High-efficiency air-cooled heat dissipation device for power electronic components

Abstract

The utility model discloses power electronic component high -efficient air -cooled heat abstractor belongs to power electronic heat dissipation technical field, including heat dissipation fin, heat pipe, base plate, control element, fan and connecting frame still includes metal pressing sheet, connecting plate and insulating spacer, and heat pipe is fixed in heat dissipation fin, and is connected with control element, and metal pressing sheet is engaged in the middle segment of heat pipe and is fixed in the outer wall of heat dissipation fin, and connecting plate is fixed in the front side of heat pipe, and connecting frame is fixed in connecting plate, and fan is installed in connecting frame, and the inner wall of connecting plate is fixedly connected with insulating spacer. The utility model discloses through setting up metal pressing sheet, has solved the problem of heat pipe and heat dissipation fin contact badly, heat conduction efficiency decline because of vibration, has strengthened structural stability, and simultaneously, through setting up insulating spacer, has solved the electrical short circuit risk between fan mounting support and base plate, has improved the operation safety of device.

Description

Technical Field

[0001] This utility model relates to the field of power electronic heat dissipation technology, and in particular to a high-efficiency air-cooled heat dissipation device for power electronic components. Background Technology

[0002] Power electronic components, such as high-power transistors, thyristors, and IGBT modules, are core devices for power conversion and control. During their operation, a large amount of heat is generated due to switching losses and conduction losses. If this heat cannot be dissipated in a timely and effective manner, the junction temperature of the components will be too high, which will affect the stability and reliability of their operation, and in severe cases, may even cause permanent damage.

[0003] To solve this heat dissipation problem, existing technologies generally adopt an active air cooling solution that combines heat pipes with heat sinks and fans. The basic principle is to use the extremely high thermal conductivity of heat pipes to quickly transfer the heat generated by power electronic components to large-area heat sinks, and then use the forced convection air generated by the fan to carry away the heat. This method has a good heat dissipation effect in the initial state.

[0004] However, in practical applications, especially in environments with mechanical vibration or impact, such as industrial frequency converters and new energy vehicles, the interface between heat pipes and heat sink fins, which are traditionally fixed by pressing or welding, is prone to microscopic loosening or gap formation after long-term exposure to vibration stress and alternating thermal expansion and contraction. This loosening significantly increases the contact thermal resistance between the two, forming a heat conduction bottleneck. This prevents heat from being smoothly transferred from the heat pipe to the heat sink fin, ultimately leading to a significant decrease in the heat dissipation efficiency of the entire heat dissipation device, which cannot meet the requirements for long-term stable operation of power electronic components.

[0005] Therefore, this utility model proposes a high-efficiency air-cooled heat dissipation device for power electronic components to overcome the shortcomings of the prior art. Utility Model Content

[0006] In view of the problems in the existing technology of high-efficiency air-cooled heat dissipation devices for power electronic components, such as poor contact due to vibration, reduced thermal conductivity, and electrical short circuit risk between the fan mounting bracket and the substrate, this utility model aims to provide a high-efficiency air-cooled heat dissipation device for power electronic components with an improved structure that can effectively solve the above problems.

[0007] This utility model provides a high-efficiency air-cooled heat dissipation device for power electronic components, including: heat sink fins, heat pipes, substrate, control components, fan and connecting frame; as well as metal pressure plate, connecting plate and insulating pad.

[0008] The metal clip has an arc-shaped groove that fits the outer wall of the heat pipe, and the metal clip is engaged with the middle section of the heat pipe through the arc-shaped groove.

[0009] Furthermore, the heat sink fins, heat pipes, and metal clamps are combined in the following way: the heat pipes are fixedly connected to the outer wall of the heat sink fins, and the metal clamps are engaged with the middle section of the heat pipes and simultaneously fixedly connected to the outer wall of the heat sink fins, in order to ensure continuous tight contact between the heat sink fins and the heat pipes while preventing misalignment of the heat pipes; the connecting plate is combined with the heat pipes by a fixed connection, and the connecting plate is fixedly connected to the front part of the heat pipes; the insulating gasket is combined with the connecting plate by a fixed connection, and the insulating gasket is fixedly connected to the inner wall of the connecting plate, used to separate the connecting plate from the base plate to prevent short circuits; the fan is set in the space formed by the connecting bracket, and the connecting bracket is fixedly connected to the front side of the connecting plate.

[0010] Preferably, connecting rods are fixedly connected to the four corners of the connecting frame, and the connecting rods are used to form the support structure of the connecting frame.

[0011] Preferably, the high-efficiency air-cooled heat dissipation device for power electronic components further includes a fixing block, which is fixedly connected with the connecting rod to form a space for placing a fan between the two connecting frames.

[0012] Preferably, the high-efficiency air-cooling heat dissipation device for power electronic components also includes screws, which are threadedly connected to the four corners of the substrate and are used to reinforce the substrate.

[0013] Preferably, the outer wall of the control element is provided with heat dissipation holes, which are used to assist the control element in dissipating heat.

[0014] Preferably, the heat pipe passes through the substrate, with one end of the heat pipe connected to a control element and the other end connected to a heat dissipation fin.

[0015] Preferably, the metal pressure plate achieves precise engagement with the heat pipe by having an arc-shaped groove that fits the outer wall of the heat pipe.

[0016] Preferably, an insulating gasket is disposed between the connecting plate and the substrate. The insulating gasket is made of a non-conductive material, which effectively improves the electrical isolation effect.

[0017] This utility model has the following beneficial effects:

[0018] 1. This utility model solves the problem in the prior art that the heat pipe and heat dissipation fins are prone to poor contact and reduced heat conduction efficiency due to vibration or thermal expansion and contraction of the heat dissipation device. It achieves the effect of enhancing the stability of the heat dissipation structure and ensuring efficient heat conduction.

[0019] 2. This utility model solves the problem of electrical short circuit that may occur due to accidental contact between the fan mounting bracket and the base plate in the prior art by setting an insulating gasket on the inner wall of the connecting plate, thereby achieving the effect of electrical insulation and improving the overall operational safety of the device.

[0020] 3. This utility model, by coordinating the design of the connecting plate, connecting frame, connecting rod and fixing block to form a complete fan fixing assembly, solves the problem of the fragmented and unstable fan installation structure in the prior art, and achieves a more compact and reasonable overall structure, which is convenient for installation and maintenance, and ensures that the fan can operate stably to provide a continuous and efficient air cooling effect. Attached Figure Description

[0021] Figure 1 This is a front perspective view of the high-efficiency air-cooled heat dissipation device for power electronic components proposed in this utility model;

[0022] Figure 2 This is a partial structural diagram of the heat pipe of the high-efficiency air-cooled heat dissipation device for power electronic components proposed in this utility model;

[0023] Figure 3 This is a partial structural diagram of the control element of the high-efficiency air-cooled heat dissipation device for power electronic components proposed in this utility model;

[0024] Figure 4 This is a partial structural diagram of the metal plate of the high-efficiency air-cooled heat dissipation device for power electronic components proposed in this utility model.

[0025] Legend:

[0026] 1. Heat sink fins; 2. Heat pipes; 3. Metal plates; 4. Screws; 5. Base plate; 6. Control components; 7. Fan; 8. Mounting block; 9. Heat dissipation holes; 10. Connecting rods; 11. Connecting brackets; 12. Connecting plates; 13. Insulating pads. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0028] Example:

[0029] Please refer to Figures 1 to 4This utility model provides a high-efficiency air-cooled heat dissipation device for power electronic components, which aims to solve the problems in the prior art where the heat pipe 2 and the heat dissipation fin 1 have poor contact due to vibration, resulting in a decrease in heat conduction efficiency, and there is a risk of electrical short circuit between the fan 7 and the substrate 5.

[0030] like Figure 1 As shown, the high-efficiency air-cooled heat dissipation device for power electronic components includes heat dissipation fins 1 and a base plate 5 fixedly connected to the bottom of the heat dissipation fins 1. The base plate 5 is used to support the heat dissipation structure at the top and fix the control element 6 at the bottom. The control element 6 is the heat source that needs to be dissipated. The outer wall of the control element 6 is provided with heat dissipation holes 9, which are used to assist the control element 6 in dissipating heat itself.

[0031] like Figure 1 and Figure 2 As shown, heat pipe 2 serves as the core heat-conducting component. Heat pipe 2 is fixedly connected to the outer wall of heat dissipation fin 1. At the same time, heat pipe 2 passes through substrate 5 and is fixedly connected to control element 6 at the bottom of substrate 5. One end of heat pipe 2 is connected to control element 6, and the other end is connected to heat dissipation fin 1, thereby constructing a fast heat conduction channel from control element 6 to heat dissipation fin 1.

[0032] The high-efficiency air-cooled heat dissipation device for power electronic components also includes a metal plate 3. The metal plate 3 forms a specific structural fit and connection relationship with the heat pipe 2 and the heat dissipation fins 1. At the same time, electrical safety is ensured by setting an insulating pad 13.

[0033] like Figure 4 As shown, the metal plate 3 has an arc-shaped groove that fits the outer wall of the heat pipe 2. The metal plate 3 is engaged and connected to the middle section of the heat pipe 2 through its arc-shaped groove, and is also fixedly connected to the outer wall of the heat dissipation fin 1. This dual connection method of engagement and fixation provides reliable positioning for the heat pipe 2, prevents the heat pipe 2 from being misaligned due to vibration or impact during operation, and ensures that the heat pipe 2 and the heat dissipation fin 1 always maintain close contact, thereby ensuring efficient and stable heat conduction.

[0034] like Figure 1 and Figure 3 As shown, the high-efficiency air-cooled heat dissipation device for power electronic components also includes a connecting plate 12, which is fixedly connected to the front part of the heat pipe 2. An insulating gasket 13 is fixedly connected to the inner wall of the connecting plate 12. The insulating gasket 13 is made of non-conductive material and is disposed between the connecting plate 12 and the substrate 5 to separate the connecting plate 12 and the substrate 5. This insulating structure effectively prevents the risk of electrical short circuit caused by accidental contact under complex working conditions, and greatly improves the operational safety of the device.

[0035] In a preferred embodiment, to securely mount the fan 7, the fan 7 mounting assembly includes a connecting bracket 11, which is fixedly connected to the front side of the connecting plate 12. To construct the support structure of the connecting bracket 11, connecting rods 10 are fixedly connected to the four corners of the connecting bracket 11. To form a space between the two connecting brackets 11 for placing the fan 7, the device also includes a fixing block 8, which is fixedly connected to the connecting rods 10, thereby securely mounting the fan 7 to the side of the heat sink fins 1 to provide forced airflow.

[0036] As another preferred embodiment, in order to further reinforce the entire device, screws 4 are threaded to the four corners of the substrate 5, and the substrate 5 can be securely mounted on the equipment chassis or other mounting surface by means of the screws 4.

[0037] As another preferred embodiment, in order to enhance the heat dissipation capacity of the control element 6, heat dissipation holes 9 are provided on the outer wall of the control element 6. The heat dissipation holes 9 help the heat generated inside the control element 6 to be initially dissipated through air convection.

[0038] Working principle:

[0039] When the device is working, the control element 6 generates a large amount of heat as the main heat source. Some of the heat is initially dissipated naturally through the heat dissipation holes 9 on its outer wall, but most of the core heat needs to be efficiently conducted and dissipated through this device. The heat pipe 2 is tightly connected to the control element 6 and uses its efficient phase change heat transfer characteristics to quickly absorb the heat generated by the control element 6 and conduct it upwards to the large-area heat dissipation fin array 1.

[0040] During the heat conduction process, the metal plate 3 plays a crucial role in structural stability and thermal conductivity assurance. It engages with the middle section of the heat pipe 2 through its arc-shaped slot and is simultaneously fixed to the heat dissipation fin 1. This structure ensures a lasting and tight physical contact between the heat pipe 2 and the heat dissipation fin 1, effectively avoiding contact gaps caused by equipment vibration or thermal expansion and contraction. This solves the problem of decreased thermal conductivity and ensures that heat can be continuously and efficiently transferred from the heat pipe 2 to the heat dissipation fin 1.

[0041] Once the heat is evenly distributed on the heat dissipation fins 1, the fan 7, which is fixed by the connecting bracket 11, connecting rod 10, and fixing block 8, starts up, generating forced convection air. The airflow flows at high speed through the gaps in the heat dissipation fins 1, quickly carrying away the heat from the fins, thus completing the entire process of efficient air cooling. During this process, the insulating gasket 13 fixed to the inner wall of the connecting plate 12 effectively isolates the fan 7 mounting assembly from the base plate 5, preventing the risk of electrical short circuits and ensuring the safe operation of the device. The entire device is finally installed and fixed by the screws 4 on the base plate 5.

Claims

1. A high-efficiency air-cooled heat dissipation device for power electronic components, comprising: Heat dissipation fins (1); Heat pipe (2), which is fixedly connected to the outer wall of the heat dissipation fins (1); The substrate (5) is fixedly connected to the bottom of the heat dissipation fins (1); A control element (6) is fixedly connected to the bottom of the substrate (5) via the heat pipe (2); Fan (7); A connecting frame (11) is provided, and the fan (7) is disposed within the space formed by the connecting frame (11); Its features are, It also includes a metal plate (3), which is engaged with the middle section of the heat pipe (2) and is also fixedly connected to the outer wall of the heat dissipation fins (1) to prevent the heat pipe (2) from being misaligned and to ensure close contact. It also includes a connecting plate (12), which is fixedly connected to the front part of the heat pipe (2), and the connecting bracket (11) is fixedly connected to the front side of the connecting plate (12). An insulating gasket (13) is fixedly connected to the inner wall of the connecting plate (12). The insulating gasket (13) is used to separate the connecting plate (12) from the substrate (5) to prevent short circuit.

2. The high-efficiency air-cooled heat dissipation device for power electronic components according to claim 1, characterized in that, Connecting rods (10) are fixedly connected to the four corners of the connecting frame (11), and the connecting rods (10) are used to form the support structure of the connecting frame (11).

3. The high-efficiency air-cooled heat dissipation device for power electronic components according to claim 2, characterized in that, It also includes a fixing block (8), which is fixedly connected to the connecting rod (10) to form a space for placing the fan (7) between the two connecting frames (11).

4. The high-efficiency air-cooled heat dissipation device for power electronic components according to claim 1, characterized in that, It also includes screws (4), which are threaded to the four corners of the substrate (5) and are used to reinforce the substrate (5).

5. The high-efficiency air-cooled heat dissipation device for power electronic components according to claim 1, characterized in that, The outer wall of the control element (6) is provided with heat dissipation holes (9), which are used to assist the control element (6) in dissipating heat.

6. The high-efficiency air-cooled heat dissipation device for power electronic components according to claim 1, characterized in that, The heat pipe (2) passes through the substrate (5), with one end of the heat pipe (2) connected to the control element (6) and the other end connected to the heat dissipation fins (1).

7. The high-efficiency air-cooled heat dissipation device for power electronic components according to claim 1, characterized in that, The metal plate (3) has an arc-shaped groove that fits the outer wall of the heat pipe (2), and the metal plate (3) is engaged and connected to the middle section of the heat pipe (2) through the arc-shaped groove.

8. The high-efficiency air-cooled heat dissipation device for power electronic components according to claim 1, characterized in that, The insulating pad (13) is disposed between the connecting plate (12) and the substrate (5), and the insulating pad (13) is made of a non-conductive material.

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