A driving structure for precise four-step lifting of a chip mounter

Abstract

The utility model provides a kind of driving structure of four-step jacking of patching machine precision, it includes: jacking rod structure and drive assembly, jacking rod structure is inserted into drive assembly, drive assembly includes installation bottom plate and installation top plate and four drive units being set to the surface of installation bottom plate, installation top plate is fixedly installed to the top end of installation bottom plate, four drive units are respectively fixed to installation bottom plate periphery, one of drive structure is equipped with heating unit, and heating unit is movably sleeved on the surface of jacking rod structure.The utility model focuses four-step jacking driving structure on high-end precision manufacturing scene, such as semiconductor packaging, wafer support, accurately solve the industry pain point of traditional pin driving impact, low precision, short stroke, poor rigidity, easy to damage workpiece.Congruent precision manufacturing, domestic substitution, three big trends of intelligent manufacturing, technical advantage is outstanding, downstream demand is clear, market space is broad, with high growth and high profitability.

Description

Technical Field

[0001] This utility model relates to a drive structure for a precise four-step lifting and lowering mechanism for a chip mounter, belonging to the field of semiconductor packaging technology. Background Technology

[0002] With the rapid development of semiconductor packaging technology towards miniaturization, high density, thinning, and high precision, the memory chip mounting process places increasingly stringent demands on the operating accuracy, motion stability, contact smoothness, and adaptability of the internal ejector pin support drive mechanism. As the core load-bearing and lifting execution component of the pick-and-place machine, the ejector pin drive structure is mainly used for bottom support and fixed-point lifting of the wafer wafer, providing stable workpiece posture and flatness assurance for precise material picking and alignment by the mounting nozzle. Its motion control characteristics and mechanical structure design directly determine the overall mounting accuracy, production yield, and equipment adaptability.

[0003] Most existing semiconductor packaging ejector pin drive structures use voice coil motors with crossed roller guides, single-stage lead screws, and cams for driving, which leads to the following problems: 1. Due to travel restrictions, large-scale lifting is not possible. Voice coil motors have a short effective stroke and are only suitable for micro-stroke fine-tuning. They cannot meet the large-range lifting and lowering required for wafer replacement of different thicknesses and specifications. They can only perform small-distance floating compensation and cannot realize four-step segmented long-stroke logic actions.

[0004] 2. Poor resistance to overturning Cross roller guides have weak lateral rigidity. When the ejector pins are lifted vertically, there is an off-center load and torque overturning. Long-term use can easily lead to displacement and tilting, resulting in poor verticality of the ejector pins and drift in mounting positioning accuracy. 3. Extremely high precision assembly requirements. The coaxiality and parallelism of the guide rail and voice coil motor have extremely strict assembly tolerances, making assembly difficult, debugging cycle long, mass production consistency poor, and equipment rework and correction difficult in the later stages. 4. Ability to perform four-step movements without segmentation. It can only achieve overall synchronous lifting and synchronous detachment. The impact is large when contacting and detaching from the blue film, which can easily damage thin wafers, causing the wafers to be unable to be successfully peeled off due to excessive stickiness. 5. High heat generation affects accuracy and stability. Voice coil motors are prone to overheating when kept in position for extended periods of power. Thermal deformation causes displacement of the guide rails and ejector pins, resulting in large temperature drift and a significant decrease in repeatability accuracy under high and low temperature environments. 6. Poor output linearity and difficulty in controlling constant top pressure. The nonlinear output force under short stroke is difficult to stabilize and maintain a constant top pressure. When supporting blue film wafers, it is easy to over-push or under-support, which limits the yield. 7. Bulky structure and low integration The combination of voice coil motor and cross roller guide has a large lateral space requirement, which is not conducive to the multi-channel, densely packed ejector pin layout of the pick and place machine, and limits the miniaturization and modular design of the equipment. Utility Model Content

[0005] This invention addresses the technical problems of traditional ejector pin drives, such as large impact, low precision, short stroke, poor rigidity, and easy damage to workpieces, by providing a precise four-step lifting drive structure for a pick-and-place machine.

[0006] This utility model solves the above-mentioned technical problems through the following technical solutions: This utility model provides a drive structure for precise four-step lifting of a chip mounter, including a top rod structure and a drive assembly for mounting the top rod structure. The top rod structure is inserted into the drive assembly. The drive assembly includes a mounting base plate, a mounting top plate, and four drive units disposed on the surface of the mounting base plate. The mounting top plate is fixedly mounted to the top of the mounting base plate. The mounting top plate and the mounting base plate are vertically distributed. The top rod structure is inserted through the middle of the mounting top plate. The four drive units are respectively fixed to the four sides of the mounting base plate. The four drive units are symmetrically distributed in pairs. A heating unit is mounted on one of the drive structures, and the heating unit is movably sleeved on the surface of the top rod structure.

[0007] In this technical solution, the push rod structure includes push rod one, push rod two, push rod three and push rod four, which are sequentially nested together.

[0008] In this technical solution, an O-ring three is provided in the groove of the outer wall of the top end of the top rod three, and the O-ring three is sealed and fitted inside the top rod three. An O-ring two is provided in the groove of the outer wall of the top end of the top rod three, and the O-ring two is sealed and fitted inside the top rod two. An O-ring one is provided in the groove of the outer wall of the top end of the top rod two, and the O-ring one is sealed and fitted inside the top rod one.

[0009] In this technical solution, a linear guide rail is fixedly installed in the middle of the mounting base plate. The linear guide rail has a T-shaped cross-section and is arranged between four drive units. Each drive unit includes a micro electric cylinder one, two micro electric cylinders two, and a micro electric cylinder three. The two micro electric cylinders two are staggered at the upper and lower ends of the mounting base plate, and are symmetrically distributed with the micro electric cylinder one and the micro electric cylinder three, respectively.

[0010] In this technical solution, the first miniature electric cylinder is fixed to the side of the mounting base plate by the module fixing plate three, one of the second miniature electric cylinders is fixed to the same side of the mounting base plate by the module fixing plate two, and the third miniature electric cylinder and the other second miniature electric cylinder are both fixed to the other side of the mounting base plate by the module fixing plate one.

[0011] In this technical solution, the telescopic end of the miniature electric cylinder one is fixedly connected to the push rod one through the guide plate one, and the push rod one is also fixedly connected to one of the sliders on the linear guide rail through the guide plate two. The telescopic end of the miniature electric cylinder three is fixedly connected to the push rod three through the guide plate four, and the push rod three is also fixedly connected to another slider on the linear guide rail through the guide plate six.

[0012] In this technical solution, the telescopic end of one of the miniature electric cylinders is fixedly connected to the push rod four via the guide plate five, and the telescopic end of the other miniature electric cylinder is fixedly connected to the push rod two via the guide plate three.

[0013] In this technical solution, a Z-shaped sensor plate is fixedly connected to the side of the mounting base plate near the first micro electric cylinder. The Z-shaped sensor plate is distributed correspondingly to the first guide plate. Sensor plates are fixedly installed on the first, second, third and fourth micro electric cylinders. The sensor plates are distributed correspondingly to the telescopic ends of the drive unit.

[0014] In this technical solution, the heating unit is fixedly installed on the guide plate. The heating unit includes a guide sleeve, a heat insulation sleeve, and electric heating wires. The guide sleeve is fixedly installed at the bottom end of the guide plate. The heat insulation sleeve is embedded in the guide sleeve. Multiple annular electric heating wires are fixedly connected to the inner wall of the heat insulation sleeve. The guide sleeve and the heat insulation sleeve are both movably sleeved on the surface of the top rod.

[0015] In this technical solution, the guide sleeve surface is provided with a convex shaft, and the convex shaft is fixedly connected to one end of the guide plate through a convex rib.

[0016] Based on common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of this utility model.

[0017] The positive and progressive effects of this utility model are as follows: The aforementioned drive structure for precise four-step top lifting of a pick-and-place machine has the following advantages: 1. The motion process is segmented and controllable, with no impact and no damage to the workpiece. It adopts a four-step independent action logic of rapid approach → low-speed buffer → precise lifting → stable holding. The four-step drive structure is layered and segmented for independent control of step-by-step detachment and descent. The speed, position and pressure are controllable in segments throughout the process, avoiding the problem of large start-stop impact of traditional single-stage drive and voice coil motor drive, which greatly improves the production yield. It also works with a heating unit to achieve smooth wafer peeling and prevent wafer chip edge chipping and hidden cracks. 2. High positioning accuracy and good repeatability. Four-step graded transmission + precise limit guidance, controllable lifting step distance of the ejector pin, high verticality, and repeatability positioning accuracy are far superior to cylinder, ordinary cam, and voice coil micro stroke structure. The multi-ejector pin array has strong synchronization and stable support flatness, making it suitable for high-precision mounting scenarios of blue film wafers. 3. High rigidity, large load-bearing capacity, and resistance to eccentric loading and overturning. Compared to the shortcomings of weak rigidity of voice coil motors and poor anti-overturning of cross roller guides, the four-step top mechanical transmission structure has sufficient overall rigidity, strong ability to withstand vertical loads and lateral loads, and is not prone to displacement, tilting, or accuracy drift during long-term operation, thus significantly improving the long-term stability and service life of the equipment. 4. Wide travel range, broad adaptability, and convenient model changeover. Overcoming the limitation of voice coil motor stroke, the four-step lifting mechanism can handle both large-stroke shape change and micro-stroke precise lifting. It is compatible with wafer frames of different thicknesses and specifications. Compared with voice coil motors, it can appropriately adjust the lifting distance according to the wafer specifications to adapt to different packaging scenarios. It also eliminates the need for repeated manual adjustment of the ejector pin height, allowing for fast model changeover and adaptability to mixed-product production lines. 5. Controllable and stable voltage support, with stronger process adaptability. It can achieve a stable pressure holding function, and after being lifted, it provides constant pressure to support the workpiece smoothly, eliminating springback, sinking and micro-displacement, and is perfectly adapted to the high-difficulty mounting process of ultra-thin storage chips (below 50μm) and fragile chips. 6. Reduces assembly and debugging difficulty, resulting in better mass production consistency. The structure features built-in graded limit and transmission self-locking logic, which provides higher tolerance for assembly coaxiality and parallelism. Compared with the high-precision assembly requirements of voice coil + cross roller, it is simple to debug, has high consistency in mass production assembly, and lower manufacturing and after-sales maintenance costs. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the exploded structure of this utility model.

[0020] Figure 3 This is an exploded structural diagram of the ejector pin structure of this utility model.

[0021] Figure 4 This is a schematic diagram of the internal front view of the present invention.

[0022] Figure 5 This utility model Figure 4 A magnified schematic diagram of the structure at point A in the middle.

[0023] Figure 6 This is a schematic diagram of the overall three-dimensional structure of the present invention after assembly.

[0024] Figure 7 This utility model Figure 6 A magnified schematic diagram of the structure at point B in the middle.

[0025] Figure 8 This is a schematic diagram of the half-section structure of this utility model.

[0026] Explanation of reference numerals in the attached figures: 1. Linear guide rail; 2. Miniature electric cylinder one; 3. Miniature electric cylinder two; 4. Miniature electric cylinder three; 5. Cylindrical pin one; 6. O-ring one; 7. O-ring two; 8. O-ring three; 9. Low-head socket head cap screw; 10. Cylindrical pin two; 11. Mounting base plate; 12. Guide plate one; 13. Guide plate two; 14. Guide plate three; 15. Guide plate four; 16. Guide plate five; 17. Guide plate six; 18. Mounting top. 19. Top rod 1; 20. Top rod 2; 21. Top rod 3; 22. Top rod 4; 23. Module fixing plate 1; 24. Module fixing plate 2; 25. Module fixing plate 3; 26. Protruding upper wire strip fixing plate; 27. Z-shaped protruding upper sensor piece; 28. Guide shaft; 29. ​​Guide shaft cover; 30. Sensor piece; 31. Guide sleeve; 32. Heat insulation sleeve; 33. Electric heating wire; 34. Protruding shaft; 35. Protruding rib. Detailed Implementation

[0027] The present invention will be further described below by way of embodiments, but the present invention is not limited to the scope of the embodiments described herein.

[0028] like Figure 1-8 As shown, the drive structure for precise four-step lifting of a chip mounter includes a top rod structure and a drive assembly for mounting the top rod structure. The top rod structure is inserted into the drive assembly, and the drive assembly drives the top rod structure to move in segments to achieve the lifting effect. The drive assembly includes a mounting base plate 11, a mounting top plate 18, and four drive units disposed on the surface of the mounting base plate 11. The mounting top plate 18 is fixedly installed to the top of the mounting base plate 11. The mounting top plate 18 and the mounting base plate 11 are vertically distributed. The top rod structure is inserted through the middle of the mounting top plate 18. The mounting top plate 18 is used for the overall installation of the drive structure without affecting the movement of the top rod structure. The four drive units are respectively fixed to the four sides of the mounting base plate 11. The four drive units are symmetrically distributed in pairs. A heating unit is installed on one of the drive structures, and the heating unit is movably sleeved on the surface of the top rod structure.

[0029] The top rod structure includes top rod 19, top rod 20, top rod 3 21 and top rod 4 22, which are sequentially nested together.

[0030] The top outer wall of the top rod 22 is provided with an O-ring 3 8, which is sealed and fitted inside the top rod 21; the top outer wall of the top rod 21 is provided with an O-ring 2 7, which is sealed and fitted inside the top rod 20; the top outer wall of the top rod 20 is provided with an O-ring 1 6, which is sealed and fitted inside the top rod 19.

[0031] Specifically, O-rings 1-6, 2-7, and 3-8 are all embedded in the groove, so that the O-rings will not move axially when the push rod structure moves. At the same time, the O-rings ensure that there is no air leakage when push rod 1-19, push rod 2-20, push rod 3-21, and push rod 4-22 extend and retract relative to each other, thus forming a sealed environment to ensure that there is no air leakage during the four-step top vacuum extraction.

[0032] A linear guide rail 1 is fixedly installed in the middle of the mounting base plate 11. The linear guide rail 1 has a T-shaped cross-section and is arranged between four drive units. Each drive unit includes a micro electric cylinder 1 2, two micro electric cylinders 2 3, and a micro electric cylinder 3 4. The two micro electric cylinders 2 3 are staggered at the upper and lower ends of the mounting base plate 11, and are symmetrically distributed with the micro electric cylinder 1 2 and the micro electric cylinder 3 4, respectively.

[0033] The miniature electric cylinder 2 is fixed to the side of the mounting base plate 11 by the module fixing plate 3 25, and one of the miniature electric cylinders 3 is fixed to the same side of the mounting base plate 11 by the module fixing plate 2 24. The miniature electric cylinder 4 and the other miniature electric cylinder 3 are both fixed to the other side of the mounting base plate 11 by the module fixing plate 1 23.

[0034] The telescopic end of the miniature electric cylinder 2 is fixedly connected to the push rod 19 via the guide plate 12. The push rod 19 is also fixedly connected to one of the sliders on the linear guide rail 1 via the guide plate 2 13. Thus, the miniature electric cylinder 2 drives the push rod 19 to telescopically extend and retract, while the push rod 19 drives the guide plate 2 13 and the slider to move. The slider and the linear guide rail 1 cooperate to achieve stable telescopic function.

[0035] The telescopic end of the miniature electric cylinder 4 is fixedly connected to the push rod 21 via the guide plate 4 15. The push rod 21 is also fixedly connected to another slider on the linear guide rail 1 via the guide plate 6 17. In this way, the miniature electric cylinder 4 drives the push rod 21 to telescopically extend and retract, while the push rod 21 drives the guide plate 6 17 and the other slider to move synchronously, so that the push rod 21 can move stably and maintain axial extension and retraction with the other push rods to ensure lifting accuracy.

[0036] One of the miniature electric cylinders 2 and 3 has its telescopic end fixedly connected to the top rod 4 and 22 via the guide plate 5 and 16, and the other miniature electric cylinder 2 and 3 has its telescopic end fixedly connected to the top rod 20 via the guide plate 3 and 14. The four miniature electric cylinders can drive the four top rods to control them separately, so as to achieve precise four-part lifting.

[0037] Furthermore, the guide plate 2 13 is fixedly connected to the slider on the linear guide rail 1 by a low-profile hexagon socket bolt 9, and the guide plate 2 13 and the slider can be fixed by the low-profile hexagon socket bolt 9.

[0038] The guide plate 6 17 is provided with a cylindrical pin 1 5, which is fitted and inserted into the guide plate 4 15. The cylindrical pin 1 5 can connect the guide plate 6 17 and the guide plate 4 15, and can realize synchronous movement.

[0039] The mounting base plate 11 has a plurality of cylindrical pins 10 on its surface. There are 13 cylindrical pins 10. The cylindrical pins 10 are respectively engaged with miniature electric cylinders 2, 3, 4 and 4. The cylindrical pins 10 can be used to position the miniature electric cylinders 2, 3, 4 and 4, ensuring that their installation positions are not deviated.

[0040] A protruding cable tray fixing plate 26 is fixedly connected to the middle of the bottom end of the mounting base plate 11. The protruding cable tray fixing plate 26 is used to fix the cable and ensure that it will not affect the normal operation of the drive component.

[0041] A Z-shaped sensor plate 27 is fixedly connected to the side of the mounting base plate 11 near the micro electric cylinder 2. The Z-shaped sensor plate 27 is distributed correspondingly to the guide plate 12. When the micro electric cylinder 2 drives the guide plate 12 to rise, the Z-shaped sensor plate 27 can detect the moving distance of the guide plate 12.

[0042] The top of the push rod 19 is nested with a guide shaft cover 29. The guide shaft cover 29 has a guide shaft 28 in the middle. The guide shaft cover 29 is used to limit the maximum distance during the lifting process of the push rod structure to prevent the electric cylinder from overtraveling and breaking the chip. The guide shaft 28 is used to block the through hole in the center of the guide shaft cover 29 to prevent dust from entering. In use, the guide shaft 28 is not installed. The guide shaft cover 29 can lift the chip and then gradually descend to form a negative pressure to detach the chip and complete the removal.

[0043] Sensor plates 30 are fixedly installed on each of the miniature electric cylinders 2, 3, 4, and 4. The sensor plates 30 are distributed corresponding to the telescopic ends of the miniature electric cylinders. Thus, when the miniature electric cylinders 2, 3, 4, and 4 are shortened, their telescopic ends can contact the sensor plates 30, at which point the telescopic extension stops, ensuring that the lifting distance is the same each time.

[0044] The heating unit is fixedly installed on the guide plate 12. The heating unit includes a guide sleeve 31, a heat insulation sleeve 32, and an electric heating wire 33. The guide sleeve 31 is fixedly installed at the bottom of the guide plate 12. The heat insulation sleeve 32 is embedded in the guide sleeve 31. Multiple annular electric heating wires 33 are fixedly connected to the inner wall of the heat insulation sleeve 32. The guide sleeve 31 and the heat insulation sleeve 32 are movably sleeved on the surface of the top rod 20. At the same time, the guide sleeve 31 is set at the tail end of the top rod 19 so that when the guide sleeve 31 is heated, heat can be transferred to the top rod structure, so that the blue film of the chip can be heated to reduce the viscosity and facilitate the effective separation of the chip. Optionally, the heat insulation sleeve 32 is made of heat-insulating ceramic material, which can isolate the temperature and allow the heat to act on the top rod structure to achieve heat transfer.

[0045] Furthermore, the guide sleeve 31 is provided with a convex shaft 34 on its surface. The convex shaft 34 is fixedly connected to the tail end of the guide plate 12 through a convex rib 35. The convex shaft 34 can be used for circuit installation. Multiple electric heating wires 33 are electrically connected within the convex shaft 34. The convex rib 35 can improve the installation stability of the guide sleeve 31 so that it will not interfere with the movement of the push rod structure. At the same time, it can heat the push rod structure to improve the chip removal effect and prevent chip breakage.

[0046] In another embodiment, neither the guide shaft 28 nor the guide shaft cover 29 is installed. The lifting operation is completed by sequentially raising the push rods 19, 20, 31, and 42. The push rod 19 rises to wrap around the chip to be lifted, pressing down on the blue film around the chip, tightening the film, and dispersing the force of the central push rod to prevent the ultra-thin chip from arching and cracking. By pressing down on the blue film of adjacent chips, they will not be lifted up and accidentally removed. Then, the push rods 20, 31, and 42 are moved up in sequence to detach the chip from the blue film. This can prevent the ultra-thin chip from arching and cracking due to concentrated force. The outer ring pre-support during the four-step lifting process plays a flexible peeling role.

[0047] The four-step top-drive structure focuses on high-end precision manufacturing scenarios such as semiconductor packaging and wafer support, precisely addressing the industry pain points of traditional ejector drives (voice coil + crossed roller, single-stage lead screw, cam) such as high impact, low precision, short stroke, poor rigidity, and easy damage to workpieces. Aligning with the three major trends of precision manufacturing, domestic substitution, and intelligent manufacturing, it boasts significant technological advantages, clear downstream demand, and a broad market space, exhibiting high growth potential and profitability. It is an innovative technology with significant investment and industrialization value.

[0048] This utility model is not limited to the above-described embodiments. Any changes in its shape or structure fall within the protection scope of this utility model. The protection scope of this utility model is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this utility model, but all such changes and modifications fall within the protection scope of this utility model.

Claims

1. A drive structure for precise four-step lifting and lowering of a pick-and-place machine, comprising a push rod structure and a drive assembly for mounting the push rod structure, characterized in that, The top rod structure is inserted into the drive assembly. The drive assembly includes a mounting base plate (11) and a mounting top plate (18), and four drive units disposed on the surface of the mounting base plate (11). The mounting top plate (18) is fixedly installed on the top of the mounting base plate (11). The mounting top plate (18) and the mounting base plate (11) are vertically distributed. The top rod structure is inserted through the middle of the mounting top plate (18). The four drive units are respectively fixed to the four sides of the mounting base plate (11). The four drive units are symmetrically distributed in pairs. A heating unit is installed on one of the drive structures, and the heating unit is movably sleeved on the surface of the top rod structure.

2. The drive structure for precise four-step lifting and lowering of a pick-and-place machine as described in claim 1, characterized in that: The top rod structure includes top rod one (19), top rod two (20), top rod three (21) and top rod four (22), which are sequentially nested together.

3. The drive structure for precise four-step lifting and lowering of a pick-and-place machine as described in claim 2, characterized in that: The top outer wall of the top rod four (22) is provided with an O-ring three (8) in the groove, and the O-ring three (8) is sealed and fitted inside the top rod three (21). The top outer wall of the top rod three (21) is provided with an O-ring two (7) in the groove, and the O-ring two (7) is sealed and fitted inside the top rod two (20). The top outer wall of the top rod two (20) is provided with an O-ring one (6) in the groove, and the O-ring one (6) is sealed and fitted inside the top rod one (19).

4. The drive structure for precise four-step lifting and lowering of a chip mounter as described in claim 1, characterized in that: A linear guide rail (1) is fixedly installed in the middle of the mounting base plate (11). The linear guide rail (1) has a T-shaped cross section. The linear guide rail (1) is arranged between four drive units. The drive unit includes a micro electric cylinder one (2), two micro electric cylinders two (3) and a micro electric cylinder three (4). The two micro electric cylinders two (3) are staggered at the upper and lower ends of the mounting base plate (11). The two micro electric cylinders two (3) are symmetrically distributed with the micro electric cylinder one (2) and the micro electric cylinder three (4) respectively.

5. The drive structure for precise four-step lifting and lowering of a pick-and-place machine as described in claim 4, characterized in that: The first miniature electric cylinder (2) is fixed to the side of the mounting base plate (11) by the module fixing plate three (25), and one of the miniature electric cylinders (3) is fixed to the same side of the mounting base plate (11) by the module fixing plate two (24). The second miniature electric cylinder (4) and the third miniature electric cylinder (3) are both fixed to the other side of the mounting base plate (11) by the module fixing plate one (23).

6. The drive structure for precise four-step lifting and lowering of a pick-and-place machine as described in claim 5, characterized in that: The telescopic end of the micro electric cylinder 1 (2) is fixedly connected to the push rod 1 (19) via the guide plate 1 (12). The push rod 1 (19) is also fixedly connected to one of the sliders on the linear guide rail (1) via the guide plate 2 (13). The telescopic end of the micro electric cylinder 3 (4) is fixedly connected to the push rod 3 (21) via the guide plate 4 (15). The push rod 3 (21) is also fixedly connected to another slider on the linear guide rail (1) via the guide plate 6 (17).

7. The drive structure for precise four-step lifting and lowering of a pick-and-place machine as described in claim 6, characterized in that: One of the miniature electric cylinders 2 (3) has its telescopic end fixedly connected to the top rod 4 (22) via the guide plate 5 (16), and the other miniature electric cylinder 2 (3) has its telescopic end fixedly connected to the top rod 2 (20) via the guide plate 3 (14).

8. The drive structure for precise four-step lifting and lowering of a pick-and-place machine as described in claim 1, characterized in that: A Z-shaped sensor plate (27) is fixedly connected to the side of the mounting base plate (11) near the micro electric cylinder one (2). The Z-shaped sensor plate (27) is distributed in correspondence with the guide plate one (12). Sensor plates (30) are fixedly installed on the micro electric cylinder one (2), micro electric cylinder two (3), micro electric cylinder three (4) and micro electric cylinder four. The sensor plates (30) are distributed in correspondence with the telescopic end of the drive unit.

9. The drive structure for precise four-step lifting and lowering of a pick-and-place machine as described in claim 1, characterized in that: The heating unit is fixedly installed on the guide plate (12). The heating unit includes a guide sleeve (31), a heat insulation sleeve (32), and an electric heating wire (33). The guide sleeve (31) is fixedly installed at the bottom of the guide plate (12). The heat insulation sleeve (32) is embedded in the guide sleeve (31). Multiple annular electric heating wires (33) are fixedly connected to the inner wall of the heat insulation sleeve (32). The guide sleeve (31) and the heat insulation sleeve (32) are both movably sleeved on the surface of the top rod (20).

10. The drive structure for precise four-step lifting and lowering of a pick-and-place machine as described in claim 9, characterized in that: The guide sleeve (31) has a convex shaft (34) on its surface, and the convex shaft (34) is fixedly connected to the tail end of the guide plate (12) through a convex rib (35).

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