipes respectively, ensuring low thermal resistance and connection strength along the heat transfer path. Finally, this heat sink structure integrates shielding and heat dissipation functions, significantly saving internal space and reducing the number of parts and assembly steps.

[0008] In some possible implementations, a heat-conducting medium is provided in the shielding cavity.

[0009] In some possible implementations, mounting holes are provided at the corners of the base.

[0010] In some possible implementations, the base is provided with a first L-shaped groove that mates with the first heat pipe, and the base is provided with a second L-shaped groove that mates with the second heat pipe, with the first L-shaped groove and the second L-shaped groove being spaced apart.

[0011] In some possible implementations, a first embedding groove cooperating with a first heat pipe is provided on the surface of the substrate away from the fins, and a second embedding groove cooperating with a second heat pipe is provided on the surface of the substrate away from the fins, with the first embedding groove and the second embedding groove being spaced apart.

[0012] In some possible implementations, the ratio of fin thickness to the spacing between two adjacent fins is 1:2.

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a first structural schematic diagram of the heat sink structure provided in an embodiment of this application; Figure 2 This is a second structural schematic diagram of the heat sink structure provided in the embodiments of this application; Figure 3 This is an exploded view of the heat sink structure provided in an embodiment of this application; In the diagram: 100, base; 110, shielding cavity; 120, heat-conducting medium; 130, mounting hole; 140, first L-shaped groove; 150, second L-shaped groove; 200, First heat pipe; 300, Second heat pipe; 400. Heat dissipation mechanism; 410. Substrate; 420. Fins; Detailed Implementation

[0016] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0017] In existing technologies, heat sinks and shielding structures are mostly designed as separate units. One approach involves first assembling a heat sink around the electronic components for heat dissipation, and then adding an additional metal shielding cover for shielding. This solution requires a separate assembly space, leading to an increase in equipment size. Furthermore, the gap between the heat sink and the shielding cover can easily create an electromagnetic leakage path, and the shielding cover can obstruct airflow, reducing heat dissipation efficiency. Another approach involves coating the heat sink surface with an electromagnetic shielding coating. However, this coating is prone to wear and peeling due to long-term high temperatures and vibrations, resulting in a decrease in shielding performance. Excessive coating thickness increases thermal resistance, affecting heat dissipation, while insufficient thickness fails to meet shielding requirements, making it difficult to balance the long-term reliability of both heat dissipation and shielding. In summary, there is currently a lack of a heat sink structure with high integration that can simultaneously and stably achieve efficient heat dissipation and reliable electromagnetic shielding, while also meeting the miniaturization requirements of electronic devices.

[0018] Please see Figure 1 , Figure 2 , Figure 3 ,in, Figure 1 This is a first structural diagram of the heat sink structure provided in an embodiment of this application. Figure 2 This is a second structural schematic diagram of the heat sink structure provided in an embodiment of this application. Figure 3 This is an exploded view of a heat sink structure provided in an embodiment of this application. One embodiment provides a heat sink structure with shielding function, including: a base 100, a first heat pipe 200, a second heat pipe 300, and a heat dissipation mechanism 400.

[0019] The following is a detailed description of the specific structure of the radiator.

[0020] like Figures 1 to 3 As shown, multiple shielding cavities 110 are formed on the base 100. The base 100 is a pure copper component, which can improve thermal conductivity, and adopts a nickel plating process to reduce surface roughness and improve thermal radiation performance.

[0021] The first heat pipe 200 is welded to the base 100. The first heat pipe 200 is an L-shaped heat pipe. One end of the first heat pipe 200 is welded to the base 100, and the other end of the first heat pipe 200 is welded to the substrate 410.

[0022] Specifically, the first heat pipe 200 includes a first horizontal segment, a second horizontal segment, a first vertical segment, and a third horizontal segment connected in sequence. The first and second horizontal segments are both welded to the base 100, the first vertical segment is perpendicular to the second horizontal segment, and the third horizontal segment is parallel to the first horizontal segment. The third horizontal segment is welded to the substrate 410 of the heat dissipation mechanism 400. In addition, the first horizontal segment extends along the width direction of the base 100, and the second horizontal segment extends along the length direction of the base 100, which increases the heat conduction area and enhances the welding strength.

[0023] The second heat pipe 300 is welded to the base 100. The second heat pipe 300 is an L-shaped heat pipe. One end of the second heat pipe 300 is welded to the base 100, and the other end of the second heat pipe 300 is welded to the substrate 410.

[0024] Specifically, the second heat pipe 300 includes a fourth horizontal segment, a fifth horizontal segment, a second vertical segment, and a sixth horizontal segment connected in sequence. The fourth and fifth horizontal segments are both welded to the base 100, the second vertical segment is perpendicular to the fifth horizontal segment, and the sixth horizontal segment is parallel to the fourth horizontal segment. The sixth horizontal segment is welded to the substrate 410 of the heat dissipation mechanism 400. Furthermore, the fourth horizontal segment extends along the width direction of the base 100, and the fifth horizontal segment extends along the length direction of the base 100, which increases the heat conduction area and enhances the welding strength.

[0025] The heat dissipation mechanism 400 includes an integrally formed substrate 410 and fins 420. There are multiple fins 420 arranged in an array on the substrate 410. The surface of the substrate 410 opposite to the fins 420 is welded to the first heat pipe 200 and the second heat pipe 300 respectively.

[0026] Both the substrate 410 and the fins 420 are made of aluminum alloy, which reduces weight, and the use of nickel plating reduces surface roughness and improves thermal radiation performance.

[0027] The substrate has multiple mounting holes for fixing to electronic and electrical products using fasteners such as screws.

[0028] This heat sink structure features multiple shielding cavities 110 formed on the base 100. These shielding cavities 110 can cover heat-generating electronic components, providing electromagnetic shielding. The base 100 and the heat dissipation mechanism 400 are connected by two heat pipes, and heat is also transferred through the heat pipes. This design increases the heat transfer flux, making it suitable for high-power devices. Furthermore, the base 100 and the heat dissipation mechanism 400 are respectively connected to the heat pipes, ensuring low thermal resistance and connection strength along the heat transfer path. Finally, this heat sink structure integrates shielding and heat dissipation functions, significantly saving internal space and reducing the number of parts and assembly steps.

[0029] like Figures 1 to 3 As shown, in some embodiments, a thermally conductive medium 120 is disposed in the shielding cavity 110. The thermally conductive medium 120 can be attached to the electronic components to conduct heat.

[0030] like Figures 1 to 3 As shown, in some embodiments, mounting holes 130 are provided at the corners of the base 100. The mounting holes 130 are used to fix the heat sink.

[0031] like Figures 1 to 3 As shown, in some embodiments, the base 100 is provided with a first L-shaped groove 140 that cooperates with the first heat pipe 200, and the base 100 is provided with a second L-shaped groove 150 that cooperates with the second heat pipe 300. The first L-shaped groove 140 and the second L-shaped groove 150 are spaced apart.

[0032] like Figures 1 to 3 As shown, in some embodiments, the surface of the substrate 410 opposite to the fin 420 is provided with a first embedding groove that cooperates with the first heat pipe 200, and the surface of the substrate 410 opposite to the fin 420 is provided with a second embedding groove that cooperates with the second heat pipe 300. The first embedding groove and the second embedding groove are provided at intervals.

[0033] The first and second embedding slots provide a stable position for the heat pipe on the heat dissipation substrate. During the soldering process, the heat pipe is fixed within the slot, and the solder can evenly fill the gap between the heat pipe and the slot wall, forming a full and reliable weld, ensuring a strong mechanical connection and extremely low thermal resistance. The partial or complete embedding of the heat pipe into the substrate slot increases the contact area between the heat pipe's condenser end and the substrate. This allows heat conducted from the heat pipe to diffuse more quickly and fully throughout the entire substrate, and then to the dense fin array, greatly improving the end-efficiency heat dissipation.

[0034] like Figures 1 to 3As shown, in some embodiments, the ratio of the thickness of the fin 420 to the spacing between two adjacent fins 420 is 1:2. Thus, within a limited space, thinner fins and smaller spacing allow for the arrangement of more fins, resulting in a larger total heat dissipation area. However, excessively small spacing leads to a sharp increase in wind resistance, hindering airflow and reducing the convective heat transfer coefficient. A 1:2 thickness-to-spacing ratio ensures sufficient heat dissipation area while allowing smooth airflow, maximizing heat dissipation efficiency per unit volume.

[0035] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0036] In the description of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0037] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0038] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In the embodiments of this application, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0040] The above are merely preferred embodiments of this application and do not constitute any limitation on this application. Any person skilled in the art can make many possible variations and modifications to the technical solution of this application, or modify it into equivalent embodiments, without departing from the scope of the technical solution of this application. Therefore, all equivalent changes made based on the shape, structure, and principle of this application without departing from the content of the technical solution of this application should be covered within the protection scope of this application.

Claims

1. A heat sink structure with shielding function, characterized in that, include: A base, on which multiple shielding cavities are formed; A first heat pipe, which is welded to the base; A second heat pipe is welded to the base; The heat dissipation mechanism includes an integrally formed substrate and fins. The fins are multiple and arranged in an array on the substrate. The surface of the substrate opposite to the fins is welded to the first heat pipe and the second heat pipe, respectively.

2. The heat sink structure with shielding function according to claim 1, characterized in that, The shielding cavity is equipped with a heat-conducting medium.

3. The heat sink structure with shielding function according to claim 1, characterized in that, The base has mounting holes at its corners.

4. The heat sink structure with shielding function according to claim 1, characterized in that, The base is provided with a first L-shaped groove that mates with the first heat pipe, and the base is provided with a second L-shaped groove that mates with the second heat pipe. The first L-shaped groove and the second L-shaped groove are spaced apart.

5. The heat sink structure with shielding function according to claim 1, characterized in that, The substrate has a first embedding groove on the surface opposite to the fins that cooperates with the first heat pipe, and a second embedding groove on the surface opposite to the fins that cooperates with the second heat pipe. The first embedding groove and the second embedding groove are spaced apart.

6. The heat sink structure with shielding function according to claim 1, characterized in that, The thickness of the fin is in a ratio of 1 to 2 to the distance between two adjacent fins.

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