A power supply heat dissipation device

Abstract

The utility model relates to a kind of power supply heat dissipation device, it includes: shell, inside is equipped with multiple power modules, the side of each the power module is equipped with heat dissipation plate, the inside of the heat dissipation plate is equipped with cavity;Water distributor is equipped with water inlet and water outlet, the water distributor includes multiple water distribution pipes, each the water distribution pipe is connected to a the heat dissipation plate.By setting heat dissipation plate on the side of power module, by water distributor to inject cooling water into heat dissipation plate, good heat dissipation effect can be played, meet the heat dissipation demand of electrical device, guarantee the stability of electrical device.

Description

Technical Field

[0001] This utility model relates to the field of electrical equipment, specifically to a power supply heat dissipation device. Background Technology

[0002] Power supplies generate a significant amount of heat during operation. As equipment designs become increasingly compact and the space between electrical components shrinks, conventional natural cooling or forced air cooling is no longer sufficient to meet the heat dissipation requirements of these components. Furthermore, the higher the temperature of these heat-generating electrical components, the worse their stability. Therefore, it is necessary to propose a new power supply heat dissipation device to address these issues. Utility Model Content

[0003] Based on the above description, this utility model provides a power supply heat dissipation device to solve the problem that conventional natural cooling or forced air cooling in related technologies cannot meet the heat dissipation requirements of electrical devices.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A power supply heat dissipation device includes: a housing, which is provided with multiple power modules inside, each of the power modules is provided with a heat dissipation plate on one side, and the heat dissipation plate is provided with a cavity inside; a water distributor, which is provided with an inlet and an outlet, and the water distributor includes multiple water distribution pipes, each of the water distribution pipes being connected to one of the heat dissipation plates.

[0005] Based on the above technical solution, the present invention can be further improved as follows.

[0006] Furthermore, the heat sink has heat dissipation fins on the side away from the power module.

[0007] Furthermore, an mounting plate is installed inside the housing, and the water distributor is mounted on the mounting plate.

[0008] Furthermore, the power module has an electrical interface on its outer side, which extends out of the mounting plate.

[0009] Furthermore, the upper end of the heat sink is provided with a water inlet pipe, which passes through the upper end of the mounting plate, and the water distribution pipe is connected to the water inlet pipe.

[0010] Furthermore, the lower end of the heat sink is provided with a water outlet pipe, which passes through the lower end of the mounting plate and is connected to the water inlet pipe.

[0011] Furthermore, the power modules are arranged in multiple rows at intervals, with each row of power modules corresponding to one mounting plate.

[0012] Furthermore, the housing is provided with an opening, through which the water inlet and the water outlet extend.

[0013] Furthermore, a circuit board is provided on one side of the power module, and the heat sink is attached to the circuit board.

[0014] Furthermore, a control device is provided inside the housing, and the control device is signal-connected to the power module. Compared with the prior art, the technical solution of this application has the following beneficial technical effects: By installing a heat sink on one side of the power module and injecting cooling water into the heat sink through a water distributor, a good heat dissipation effect can be achieved, meeting the heat dissipation requirements of electrical components and ensuring the stability of electrical components. Attached Figure Description

[0015] Figure 1 A schematic diagram of the overall structure of the power supply heat dissipation device provided in the embodiment of this utility model; Figure 2 This is a schematic diagram of the internal structure of the power supply heat dissipation device provided in an embodiment of the present invention.

[0016] The attached diagram lists the components represented by each number as follows: 1. Housing; 2. Power module; 3. Heat sink; 4. Water distributor; 41. Inlet; 42. Outlet; 43. Water distribution pipe; 5. Heat dissipation fins; 6. Mounting plate; 7. Electrical interface; 8. Inlet pipe; 9. Outlet pipe; 10. Control device. Detailed Implementation

[0017] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0018] This utility model provides a power supply heat dissipation device that can solve the problem that conventional natural cooling or forced air cooling in related technologies cannot meet the heat dissipation requirements of electrical components.

[0019] See Figure 1 As shown in the figure, a power supply heat dissipation device according to an embodiment of the present invention includes: a housing 1, which houses multiple power modules 2, each power module 2 having a heat dissipation plate 3 on one side, and the heat dissipation plate 3 having a cavity inside; and a water distributor 4, which has an inlet 41 and an outlet 42, and includes multiple water distribution pipes 43, each water distribution pipe 43 being connected to one of the heat dissipation plates 3. By setting a heat dissipation plate 3 on one side of the power module 2 and injecting cooling water into the heat dissipation plate 3 through the water distributor 4, a good heat dissipation effect can be achieved, meeting the heat dissipation requirements of electrical components and ensuring the stability of electrical components.

[0020] See Figure 1 As shown, in some embodiments, the heat sink 3 is provided with heat dissipation fins 5 on the side away from the power module 2, which improves heat transfer efficiency and heat dissipation effect.

[0021] See Figure 1 As shown, in some embodiments, an mounting plate 6 is installed inside the housing 1, and the water distributor 4 is mounted on the mounting plate 6. The mounting plate 6 is fixed to the internal frame of the housing 1 and provides support for the water distributor 4.

[0022] See Figure 2 As shown, in some embodiments, the power module 2 is provided with an electrical interface 7 on its outer side, which extends out of the mounting plate 6 for easy removal and use.

[0023] See Figure 2 As shown, in some embodiments, the upper end of the heat sink 3 is provided with a water inlet pipe 8, the water inlet pipe 8 passes through the upper end of the mounting plate 6, the water distribution pipe 43 is connected to the water inlet pipe 8, and the mounting plate 6 can support the water inlet pipe 8, which facilitates the connection of the water distribution pipe 43.

[0024] See Figure 2 As shown, in some embodiments, the lower end of the heat sink 3 is provided with a water outlet pipe 9, which passes through the lower end of the mounting plate 6. The water distribution pipe 43 is connected to the water outlet pipe 9. The mounting plate 6 can support the water outlet pipe 9 and facilitate the connection of the water distribution pipe 43.

[0025] See Figure 1 As shown, in some embodiments, the power modules 2 are arranged in multiple rows at intervals, and each row of power modules 2 corresponds to one mounting plate 6, realizing a modular design, high space utilization, and good heat dissipation.

[0026] In some embodiments, the housing 1 is provided with an opening, through which the water inlet 41 and the water outlet 42 extend to facilitate connection to an external water pipe for heat dissipation.

[0027] In some embodiments, a circuit board is provided on one side of the power module 2, and the heat sink 3 is attached to the circuit board to dissipate heat from the circuit board and reduce the heat generated by the circuit board.

[0028] See Figure 1 As shown, in some embodiments, a control device 10 is provided inside the housing 1, and the control device 10 is signal-connected to the power module 2 for controlling the power module 2. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0029] It is understood that spatial relation terms such as "below," "under," "below," "below," "above," "above," etc., can be used here to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as "below" or "below" of the other element or feature will be oriented "above" the other element or feature. Therefore, the exemplary terms "below" and "below" can include both upper and lower orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0030] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. In the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have the transmission of electrical signals or data between them.

[0031] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0032] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A power supply heat dissipation device, characterized in that, It includes: The housing (1) has multiple power modules (2) inside, and each power module (2) has a heat sink (3) on one side, and the heat sink (3) has a cavity inside; The water distributor (4) is provided with an inlet (41) and an outlet (42). The water distributor (4) includes a plurality of water distribution pipes (43), each of which is connected to a heat sink (3).

2. The power supply heat dissipation device according to claim 1, characterized in that: The heat sink (3) has heat dissipation fins (5) on the side away from the power module (2).

3. The power supply heat dissipation device according to claim 1, characterized in that: An installation plate (6) is installed inside the housing (1), and the water distributor (4) is installed on the installation plate (6).

4. The power supply heat dissipation device according to claim 3, characterized in that: The power module (2) has an electrical interface (7) on its outer side, and the electrical interface (7) extends out of the mounting plate (6).

5. The power supply heat dissipation device according to claim 3, characterized in that: The upper end of the heat sink (3) is provided with a water inlet pipe (8), which passes through the upper end of the mounting plate (6), and the water distribution pipe (43) is connected to the water inlet pipe (8).

6. The power supply heat dissipation device according to claim 3, characterized in that: The lower end of the heat sink (3) is provided with a water outlet pipe (9), which passes through the lower end of the mounting plate (6), and the water distribution pipe (43) is connected to the water outlet pipe (9).

7. The power supply heat dissipation device according to claim 3, characterized in that: The power modules (2) are arranged in multiple columns at intervals, and each column of power modules (2) corresponds to one mounting plate (6).

8. The power supply heat dissipation device according to claim 1, characterized in that: The housing (1) has an opening, through which the inlet (41) and the outlet (42) protrude.

9. The power supply heat dissipation device according to claim 1, characterized in that: The power module (2) has a circuit board on one side, and the heat sink (3) is attached to the circuit board.

10. The power supply heat dissipation device according to claim 1, characterized in that: The housing (1) is equipped with a control device (10), which is connected to the power module (2).

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