Router air exhaust and heat dissipation mechanism

Abstract

The utility model discloses a router exhaust heat dissipation mechanism relates to the weak current equipment field, and the top cover of this scheme adopts gradient structure and is arranged with straight heat pipe through and pastes, and the both ends of heat pipe are equipped with the paster and fin respectively, can form the continuous efficient conduction path between the inner wall and the outer wall of top cover to heat. The top heat dissipation groove on top cover and the bottom heat dissipation groove of base bear the internal heat upwards and downwards respectively and distribute and radiate, and the heat of mainboard area and top area can be released in the structure inner part area. Through the gradient design expansion heat pipe pasting area, the linear conduction reduces the thermal resistance and the synergies of the multi -surface heat dissipation structure, make this scheme realize the high efficiency heat conduction and the quick heat dissipation in the limited thickness, and the heat dissipation performance and operating stability of router under the high load condition are improved significantly.

Description

Technical Field

[0001] This utility model relates to the field of low-voltage electrical equipment, and in particular to a router exhaust and heat dissipation mechanism. Background Technology

[0002] During long-term operation, routers continuously generate heat from their internal control chips, radio frequency modules, and power supply components. The compact design of routers limits internal space and airflow, causing heat to accumulate inside the casing and leading to a significant temperature rise. Existing structures typically rely on natural convection cooling or simple ventilation holes on the top and side walls. However, due to insufficient heat dissipation area and limited cooling paths, heat cannot be effectively transferred from high-heat areas to the outside of the casing. This results in core components operating at high temperatures for extended periods, potentially causing performance degradation, signal instability, and automatic system frequency throttling. The problem of insufficient heat dissipation is particularly pronounced under high-load conditions. Utility Model Content

[0003] The purpose of this utility model is to solve the problem of low efficiency in the current passive heat dissipation design of routers, and to propose a router exhaust heat dissipation mechanism.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a router exhaust and heat dissipation mechanism, comprising a base and a top cover that fit together, wherein the top of the top cover is arranged in a gradient and a plurality of heat pipes are attached through it, and both ends of the heat pipes are provided with heat conductors. A tail plate is installed between the base and the top cover. A top heat dissipation groove is provided on the top cover, and a bottom heat dissipation groove is provided on the lower surface of the base. The heat conductors are patches and fins.

[0005] As a further description of the above technical solution: the patch is attached to the inner wall of the top cover, and the patch and fins are respectively located at both ends of the heat pipe and are tightly attached.

[0006] As a further description of the above technical solution: the top cover is provided with a plurality of slots, the fins are fixed in the slots and fully contact the shell, and the inner wall of the slots is provided with a fitting groove for fitting the heat pipe.

[0007] As a further description of the above technical solution: the top cover is provided with a through hole for the heat pipe to pass through for sealing.

[0008] As a further description of the above technical solution: the top heat dissipation groove is located on the other side of the patch on the top cover, and both the patch and the fins are made of metal.

[0009] As a further description of the above technical solution: a hook is provided on the lower surface of the base, and the inner wall of the hook is connected to the inner wall of the base.

[0010] As a further description of the above technical solution: the heat pipe is located on the inner wall of the top cover and runs straight through the gradient transition area of ​​the top cover. The heat pipe is horizontally attached to the inner and outer walls of the top cover without bending.

[0011] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are: When in use, this solution uses a heat pipe that runs straight through the top cover and is fully and horizontally attached to it. Half of the upper surface is attached to the inner wall of the top cover, and the other half of the lower surface is attached to the outer wall of the top cover. This allows for maximum heat conduction through the fit, and the straight design maximizes heat dissipation efficiency. The overall volume is also limited by the thickness of the top cover. Through the gradient design of the top cover, a high-efficiency heat dissipation optimization setting is achieved within a limited volume. Meanwhile, this solution uses a patch installed on the inner wall of the top cover, with the patch located at the highest point of the inner wall of the top cover, so that it can fully contact the heat under the heat accumulation effect and heat one end of the heat pipe. During this process, some heat is transferred to the top cover through the patch and directly dissipated through the top heat dissipation slot. When high heat occurs, the heat pipe conducts the heat in a straight line to the fins, which are directly exposed to the outside, so that the heat can be dissipated quickly and efficiently. In addition, the fins are installed in the slot, so that they can also use the top cover for heat dissipation. Meanwhile, the heat dissipation slots at the bottom of the base can dissipate heat from the motherboard mounted on it to a limited extent, meeting the requirement for direct heat dissipation from the motherboard that is in contact with it. Attached Figure Description

[0012] Figure 1 This is a three-dimensional schematic diagram of the present invention; Figure 2 This is an exploded view of the present invention; Figure 3 This is an exploded view of the top cover of this utility model; Figure 4 This is a three-dimensional schematic diagram of the top cover of this utility model.

[0013] Legend: 1. Base; 2. Top cover; 3. Tail plate; 4. Heat pipe; 5. Patch; 6. Fin; 7. Bottom heat dissipation slot; 8. Hook; 9. Top heat dissipation slot; 10. Through hole; 11. Fitting groove; 12. Card slot. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] like Figure 1 - Figure 4 As shown, the present invention provides a router exhaust and heat dissipation mechanism, including a base 1 and a top cover 2 that fit together. The top of the top cover 2 is arranged in a gradient and has several heat pipes 4 that are attached through it. Both ends of the heat pipes 4 are provided with heat conductors. A tail plate 3 is installed between the base 1 and the top cover 2. A top heat dissipation groove 9 is provided on the top cover 2, and a bottom heat dissipation groove 7 is provided on the lower surface of the base 1. The heat conductors are patch 5 and fin 6.

[0016] The patch 5 is located in the high-heat accumulation distribution area on the inner wall of the top cover 2. It can preferentially absorb internal heat and conduct the heat to the heat pipe 4, realizing the rapid removal of high-heat. The fins 6 are installed in the slot 12 and exposed to the outside air, so that the heat transferred from the heat pipe 4 can be quickly dissipated over a larger area and form a synergistic heat dissipation with the outer wall of the top cover 2.

[0017] The fins 6 are fixed in the slot 12 and are in an exposed position, so that the high temperature transmitted from the heat pipe 4 can come into contact with the outside air with a larger heat dissipation area. At the same time, the fins 6 further participate in heat dissipation after forming a tight contact with the shell through the slot 12, so that the heat dissipation component and the shell form a composite structure for synergistic heat dissipation, thereby improving the external heat dissipation rate.

[0018] Specifically, such as Figure 2 As shown, the patch 5 is attached to the inner wall of the top cover 2, and the patch 5 and the fins 6 are respectively located at both ends of the heat pipe 4 and are tightly attached.

[0019] The patch 5 is located at the highest heat accumulation point on the inner wall of the top cover 2, which enables it to fully absorb the high-temperature airflow rising and accumulating inside, and directly introduce the heat into one end of the heat pipe 4, realizing the rapid removal of heat from the high-level area; the patch 5 itself is in the same heat flow path as the top heat sink 9, so that some heat can be directly dissipated to the outside through the structure of the top cover 2, forming a dual-path heat dissipation effect.

[0020] Specifically, such as Figure 1 As shown, the top cover 2 has several slots 12, the fins 6 are fixed in the slots 12 and fully contact the shell, and the inner wall of the slots 12 has a bonding groove 11 for bonding the heat pipe 4.

[0021] By setting the slot 12, the fins 6 can be installed, and the fitting groove 11 inside is used to fit the heat pipe 4 to make it tighter and prevent the heat pipe 4 from protruding.

[0022] Specifically, such as Figure 4 As shown, the top cover 2 has a through hole 10 for sealing the heat pipe 4 through.

[0023] By setting through hole 10, which is a hole formed by injection molding of heat pipe 4 and top cover 2, the direct connection between heat pipe 4 and top cover 2 at this location has a high sealing effect.

[0024] Specifically, such as Figure 2 As shown, the top heat dissipation groove 9 is located on the other side of the patch 5 on the top cover 2, and both the patch 5 and the fins 6 are made of metal.

[0025] The patch 5 and fin 6 are made of metal, which has a good thermal conductivity and can transfer heat effectively. They also have a larger contact area with the air, which enhances the heat exchange efficiency of the heat pipe 4.

[0026] Specifically, such as Figure 2 As shown, a hook 8 is provided on the lower surface of the base 1, and the inner wall of the hook 8 is connected to the inner wall of the base 1.

[0027] The bottom heat dissipation slots 7 of the base 1 provide an independent heat dissipation path for the motherboard area, preventing the heat generated by the motherboard from interfering with the heat flow at the top. This creates upper and lower partitioned heat dissipation within the overall structure, further improving heat dissipation stability. Through the above-mentioned multi-node, short-path, dual-sided heat dissipation and structural collaborative design, this solution achieves efficient heat conduction, high-speed heat dissipation and multi-faceted heat dissipation within a limited volume, significantly improving the router's temperature control capability under high load conditions.

[0028] By setting up hook 8, it can be hung up. Through the design of the connection at the hook 8 position, an air inlet can be present at the bottom during the upward evaporation of hot air.

[0029] Specifically, such as Figure 4 As shown, the heat pipe 4 is located on the inner wall of the top cover 2 and runs straight through the gradient transition area of ​​the top cover 2. The heat pipe 4 is horizontally attached to the inner and outer walls of the top cover 2 without bending.

[0030] This solution arranges a straight heat pipe 4 between the inner and outer walls of the top cover 2, and makes the large surface area of ​​the heat pipe 4 closely fit the inner and outer walls of the top cover 2, so that heat can be quickly conducted in the shortest path and dissipated on both sides of the shell at the same time, thereby achieving high-efficiency heat conduction and diffusion in a structure with limited thickness.

[0031] The gradient structure of the top cover 2 provides a continuous and stable contact surface for the heat pipe 4, allowing the heat pipe 4 to maintain a straight state while having a larger contact area, avoiding heat transfer attenuation caused by bending, and significantly improving the heat transfer efficiency from the heat source to the outer shell surface.

[0032] This solution deeply integrates the heat pipe 4 with the gradient structure of the top cover 2. The heat pipe 4 is arranged within the gradient transition zone of the top cover 2, and in a straight state, it is in close contact with the inner and outer walls of the top cover 2 over a large area. This allows the gradient structure to simultaneously perform multiple functions, including guiding, supporting, and expanding the heat dissipation surface of the heat pipe 4. Traditional top covers 2 often adopt a planar structure, which makes it difficult to balance internal installation space and external heat dissipation area. However, this solution, through gradient design, extends the effective contact length of the heat pipe 4 without increasing the overall volume of the top cover 2. This improves the continuity of the heat absorption and release path of the heat pipe 4, reduces thermal resistance points in the heat transfer process, and significantly improves heat dissipation efficiency.

[0033] The gradient structure allows heat pipe 4 to form a larger outer wall contact area near the outer shell surface, enabling heat to diffuse more quickly over a larger surface area when transferred to the shell. Simultaneously, the temperature difference at different heights on the outer shell surface creates a natural convection airflow acceleration effect, further enhancing heat dissipation. In traditional designs, due to the flat outer shell surface, heat tends to concentrate in a small area for dissipation. The gradient outer wall, however, allows the external heat dissipation path to expand in a stepped manner, releasing more heat within the same heat dissipation cycle.

[0034] The gradient structure provides clearer installation zones for the patch 5 and fins 6, allowing the top heat accumulation point to preferentially heat the higher end of the heat pipe 4 via the patch 5, while the outer fins 6 obtain a more adequate air contact environment at a higher gradient, achieving segmented conduction and distributed dissipation of internal high temperature to the external air. Compared to centralized heat dissipation at a single height, this solution forms a complete closed heat transfer chain from internal high-level heat absorption, rapid conduction in the middle section, and accelerated heat dissipation at the external high level, making the heat flow path smoother and the heat diffusion space more sufficient.

[0035] The introduction of a gradient structure enables the top cover 2 to have zoned heat dissipation capabilities, naturally separating the patch 5 area, the heat pipe 4 bonding area, and the exposed fin 6 area structurally, preventing heat accumulation in localized areas, thereby significantly enhancing the overall stability of the heat dissipation system. Overall, this solution achieves spatial optimization of the heat pipe 4 arrangement, continuity of the heat dissipation path, multi-layer expansion of the heat dissipation area, and structural improvement of heat zoned exhaust, enabling the router to achieve heat pipe 4 efficient heat dissipation capabilities approaching those of large heat sinks within a limited volume.

[0036] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A router exhaust and heat dissipation mechanism, comprising a base (1) and a top cover (2) that fit together, characterized in that: The top of the top cover (2) is arranged in a gradient and several heat pipes (4) are attached through it. Both ends of the heat pipes (4) are provided with heat conductors. A tail plate (3) is installed between the base (1) and the top cover (2). A top heat dissipation groove (9) is provided on the top cover (2), and a bottom heat dissipation groove (7) is provided on the lower surface of the base (1). The heat conductors are a patch (5) and a fin (6).

2. The router exhaust and heat dissipation mechanism according to claim 1, characterized in that, The patch (5) is attached to the inner wall of the top cover (2), and the patch (5) and the fin (6) are respectively located at both ends of the heat pipe (4) and are tightly attached.

3. The router exhaust and heat dissipation mechanism according to claim 1, characterized in that, The top cover (2) has several slots (12) and the fins (6) are fixed in the slots (12) and fully contact the shell. The inner wall of the slots (12) has a bonding groove (11) for bonding the heat pipe (4).

4. The router exhaust and heat dissipation mechanism according to claim 1, characterized in that, The top cover (2) has a through hole (10) for sealing the heat pipe (4) through.

5. A router exhaust and heat dissipation mechanism according to claim 2, characterized in that, The top heat dissipation groove (9) is located on the other side of the patch (5) on the top cover (2). Both the patch (5) and the fins (6) are made of metal.

6. A router exhaust and heat dissipation mechanism according to claim 1, characterized in that, The lower surface of the base (1) is provided with a hook (8), and the inner wall of the hook (8) is connected to the inner wall of the base (1).

7. A router exhaust and heat dissipation mechanism according to claim 1, characterized in that, The heat pipe (4) is located on the inner wall of the top cover (2) and runs straight through the gradient transition area of ​​the top cover (2). The heat pipe (4) is horizontally attached to the inner and outer walls of the top cover (2) without bending.

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