Double-nozzle rotary turret chip mounter

Abstract

The application relates to the technical field of mounting equipment, and provides a double-suction-nozzle rotary table type chip mounter, which comprises a machine base, a rotary table and a mounting and pressing device. The rotary table is rotatably arranged on the machine base, and the rotary table is circumferentially provided with a plurality of chip mounting heads. Each chip mounting head comprises at least two suction nozzles. The mounting and pressing device is arranged on a chip mounting station of the machine base and is used for simultaneously pressing the suction nozzles on the chip mounting heads rotating to the chip mounting station. The mounting and pressing device comprises at least two mounting and pressing heads, and each mounting and pressing head corresponds to one suction nozzle. Since the chip mounting heads in the rotary table may generate certain errors due to mechanical systems and other reasons during each mounting, at least two suction nozzles are arranged on each chip mounting head, the mounting and pressing device can simultaneously press at least two suction nozzles during chip mounting, that is, at least two lamp bead bulk materials can be simultaneously mounted by one chip mounting head, and compared with mounting one lamp bead by one chip mounting head, the mounting precision and the mounting consistency effect are effectively improved.

Description

Technical Field

[0001] This application relates to the field of placement equipment technology, and in particular to a dual-nozzle turret placement machine. Background Technology

[0002] LED (Light Emitting Diode) displays are formed by mounting loose LED chips onto a PCB substrate using a pick-and-place machine. Common types of pick-and-place machines include turret machines, arch-type machines, and array machines. Turret machines, with multiple placement heads distributed circumferentially around the turret, each equipped with a nozzle, and multiple stations circumferentially distributed around the turret, allow for a multi-station parallel design. The process from nozzle pickup to placement can be performed simultaneously, and continuous operation is possible due to the turret's rotation, making it suitable for mass production.

[0003] However, turret-type chip mounters still have some problems such as low mounting accuracy and poor mounting consistency. Utility Model Content

[0004] This application provides a dual-nozzle turret placement machine to solve some technical problems of low placement accuracy and poor placement consistency in current turret placement machines.

[0005] To address the aforementioned problems, this application provides a dual-nozzle turret placement machine, comprising:

[0006] The machine base is equipped with a surface mount station;

[0007] A turret is rotatably mounted on the base, and the turret is circumferentially provided with a plurality of patch heads, each patch head including at least two nozzles;

[0008] A placement pressing device is disposed on the placement station and is used to simultaneously press down the nozzle on the placement head that has rotated to the placement station. The placement pressing device includes at least two placement pressing heads, and each placement pressing head corresponds to one nozzle.

[0009] In some embodiments, the at least two nozzles are distributed on the patch head along the tangential direction of the turret.

[0010] In some embodiments, each of the patch heads is provided with two of the suction nozzles;

[0011] The base is also provided with a pre-positioning station, on which two pre-positioning devices are distributed adjacently along the circumference of the turret. The two pre-positioning devices are used to simultaneously correspond to the nozzles at the same position on two adjacent patch heads.

[0012] In some embodiments, the dual-nozzle turret placement machine further includes:

[0013] A prepositioning pressing device is disposed on the prepositioning station. The prepositioning pressing device includes two prepositioning pressing heads and a prepositioning pressing drive mechanism. The prepositioning pressing drive mechanism is used to drive the prepositioning pressing heads to move downward. Each prepositioning pressing head corresponds to a suction nozzle at the prepositioning device.

[0014] In some embodiments, the pre-positioning device includes a pre-positioning correction claw and a waste material discharge pipe, the waste material discharge pipe having a feed inlet, and the feed inlet and the pre-positioning correction claw respectively corresponding to two nozzles on the same patch head.

[0015] In some embodiments, the base is further provided with a loading station, an electrical testing station, a precision positioning station, and a visual coordinate station. The loading station, the pre-positioning station, the electrical testing station, the precision positioning station, the visual coordinate station, and the patching station are sequentially distributed around the circumference of the turret along the rotation direction of the turret.

[0016] The feeding station is equipped with a dual-track feeding device; the electrical testing station is equipped with an electrical testing device, which includes two testing ports; the precision positioning station has two precision positioning devices distributed adjacent to each other along the circumference of the turret, which are used to simultaneously correspond to the nozzles at different positions on two adjacent patch heads; the vision coordinate station is equipped with a coordinate camera, which is used to simultaneously acquire images of the material at the two nozzles.

[0017] In some embodiments, the base is provided with a worktable assembly at the placement station. The worktable assembly includes a first slide rail extending along a first direction, a first slide plate slidably disposed on the first slide rail, a second slide rail extending along a second direction disposed on the first slide plate, a second slide plate slidably disposed on the second slide rail, and a worktable disposed on the second slide plate, wherein the first direction and the second direction are perpendicular to each other.

[0018] In some embodiments, the dual-nozzle turret placement machine further includes:

[0019] A conveying device is located on the side of the base where the first slide rail is provided, and the conveying device is used to convey the substrate along the first direction.

[0020] In some embodiments, the conveying device includes an infeed belt assembly, a transfer belt assembly, and an outfeed belt assembly arranged sequentially along the first direction; and the infeed belt assembly, the transfer belt assembly, and the outfeed belt assembly are configured to carry two opposite ends of the substrate in the length direction.

[0021] The transfer belt assembly includes a mounting base, a transfer belt conveying mechanism, and a rotating mechanism; the mounting base has a base plate and side plates located on opposite sides of the base plate, and each side plate is provided with a transfer belt conveying mechanism; the rotating mechanism is connected to the base plate and is used to rotate the transfer belt conveying mechanism to convey the base plate along the second direction.

[0022] In some embodiments, the transfer belt conveyor mechanism includes a first conveyor belt and a second conveyor belt, which are arranged vertically on the side plate;

[0023] The transfer belt assembly also includes a lifting mechanism, which is used to drive the first conveyor belt or the second conveyor belt to dock with the workbench.

[0024] The beneficial effects of this embodiment are as follows: By including at least two nozzles in each placement head of the turret, and simultaneously pressing down the placement pressure device on at least two nozzles on the placement head of the rotating placement station, the placement head can simultaneously place at least two LED chips in one placement operation. Since each placement operation in the turret may produce a certain error due to mechanical system issues, compared to placing one LED chip at a time, this effectively improves placement accuracy and consistency. Furthermore, the simultaneous placement of at least two LED chips by the placement head further enhances the placement efficiency of the turret-type placement machine.

[0025] When each pick-and-place head is equipped with two nozzles, two pre-positioning devices are distributed adjacently along the circumference of the turret at the pre-positioning station on the machine base. These two pre-positioning devices are used to simultaneously correspond to nozzles at different positions on two adjacent pick-and-place heads. As the turret drives the two nozzles on the pick-and-place head to pass through the two pre-positioning devices in sequence, the pre-positioning of the LEDs on the nozzles can be completed. Moreover, the two pre-positioning devices simultaneously pre-position the LEDs on nozzles at different positions on two adjacent pick-and-place heads, that is, pre-positioning of two LEDs is performed simultaneously, which improves the working efficiency of the pick-and-place machine.

[0026] When a dual-nozzle turret placement machine is equipped with a worktable at the placement station, and a conveying device is provided on one side of the machine base, the conveying device can carry substrates placed along the second direction in the length direction and convey the substrates along the first direction. This allows multiple dual-nozzle turret placement machines to be connected and placed along the first direction, and can reduce the floor space occupied by multiple dual-nozzle turret placement machines connected along the first direction. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0028] Figure 1 This is a first-view perspective three-dimensional structural diagram of a dual-nozzle turret placement machine provided in an embodiment of this application;

[0029] Figure 2 yes Figure 1 Enlarged view of point A in the middle;

[0030] Figure 3 This is a two-dimensional structural schematic diagram of a dual-nozzle turret placement machine provided in an embodiment of this application from a second perspective;

[0031] Figure 4 This is a three-dimensional structural diagram of the base of a dual-nozzle turret placement machine provided in an embodiment of this application;

[0032] Figure 5 This is a schematic diagram of the worktable structure in a dual-nozzle turret placement machine provided in an embodiment of this application;

[0033] Figure 6 This is a schematic diagram of the turret structure in a dual-nozzle turret placement machine provided in one embodiment of this application;

[0034] Figure 7 This is an exploded view of the placement head in a dual-nozzle turret placement machine provided in an embodiment of this application;

[0035] Figure 8 This is a schematic diagram of the mounting and pressing device in a dual-nozzle turret placement machine according to an embodiment of this application;

[0036] Figure 9 This is a schematic diagram of the prepositioning station in a dual-nozzle turret placement machine provided in an embodiment of this application;

[0037] Figure 10 This is a schematic diagram of the dual-track feeding device in a dual-nozzle turret placement machine provided in an embodiment of this application;

[0038] Figure 11 This is an exploded view of the electrical testing device in a dual-nozzle turret placement machine provided in an embodiment of this application;

[0039] Figure 12 This is a schematic diagram of the precision positioning device in a dual-nozzle turret placement machine provided in an embodiment of this application;

[0040] Figure 13 This is a schematic diagram of the coordinate camera structure in a dual-nozzle turret placement machine provided in an embodiment of this application;

[0041] Figure 14 This is a schematic diagram of the prepositioning and pressing device in a dual-nozzle turret placement machine according to an embodiment of this application;

[0042] Figure 15 This is a schematic diagram of the conveying device in a dual-nozzle turret placement machine provided in an embodiment of this application;

[0043] Figure 16 This is a schematic diagram of the transfer belt assembly in a dual-nozzle turret placement machine provided in one embodiment of this application;

[0044] Figure 17 This is an exploded view of the transfer belt assembly in a dual-nozzle turret placement machine provided in an embodiment of this application;

[0045] Figure 18 This is a schematic diagram of the conveyor device and the placement state of the substrate on the worktable when the transfer belt assembly of the dual-nozzle turret placement machine provided in an embodiment of this application transports the substrate to the worktable.

[0046] In the diagram: 100, base; 10, frame; 11, left side plate; 12, right vertical plate; 13, mounting base plate; 14, mounting top plate; 15, mounting vertical plate; 20, workbench assembly; 21, first slide rail; 22, second slide rail; 23, first slide plate; 24, second slide plate; 25, workbench; 30, pre-positioning device; 31, pre-positioning correction claw; 32, residual material discharge pipe; 321, feed inlet; 40, double-rail feeding device; 41, vibratory feeder base plate; 42, storage device vibration source; 43, storage disc; 44, circular vibration source; 45, circular vibration disc; 46, double linear vibration track; 50, electrical testing device; 51, quick-release base; 52, fine-tuning slide table; 53, terminal block; 54, probe; 55, test port; 56, blow needle; 60, precision positioning device; 61, precision positioning correction claw; 70, coordinate camera; 71, camera; 7 2 Lenses; 73 Light source; 74 NG nozzle; 75 NG material box; 200 Turret; 201 Turntable; 202 Drive motor; 203 Placement head; 2031 Nozzle bracket; 2032 Nozzle; 2033 Guide sleeve; 2034 Clamping block; 2035 Guide rod; 2036 Return spring; 300 Placement pressing device; 301 Placement pressing drive mechanism; 302 Placement pressing head; 400 Pre-positioning pressing device; 401 Pre-positioning pressing drive mechanism; 402 Pre-positioning pressing head; 500 Conveying device; 501 Infeed belt assembly; 502 Transfer belt assembly; 5022 Transfer belt conveyor mechanism; 5022a First conveyor belt; 5022b Second conveyor belt; 5023 Rotation mechanism; 5024 Lifting mechanism; 503 Outfeed belt assembly. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are only for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to this application are shown in the accompanying drawings, not all structures. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0048] Please see Figures 1 to 3 This application provides a dual-nozzle turret placement machine, which can be used for mounting LED displays, but is not limited thereto. The following embodiments of this application use the dual-nozzle turret placement machine for mounting LED displays as an example. LED display mounting involves attaching loose LED chips onto a PCB substrate.

[0049] The dual-nozzle brick-tower placement machine provided in this application includes a base 100, a turret 200, and a placement pressing device 300. The base 100 has a placement station. The turret 200 is rotatably mounted on the base 100, and a plurality of placement heads 203 are arranged circumferentially on the turret 200. Each placement head 203 has at least two nozzles 2032. The placement pressing device 300 is disposed on the placement station of the base 100 and is used to simultaneously press down on the nozzles 2032 on the placement heads 203 that have rotated to the placement station. The placement pressing device 300 includes at least two placement pressing heads 302, each placement pressing head 302 corresponding to one nozzle 2032.

[0050] It is understandable that the turret 200 in a turret-type pick-and-place machine, by rotating on the base 100, allows its circumferentially arranged placement heads 203 to complete the entire process from picking up LED chips from the feeding device to mounting them onto the PCB circuit board. By setting at least two suction nozzles 2032 on each placement head 203 of the turret 200, and simultaneously pressing down the placement pressing device 300 on at least two suction nozzles 2032 on the rotating placement head 203, the placement head 203 can simultaneously mount at least two LED chips in one placement operation. Since each placement by the placement head 203 in the turret 200 may produce a certain error due to mechanical system reasons, compared to mounting one LED chip at a time by one placement head 203, this effectively improves the placement accuracy and consistency. Furthermore, the simultaneous mounting of at least two LED chips by each placement head 203 further enhances the placement efficiency of the turret-type pick-and-place machine.

[0051] Please refer to the following: Figure 4 The base 100 is used to mount the turret 200, the placement pressure device 300, and other components of the dual-nozzle pick-and-place machine. This application embodiment does not limit the specific structure of the base 100; for example, as... Figure 4 As shown, taking the placement of the base 100 in the figure as an example, the base 100 may include a frame 10 and a left side plate 11, a right side plate 12, a mounting base plate 13, a mounting top plate 14, and a mounting stand 15, etc., disposed on the frame 10. The base 100 is equipped with a placement station. It can be understood that the placement station is located on the frame 10 and circumferentially on the turret 200. When the placement head 203 on the turret 200 picks up loose LED chips through the suction nozzle 2032 and rotates to the placement station, the placement pressing device 300 presses down the suction nozzle 2032 to place the loose LED chips onto the PCB substrate. It should be noted that the PCB substrate at the placement station can be moved by a conveyor 500, or by a worktable 25 disposed on the base 100, or a worktable 25 fixedly supporting the PCB substrate can be provided at the placement station.

[0052] Please refer to the following: Figure 5 When the PCB substrate on the placement station is moved to the placement station by the worktable set on the base 100, such as Figure 5 As shown, in some embodiments, the base 100 may have a worktable assembly 20 at the placement station. The worktable assembly 20 includes a first slide rail 21 extending along a first direction X. A first slide plate 23 is slidably disposed on the first slide rail 21. A second slide rail 22 extending along a second direction Y is disposed on the first slide plate 23. A second slide plate 24 is slidably disposed on the second slide rail 22, and a worktable 25 is disposed on the second slide plate 24. The first direction X and the second direction Y are perpendicular to each other.

[0053] The worktable 25 is used to load and fix the PCB substrate. The specific structure of the worktable 25 is not limited in this embodiment. The PCB substrate to be mounted can be loaded by moving the worktable 25 along the second slide rail 22 away from the turret 200. Then, the worktable 25 moves along the second slide rail 22 towards the turret 200 to a position corresponding to the mounting station. It then moves along the first slide rail 21 from the loading station to the mounting station, thereby moving the PCB substrate to be mounted to the mounting station. After mounting is complete, the worktable 25 moves along the first slide rail 21 from the mounting station to the loading station, and then moves along the second slide rail 22 away from the turret 200 from the loading station to deliver the mounted PCB substrate.

[0054] Please refer to the following: Figure 6 The turret 200 is rotatably mounted on the base 100. This application embodiment does not limit the specific structure of the turret 200. It can be understood that the turret 200 includes a turntable 201 with multiple workstations and a drive motor 202 for rotating the turntable 201. The turntable 201 can be mounted on the mounting top plate 14 of the base 100, and the drive motor 202 can be mounted on the mounting top plate 14 and located between two mounting uprights 15, such as... Figure 3 and Figure 6 As shown, the turret 200 is circumferentially equipped with several placement heads 203, that is, each station of the turntable 201 is equipped with a placement head 203. The placement head 203 includes a suction nozzle 2032, so that the placement head 203 can pick up the LED beads and drive the LED beads to rotate to the placement station for placement after positioning and detection.

[0055] Please refer to the following: Figure 7 Each placement head 203 includes at least two nozzles 2032, meaning that at least two nozzles 2032 are provided on each station of the turntable 201. The specific structure of the placement head 203 is not limited in this embodiment; for example, ... Figure 7As shown, in some embodiments, the patch head 203 may further include a nozzle bracket 2031. Two nozzles 2032 can be mounted on one end of the nozzle bracket 2031, and the other end of the nozzle bracket 2031 can be mounted on a station circumferentially on the turntable 201 in the turret 200 using bolts. This application does not impose specific limitations on the specific mounting method of the nozzles 2032 on the nozzle bracket 2031. For example, a guide sleeve 2033 can be fixedly mounted on the nozzle bracket 2031, and a guide rod 2035 can pass through the upper end of the guide sleeve 2033 and connect to the clamping block 2034. Then, the nozzles 2032 are fixed on the clamping block 2034, so that the guide rod 2035 can drive the nozzles 2032 to move up and down. It is understood that a return spring 2036 may also be sleeved on the guide rod 2035.

[0056] It should be noted that, since the nozzles 2032 on the same placement head 203 are simultaneously placed under the action of the placement pressing device 300, the specific arrangement of the nozzles 2032 on the nozzle holder 2031 can be determined according to the specific arrangement of the LED beads on the PCB substrate and the relative position of the PCB substrate and the placement head 203 at the placement station. Taking a rectangular array of LED beads on the PCB substrate as an example, LED beads on two nozzles 2032 can be mounted onto the PCB substrate to form two LED beads in the same row but different columns in the LED display screen. For example, in some embodiments, at least two nozzles 2032 on the placement head 203 are distributed along the tangential direction of the turret 200 on the placement head 203. The tangential direction of the turret 200 is the tangential direction of the turntable 201 in the turret 200, such as... Figure 6 and Figure 7 As shown, taking a placement head 203 with two nozzles 2032 as an example, it can be understood that when the nozzle support 2031 is set on the station of the turntable 201, the axis of symmetry of the nozzle support 2031 is in the radial direction of the turntable 201, and the two nozzles 2032 can be symmetrically distributed relative to the axis of symmetry of the nozzle support 2031. Furthermore, this application does not impose specific restrictions on the center distance between the two nozzles 2032; it can be understood that the center distance between the two nozzles 2032 is an integer multiple of the center distance between two adjacent rows of LED beads in the LED display screen. For different LED display screens, the center distance between two adjacent rows of LED beads can be achieved by replacing the corresponding placement head 203 on the turret 200.

[0057] Please refer to the following: Figure 8 The placement pressing device 300 is installed at the placement station of the base 100. For example... Figure 3As shown, the placement pressing device 300 can be mounted on the mounting top plate 14 of the base 100. When the placement head 203 in the turret 200 rotates to the placement station carrying LED beads, the placement pressing device 300 can drive the placement pressing head 302 to move downward so that the placement pressing head 302 presses down on its corresponding nozzle 2032, thereby placing the LED beads on the nozzle 2032 onto the PCB substrate.

[0058] Please refer to the following: Figure 9 In some embodiments, each patch head 203 in the turret 200 is provided with two suction nozzles 2032. The base 100 is also provided with a pre-positioning station. Two pre-positioning devices 30 are distributed adjacently along the circumference of the turret 200 at the pre-positioning station, and the two pre-positioning devices 30 are used to simultaneously correspond to the suction nozzles 2032 at different positions on two adjacent patch heads 203.

[0059] like Figure 2 and Figure 9 As shown, two pre-positioning devices 30 are mounted on the mounting base plate 13 of the machine base 100. It can be understood that the distribution spacing of the two pre-positioning devices 30 corresponds to the distribution spacing of two adjacent pick-and-place heads 203 on the turret 200, so that the two pre-positioning devices 30 can simultaneously correspond to the nozzles 2032 on two adjacent pick-and-place heads 203. The specific structure of the pre-positioning devices 30 is not limited in this embodiment; for example, a correction claw is generally provided in the pre-positioning device 30. It should be noted that since the pre-positioning correction claw 31 needs to open and close, occupying a large space, and the distance between the two nozzles 2032 in the pick-and-place head 203 is small, two pre-positioning devices 30 are provided. This way, when each pick-and-place head 203 passes through the two pre-positioning devices 30 in sequence, the pre-positioning of the LED beads on its two nozzles 2032 can be completed. Furthermore, the two pre-positioning devices 30 can simultaneously pre-position the LED beads on nozzles 2032 at different positions on two adjacent pick-and-place heads 203, further improving the working efficiency of the turret pick-and-place machine.

[0060] It should be noted that, as Figure 9 As shown, the two prepositioning devices 30 simultaneously corresponding to the nozzles 2032 at different positions on the two adjacent patch heads 203 means that when the two adjacent patch heads 203 are rotated to correspond to the two prepositioning devices 30 respectively, that is, rotated to above the prepositioning devices 30, the prepositioning correction claw 31 in one prepositioning device 30 corresponds to the nozzle 2032 located on the left side of the patch head 203 above it, and the prepositioning correction claw 31 in the other prepositioning device 30 corresponds to the nozzle 2032 located on the right side of the patch head 203 above it.

[0061] like Figure 9As shown, in some embodiments, the pre-positioning device 30 may include a pre-positioning correction claw 31 and a waste material discharge pipe 32. The waste material discharge pipe 32 has a feed inlet 321. The feed inlet 321 and the pre-positioning correction claw 31 correspond to two suction nozzles 2032 on the same patch head 203.

[0062] The residual material discharge pipe 32 is used to remove residual material from the suction nozzle 2032, such as dust and other impurities. In the pre-positioning device 30, the inlet 321 of the residual material discharge pipe 32 and the pre-positioning correction claw 31 are respectively aligned with the two suction nozzles 2032 on the same patch head 203. When the patch head 203 rotates to the pre-positioning station, the two suction nozzles 2032 on the patch head 203 are directly facing the inlet 321 of the residual material discharge pipe 32 and the pre-positioning correction claw 31, respectively. Thus, the pre-positioning station can also be used as a residual material discharge station. When residual material needs to be discharged from the suction nozzles 2032 in the turret 200, the turret 200 is rotated, causing the patch head 203 to pass through the two pre-positioning devices 30 sequentially, thus completing the discharge of residual material from the two suction nozzles 2032 on one patch head 203. Furthermore, during the material discharge process, the two pre-positioning devices 30 can simultaneously discharge material from nozzles 2032 at different positions on two adjacent pick-and-place heads 203, further improving the working efficiency of the turret pick-and-place machine. It also makes full and rational use of the workstation space of the dual-nozzle turret pick-and-place machine, avoiding idle workstation space. Compared to setting up a separate material discharge station, it effectively simplifies the overall structure of the dual-nozzle turret pick-and-place machine, making the overall structure more compact.

[0063] like Figure 2 As shown, in some embodiments, the base also includes a loading station, an electrical testing station, a precision positioning station, and a vision coordinate station. The loading station is used to allow the nozzle 2032 on the placement head 203 to pick up the LED chips. According to the testing process that the LED chips need to go through from loading to placement, the loading station, pre-positioning station, electrical testing station, precision positioning station, vision coordinate station, and placement station can be distributed sequentially around the circumference of the turret 200 along the rotation direction of the turret 200.

[0064] Please refer to the following: Figures 10 to 13The turret can be equipped with a dual-track feeding device 40 at the loading station. An electrical testing device 50, including two testing ports 55, is installed at the electrical testing station. Two precision positioning devices 60 are distributed circumferentially around the turret 200 at the precision positioning station, simultaneously corresponding to nozzles 2032 at different positions on two adjacent placement heads 203. A coordinate camera 70 is installed at the vision coordinate station, simultaneously acquiring images of the material at both nozzles 2032. Therefore, when the turret 200 drives the placement head 203 sequentially through the loading station, pre-positioning station, electrical testing station, precision positioning station, vision coordinate station, and placement station, the actions of both nozzles 2032 can be completed simultaneously, effectively improving the working efficiency of the turret placement machine.

[0065] It is understood that the dual-track feeding device 40, electrical testing device 50, precision positioning device 60, and coordinate camera 70 are all mounted on the mounting base 13 of the machine base 100. This application embodiment does not limit their specific structure; they can all be selected from existing devices. For example, the dual-track feeding device 40 can be a dual-track vibratory feeder feeding device, including a vibratory feeder base plate 41, a storage vibratory source 42, a storage disc 43, a circular vibratory source 44, a circular vibratory disc 45, and dual linear vibratory tracks 46. The ends of the two dual linear vibratory tracks 46 are arranged side-by-side to allow the two suction nozzles 2032 on the patch head 203 to simultaneously pick up materials. The electrical testing device 50 may include a quick-release base 51, a fine-tuning slide 52 mounted on the quick-release base 51, two terminals 53, two sets of probes 54, and two test ports 55 corresponding to the two sets of probes 54 respectively. Each test port 55 may also correspond to a blow needle 56, which is used to periodically blow air to clean the test port 55. The precision positioning device 60 may include a precision positioning correction claw 61, wherein the specific opening and closing control structure of the precision positioning correction claw 61 may utilize a cam mechanism, but is not limited thereto. The coordinate camera 70 may include a camera 71, a lens 72, and a light source 73 disposed above the lens 72. Of course, two NG nozzles may also be disposed above the light source 73, which are used to blow NG material through a conduit to the NG material box.

[0066] Please refer to the following: Figure 14 In some embodiments, the dual-nozzle turret placement machine further includes a pre-positioning pressing device 400, disposed on a pre-positioning station. The pre-positioning pressing device 400 includes two pre-positioning pressing heads 402 and a pre-positioning pressing drive mechanism 401. The pre-positioning pressing drive mechanism 401 is used to drive the pre-positioning pressing heads 402 to move downward. Each pre-positioning pressing head 402 corresponds to a nozzle 2032 at a pre-positioning device 30. By having one pre-positioning pressing drive mechanism 401 drive two pre-positioning pressing heads 402 to move downward, the overall structure of the dual-nozzle turret placement machine is simplified.

[0067] It should be noted that during the process of the placement head 203 passing through various stations, in addition to the need to press down the nozzle 2032 when passing through the pre-positioning station and the placement station as described above, corresponding pressing devices are also required when passing through the loading station, testing station, and precision positioning station. The placement pressing device 300, loading pressing device, testing pressing device, and precision positioning pressing device can all be the same as the pre-positioning pressing device, all driven by a single pressing drive mechanism to move two pressing heads downwards, but are not limited to this. Of course, considering that dual-track loading may result in different material arrival times and that the material on the nozzle 2032 may have fallen off by the time it reaches the placement station, in some embodiments, the loading pressing device and the placement pressing device can use independent pressing, i.e., each pressing head corresponds to one pressing drive mechanism. For example... Figure 8 As shown, each placement pressing drive mechanism 301 in the placement pressing device 300 corresponds to one placement pressing head 302. It can be understood that the pressing drive mechanism is a linear drive mechanism, such as a cylinder or an electric telescopic rod, but it is not limited to these.

[0068] Please refer to the following: Figures 15 to 18 In some embodiments, when the base 100 is provided with a worktable assembly 20 at the placement station, the worktable assembly 20 includes a first slide rail 21 extending along a first direction X, a first slide plate 23 slidably disposed on the first slide rail 21, a second slide rail 22 extending along a second direction Y disposed on the first slide plate 23, a second slide plate 24 slidably disposed on the second slide rail 22, and a worktable 25 disposed on the second slide plate 24. The dual-nozzle turret placement machine may also include a conveying device 500, which is located on the side of the base 100 where the first slide rail 21 is disposed, and the conveying device 500 is configured to carry a substrate placed along the second direction Y in the length direction, and the conveying device 500 is used to convey the substrate along the first direction X.

[0069] Since the conveyor 500 transports the substrate along the first direction X, multiple dual-nozzle turret placeers can be connected and mounted in the same direction X. This means that the LEDs on an LED display screen are mounted in sections by multiple dual-nozzle turret placeers, effectively dispersing mounting errors. Furthermore, by placing the substrate along the second direction Y, the length of the conveyor 500 in the first direction X is effectively reduced when the conveyor 500 transports the same number of substrates simultaneously, thus reducing the floor space occupied by multiple dual-nozzle turret placeers connected in the first direction X. In addition, if one of the connected dual-nozzle turret placeers malfunctions, the conveyor 500 of that placeer can still transport substrates to the other placeers behind it, serving as a board transfer mechanism, thus not affecting the operation of other placeers.

[0070] By providing a conveyor 500 on one side of the base 100 in the dual-nozzle turret placement machine, when the substrate is conveyed to the position corresponding to the second slide rail 22, it can be transferred to the worktable 25 to complete the loading. Of course, the substrates that have been mounted on the worktable 25 can also be transferred to the conveyor 500 to be conveyed to the next dual-nozzle turret placement machine for mounting other areas of the substrate. The transfer of the substrate between the worktable 25 and the conveyor 500 can be accomplished by a robot, or by the conveyor 500 and the worktable 25 itself, but is not limited to this.

[0071] like Figures 15 to 17 As shown, in some embodiments, the conveying device 500 may include an infeed belt assembly 501, a transfer belt assembly 502, and an outlet belt assembly 503 arranged sequentially along a first direction X. The transfer belt assembly 502 includes a mounting base 5021, a transfer belt conveying mechanism 5022, and a rotating mechanism 5023. The mounting base 5021 has a base plate and side plates located on opposite sides of the base plate, each side plate being provided with a transfer belt conveying mechanism 5022. The rotating mechanism 5023 is connected to the base plate and is used to rotate the transfer belt conveying mechanism 5022 to convey the substrate along a second direction Y.

[0072] It should be noted that since the conveying device 500 conveys the substrate along the first direction X, when the infeed belt assembly 501, the transfer belt assembly 502, and the outfeed belt assembly 503 in the conveying device 500 are sequentially arranged along the first direction X, it can be understood that the belts in the infeed belt assembly 501, the transfer belt assembly 502, and the outfeed belt assembly 503 are transmitted along the first direction X. When the rotating mechanism 5023 rotates the transfer belt conveying mechanism 5022 to convey the substrate along the second direction Y, it can be understood that the rotating mechanism 5023 rotates the transfer belt conveying mechanism 5022 90 degrees so that its belt is transmitted along the second direction Y. Therefore, when the worktable 25 moves on the second slide rail 22 to one end close to the conveying device 500, the transfer belt assembly 502 and the worktable 25 can transfer substrates to each other. It can be understood that a conveyor belt can also be provided on the worktable 25.

[0073] By using a transfer belt assembly 502 between the infeed belt assembly 501 and the outfeed belt assembly 503 of the conveyor 500, and by having the rotating mechanism 5023 drive the transfer belt assembly 502 to rotate, the transfer of the substrate between the worktable 25 and the conveyor 500 can be realized.

[0074] The transfer belt assembly 502 includes side plates located on opposite sides of the base plate, and each side plate is equipped with a transfer belt conveyor mechanism 5022. It can be understood that the transfer belt assembly 502 carries the opposite ends of the substrate along its length through the transfer belt conveyor mechanisms 5022 on both side plates. The infeed belt assembly 501 and the outfeed belt assembly 503 can also carry the opposite ends of the substrate along its length through belt conveyor mechanisms, thereby driving the substrate to move through belt transmission. For example, the infeed belt assembly 501 may include two sets of oppositely arranged infeed belt conveyor mechanisms, and the outfeed belt assembly 503 may include two sets of oppositely arranged outfeed belt conveyor mechanisms.

[0075] like Figure 16 and Figure 17 As shown, in some embodiments, the transfer belt conveyor mechanism 5022 includes a first conveyor belt 5022a and a second conveyor belt 5022b, which are arranged vertically on the side plate. The transfer belt assembly 502 also includes a lifting mechanism 5024, which is used to drive the first conveyor belt 5022a or the second conveyor belt 5022b to dock with the worktable 25.

[0076] By providing a first conveyor belt 5022a and a second conveyor belt 5022b distributed vertically on each side plate of the transfer belt assembly 502, the first conveyor belt 5022a and the second conveyor belt 5022b can be used to transport the substrate to be mounted to the worktable 25 and to receive the mounted substrate from the worktable 25, respectively. This embodiment of the application uses the first conveyor belt 5022a to transport the substrate to be mounted to the worktable 25 and the second conveyor belt 5022b to receive the mounted substrate from the worktable 25 as an example for explanation.

[0077] The lifting mechanism 5024 can be connected to the rotating mechanism 5023 in the transfer belt assembly 502. For example, the rotating mechanism 5023 can be located at the movable end of the lifting mechanism 5024. The lifting mechanism 5024 can be a linear drive mechanism such as a cylinder or an electric telescopic rod, but is not limited to these.

[0078] When the conveying device 500 is operating, as the board feeding assembly conveys the substrate to be mounted to the transfer belt conveyor mechanism 5022, the rotating mechanism 5023 drives the mounting base 5021 to rotate 90 degrees, thereby rotating the conveying direction of the transfer belt conveyor mechanism 5022 to the second direction Y. Then, the lifting mechanism 5024 drives the mounting base 5021 to rise until the second conveyor belt 5022b is flush with the transmission belt in the worktable 25. The transmission belt in the worktable 25 and the second conveyor belt 5022b cooperate to transfer the mounted substrate to the transfer belt conveyor mechanism 5022. The lifting mechanism 5024 then drives the mounting base 5021 to fall until the first conveyor belt 5022a is flush with the transmission belt in the worktable 25, thereby the first conveyor belt 5022a and the transmission belt in the worktable 25 cooperate to transfer the substrate to be mounted onto the worktable 25. Subsequently, the rotating mechanism 5023 drives the mounting base 5021 to rotate to its initial position and rise until the second conveyor belt 5022b aligns with the belt in the board output conveyor mechanism. The substrate to be mounted is then transferred to the board output conveyor mechanism and subsequently conveyed to the next mechanism. Finally, the lifting mechanism 5024 drives the mounting base 5021 to descend until the first conveyor belt 5022a aligns with the board input conveyor mechanism. The substrate to be mounted can then be conveyed to the intermediate conveyor belt mechanism 5022, thus entering the next loading and unloading conveyor cycle.

[0079] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A dual-nozzle turret placement machine, characterized in that, include: The machine base is equipped with a surface mount station; A turret is rotatably mounted on the base, and the turret is circumferentially provided with a plurality of patch heads, each patch head including at least two nozzles; A placement pressing device is disposed on the placement station and is used to simultaneously press down the nozzle on the placement head that has rotated to the placement station. The placement pressing device includes at least two placement pressing heads, and each placement pressing head corresponds to one nozzle.

2. The dual-nozzle turret placement machine as described in claim 1, characterized in that, The at least two nozzles are distributed on the patch head along the tangential direction of the turret.

3. The dual-nozzle turret placement machine as described in claim 1, characterized in that, Each of the patch heads is provided with two of the suction nozzles; The base is also provided with a pre-positioning station, on which two pre-positioning devices are distributed adjacently along the circumference of the turret. The two pre-positioning devices are used to simultaneously correspond to the nozzles at different positions on two adjacent patch heads.

4. The dual-nozzle turret placement machine as described in claim 3, characterized in that, The dual-nozzle turret placement machine also includes: A prepositioning pressing device is disposed on the prepositioning station. The prepositioning pressing device includes two prepositioning pressing heads and a prepositioning pressing drive mechanism. The prepositioning pressing drive mechanism is used to drive the prepositioning pressing heads to move downward. Each prepositioning pressing head corresponds to a suction nozzle at the prepositioning device.

5. The dual-nozzle turret placement machine as described in claim 3, characterized in that, The pre-positioning device includes a pre-positioning correction claw and a waste material discharge pipe. The waste material discharge pipe has a feed inlet, and the feed inlet and the pre-positioning correction claw correspond to two nozzles on the same patch head.

6. The dual-nozzle turret placement machine as described in claim 3, characterized in that, The base is also provided with a loading station, an electrical testing station, a precision positioning station, and a visual coordinate station. The loading station, the pre-positioning station, the electrical testing station, the precision positioning station, the visual coordinate station, and the patching station are distributed in sequence around the circumference of the turret along the rotation direction of the turret. The feeding station is equipped with a dual-track feeding device; the electrical testing station is equipped with an electrical testing device, which includes two testing ports; the precision positioning station has two precision positioning devices distributed adjacent to each other along the circumference of the turret, which are used to simultaneously correspond to the nozzles at different positions on two adjacent patch heads; the vision coordinate station is equipped with a coordinate camera, which is used to simultaneously acquire images of the material at the two nozzles.

7. The dual-nozzle turret placement machine as described in claim 1, characterized in that, The base is provided with a worktable assembly at the placement station. The worktable assembly includes a first slide rail extending along a first direction, a first slide plate slidably disposed on the first slide rail, a second slide rail extending along a second direction disposed on the first slide plate, a second slide plate slidably disposed on the second slide rail, and a worktable disposed on the second slide plate, wherein the first direction and the second direction are perpendicular to each other.

8. The dual-nozzle turret placement machine as described in claim 7, characterized in that, The dual-nozzle turret placement machine also includes: A conveying device is located on one side of the base where the first slide rail is provided, and the conveying device is configured to carry a substrate placed along the second direction in the length direction, and the conveying device is used to convey the substrate along the first direction.

9. The dual-nozzle turret placement machine as described in claim 8, characterized in that, The conveying device includes an infeed belt assembly, a transfer belt assembly, and an outfeed belt assembly arranged sequentially along the first direction. The transfer belt assembly includes a mounting base, a transfer belt conveying mechanism, and a rotating mechanism; the mounting base has a base plate and side plates located on opposite sides of the base plate, and each side plate is provided with a transfer belt conveying mechanism; the rotating mechanism is connected to the base plate and is used to rotate the transfer belt conveying mechanism to convey the base plate along the second direction.

10. The dual-nozzle turret placement machine as described in claim 9, characterized in that, The transfer belt conveyor mechanism includes a first conveyor belt and a second conveyor belt, which are arranged vertically on the side plate. The transfer belt assembly also includes a lifting mechanism, which is used to drive the first conveyor belt or the second conveyor belt to dock with the workbench.

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