Chip compression molding package mold core

Abstract

The utility model relates to LED packaging technical field especially CHIP mould pressing package mould core, including substrate, the substrate surface is equipped with several flow glue channel, the both sides of flow glue channel are equipped with several reinforcing ribs, and are respectively in the glue inlet and glue outlet between several reinforcing ribs located flow glue channel both sides, the reinforcing rib includes the first reinforcing rib parallel to the glue inlet and glue outlet direction and is distributed between two adjacent flow glue channels, the middle region of two first reinforcing ribs is equipped with the hollow slot, the utility model discloses in the mould pressing process, the glue not only can fill flow glue channel, but also can fill the hollow slot position fully, forms the continuous complete colloid plane, makes the bonding area of substrate process waste edge and film material improve significantly, solves the problem of flying material caused by the hollow area suspension in traditional design, effectively avoids the cutting blade collapse and product damage caused by flying material, improves the stability of cutting process significantly, improves the product manufacturing yield ratio simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, specifically a CHIP molding packaging core. Background Technology

[0002] In the LED packaging field, cutting is a critical process in the chip molding process. Due to the stress of the adhesive after molding, the substrate is prone to significant deformation, and LED chips have stringent requirements regarding cut burrs. Therefore, the industry commonly uses a back-cutting process with the adhesive side facing down. Chip substrates need to be designed with process waste edges to meet the pressure requirements during molding. However, existing back-cutting processes have significant technical defects: the reinforcing ribs of traditional mold cores are parallel to the glue channel, and the reinforcing ribs between units cannot be filled with glue, resulting in a hollowed-out shape on the substrate after molding. Figure 3 and Figure 4 As shown in the suspended area, only the adhesive plane formed by the adhesive channel can bond with the film material during the cutting process. During the cutting process, the suspended area of ​​the substrate is prone to detaching from the film material due to the lack of effective adhesion, forming flying material. This flying material may splash onto the cutting blade, causing it to break or fall into the uncut area, resulting in subsequent cutting of broken products. This seriously affects the stability of the production process and the product yield, while also increasing the replacement cost of the cutting blade and raising the overall production cost. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a CHIP molding packaging core, which solves the technical problems of traditional CHIP molding packaging cores, such as blade breakage, product damage, poor production process stability, low product yield, and high manufacturing costs.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a CHIP molding and packaging core, including a substrate, the surface of the substrate is provided with a plurality of glue channels, a plurality of reinforcing ribs are provided on both sides of the glue channels, and glue inlet and glue outlet are respectively located between the plurality of reinforcing ribs on both sides of the glue channels. The reinforcing ribs include first reinforcing ribs parallel to the glue inlet and glue outlet directions and distributed between two adjacent glue channels. A hollow groove is provided in the middle area of ​​the two first reinforcing ribs, and glue is filled in the hollow groove to form a glue plane.

[0005] Preferably, a first reinforcing rib is provided on both sides of the glue flow channel near the corner area.

[0006] Preferably, the ratio of the width of the hollowed-out groove to the width of the two first reinforcing ribs is 4:1:1.

[0007] Preferably, the hollowed-out groove is rectangular in shape.

[0008] Preferably, the reinforcing rib further includes a plurality of second reinforcing ribs parallel to the direction of the glue inlet and glue outlet, the plurality of second reinforcing ribs being located between two first reinforcing ribs, and the plurality of second reinforcing ribs being distributed sequentially at intervals.

[0009] Preferably, the glue channel is connected to the hollow groove, so that the glue can be filled into the glue channel and the hollow groove simultaneously during the molding process, and form a glue plane.

[0010] By employing the above technical solution, this utility model provides a CHIP molding encapsulation core, which has at least the following beneficial effects: 1. This utility model forms a hollow groove by grooving the area between the two first reinforcing ribs. During the molding process, the glue can not only fill the glue channel, but also fully fill the hollow groove position to form a continuous and complete glue plane. This significantly increases the bonding area between the substrate process waste edge and the film material, solves the problem of flying material caused by the hollow area being suspended in the traditional design, effectively avoids the cutting blade breakage and product damage caused by flying material, significantly improves the stability of the cutting process, and improves the product manufacturing yield.

[0011] 2. This utility model does not require changes to the core process of existing CHIP molding and packaging. Performance improvement can be achieved simply by optimizing the core structure. It has good process compatibility and practicality. Furthermore, by controlling the ratio of the width of the cutout groove to the width of the two first reinforcing ribs at 4:1:1, this design balances support strength and glue filling efficiency. It avoids insufficient substrate pressure due to excessive cutouts and reduces unnecessary glue waste, thus controlling material costs. At the same time, the position and area of ​​the cutout groove can be flexibly adjusted according to the actual size of the LED product to adapt to the packaging requirements of different specifications of CHIP substrates. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application: Figure 1 This is a schematic diagram of the improved structure of this utility model; Figure 2 This is a partial structural diagram of the hollowed-out groove location of this utility model; Figure 3 This is a schematic diagram of the structure of the present invention before the improvement; Figure 4 This is a partial structural diagram of the suspended area of ​​this utility model.

[0013] Figure label: 1. Substrate; 2. Adhesive channel; 3. Reinforcing rib; 31. First reinforcing rib; 32. Second reinforcing rib; 4. Adhesive inlet; 5. Adhesive outlet; 6. Hollow groove; 7. Adhesive plane; 8. Suspended area. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Due to existing technology, the reinforcing ribs 3 located adjacent to the adhesive flow channel 2 cannot be filled with adhesive, resulting in a hollow shape and suspended area 8 on the substrate 1 after molding. Furthermore, during the back-cutting process, the waste edges of the substrate 1 detach from the film material due to the lack of an effective bonding surface, forming fly waste. Please refer to [the relevant documentation / reference]. Figures 1-2 This embodiment provides a CHIP molding and encapsulation core. By improving the suspended area 8 of the original core, the bonding area between the process waste edge of the substrate 1 and the film material can be significantly increased. This completely solves the problem of material flying caused by the suspended hollow area in the traditional design, effectively avoiding blade breakage and product damage caused by material flying, significantly improving the stability of the cutting process, and improving the product manufacturing yield. The core includes a substrate 1, the surface of which is provided with a plurality of glue channels 2, and a plurality of reinforcing ribs 3 are provided on both sides of the glue channels 2. Glue inlets are located between the reinforcing ribs 3 on both sides of the glue channels 2. 4 and the glue outlet 5, the reinforcing rib 3 includes a first reinforcing rib 31 parallel to the glue inlet 4 and the glue outlet 5 and distributed between two adjacent glue channels 2. The middle area of ​​the two first reinforcing ribs 31 is provided with a hollow groove 6, which is filled with glue and forms a glue plane 7. By providing a hollow groove 6 in the middle of the first reinforcing ribs 31 between two adjacent glue channels 2, the glue can fill the hollow groove 6 and form a glue plane 7, which supplements the bonding surface of the traditional reinforcing rib 3 area, avoids the problem of waste edge suspension caused by the hollowing of the substrate 1, reduces the generation of fly material from the source, and ensures the integrity of the cutting blade and product quality.

[0016] In traditional mold core back cutting, the waste edges at the corners are more prone to falling off due to insufficient support, resulting in flying material, which affects cutting accuracy and product yield. To address this issue, a first reinforcing rib 31 is provided on both sides of the glue channel 2 near the corner area; the glue channel 2, together with the hollow groove 6, fills the corners with glue to ensure that the waste edges at the corners are effectively bonded to the film material, further reducing the risk of flying material at the corners and ensuring the stability of the cutting process.

[0017] If the ribs are too wide, the cutout area will be small and the colloid filling will be insufficient, still resulting in the problem of suspended material flying out. If the cutout is too large, the ribs will not provide sufficient support, causing the substrate 1 to deform under pressure during molding. It is impossible to balance the support strength and the colloid filling requirements. To address this issue, the ratio of the width of the cutout groove 6 to the width of the two first reinforcing ribs 31 is 4:1:1. This ratio precisely balances the support strength and the colloid filling area. The narrower first reinforcing ribs 31 on both sides ensure the pressure requirements of the substrate 1, while the wider cutout groove 6 in the middle maximizes the colloid filling space, which not only avoids the deformation of the substrate 1 but also ensures the bonding area between the waste edge and the film material.

[0018] Furthermore, the hollow groove 6 is rectangular in shape; the regular rectangular hollow shape facilitates the processing and manufacturing of the mold core, reduces the production difficulty, and ensures that the adhesive flows evenly and fills the hollow groove 6, forming a flat adhesive plane 7, which improves the adhesion and bonding stability with the film material and avoids localized material flying due to uneven adhesive.

[0019] Traditional mold core substrate 1 has a large span in the middle area and weak support. During molding, it is prone to bending deformation due to uneven stress, which affects the accuracy of glue filling and subsequent cutting quality. To address this issue, the reinforcing rib 3 also includes several second reinforcing ribs 32 parallel to the glue inlet 4 and glue outlet 5. The several second reinforcing ribs 32 are located between two first reinforcing ribs 31 and are distributed alternately. The addition of the spaced second reinforcing ribs 32 can enhance the overall support strength of the substrate 1, especially strengthen the pressure bearing capacity of the middle area, reduce molding deformation, and at the same time, the spaced design does not hinder the flow of glue, ensuring that the glue can still fully fill the hollow groove 6, taking into account both support and bonding effects.

[0020] The glue flow channel 2 is connected to the hollow groove 6, so that the glue can be filled into the glue flow channel 2 and the hollow groove 6 simultaneously during the molding process, forming a glue plane 7. The design of the glue flow channel 2 and the hollow groove 6 allows the glue to flow into the glue flow channel 2 and the hollow groove 6 simultaneously during molding, forming a continuous and complete glue plane 7, ensuring that there are no suspended areas 8 on the surface of the substrate 1. The process waste edges of the substrate 1 can be fully bonded to the film material, reducing the generation of fly waste, ensuring the stability of the cutting process, improving product yield, and reducing blade wear costs.

[0021] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0022] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A CHIP molding encapsulation core, characterized in that, The substrate (1) includes a substrate (1) with a plurality of glue channels (2) on its surface. A plurality of reinforcing ribs (3) are provided on both sides of the glue channels (2). The glue inlet (4) and glue outlet (5) are located between the plurality of reinforcing ribs (3) on both sides of the glue channels (2). The reinforcing ribs (3) include first reinforcing ribs (31) that are parallel to the direction of the glue inlet (4) and the glue outlet (5) and distributed between two adjacent glue channels (2). A hollow groove (6) is provided in the middle area of ​​the two first reinforcing ribs (31). The hollow groove (6) is filled with glue and forms a glue plane (7).

2. The CHIP molding encapsulation core according to claim 1, characterized in that, The glue channel (2) has a first reinforcing rib (31) on both sides near the corner area.

3. The CHIP molding encapsulation core according to claim 1, characterized in that, The ratio of the width of the hollow groove (6) to the width of the two first reinforcing ribs (31) is 4:1:

1.

4. The CHIP molding encapsulation core according to claim 1, characterized in that, The hollowed-out groove (6) is rectangular in shape.

5. The CHIP molding encapsulation core according to claim 1, characterized in that, The reinforcing rib (3) also includes several second reinforcing ribs (32) parallel to the direction of the glue inlet (4) and the glue outlet (5). The several second reinforcing ribs (32) are located between the two first reinforcing ribs (31) and are distributed in sequence at intervals.

6. The CHIP molding encapsulation core according to claim 1, characterized in that, The glue channel (2) is connected to the hollow groove (6), so that the glue can be filled into the glue channel (2) and the hollow groove (6) simultaneously during the molding process, and form a glue plane (7).

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